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TPS63070
TPS630701
SLVSC58A – JUNE 2016 – REVISED AUGUST 2016
0805 FB R4
VSEL R2 100 kΩ 50%
R5 FB2
10 kΩ 40%
EN PG 3V
30% 4.2 V
PS/SYNC PGND 5V
20% 7V
CVAUX VAUX GND 9V
10%
12 V
100 nF
0
Copyright © 2016, Texas Instruments Incorporated
100P 1m 10m 100m 1 2
Output Current (A) D001
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS63070
TPS630701
SLVSC58A – JUNE 2016 – REVISED AUGUST 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 9 Application and Implementation ........................ 16
2 Applications ........................................................... 1 9.1 Application Information............................................ 16
3 Description ............................................................. 1 9.2 Typical Application for adjustable version .............. 16
4 Revision History..................................................... 2 9.3 Typical Application for Fixed Voltage Version ....... 24
5 Device Comparison Table..................................... 3 10 Power Supply Recommendations ..................... 28
10.1 Thermal Information .............................................. 28
6 Pin Configuration and Functions ......................... 3
7 Specifications......................................................... 4 11 Layout................................................................... 29
11.1 Layout Guidelines ................................................. 29
7.1 Absolute Maximum Ratings ...................................... 4
11.2 Layout Example .................................................... 29
7.2 ESD Ratings ............................................................ 4
7.3 Recommended Operating Conditions....................... 4 12 Device and Documentation Support ................. 30
7.4 Thermal Information ................................................. 5 12.1 Device Support .................................................... 30
7.5 Electrical Characteristics........................................... 6 12.2 Related Links ........................................................ 30
7.6 Typical Characteristics .............................................. 8 12.3 Receiving Notification of Documentation Updates 30
12.4 Community Resources.......................................... 30
8 Detailed Description .............................................. 9
12.5 Trademarks ........................................................... 30
8.1 Overview ................................................................... 9
12.6 Electrostatic Discharge Caution ............................ 30
8.2 Functional Block Diagram TPS63070 ....................... 9
12.7 Glossary ................................................................ 30
8.3 Functional Block Diagram TPS630701 ................... 10
8.4 Feature Description................................................. 10 13 Mechanical, Packaging, and Orderable
8.5 Device Functional Modes........................................ 14
Information ........................................................... 31
4 Revision History
Changes from Original (June 2016) to Revision A Page
QFN PACKAGE
Top View Bottom View
L2
L1
L2
PGND
PGND
L1
7 13
13 7
EN 14 11 9 6 FB2 FB2 6 9 11 14 EN
15 10 10
5 15
VSEL 1 2 3 4 5 FB FB 4 3 2 1 VSEL
VAUX
GND
VAUX
GND
PS/S
PS/S
PG
PG
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
EN 14 I Enable input. Pull high to enable the device, pull low to disable the device.
FB 5 I Voltage feedback of adjustable versions, must be connected to VOUT on fixed output voltage
versions
GND 4 Control / logic ground
L1 11 I Connection for Inductor
L2 9 I Connection for Inductor
PS/SYNC 1 I Pull to low for forced PWM, pull high for PWM/PFM (power save) mode. Apply a clock signal to
synchronize to an external frequency.
PG 2 O Open drain power good output
PGND 10 Power ground
VIN 12, 13 I Supply voltage for power stage
VOUT 7,8 O Buck-boost converter output
VAUX 3 O Connection for Capacitor of internal voltage regulator. This pin must not be loaded externally.
VSEL 15 I Voltage scaling input. A high level on this pin enables a transistor which pulls pin FB2 to GND.
FB2 6 O Voltage scaling output. Connect a resistor from FB to FB2 to change the voltage divider ratio on the
feedback pin. A logic high level on VSEL will change the output voltage to a higher value. Leave the
pin open or connect to GND if not used.
7 Specifications
7.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN, PS/SYNC, EN, VSEL –0.3 20 V
L1 –0.3 20 V
Voltage range L2, PG, VOUT, FB –0.3 12 V
AUX –0.3 7 V
FB2 –0.3 3 V
Operating junction –40 150 °C
temperature, Tj
Storage temperature °C
–65 150
range, Tstg
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) Due to the dc bias effect of ceramic capacitors, the effective capacitance is lower than the nominal value when a voltage is applied. This
is why the capacitance is specified to allow the selection of the minimal capacitor required with the dc bias effect for this type of
capacitor in mind. The capacitance range given above is for the nominal inductance of 1.5 µH. Please also see the detailed design
procedure in the application section about the ratio of inductance and minimum output capacitance.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
90 60
-40 -40
80 30 55 30
85 80
125 50 125
70
RDSon [m:]
RDSon [m:]
45
60
40
50
35
40
30
30 25
20 20
0 5 10 15 20 0 5 10 15 20
VIN [V] D019
VIN [V] D020
Vout = 5V I = 1A Vout = 5V I = 1A
Figure 1. Rds(on) of High-side Buck Switch Figure 2. Rds(on) of High-side Boost Switch
120 150
-40 -40
30 140 30
110
85 130 85
125 125
100 120
RDSon [m:]
RDSon [m:]
110
90
100
80
90
70 80
70
60
60
50 50
0 5 10 15 20 0 5 10 15 20
VIN [V] D021
VIN [V] D022
Vout = 5V I = 1A Vout = 5V I = 1A
Figure 3. Rds(on) of Low-side Boost Switch Figure 4. Rds(on) of Low-side Buck Switch
8 Detailed Description
8.1 Overview
The TPS6307x use 4 internal N-channel MOSFETs to maintain synchronous power conversion at all possible
operating conditions. This enables the device to keep high efficiency over a wide input voltage and output power
range. To regulate the output voltage at all possible input voltage conditions, the device automatically switches
from buck operation to boost operation and back as required by the configuration. It always uses one active
switch, one rectifying switch, one switch on, and one switch held off. Therefore, it operates as a buck converter
when the input voltage is higher than the output voltage, and as a boost converter when the input voltage is
lower than the output voltage. There is no mode of operation in which all 4 switches are switching. The RMS
current through the switches and the inductor is kept at a minimum, to minimize switching and conduction losses.
For the remaining 2 switches, one is kept on and the other is kept off, thus causing no switching losses.
Controlling the switches this way allows the converter to always keep high efficiency over the complete input
voltage range. The device provides a seamless transition from buck to boost or from boost to buck operation.
L1 L2
VIN VOUT
VIN VOUT
Current
Sensor
Bias
Regulator
_
VAUX _
Modulator FB
+
+
PG
Oscillator + VREF
-
Device
PS/SYNC Control
EN FB2
VSEL
Temperature PGND
Protection
GND PGND
Copyright © 2016, Texas Instruments Incorporated
L1 L2
VIN VOUT
VIN VOUT
Current
Sensor
Bias
Regulator
_
VAUX _
Modulator
+
+
PG
Oscillator +
-
Device VREF
PS/SYNC Control
EN FB2
VSEL
Temperature PGND
Protection
GND PGND
Copyright © 2016, Texas Instruments Incorporated
L1 L2
Vin Vout
Boost
Drive
Buck
Drive
PWM PWM
Vref
Ramp Generator 0.8V
8.4.2 Enable
The enable pin of the TPS63070 is not just a simple digital input but compares the voltage applied to a fixed
threshold of 0.8V for a rising voltage. This allows to drive the pin by a slowly changing voltage and enables the
use of an external RC network to achieve a precise power-up delay. The enable input threshold for a falling edge
is typically 100mV lower than the rising edge threshold. The TPS63070 starts operation when the rising threshold
is exceeded. For proper operation, the EN pin must be terminated and must not be left floating. Pulling the EN
pin low forces the device into shutdown. In this mode, the internal high side and low side MOSFETs are turned
off and the entire internal-control circuitry is switched off. The enable pin can also be used with an external
voltage divider to set a user-defined minimum supply voltage.
It is recommended to not connect EN directly to VIN but use a resistor in series in the range of 1kΩ to 1MΩ. If
several inputs like EN and PS/SYNC are connected to VIN, the resistor can be shared. No resistor is required if
the pin is driven from an analog or digital signal rather than a supply voltage.
8.4.5 PS/SYNC
The PS/SYNC pin has two functions:
• switching between forced PWM mode and power save mode
• synchronizing to an external clock applied at pin PS/SYNC
When PS/SYNC is set high, the device operates in power save mode at low output current. For an average
inductor current above a certain threshold the device switches to forced PWM mode. The automatic switch-over
from PFM to PWM and vice versa is done such that the efficiency is kept at the maximum possible level. It is not
based on a fixed threshold but at a current that depends on input voltage and output voltage to keep the
efficiency at the maximum possible level.
The power save mode is disabled when PS/SYNC is set low. The device then operates in forced fixed frequency
PWM mode independent of the output current.
TPS6307x can be synchronized to an external clock applied at pin PS/SYNC. Details about the voltage level and
frequency range can be found in the electrical characteristics. When an external clock is detected, TPS6307x
switches from internal clock or power save mode to fixed frequency operation based on the external clock
frequency. When the external clock is removed, TPS6307x switches back to internal clock or power save mode
depending on the average inductor current and status of the PS/SYNC pin. The PS/SYNC pin has two parallel
input stages, a slow one with the precise threshold for PWM/PFM mode change and a fast digital input stage for
an external clock signal for synchronization.
It is recommended to not connect PS/SYNC directly to VIN but use a resistor in series in the range of 1kΩ to
1MΩ. If several inputs like EN and PS/SYNC are connected to VIN, the resistor can be shared. No resistor is
required if the pin is driven from an analog or digital signal rather than a supply voltage.
TPS63070
L1 L2
VIN = 2.0 V to 16 V VOUT = Vo1 / Vo2
VIN VOUT
2x10 µF 10 µF 10 µF
R1
0805 0603 0603 3x22 µF
FB
10 kΩ PS/SYNC R2 R3
EN
FB2
VSEL
PG
PGND
VAUX GND
100 nF
The resistor values for the feedback divider and FB2 are in the 50-500kΩ range. R3 is calculated as follows:
(1)
Comparator low
Vo PWM mode
it is possible to calculate the output current in the different conditions in boost mode using Equation 2 and
Equation 3 and in buck mode using Equation 4 and Equation 5.
V -V
Duty Cycle Boost D= OUT IN
V
OUT (2)
V
Duty Cycle Buck D= OUT
V
IN (4)
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
1.5 µH
L1 L2
TPS63070 VOUT = 2.5 V to 9 V
C4
VIN = 2.0 V to 16 V VOUT
C1 10 µF
VIN COUT
CIN 10 µF R1
0603 3x22 µF
2x10 µF 0603
0805
0805 FB R4
VSEL R2 100 kΩ
R5 FB2
10 kΩ
EN PG
PS/SYNC PGND
100 nF
Copyright © 2016, Texas Instruments Incorporated
(1) Inductor tolerance and current de-rating is anticipated. The effective inductance can vary by +20% and
–30%.
(2) Capacitance tolerance and bias voltage de-rating of +20% and -50% is anticipated. For capacitors with
larger dc bias effect, a larger nominal value needs to be selected.
(3) Typical application. Other check marks indicates recommended filter combinations
9.2.2.1 Programming The Output Voltage
While the output voltage of the TPS63070 is adjustable, the TPS630701 is set to a fixed voltage. For fixed output
versions, the FB pin must be connected to the output directly. The adjustable version can be programmed for
output voltages from 0.8V to 9V by using a resistive divider from VOUT to GND. The voltage at the FB pin
(VREF)is regulated to 800mV. The value of the output voltage is set by the selection of the resistive divider from
Equation 6 . It is recommended to choose resistor values which allow a current of at least 2uA, meaning the
value of R2 shouldn't exceed 400kΩ. Lower resistor values are recommended for highest accuracy and most
robust design.
æV ö
R1 = R 2 çç OUT - 1÷÷
è V REF ø (6)
V -V
Duty Cycle Boost D= OUT IN
V
OUT (7)
Iout Vin ´ D
IPEAK = +
η ´ (1 - D) 2 ´ f ´ L (8)
Where,
D =Duty Cycle in Boost mode
f = Converter switching frequency (typical 2.4MHz)
L = Selected inductor value
η = Estimated converter efficiency (use the number from the efficiency curves or 0.90 as an assumption)
Note: The calculation must be done for the minimum input voltage which is possible to have in boost mode
Calculating the maximum inductor current using the actual operating conditions gives the minimum saturation
current of the inductor needed. It is recommended to choose an inductor with a saturation current 20% higher
than the value calculated from Equation 8. The following inductors are recommended for use:
The inductor value also affects the stability of the feedback loop. In particular the boost transfer function exhibits
a right half-plane zero. The frequency of the right half plane zero is inverse proportional to the inductor value and
the load current. This means the higher the value of the inductance and load current, the more the right half
plane zero is moved to a lower frequency. This degrades the phase margin of the feedback loop. It is
recommended to choose the inductor's value in order to have the frequency of the right half plane zero >400
kHz. The frequency of the RHPZ is calculated using Equation 9.
(1 - D)2 ´ Vout
f RHPZ =
2p ´ Iout ´ L (9)
With,
D =Duty Cycle in Boost mode
Note: The calculation must be done for the minimum input voltage which is possible to have in boost mode
If the operating conditions results in a frequency of the RHPZ of less than 400kHz, more output capacitance
should be added to reduce the cross over frequency.
100% 100%
90% 90%
80% 80%
70% 70%
60% 60%
Efficiency
Efficiency
50% 50%
40% 40%
3V 3V
30% 4.2 V 30% 4.2 V
5V 5V
20% 7V 20% 7V
10% 9V 10% 9V
12 V 12 V
0 0
100P 1m 10m 100m 1 2 100P 1m 10m 100m 1 2
Output Current (A) D003
Output Current (A) D004
Vout = 7 V PFM T = 25 °C Vout = 7 V PWM T = 25 °C
100% 100%
90% 90%
80% 80%
70% 70%
60% 60%
Efficiency
Efficiency
50% 50%
40% 40%
3V 3V
30% 4.2 V 30% 4.2 V
5V 5V
20% 7V 20% 7V
10% 9V 10% 9V
12 V 12 V
0 0
100P 1m 10m 100m 1 2 100P 1m 10m 100m 1 2
Output Current (A) D005
Output Current (A) D006
Vout = 9 V PFM T = 25 °C Vout = 9 V PWM T = 25 °C
Figure 11. Efficiency vs Output Current Figure 12. Efficiency vs Output Current
7.28 7.28
3V 3V
7.21 4.2 V 7.21 4.2 V
5V 5V
7V 7V
7.14 9V 7.14 9V
Output Voltage (V)
7 7
6.93 6.93
6.86 6.86
6.79 6.79
100P 1m 10m 100m 1 2 100P 1m 10m 100m 1 2
Output Current (A) D009
Output Current (A) D010
Vout = 7 V PFM T = 25 °C Vout = 7 V PWM T = 25 °C
Figure 13. Output Voltage vs Output Current Figure 14. Output Voltage vs Output Current
9.36 9.36
3V 3V
9.27 4.2 V 4.2 V
9.27
5V 5V
7V 7V
9.18 9V 9.18 9V
Output Voltage (V)
12 V 12 V
9.09 9.09
9 9
8.91 8.91
8.82 8.82
8.73 8.73
100P 1m 10m 100m 1 2 100P 1m 10m 100m 1 2
Output Current (A) D011
Output Current (A) D012
Vout = 9 V PFM T = 25 °C Vout = 9 V PWM T = 25 °C
Figure 15. Output Voltage vs Output Current Figure 16. Output Voltage vs Output Current
1 4.5
0.9 4
0.8 3.5
3
0.6
2.5
0.5
2
0.4
1.5
0.3
-40qC 1 -40qC
0.2 25qC 25qC
0.1 85qC 0.5 85qC
125qC 125qC
0 0
3 4 5 6 7 8 9 10 11 12 13 14 15 16 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Input Voltage (V) D014
Input Voltage (V) D017
Vout = 7 V resistive load Vout = 7 V after start-up with
PG = high
Figure 17. Typical Start-up Current
Figure 18. Maximum Load Current vs Input Voltage
1 4.5
0.9 4
0.8 3.5
0.7 Max Output Current (A)
Output Current (A)
3
0.6
2.5
0.5
2
0.4
1.5
0.3
-40qC 1 -40qC
0.2 25qC 25qC
0.1 85qC 0.5 85qC
125qC 125qC
0 0
3 4 5 6 7 8 9 10 11 12 13 14 15 16 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Input Voltage (V) D015
Input Voltage (V) D018
Vout = 9 V resistive load Vout = 9 V after start-up with
PG = high
Figure 19. Typical Start-up Current
Figure 20. Maximum Load Current vs Input Voltage
Figure 21. Load Transient Response Figure 22. Load Transient Response
Figure 23. Load Transient Response Figure 24. Load Transient Response
Figure 25. Line Transient Response Figure 26. Line Transient Response
Figure 27. Output Voltage Ripple Figure 28. Output Voltage Ripple
Vin = 12V; Vout = 7 V PFM Io = 0.3A Vin = 5V; Vout = 9 V PFM Io = 0.1A
Figure 29. Output Voltage Ripple Figure 30. Output Voltage Ripple
Vin = 5V; Vout = 9 V PWM Io = 0.5A Vin = 12V; Vout = 9 V PFM Io = 0.1A
Figure 31. Output Voltage Ripple Figure 32. Output Voltage Ripple
Vin = 4.5V; Vout = 7 V PFM Io = 0.5A Vin = 7V; Vout = 9 V PFM Io = 0.5A
L
1.5 µH
TPS630701
L1 L2
C4 VOUT = 5 V
VIN = 2.0 V to 16 V VOUT
C1 10 µF
VIN COUT
CIN 10 µF
0603 3x22 µF
2x10 µF 0603
0805
0805 FB R4
VSEL 100 kΩ
R5 FB2
10 kΩ
EN PG
PS/SYNC PGND
100 nF
Copyright © 2016, Texas Instruments Incorporated
Figure 35. Typical Application For Fixed Voltage Version With Minimum External Part Count And
Minimum Soft Start Time
The TPS6307x series of buck-boost converter has internal loop compensation. Therefore, the external L-C filter
has to be selected according to the internal compensation. It's important to consider that the effective inductance,
due to inductor tolerance and current derating can vary between 20% and -30%. The same for the capacitance
of the output filter: the effective capacitance can vary between +20% and -80% of the specified datasheet value,
due to capacitor tolerance and bias voltage. For this reason, Output Filter Selection shows the nominal
capacitance and inductance value allowed. For the fixed voltage version TPS630701, the effective capacitance
on the output (in µF) needs to be at least 15 times higher than the effective inductance (in µH) to ensure a good
transient response and stable operation.
100% 100%
90% 90%
80% 80%
70% 70%
60% 60%
Efficiency
Efficiency
50% 50%
40% 40%
3V 3V
30% 4.2 V 30% 4.2 V
5V 5V
20% 7V 20% 7V
10% 9V 10% 9V
12 V 12 V
0 0
100P 1m 10m 100m 1 2 100P 1m 10m 100m 1 2
Output Current (A) D001
Output Current (A) D002
Vout = 5 V PFM T = 25 °C Vout = 5 V PWM T = 25 °C
Figure 36. Efficiency vs Output Current Figure 37. Efficiency vs Output Current
5.25 5.2
3V 3V
5.2 4.2 V 5.15 4.2 V
5V 5V
5.15 7V 7V
9V 5.1 9V
Output Voltage (V)
Output Voltage (V)
5.1 12 V 12 V
5.05
5.05
5
5
4.95
4.95
4.9 4.9
4.85 4.85
100P 1m 10m 100m 1 2 100P 1m 10m 100m 1 2
Output Current (A) D007
Output Current (A) D008
Vout = 5 V PFM T = 25 °C Vout = 5 V PWM T = 25 °C
Figure 38. Output Voltage vs Output Current Figure 39. Output Voltage vs Output Current
1 4.5
0.9 4
0.8 3.5
3
0.6
2.5
0.5
2
0.4
1.5
0.3
-40qC 1 -40qC
0.2 25qC 25qC
0.1 85qC 0.5 85qC
125qC 125qC
0 0
3 4 5 6 7 8 9 10 11 12 13 14 15 16 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Input Voltage (V) D013
Input Voltage (V) D016
Vout = 5 V resistive load Vout = 5 V after start-up with
PG = high
Figure 40. Typical Start-up Current
Figure 41. Maximum Load Current vs Input Voltage
Figure 42. Load Transient Response Figure 43. Load Transient Response
Figure 46. Output Voltage Ripple Figure 47. Output Voltage Ripple
11 Layout
L1
GND GND
CIN COUT
C1 C4
L2
PGND
L1
VIN VOUT
VIN
EN
VSEL
FB2
FB
R3 VOUT
VAUX
PS/S
GND
PG
R1
R2
CVAUX
Figure 49. EVM Layout
12.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 2-Nov-2017
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
TPS630701RNMR ACTIVE VQFN-HR RNM 15 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 0701
& no Sb/Br)
TPS630701RNMT ACTIVE VQFN-HR RNM 15 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 0701
& no Sb/Br)
TPS63070RNMR ACTIVE VQFN-HR RNM 15 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 3070
& no Sb/Br)
TPS63070RNMT ACTIVE VQFN-HR RNM 15 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 3070
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 2-Nov-2017
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Oct-2016
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Oct-2016
Pack Materials-Page 2
PACKAGE OUTLINE
RNM0015A SCALE 4.000
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
2.6 A
B
2.4
3.1
2.9
1 MAX C
SEATING PLANE
0.05
PKG 0.08 C
0.00
2X 0.725 2X 0.775
2X 0.5 (0.2) TYP
5 7 8 2X (0.25)
0.5 TYP
4 1.6
1.4
9
SYMM
1.5 1
11
1.25
1 2X
1.05
15 13 12 0.5
0.5 2X
8X 0.3 0.3
0.3 15X
0.2
0.1 C B A
0.05 C
4222000/A 07/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
RNM0015A VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
2X (0.75)
2X (0.725) 2X (0.525)
15 14 13 12 4X (0.6)
8X (0.6)
8X (0.25)
2X (1.35)
1
11
2X
SYMM (0.5)
(2.8)
5X (0.5) 9
4 (1.7) 3X
(0.25)
(R0.05) TYP
2X (0.25)
5 6 7 8
4X (0.25)
(0.6)
(1.15) 2X (0.775)
PKG
0.05 MIN
0.05 MAX ALL AROUND
ALL AROUND
NON SOLDER MASK SOLDER MASK
DEFINED DEFINED
PADS 1-6, 14 & 15 PADS 7-13
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
4. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
RNM0015A VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
2X (0.75)
2X (0.725) 2X (0.525)
13 12 4X (0.6)
15 14
8X (0.6)
14X (0.25)
(1.06) SOLDER MASK
3X EDGE,TYP
1
EXPOSED
METAL
11
2X
2X (0.72) EXPOSED
METAL
SYMM 10
(2.8)
(0.5)
TYP
5X (0.5)
9
4X
4 (0.14) (0.575)
(R0.05) TYP
2X (0.25)
METAL UNDER
5 6 SOLDER MASK
7 8 TYP
2X (0.388)
4X (0.25)
(1.15) 2X (1.163)
PKG
4222000/A 07/2015
NOTES: (continued)
5. For alternate stencil design recommendations, see IPC-7525 or board assembly site preference.
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