Thermal Performance Evaluation of Carbon Based Material For A Computer Heat Sink Using Finite Element Analysis

Adamson University
College of Engineering
Mechanical Engineering Department
Thermal Performance Evaluation of Carbon-based Material

for a Computer Heat Sink using Finite Element Analysis
Thesis by
De Vera, Arvin Brian M.
Guibelondo, Heinz Hayle M.
Retonel, Jayson S.
A Project Study Presented to

The Mechanical Engineering Department
Adamson University
In Partial Fulfillment of the Requirements

For the Degree of Bachelor of Science
In Mechanical Engineering
March 2018
ii
This thesis, entitled THERMAL PERFORMANCE EVALUATION OF CARBON
BASED MATERIAL FOR A COMPUTER HEAT SINK USING FINITE ELEMENT
ANALYSIS, prepared and submitted by ARVIN BRIAN M. DE VERA, HEINZ HAYLE
M. GUIBELONDO and JAYSON S. RETONEL, in partial fulfillment of the requirements
for the degree of BACHELOR OF SCIENCE IN MECHANICAL ENGINEERING is
hereby accepted.
ENGR. LESTER ALFRED M. OLASIMAN

Thesis/Dissertation Adviser
Accepted as partial fulfillment of the requirements for the degree BACHELOR
OF SCIENCE IN MECHANICAL ENGINEERING.
ENGR. BASIL ALOYSIUS P. BAUTISTA

Panel
ENGR. BIENVENIDO D. MANUNTAG

Panel
ENGR. ANTONIO P. DOROLIAT

Chairperson
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ACKNOWLEDGEMENT
We would like to express our sincere gratitude to our thesis adviser Engr. Lester
Alfred M. Olasiman for the continuous support and guidance in our research. His expertise
in the field of our study and for his enthusiasm, motivation and patience are truly
appreciated.
We would like to give our sincere appreciation for the people who are involved and
contributed their knowledge, time, and provision in writing our research paper.
For our respected panel members in sharing their valuable comments and
suggestions during the oral defense. For our family and friends who always there in our
side, provided the love, moral support and trust in everything we do. Thank you so much!
To God be the glory!

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ABSTRACT
Thermal dissipation plays an important part in the process of electronic cooling thus
the temperature reduction of an object that produces heat to prevent overheating is needed
for the reliability of the component. In order to have a better thermal dissipation for the
electronic device, a medium like a heat sink is applied. It serves as a device that is
incorporated with a fan to keep a hot component such as processor to cool down. This paper
evaluates the thermal performance of different materials applied as a heat sink in the
processor. The materials consist of the commercialized Copper (Cu) and Aluminum (Al)
and also the proposed Carbon-based materials of Graphene, Carb-Al and Pitch-based
Carbon Fibers. The geometric model used for the heatsink is a typical design which is a
rectangular base plate with dimensions 92mm x 92mm x 8mm with fins. The computer
system’s processor used a high-end Intel Core I7-7820X X-Series with a TDP of 140 Watts.
A comparative analysis of its thermal simulation and flow simulation has been presented
in this paper with the use of the SolidWorks 2016 software. Under thermal steady-state
simulation, materials applied as to the heat sink undergoes a process of heat transfer which
consists of Natural Convection and Forced Convection. It is observed that an effective
temperature distribution in the heat sink results to greater heat dissipation. Flow simulation,
certain boundaries like the air velocity, temperature of each components and the processor
are also included in the simulation. The computer system unit is being considered where
the heat sink is being attached to the processor which the thermal behavior is being studied
along with the other components. All results indicated that the selected carbon-based
material for heat sink is superior to the commercial heat sink which is led by the Graphene
Heat Sink.
v
TABLE OF CONTENTS
ACKNOWLEDGEMENT ............................................................................................................ iii

ABSTRACT ................................................................................................................................... iv
TABLE OF CONTENTS .............................................................................................................. v
LIST OF FIGURES, ILLUSTRATIONS AND DRAWINGS ................................................ viii
LIST OF TABLES ....................................................................................................................... xii
NOMENCLATURE .....................................................................................................................xiii
INTRODUCTION.......................................................................................................................... 1
1.1 Statement of the Problem .............................................................................................. 2
1.2 Objectives of the Problem ............................................................................................. 5
1.3 Significance of the Study ............................................................................................... 5
1.4 Scope and Limitation ..................................................................................................... 6
REVIEW OF RELATED LITERATURE ................................................................................... 8
2.1 Heat Sink ........................................................................................................................ 8
2.1.1 Categories of Heat Sink ......................................................................................... 8
2.1.2 Heat Sink Application............................................................................................ 9
2.2 Materials for High Thermal Conduction ................................................................... 10
2.2.1 Aluminum ............................................................................................................. 11
2.2.2 Copper................................................................................................................... 12
2.3 Carbon-based Materials .............................................................................................. 14
2.3.1 Graphene .............................................................................................................. 14
2.3.2 Carb-Al ................................................................................................................. 17
2.3.3 Pitch-based Carbon Fibers.................................................................................. 19
2.4 Finite Element Analysis ............................................................................................... 21
2.4.1 Thermal Steady-State Analysis ........................................................................... 22
2.4.2 Computational Fluid Dynamics .......................................................................... 24
2.5 Design Parameters ....................................................................................................... 24
2.5.1 Material for Heat Sink......................................................................................... 25
2.5.2 Geometric Design ................................................................................................. 26
2.5.3 Boundary Condition ............................................................................................ 27
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2.6 Related Work ............................................................................................................... 28

METHODOLOGY ...................................................................................................................... 32
3.1 Theoretical Framework ............................................................................................... 33
3.1.1 Principle of Heat Transfer .................................................................................. 33
3.1.2 Heat Load ............................................................................................................. 34
3.1.3 Conduction Cooling ............................................................................................. 35
3.1.4 Natural Convection and Radiation by Air Cooling .......................................... 36
3.1.5 Forced Convection by Air Cooling ..................................................................... 37
3.1.6 Convective Heat Transfer Coefficient ................................................................ 38
3.1.7 Governing Equation............................................................................................. 39
3.2 Conceptual Framework of the Study ......................................................................... 41
3.3 Flow Chart Diagram .................................................................................................... 42
3.4 Research Instrument ................................................................................................... 43
3.5 Data Collection ............................................................................................................. 43
3.6 Geometric Modeling .................................................................................................... 43
3.6.1 Geometric Structure of Heat Sink ...................................................................... 44
3.6.2 Geometric Structure of Computer System Unit ................................................ 47
3.7 Thermal Steady-State Simulation............................................................................... 49
3.7.1 Process of Thermal Simulation ........................................................................... 49
3.7.2 Boundary Condition for Thermal Steady-State Simulation ............................ 50
3.8 Flow Simulation ........................................................................................................... 53
3.8.1 Process of Flow Simulation ................................................................................. 53
3.8.2 General Settings and Boundary Condition for Flow Simulation..................... 54
DATA AND RESULTS ............................................................................................................... 59
4.1 Properties of Material.................................................................................................. 59
4.2 Properties of Air ........................................................................................................... 59
4.3 Component’s Specification of Computer System Unit ............................................. 60
4.3.1 Processor Specification ........................................................................................ 60
4.3.2 Fan Specification .................................................................................................. 61
4.3.3 Other Components Specification ........................................................................ 62
4.4 Thermal Steady-State Simulation............................................................................... 66
4.4.1 Heat Sink under Natural Convection ................................................................. 66
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4.4.2 Heat Sink under Forced Convection .................................................................. 68

4.5 Flow Simulation ........................................................................................................... 72
4.5.1 Computer System Unit under Maximum Operating Condition ...................... 72
4.5.2 Computer System Unit under Normal Operating Condition........................... 77
CONCLUSION ............................................................................................................................ 84
RECOMMENDATION ............................................................................................................... 86
GLOSSARIES .............................................................................................................................. 87
APPENDIXES .............................................................................................................................. 89
Temperature Distribution of Heat Sink under Natural Convection ................................... 89
Total Heat Flux Distribution of Heat Sink under Natural Convection............................... 91
Temperature Distribution of Heat Sink under Forced Convection .................................... 94
Total Heat Flux Distribution of Heat Sink under Forced Convection ................................ 96
Surface Plot: Temperature Distribution of Heat Sink under Normal Operation ............ 101
Cut Plot: Temperature Contours of CPU under Maximum Operation ........................... 104
Cut Plot: Temperature Contours of CPU under Normal Operation ................................ 109
Flow Trajectory: Movement of Air and its Velocity inside the ......................................... 114
Flow Trajectory: Movement of Air and its Velocity inside the ......................................... 116
BIBLIOGRAPHY ...................................................................................................................... 119
viii
LIST OF FIGURES, ILLUSTRATIONS AND DRAWINGS
Figure 1. Model of Computer Heat Sink ............................................................................................ 1

Figure 2. Distribution of Electronic Component Failure .................................................................. 3
Figure 3. (a) Heat sink mounted on a motherboard; (b) LED light using Heat sink ......................... 9
Figure 4. Specific heats of graphene, graphite, and diamond, ........................................................ 15
Figure 5. The two-dimensional honeycomb structure of carbon atoms in graphene along ............ 16
Figure 6. Carb-Al Block ................................................................................................................... 17
Figure 7. Thermal Conductivity and Specific Thermal Conductivity of various Carbon Fibers ..... 21
Figure 8. Temperature Distribution of Heat Sink using Thermal Steady State ............................... 23
Figure 9. Heat Flux Distribution of Heat Sink using Thermal Steady State .................................... 23
Figure 10. Post processing Results of Heat Sink using CFD ........................................................... 24
Figure 11. Typical Heat Sink ........................................................................................................... 27
Figure 12. Heat Sink with Indicated Label and Description of its Structure ................................... 33
Figure 13. Heat Transfer Principle .................................................................................................. 34
Figure 14. Heat Sink Model configured in SOLIDWORKS 2016 .................................................... 44
Figure 15. Front View of Heat Sink Model configured in SOLIDWORKS 2016 ............................ 45
Figure 16. Top View of Heat Sink Model configured in SOLIDWORKS 2016 ............................... 46
Figure 17. Side View of Heat Sink Model configured in SOLIDWORKS 2016 .............................. 46
Figure 18. Heat Sink Model with fan configured in SOLIDWORKS 2016 ...................................... 47
Figure 19. Configured 3D Model Assembly Computer System Unit ............................................... 48
Figure 20. Configured 3D Model Assembly Computer System Unit ............................................... 49
Figure 21. Meshing of Rectangular Heat Sink Model (Standard Mesh – Fine) .............................. 51
Figure 22. Location of Heat Load from the Computer’s Processor ................................................ 51
Figure 23. Surface subjected to the Convective Heat Transfer Condition in the Heat Sink ............ 52
Figure 24. Boundary Condition for the Computer System Unit....................................................... 55
Figure 25. Boundary Condition for the Computer System Unit....................................................... 55
Figure 26. Applied Heat Load under Maximum Operating ............................................................. 56
Figure 27. Applied Heat Load under Normal Operating................................................................. 57
Figure 28. Image of Intel Core I7-7820X X-Series Processor ......................................................... 61
Figure 29. Image of Mechatronics – UF92B AC Axial Fan ............................................................ 62
Figure 30. Image of ASUS ROG G11CD ......................................................................................... 62
Figure 31. Image of RAM - HyperX Fury DDR4-2666 16GB ......................................................... 64
Figure 32. Image of GPU – PNY GeForce GTX-1050 2GB G DDR5 ............................................. 64
Figure 33. Image of PSU – ASUS X-30GP ...................................................................................... 65
Figure 34. Hard Drive – Seagate Firecuda ST1000DX002 – 3.5 .................................................... 65
Figure 35. Optical Drive – ASUS DRW-24B1ST ............................................................................. 66
Figure 36. Temperature Distribution of Graphene Heat Sink under Natural Convection .............. 66
Figure 37. Total Heat Flux Distribution of Graphene Heat Sink .................................................... 67
Figure 38. Temperature Distribution of Graphene Heat Sink under Forced Convection ............... 68
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Figure 40. Comparison of Maximum Temperature of Heat Sink using ........................................... 71
Figure 41. Comparison of Maximum Temperature of Heat Sink using ........................................... 72
Figure 42. Flow Simulation: Temperature Distribution of .............................................................. 72
Figure 43. Cut Plot 1 – Graphene Heat Sink: Temperature Contours ............................................ 73
Figure 46. Flow Trajectory – Graphene Heat Sink: Movement of Air ............................................ 75
Figure 47. Flow Simulation: Temperature Distribution of .............................................................. 77
Figure 51. Flow Trajectory – Graphene Heat Sink: Movement of Air ............................................ 79
Figure 52. Maximum Temperature of the Heat Sink under ............................................................. 81
Figure 53. Maximum Temperature of the Processor ....................................................................... 82
Figure 54. Temperature Distribution of Aluminum Heat Sink under Natural Convection .............. 89
Figure 55. Temperature Distribution of Copper Heat Sink under Natural Convection .................. 89
Figure 56. Temperature Distribution of Carb-Al Heat Sink under Natural Convection ................. 90
Figure 57. Temperature Distribution of Graphene Heat Sink under Natural Convection .............. 90
Figure 58. Temperature Distribution of Pitch-Based Carbon Fiber .............................................. 91
Figure 59. Total Heat Flux Distribution of Aluminum Heat Sink .................................................... 91
Figure 60. Total Heat Flux Distribution of Copper Heat Sink under Natural Convection ............. 92
Figure 61. Total Heat Flux Distribution of Carb-Al Heat Sink under Natural Convection ............ 92
Figure 63. Total Heat Flux Distribution of Pitch-Based Carbon Fiber .......................................... 93
Figure 64. Temperature Distribution of Aluminum Heat Sink under Forced Convection............... 94
Figure 65. Temperature Distribution of Copper Heat Sink under Forced Convection ................... 94
Figure 66. Temperature Distribution of Carb-Al Heat Sink under Forced Convection .................. 95
Figure 67. Temperature Distribution of Graphene Heat Sink under Forced Convection ............... 95
Figure 68. Temperature Distribution of Pitch-Based Carbon Fiber ............................................... 96
Figure 69. Total Heat Flux Distribution of Aluminum Heat Sink .................................................... 96
Figure 70. Total Heat Flux Distribution of Copper Heat Sink ........................................................ 97
Figure 71. Total Heat Flux Distribution of Carb-Al Heat Sink ....................................................... 97
Figure 73. Total Heat Flux Distribution of Pitch-Based Carbon Fiber Heat Sink ......................... 98
Figure 74. Temperature Distribution of Aluminum Heat Sink under Maximum Operation ............ 99
Figure 75. Temperature Distribution of Copper Heat Sink under Maximum Operation ................ 99
Figure 76. Temperature Distribution of Carb-Al Heat Sink under Maximum Operation ............. 100
Figure 77. Temperature Distribution of Graphene Heat Sink under Maximum Operation .......... 100
Figure 78. Temperature Distribution of Pitch-Based Carbon Fiber ............................................. 101
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Figure 79. Temperature Distribution of Aluminum Heat Sink under Normal Operation .............. 101
Figure 80. Temperature Distribution of Copper Heat Sink under Normal Operation .................. 102
Figure 81. Temperature Distribution of Carb-Al Heat Sink under Normal Operation ................. 102
Figure 82. Temperature Distribution of Graphene Heat Sink under Normal Operation .............. 103
Figure 83. Temperature Distribution of Pitch-Based Carbon Fiber ............................................. 103
Figure 84. Cut Plot 1 - Aluminum: Temperature Contours in Front Plane .................................. 104
Figure 85. Cut Plot 2 - Aluminum: Temperature Contours in Right Plane ................................... 104
Figure 86. Cut Plot 3 - Aluminum: Temperature Contours in Top Plane ..................................... 104
Figure 87. Cut Plot 1 - Copper: Temperature Contours in Front Plane ....................................... 105
Figure 88. Cut Plot 2 - Copper: Temperature Contours in Right Plane ....................................... 105
Figure 89. Cut Plot 3 - Copper: Temperature Contours in Top Plane .......................................... 105
Figure 90. Cut Plot 1 – Carb-Al: Temperature Contours in Front Plane ..................................... 106
Figure 91. Cut Plot 2 – Carb-Al: Temperature Contours in Right Plane...................................... 106
Figure 92. Cut Plot 3 – Carb-Al: Temperature Contours in Top Plane ........................................ 106
Figure 93. Cut Plot 1 – Graphene: Temperature Contours in Front Plane .................................. 107
Figure 94. Cut Plot 2 – Graphene: Temperature Contours in Right Plane................................... 107
Figure 95. Cut Plot 3 – Graphene: Temperature Contours in Top Plane ..................................... 107
Figure 96. Cut Plot 1 – Pitch-Based Carbon Fiber: ...................................................................... 108
Figure 97. Cut Plot 2 – Pitch-Based Carbon Fiber: ...................................................................... 108
Figure 98. Cut Plot 3 – Pitch-Based Carbon Fiber: Temperature Contours in Top Plane .......... 108
Figure 99. Cut Plot 1 - Aluminum: Temperature Contours in Front Plane .................................. 109
Figure 100. Cut Plot 2 - Aluminum: Temperature Contours in Right Plane ................................. 109
Figure 101. Cut Plot 3 - Aluminum: Temperature Contours in Top Plane ................................... 109
Figure 102. Cut Plot 1 - Copper: Temperature Contours in Front Plane ..................................... 110
Figure 103. Cut Plot 2 - Copper: Temperature Contours in Right Plane ..................................... 110
Figure 104. Cut Plot 3 - Copper: Temperature Contours in Top Plane ........................................ 110
Figure 105. Cut Plot 1 – Carb-Al: Temperature Contours in Front Plane ................................... 111
Figure 106. Cut Plot 2 – Carb-Al: Temperature Contours in Right Plane.................................... 111
Figure 107. Cut Plot 3 – Carb-Al: Temperature Contours in Top Plane ...................................... 111
Figure 108. Cut Plot 1 – Graphene: Temperature Contours in Front Plane ................................ 112
Figure 109. Cut Plot 2 – Graphene: Temperature Contours in Right Plane................................. 112
Figure 110. Cut Plot 3 – Graphene: Temperature Contours in Top Plane ................................... 112
Figure 111. Cut Plot 1 – Pitch-Based Carbon Fiber: .................................................................... 113
Figure 112. Cut Plot 2 – Pitch-Based Carbon Fiber: .................................................................... 113
Figure 113. Cut Plot 3 – Pitch-Based Carbon Fiber: Temperature Contours in Top Plane ........ 113
Figure 114. Flow Trajectory – Velocity: Using Aluminum Heat Sink ........................................... 114
Figure 115. Flow Trajectory – Velocity: Using Copper Heat Sink ............................................... 114
Figure 116. Flow Trajectory – Velocity: Using Carb-Al Heat Sink .............................................. 115
Figure 117. Flow Trajectory – Velocity: Using Graphene Heat Sink ........................................... 115
Figure 118. Flow Trajectory – Velocity: Using Pitch-Based Carbon Fiber Heat Sink ................. 116
xi
Figure 119. Flow Trajectory – Velocity: Using Aluminum Heat Sink ........................................... 116
Figure 120. Flow Trajectory – Velocity: Using Copper Heat Sink ............................................... 117
Figure 121. Flow Trajectory – Velocity: Using Carb-Al Heat Sink .............................................. 117
Figure 122. Flow Trajectory – Velocity: Using Graphene Heat Sink ........................................... 118
Figure 123. Flow Trajectory – Velocity: Using Pitch-Based Carbon Fiber Heat Sink ................. 118
xii
LIST OF TABLES
Table 1. Physical Properties of Copper ........................................................................................... 13

Table 2. Properties of Graphene ...................................................................................................... 15
Table 3. Performance comparison of Carb-Al TM composite to commercial materials ................. 18
Table 4. Functional properties of pitch-based carbon fibers .......................................................... 20
Table 5. Properties of commercially available high elasticity-modulus.......................................... 21
Table 6. Range of Geometric Parameters ........................................................................................ 27
Table 7. Operation conditions of the CPU....................................................................................... 28
Table 8. Typical Values of the Heat Transfer Coefficient of Fluid .................................................. 39
Table 9. Geometric Variables of Heat Sink Model .......................................................................... 44
Table 10. General Settings and Boundary Condition for Thermal Steady-State Simulation........... 50
Table 11. General Settings for Flow Simulation.............................................................................. 54
Table 12. Applied Material and its Designated Heat Sources ......................................................... 58
Table 13. Properties of Material for Heat Sink ............................................................................... 59
Table 14. Properties of Air at 30°C ................................................................................................. 60
Table 15. Different Heat Load of High End Processors .................................................................. 60
Table 16. Fan Specification ............................................................................................................. 61
Table 17. ASUS ROG G11CD’s Component Specification ............................................................. 63
Table 18. Comparison of the Maximum and Minimum Numerical Results ..................................... 70
Table 19. Comparison of the Maximum and Minimum Numerical Results ..................................... 70
Table 20. Flow Simulation: Global and Volume Goals of the ......................................................... 76
Table 21. Flow Simulation: Global and Volume Goals of the ......................................................... 81
xiii
NOMENCLATURE
FEA – Finite Element Analysis
FEM – Finite Element Method
CAD – Computer Aided Design
LED – Light Emitting Diode
CPU – Central Processing Unit
IC – Integrated Circuit
CFD – Computational Fluid Dynamics
TDP – Thermal Design Power
RAM – Random Access Memory
GPU – Graphics Processing Unit
PSU – Power Supply Unit

CHAPTER 1
INTRODUCTION
Heat sink, it is a thermal dissipation device comprised of a mass of material that is
thermally coupled to a heat source to conduct thermal energy away from the heat source.
It typically used for cooling electronics components, include thermally conductive base
plate that interfaces directly with the device to be cooled and set of plate or pin fins
extending from the base plate. In adding fins to the heat sink, the surface area with contact
in air escalate, which increase the heat transfer efficiency between the heat source and
ambient air. The typical design of a heat sink used for a computer shown in Figure 1, the
material used for the structure is aluminum.
Figure 1. Model of Computer Heat Sink

(Source: S. Jackson, WTWH Media, LLC, 2017)
2
In today’s world, a lot of innovation in different materials are develop with its own
different properties. Carbon-based material demonstrates an exceptional property such as
high strength, stability, resistance to corrosion and especially an excellent electrical and
thermal conduction. In possession of these unique, it used in a wide range of fields
including biology, energy storage, medicine and specially heat applications. The industry
still encounters challenges regarding in the synthesis, uniformity and manufacturability in
the growth of carbon materials despite of numerous advances in the past decades.
The carbon-based material shows an excellent property of thermal conductivity that
can compete the common heat conducting materials. Many industries attempt to use these
materials in enhancing the dissipation of heat, the results are implausible although the
process of making the material should be thorough. Carbon-based material like graphene
can compete and may exceed aluminum and copper in thermal conductivity.
1.1 Statement of the Problem
At the present time, the rising development of technology in the world continues
and the everyday life of people depends on electronics. According to (Visser & Gauche,
1996) , current estimates that over 55% off failures in electronic components are due to
high operating temperatures. One of these are computers that we use for online business
or transaction, researching, browsing, and even gaming. Heat must be efficiently
removed; to prevent the system from being damaged or unstable.

3
Electronic Component Failure
4% 3%
22%
52%
19%
Temperature Humidity Vibration Dust Other
Figure 2. Distribution of Electronic Component Failure
According to (David, 2004), failures of electronic components may related to the
environmental factor considering the temperature, humidity, vibration, dust, and etc.
The handbook shows that every rise of temperature in the system results to the
decreasing reliability of the electric component. The temperature contributes serious
cause of failure in electronic components that leads to overheating. Also, a study from
(VORTEC: Innovative Compressed Air Technologies, 2014), states that high
temperatures cause over 52% of electronic equipment failures. The Figure 2 shows the
distribution of the common electronic component failure which indicates that the
temperature (overheating) has the highest percentage among the other causes.
4
Heat sinks are frequently used to dissipate heat from the surface of an electric
component to avoid overheating. Computers uses heat sink to prevent the overheating
of the processor. In order to provide a better performance, the researchers come up with
the idea of replacing the common material used in heat sink. First, Copper use as the
first material for the heat sinks and because of its high thermal conduction, but due to
its heaviness and expensiveness, innovators replace the copper to aluminum. Although
aluminum material has a less thermal conductivity, compare to copper, heat sink design
should consider the weight because it is design to attach vertically to the processor.
Innovators optimize the aluminum heat sink by configuring the geometric structure.
(Chung, 2001) The optimizing of the geometric structure is not enough to handle the
high-end computers, so they came up with a heat sink with liquid cooling but it’s totally
expensive as you compare with the conventional heat sink.
Modern technology manufacturers nowadays are popularly using aluminum and
copper as heat sink. Aluminum’s properties provides best in composition especially
when it comes to heat transfer and popularly used because it is lightweight while the
latter performs above average due to high thermal conductivity but its heaviness is its
major drawback. The manufacturers are still dependent in using the common materials
in manufacturing a heat sink even though that the performance of the computer may
suffer when experiencing overheat. The performance of the computer can efficiently
maximize if it has a good heat dissipation. This study will evaluate an applicable
material for replacing the heat sink’s common material.

5
1.2 Objectives of the Problem
This study aims to analyze the thermal performance of a heat sink composed of
typical material and carbon-based material using Finite Element Analysis. The study
further intends to determine the possibility of replacing the commercially used material
by carbon-based material.
Specifically, it will:
 Design a geometric model representation of computer heat sink.
 Simulate the thermal performance of computer heat sink using Thermal
Steady-State and Flow Simulation analysis.
 Compare which carbon-based material is effective to be used for the
computer heat sink in replacing the commercial used material.
1.3 Significance of the Study
This study intends to provide information about how these carbon-based
materials have the potential to outstand the commercially available heat sink referring
to thermal performance. The researchers see the importance of carbon-based material in
improving the thermal performance of electronics such as computer. Design engineers
will get a better understanding on how these materials can be also applied in heat sinks
and other system deal with heat application. Lastly, this study will serve as a reference
and will give knowledge for the future researchers who will conduct a study related to
this matter.
6
1.4 Scope and Limitation
This study tested and compared the results of the thermal performance of
carbon-based materials such as Carb-Al, Pitch-based Carbon Fiber, and Graphene along
with the conventional materials like aluminum and copper heat sinks using FEA. The
heat sink’s geometrical model refers from a typical design which consists of a
rectangular baseplate and rectangular fins. The simulation process will involve a thermal
steady-state and flow simulation analysis of the heat sink with dimensions and
components that generate heat are also being considered. The thermal steady-state has
force convection and natural convection while the flow simulation has a conditions of
maximum and normal operation of the system unit. The study aims to prove if these
carbon-based materials can be a possible solution to increase the heat sink’s thermal
dissipation. The cooling method applied in the computer system unit is forced
convection. Though the study is using a high-end processor which requires liquid
cooling, it is being opt to use the aforementioned method to further test the heatsink
material’s capability to show its thermal dissipation in normal usage scenarios.
The researchers only used the thermal properties of the materials especially the
carbon-based ones that can be formed into a heatsink. The material’s composition will
not be discussed in this paper. It is only applied in the form of a heatsink attached to the
processor and being simulated in SOLIDWORKS to obtain the objective. Also,
fabrication of a geometric model of heat sink is not intended in this paper. The
researchers are not going to discuss the different structure of heat sink. This study limits
7
the material consideration in terms of thermal properties for the simulation of the heat
sink in which carbon-based are chosen. This study only intends to simulate the carbon-
based geometric model of a heatsink along with the conventional materials using FEA.
CHAPTER 2
REVIEW OF RELATED LITERATURE
This chapter indicates relevance at related ideas, facts, and studies provide
groundwork of the proposed study.
2.1 Heat Sink
Heat sink is a device mounted in the heat source component to enhance the thermal
dissipation. It is important component for a cooling design system that applies in hot
environment. According to (Kansal & Laad, 2015), heat sink is a passive heat exchanger
that cools a certain device (source of heat) by dissipating the heat to the ambient
temperature. Heat sink and heat spreaders are kind of heat exchanger but differs from
the geometrical structure. Heat spreaders have a large and flat surface of the top of the
component, while the heat sinks are modelled to maximize the surface area and air flow
by adding pins to the top surface of structure.
2.1.1 Categories of Heat Sink
According to (Lee, 1995), there are different types of heat sink that
removes heat from its source. The mechanism and design of heat sinks are based
on categories for different kind of applications. The first category is the passive
heat sink, which is used in dissipating heat of its own without any supply of air
flow. The second one and commonly used is the active heat sink, used to remove
high temperatures in the source and blows air with fans to give air flow, this type
of heat sink includes force convection. Another category of heat sink is the liquid
9
cooled plates which have a design of milled passages in brazed assemblies to
allow pumped water, oil or any type liquid that dissipates heat. The last category
of heat sink is the phase change recirculating system which is more advance than
the other categories. The recirculating system of the phase-change has a two phase
mechanism that employs a set of boiler and condenser in passive. This category
also has solid-to-liquid system which is used for restraining a transient
temperature gradient.
2.1.2 Heat Sink Application
Heat sinks have a wide range of applications deals in heat dissipation and
used around the world. It is extensively used in industrial control, electronic
cooling, telecommunications, and even automotive components. These
components are usually use in high power semiconductor like diodes, thyristor,
amplifiers, integrated circuits, microprocessor and etc.
(a) (b)
Figure 3. (a) Heat sink mounted on a motherboard; (b) LED light using Heat sink
(Source: Kansal & Laad, 2015; Sri Channamallikarjun, 2014)
10
Most precisely, CPU cooling, power LED cooling, and audio amplifiers
requires an effective passive heat sink for an improved thermal performance. The
heat sink is used to increase the surface area of the component to dissipate the heat
effectively and maintain the processor temperature under safe operations.
According to (Choi, Jeong, Yoo, & Seo, 2012), the typical permissible
operating temperature of the processor is 70 °C. The performance and reliability
of the processor may decrease by 10% for every 2 °C increase above the
permissible operating temperature. Although the main objective of the heat sink
is to keep the processor’s temperature below the critical limit which is 100 °C for
a reliable operation.
2.2 Materials for High Thermal Conduction
The electronics part’s reliability is greatly important particularly the thermal
considerations for the continuous progress of technology development. In the industry
of electronics and mechanical, in order to conduct heating or cooling especially in
electronic devices such as laptops or high-end computers, materials with high thermal
conductivity is essential. Nowadays, things are getting into miniature due to
technological advancement thus increasing the power of microelectronics. High end
computer processors that are superb in performance are producing heat more than the
standard are emerging in the market. (Chung, 2001), stated that the key to reliability
when it comes to these problems is heat dissipation. Heat dissipation is no stranger
process in the electronic world. This is the major process where all processors especially
11
functioning in high speeds that produces heat must be dissipated in order to avoid
overheating. Problems about heat dissipation are emerging that nowadays, engineers
and researchers are studying about how to efficiently remove heat from semiconductors.
Materials like diamond, metal matrix composites and carbon composite matrix are very
expensive but are beyond capable of performing in thermal conduction. Heat sinks must
have low thermal expansion due to low semiconductor of chips and their substrates
therefore high thermal conducting materials must be low in value of coefficient in
thermal expansion.
2.2.1 Aluminum
Heat sinks are generally made of metals. Aluminum is the most common
metal used in production of heatsinks applied in computers and other electronic
devices. According to (Cobden & Banbury, 1994), Aluminum is one of the most
common metal on earth and it covers about eight percent of the earth’s crust and
is the third most known element to man. This metal is best known for its
outstanding lightness with an atomic weight of 26.98 and specific gravity of 2.70,
approximately one-third the weight of other commonly used metals. Pure
aluminum has a thermal conductivity of 244 W/mK with the ranging temperature
of 0-100 degrees Celsius. When it comes to coefficient of thermal expansion,
aluminum is affected by their nature of constituents’ due to presence of other
materials like silicon and copper which reduces expansion while magnesium
increases it so that’s why the value varies. The value for common commercially
wrought alloys 23.5 x 10-6 /K for 4.6% Cu aluminum alloy to 24.5 x10-6 /K for
12
4.5 % Mg aluminum alloy. The melting point of this element is sensitive to purity,
e.g. for 99.99% pure aluminum at atmospheric pressure it is 660 degrees Celsius
but this reduces to 635 degrees Celsius for 99.5% commercial pure aluminum. It
has a relatively high specific heat when compared with other metals on a weight
basis, i.e. 921 J/kg at 1000 °C which is higher than that of any common metal.
(Sheasby & Pinner, 2001) stated that aluminum has three main properties
which is its low density with the approximate value 2.70, because of heat
treatments and appropriate alloying, high mechanical strength and high corrosion
resistance of the metal is gained. Also, the properties of the metal are high in
thermal and electrical conductance, high-scrap value and ductility which result to
low fabrication cost. Aluminum has been widely used in applications from the
very thin foil material in the packaging industry, ductile materials for drinking
containers, used in electrical purposes for high conductance alloys to relatively-
low strength alloys in the building industry and also for high strength materials
for aircraft, and armored vehicles.
2.2.2 Copper
Copper is widely used whenever high electrical or thermal conductivity is
required. It has an excellent electrical and thermal conductivities, exhibit good
strength and formability, have outstanding resistance to corrosion and fatigue, and
are generally nonmagnetic.

13
Pure copper is defined as having a minimum content of 99.3%. (Chung,
2001) said that this metal is a noble metal and a transitional element. Copper is a
good thermal conductor with a thermal conductivity of 398 W/mK but has high
coefficient of thermal expansion of 16.8 x 10-6 cm/cm°C Since it is viable to be
produced as a heatsink, its major drawback is its high density of 8.96 g/cm3 that
makes it heavy and is costly in production. Advantage of this material over
aluminum is that its non-reactivity with carbon, so carbon is a highly suitable for
copper and its melting point is much higher for about 1083 degrees Celsius when
not alloyed. The physical properties of the copper can be seen in Table 1.
Table 1. Physical Properties of Copper

(Source: Amruthaluri, 2007)
Property English Metric
Value Units Value Units
Atomic Number 29
Atomic Weight 63.54
Density 0.322 lb/in3 8.92 g/cm3
Melting Point 1981 °F 1083 °C
Boiling Point 4703 °F 2595 °C
Latent Heat of Fusion 88 Btu/lb 205 J/g
Linear Coefficient of Thermal Expansion at: 16.8 x
9.33 x 10-6 In/in°F cm/cm°C
77°F - 212°F (25°C - 100°C) 10-6
Specific Heat (Thermal Capacity) at:

68°F (20°C) 0.0921 Btu/lb °F 0.386 J/g°C
212°F (100°C) 0.0939 Btu/lb °F 0.393 J/g°C
Thermal Conductivity at: W

68°F (20°C) 227 Btu ft/ft2hr °F 3.94 cm/cm2°C
212°F (100°C) 223 Btu ft/ft2hr °F 3.85 W
cm/cm2°C
High conductivity coupled with intrinsic strength, formability and
corrosion resistance make copper alloys unique as conductors of electricity –

14
making them ideal for connectors and other electrical/electronic products. Wide
array of applications where copper and copper alloys provide superior services.
This includes indoor and outdoor architectural components, freshwater supply
lines and plumbing fixtures, heat exchangers and condensers, freshwater and
seawater marine hardware, industrial and chemical plant process equipment,
electrical wire and cable, printed circuit boards and industrial products.
2.3 Carbon-based Materials
The development of materials in terms of thermal analysis for high-speed
computers has led to achieve new and reliable methods of thermal management.
Temperature control is the number one cause of failure in electronics. Carbon based
materials are being studied by scientists and engineers on how these materials are viable
and could shape the future of electronic cooling.
2.3.1 Graphene
According to (Pop, Varshney, & Roy, 2012), Graphene is a two-
dimensional (2D) material, formed from a lattice of hexagonally arranged atoms.
Its term is simply coined from a single layer of graphite though other may describe
it as a bilayer or tri-layer graphene. Most thermal properties of graphene are
derived from graphite but bears the nature of the highly anisotropic crystal. (Sur,
2012) said that Graphene today is the most attractive carbon nanomaterial due to
its excellent electrical, mechanical, electronic, thermal and optical properties.
Single graphene sheets constituting graphite show intrinsically high thermal

15
conductivity of about 800W/mK or higher (theoretically estimated to be as high as
5300W/mK). The theoretical physical properties of graphene shown in Table 2.
Table 2. Properties of Graphene

(Source: Sur, 2012)
Some Basic Properties Graphene

Young’s Modulus ~1100 GPa
Fracture Strength 125 GPa
Thermal Conductivity ~5000 W m-1K-1
Mobility of charge carrier 2 x 105 cm2 V-1 s-1
Specific Surface area 2630 m2 g-1
Figure 4. Specific heats of graphene, graphite, and diamond,

all dominated by phonons at temperatures above ∼ 1 K. Lines
(Source: Pop et al., 2012)
According to (Pop et al., 2012), various studies are being conducted on
how graphene works in terms of providing a good thermal conductivity from a

16
room temperature that give a value highly as 2000-4000W/mK in free-suspended
samples.
(Chung, 2001) positively stated Graphene often holds advantage over
other materials because of higher thermal conductivity. Higher conductivity could
suggest a very good heat sinking and could provide lower temperature rise during
operation. In terms for comparison, natural diamond’s thermal conductivity is
approximately 2200 W/mK at a room temperature (that of isotopically purified
diamond is 50% higher, or ∼ 3300 W/mK). However, diamonds are attractive with
high thermal conductivity and low coefficient of thermal expansion but is
relatively scarce and expensive.
(a) (b)
Figure 5. The two-dimensional honeycomb structure of carbon atoms in graphene along

with the high-resolution transmission electron (Source: Sur, 2012)
Properties of graphene has been explored and it has proven its versatility
when it comes to applications ranging from electronic devices to electrode
materials. Aside from heat conduction, its outstanding properties in electronics

17
allowing electricity to flow rapidly through materials. (Sur, 2012) stated that
graphene in the near future could somehow replace Silicon as the substance for
computer chips in ultra-fast and quantum computers operating in terahertz speeds.
2.3.2 Carb-Al
Carb-Al is a nanocomposite carbon material which is a combination of
Carbon and Aluminum. A major technical advantage of this material is its
coefficient of thermal expansion (CTE) matching to materials used within the
semiconductor industry. The Figure 6 show the physical structure of a Carb-Al
in a block formation.
Figure 6. Carb-Al Block

(Source: Yang, Novak, Fink, Brookover, & Jiang, 2009)
According to the study of (Yang et al., 2009), this composite is made up
of 80% carbonaceous matrix and dispersed metal component of 20% aluminum
material which is considered a sophisticated composite with a high thermal

18
conductivity and excellent diffusivity. Manufactured using in a proprietary
process, this was produced out of commercially available graphite particles and
placed it in a high thermal temperature press. Out of this process, a porous carbon
backbone was produced. After the carbonaceous matrix, the study stated that
molten aluminum was injected into the porous carbon structure with some small
amount of silicone additive that enhances phonon coupling and inhibits the
formation of aluminum carbide. Without the additive, the material would be
insulating and would not achieve the thermal diffusivity.
The physical properties of the Carb-Al material can be seen in Table 3.
The table shows that the nanocomposite outstands the conventional materials
available in the market. Different from the existing materials, the study shows that
this composite has superior thermal properties and through the use of aluminum,
it is simply cost-effective.
Table 3. Performance comparison of Carb-Al TM composite to commercial materials

(Source: Yang et al., 2009)
SiC Matrix Aluminum Copper Carb-Al

Constant Units
AlSiC(55) AlSiC(70) Al1060H12 C1020 Al-C400
Thermal Diffusivity cm2/sec - 0.88 0.84 1.1 2.55
Thermal
W/mK 240 270 203 390 425
Conductivity
Coefficient of
1/K 10x10-6 7x10-6 24x10-6 17x10-6 7x10-6
Thermal Expansion
Electric Resistivity µΩ-cm 3.0 4.0 2.8 1.7 4.0
Specific Heat J/gK 1.0 1.0 1.0 0.5 0.75
Specific Gravity g/cm3 2.9 3.0 2.7 8.9 2.3
Bending Strength MPa 350 380 80 350 40
Young’s Modulus GPa 200 265 70 119 12
19
Thermal diffusivity is an important factor in rapid and fast heat transfer
in a substance. The Carb-Al’s speed to remove heat from a heat source is two to
three times higher than existing materials. The study conducted noted that this
material is lighter than Aluminum and has a thermal conductivity of 425 W/mK
which removes heat energy from a heat source to its surroundings even higher
than copper. This is potentially useful in manufacturing heat sink applications.
2.3.3 Pitch-based Carbon Fibers
From (Newcomb, 2016), Carbon fibers are being utilized as a reinforcing
material due to its high strength and high modulus of elasticity. He also stated that
the first carbon fiber filaments was represented in Thomas Edison’s incandescent
light bulb. This is a unique material to the extent that its properties span a wide
range of thermo-physical properties that can be tailored to the desired application,
allowing for a vast range of material properties. By increasing the final heat
treatment temperature of poly-acrylonitrile (PAN) based carbon fibers, increases
in tensile modulus, electrical conductivity, and thermal conductivity can be
achieved. Carbon fibers are composed mainly of carbon atoms.
Table 4 shows that pitch-based carbon fibers has an extremely high
thermal conductivity of about 2400 W/mK. It is concluded that pitch-based carbon
fibers with high modulus possess a thermal conductivity much higher than other
materials, especially when it comes to per unit weight. But according to (Huang,
2009) commercially pitch-based carbon fibers has thermal conductivity of 700

20
W/mK and high specific modulus of elasticity. Thermal conductivity of this
material is twice than that of copper which is a typical material. Carbon fiber can
be solely processed in the form of a heating heat dissipating plates. (Arai, 2001)
also stated that the superior thermal conductivity and lightweight attracts public
attention. Applications of this materials are common in super- high temperature
services in space and aircraft.
Table 4. Functional properties of pitch-based carbon fibers

(Source: Arai, 1993)
Chemical Properties Higher acid and alkali resistance than PAN-based carbon fibers
Low Coefficient of Thermal Expansion and High Thermal
Thermal Properties
Conductivity
Electromagnetic High Electrical Conductivity (Magnetic Shielding Effect) Large
Properties X-ray transmission
According to (Arai, 1993), aside from this fiber that produces high
strength and high modulus of elasticity, pitched-based carbon fibers produced
from mesophase pitch features excellent thermal conductivity as a functional
property. Other properties of this material are mainly derived from carbon fiber’s
well grown graphite crystal. Table 5 show the data comparison of Eskainos
pitched based carbon fiber along with Thornel P-120. The Figure 7, located below
show specific thermal conductivity and thermal conductivity of different material
in a bar graph representation.

21
Table 5. Properties of commercially available high elasticity-modulus

pitch based carbon fibers. (Source: Arai, 1993)
Eskainos Thornel
Property
NU-80 P-120
Tensile elasticity modulus (GPa) 785 827
Tensile Strength (GPa) 3.23 2.20
Density (kg/m3) 2180 2180
Graphite layer plane spacing d002 (mm) 0.3393 0.3374

Graphite layer stacking thickness LC (mm) 21.8 28.6
Figure 7. Thermal Conductivity and Specific Thermal Conductivity of various Carbon

Fibers
(Source: Arai, 1993)
2.4 Finite Element Analysis
Finite Element Analysis is used for optimizing and evaluating of new designs
and concepts, and substantiate the qualification performance of the design. This type of
analysis is provision in a CAD software deals in a precise mathematical calculation for

22
the approximate solution. The complex partial differential equations described the
behavior of the design or system, thus a set of linear equation have been created from
the complex partial differential equations, and using a standard technique of matrix
algebra the problem will be easily solved. The CAD software will provide tabulated
results, graphical presentation and comprehensive explanation of the behavior of the
system. According to (Hossain, Ferdous Raiyan, Sayeed, & Ahamed, 2015), this is
extensively used for accident reconstruction and forensic investigation in determining
the cause of failure. The idea of this FEA is to come up with a simpler solution for the
complicated problems and to minimize the error of system. SOLIDWORKS and
ANSYS is a standard FEA tool used within Mechanical Engineering Department at
many colleges.
2.4.1 Thermal Steady-State Analysis
Thermal analysis has two types of condition, a steady state thermal
analysis and transient thermal analysis. Thermal steady-state analysis depends on
a condition which is passive or steady to determine the temperature distribution
and other thermal extents results like thermal gradients, heat flow rates and heat
fluxes. The circumstances of the heat storage effects under a period of time does
not vary on the system. The common parameters in this type of analysis are
convection, heat flow rates, heat load, temperature boundaries and etc. Transient
thermal analysis is time dependent; it solves the problem on a condition which
subject to per unit of time (Chennakesavarao & Srihari, 2014). Figure 8 & 9, show
23
the temperature distribution and heat flux distribution of a rectangular heat sink
using thermal steady-state analysis in ANSYS application.
Figure 8. Temperature Distribution of Heat Sink using Thermal Steady State

(Source: Gupta, Venkataraman, & Nimje, 2014)
Figure 9. Heat Flux Distribution of Heat Sink using Thermal Steady State
(Source: Gupta et al., 2014)
24
2.4.2 Computational Fluid Dynamics
Computational fluid dynamics used numerical analysis with applied
mathematics and physics to solve fluid flows problem. CAD software has a CFD
application to present the movement of the fluid or gas in the system and show the
effects of the medium in the system. CFD is based on the known Navier-Stokes
equations, these governing equations describe how the velocity, pressure,
temperature, and density of a moving fluid are related. CFD normally applied in
turbines, piping systems, internal combustion engines, heat exchangers and
electric components. Figure 10 show a cross sectional view (Cut Plot) of
temperature distribution of heat sink in a computer case.
Figure 10. Post processing Results of Heat Sink using CFD

(Source: Gupta et al., 2014)
2.5 Design Parameters
In optimizing the thermal performance of the heat sink, every parameter must be
considered before designing an effective heat sink. Various parameters are needed to
25
examine in determining the total performance of the system and not only to focus in the
heat sink. Although, each parameter should go through a certain study for the
development of each design. According to the study on optimum design and selection
of heat sink, (Kumar, Kumar, & Kumar, 2013) states the following design parameters;
material used for heat sink, geometrical figures of heat sink (height and number of fins,
thickness of base plate and fins), maximum heat sink temperatures, amount of required
heat dissipation, the induced flow velocity, weight of the heat sink and even the
appearance and cost.
According to (Lee, 1995), in any type of heat sink, one of the most important
external parameters in air cooling is the flow condition which can be classified as
natural, low flow mixed, and high flow forced convection. There is no clear definition
or consensus on the flow velocity that separates the mixed and forced flow regimes. It
is generally accepted in applications, however, that the effect of buoyant force on the
overall heat transfer diminishes to a negligible level (under 5%) when the air flow
velocity exceeds beyond 1.5 to 2 m/s.
2.5.1 Material for Heat Sink
In considering a material of heat sink, (Chung, 2001) it must have a
higher thermal conductivity and lower thermal resistance for having a good
conduction to the heat source. If a heat sink possesses these properties, it can
provide a good dissipation of heat. Copper and Aluminum is normally used in

26
this application of heat sink because of its good thermal properties. In addition,
the cost, appearance, weight and machinability of material should less consider.
2.5.2 Geometric Design
Countless experiments and reports has made for the optimization of the
geometric design of heat sink. Each variable of the heat sink design varies,
(Zaghlol, Ken, Butler, Teertstra, & Culham, 2002) says that “one variable at a
time is useful for simple designs, but often fall short for real-world application”
According to (Lee, 1995), thermal performance depends on the parameters
including thermal conduction, resistance, and dimensions of geometric model,
also the airflow condition between the fins. He states that having an excessive fin
for optimizing the heat sink is risky. It can induce a high pressure drop across the
heat sink that will cause a reduction in flow velocity of air.
Typical design of heat sink is the rectangular base plate with rectangular
fins. In these design, you can determine the effects of altering the geometric
variables in the thermal distribution of heat load. The important geometric
variables are base and fin height, fin thickness and the in-between space or interval
of each fin. The Figure 11 and Table 6 shown below represent a typical heat sink
with dimensional label and value.

27
Figure 11. Typical Heat Sink

(Source: Arularasan & Velraj, 2008)
Table 6. Range of Geometric Parameters

(Source: Arularasan & Velraj, 2008)
Parameter Minimum Value Maximum Value Increment Value

Fin Height (H) 16 mm 48 mm 16
Fin Thickness (T) 0.8 mm 1.6 mm 0.4
Base Height (BH) 4 mm 12 mm 4
Fin Pitch (S) 1.5 mm 4 mm -
According to a study of (Arularasan & Velraj, 2008), an experimental
validation of simulation results also have been performed and concluded that the
efficient heat sink geometric variable is; fin height, fin thickness, base height and
fin pitch are found to be optimal at 48 mm,1.6 mm, 8 mm and 4mm respectively.
2.5.3 Boundary Condition
(Chen, Wu, & Hwang, 2008), the heat from the processor is dissipated to
the surrounding through heat sink. The fan removes the heat from the heat sink by
blowing air across its surface. The convection heat transfer is proportional to the
difference in temperatures between heat sink, this factor known as the heat transfer
28
coefficient (heff). The heat transfer coefficient is dependent on the convection rate
across the surface area of heat sink. So the higher the value of coefficient, the
higher the convection heat transfer. During operation, the convective and radiative
heat transfer is the reason of dissipation of heat.
According to (Ozturk & Tari, 2007), the radiation effect of the material
is unnecessary for forced cooling convection of CPU. The study proves that
radiation heat transfer has a minimum significant for cooling.
These are the boundary condition need to set for the operating condition
of CPU heat sink, heat transfer coefficient, ambient temperature, heat source and
volume. Table 7 shown the operation condition of CPU in a specific condition.
Table 7. Operation conditions of the CPU

(Source: (Chen et al., 2008)
Parameter Value Description
heff 300 Heat transfer coefficient when fan is in full speed operation (W/m2K)
heff 10 Heat transfer coefficient in natural convection (W/m2K)
Tamb 25 Surrounding Temperature (°C)
V 5x10-6 Volume of CPU (m3)
P 30 CPU heat source (W)
2.6 Related Work
Various works had been done using finite element method for solving heat
transfer-based problems. A study about CFD and thermal analysis of heatsink and its
29
application in CPU conducted by (Gupta et al., 2014), where the paper’s goal is to
determine the temperature distribution and heat flux of a heat sink of a desktop
computer. CFD simulation and thermal analysis is carried out with provided by
ANSYS-FLUENT software. In their work, it covered geometric parameters and design
where the desktop assembly which consists of computer chassis, a printed circuit board,
a 5 MW thermal power heat source and the heat sink made from aluminum. The paper
compared two geometric models; first is the cylindrical-finned heat sink and the other
one is with rectangular fins and concluded that the heart transfer rate of the latter is
greater than the former with the same boundary conditions thus making the rectangular
finned heatsink more efficient when it comes to temperature distribution.
The paper of (Hossain et al., 2015), Analysis of Thermal Characteristics of
Flared and Rectangular Fin Profiles by Using Finite Element Method where it tried to
analyze the temperature distribution and heat flux of a flared fin and rectangular fin
profile. The analysis was carried out in ANSYS Workbench and undergoes a process of
FEM which thermal-steady state flow is measured. Also, two different types of meshing
were used in the analysis namely Tetrahedral and Hexahedral. It resulted that tetrahedral
mesh had certain superiorities over hexahedral mesh due to less time to generate mesh,
uniformity, non-extensive calculation. The paper concluded that the increase in thermal
conductivity of fin material also increases the temperature distribution and the
performance of fin profiles can vary depending on the on circumstances where the
profiles are applied. It includes length of the fins, thermal conductivity and ambient
temperature, etc.
30
From the study of (Chennakesavarao & Srihari, 2014), they tried to optimize the
design of heat sink and reduce the weight and the size in power electronics. In their
paper, a power amplifier is applied to an army vehicle where it has modules that
generates heat of about 1440 W and they tried to use two Aluminum 6061 alloy material
heatsinks accompanied by two 300 cfm fans to dissipate the heat generated inside the
equipment and maintain temperature less than 850 degrees Celsius. Using
SOLIDWORKS FLOW SIMULATION, they managed to test amplifier heatsink in
thermal and flow simulation analysis. Modifications of the weight set against the
original design of the heatsink was conducted in their study and provided three models.
Results showed that the heatsink was optimized for more heat transfer, from 10.3kgs to
3.9kg which is lesser weight and less pressure drop with the use of flow simulation
analysis.
(Sri Channamallikarjun, 2014) studied the about the thermal analysis of CPU
using variable heat sink with base plate thickness. The study was analyzed with the use
of CFD where they compared different modifications of the thickness of base plates,
height of the fins of heat sinks with the use of aluminum and copper. They concluded
that if the base plate is selected to be copper rather than aluminum, thermal resistance
decreases but its drawback is that it will make the heatsink heavy. According to them,
increasing the thickness of the base plate makes the heatsink performance better thus,
height configurations will be considered in order to limit space.

31
(Ozturk & Tari, 2007)’s paper studied about the computational fluid dynamics
modelling of a computer chassis. They initially modeled a chassis with different
components present inside like the AGP, chipset, power supply, CPU fan, heatsink fans
and the like. CFD carried by ANSYS was the software they used for the simulation and
used FLUENT software for the post-processing. Their study used 3 commercial
heatsinks ALPHA, EVERCOOL and COOLMASTER which are primarily made of
aluminum and aluminum infused with copper at the bottom base subjected under a 70
W CPU case. The remaining two, where EVERCOOL has the higher conduction rate
because of its copper base. Their paper discussed about the dissipation of heat inside of
the CPU along with the components. Temperature distribution of the heatsinks are also
compared in their study. From the above mentioned heatsinks, the Alpha outperforms
two because of its larger surface area. It is concluded in their paper that the heat source
or processor in a computer system corresponds to the proximity of the base center of the
heat sink which makes it hot. The fan blows ambient temperature to cool down the heat
sink but because of its hub, blocking the air path, the center of the heat sink is hotter
compared to the surrounding.

CHAPTER 3
METHODOLOGY
The study will conduct a comparative analysis of different material applied in
computer heat sink by using FEA to determine the thermal performance. Through reading
research journals, articles and other scientific studies, the carbon-based material has a
potential of high thermal conductivity compared to common material and can be viable to
be used in computer heat sink. The process of solving in FEA will be based from the
research journals and articles with similar approach. The study requires the properties of
the materials proposed specifically for thermal properties, design parameters of heat sink,
and the boundary conditions of the computer heat system. The geometrical model of heat
sink will be modeled by using SOLIDWORKS software. The structural design and
dimension of the heat sink will be based on a typical design of heat sink.
The computer heat sink will be subjected to a Thermal Steady-State and Flow
Simulation analysis, which describe the behavior of structure undergoing series of tests in
practical application. After creating the geometric model, the meshing of the heat sink will
be carried out in SOLIDWORKS. Under Thermal Steady-State, the study will consider a
boundary condition for setting the simulation process which includes the heat load,
operating temperature of the processor, the ambient temperature of the system, air velocity
of fan and other parameters. Flow Simulation meanwhile solves the heat transfer problems
of the heatsink. The materials to be used in this study are the conventional Aluminum,
Copper, and the proposed carbon-based materials namely Carb-Al, Graphene and Pitch-
based Carbon Fibers. In the process, each material will conduct a series of simulation that
33
varies with the maximum working temperature of computer processor. The study will
compare and interpret the obtained results from each material. As the materials are
compared, this study will give a recommendation according to the results on which is
effective material for the computer heat sink.
3.1 Theoretical Framework
3.1.1 Principle of Heat Transfer
A heat sink transfers thermal energy from a higher temperature device to
a lower temperature fluid medium. In these system of cooling, air is the usual fluid
medium applied. (Magadum & Shamrao, 2015) Electronics device are not
working in 100% due to the production of excess heat which is harmful. The heat
produces of the component absorbed by the heat sink through conduction and
captivated temperature of heat sink is transfer to the surrounding by convection
and radiation.
Figure 12. Heat Sink with Indicated Label and Description of its Structure
(Source: Magadum & Shamrao, 2015)
34
Figure 13. Heat Transfer Principle

(Source: Cengel, 2002)
The Figure 12 shows the designated label and description for the heat
sink structure while the Figure 13 explain the heat transfer principle of the heat
sink and the temperature at different location.
3.1.2 Heat Load
The power dissipation of an electronic component is measured by the
voltage applied and the current under full-load condition which relates to the heat
load of the component. According to (Y. Cengel, 2002) the first law of
thermodynamics, the energy that enters the system is equal to the energy that
leaves the system, in a steady state condition. Therefore, the energy consumption
of the component is equal to the heat load (heat dissipation of the component).
𝑊̇𝑒 = 𝑉𝐼 = 𝐼 2 𝑅 (W) (1)
𝑄̇ = 𝑤̇𝑒 (W) (2)

35
where 𝑊̇𝑒 is the electric power consumption, 𝑉 is the voltage, 𝐼 is the
current, 𝑅 is the resistance and 𝑄 is the power dissipation or heat load.
3.1.3 Conduction Cooling
Conductive heat transfer is the transfer of heat through solid, and may
also in form of liquid and gas. The principle of heat sink considers conduction and
convection for absorbing and dissipating the heat from the component. According
to (Y. Cengel, 2002), Fourier’s law of conduction is considered, it is simplified to
a steady one-dimensional form in x-direction, shows that when there is a
temperature gradient in the body the energy moved from higher temperature
region to lower temperature region, as the atomic vibration and molecular
collision occur. It is expressed as:
𝑑𝑇
𝑄𝑐𝑜𝑛𝑑 = 𝑘𝐴 𝑑𝑥 (W) (3)
The conduction heat transfer rate is directly proportional to the thermal
conductivity of material, the cross-sectional area through which heat is
𝑑𝑇
transferred, and 𝑑𝑥 denotes as temperature gradient.
𝛥𝑇 𝛥𝑇
𝑄𝑐𝑜𝑛𝑑 = 𝑘𝐴 = (W) (4)
𝐿 𝑅
36
Thus, equation above simplified from the differential equation form of
Fourier’s law of conduction, where the heat transfer rate of conduction within a
plane layer is proportional to the thermal conductivity of material, cross-sectional
area and the temperature difference across the plane denoted as 𝛥𝑇 but inversely
proportion to the thickness of layer denoted as 𝐿.
3.1.4 Natural Convection and Radiation by Air Cooling
A heat system with natural convection is efficient since it doesn’t have
fan that depends on cooling. The effectiveness of the natural convection relies on
the passage where the air flows, narrow passage tend to slow down the air so it
become ineffective. The natural convection heat transfer is directly proportion to
the magnitude of the fluid flow rate.
̇ = ℎ𝑐𝑜𝑛𝑣 𝐴𝑠 𝛥𝑇
𝑄𝑐𝑜𝑛𝑣 (W) (5)
𝛥𝑇 0.25
ℎ𝑐𝑜𝑛𝑣 = 𝐾 ( 𝐿𝑐 ) (W/m2 · °C) (6)
𝛥𝑇 = 𝑇𝑠 − 𝑇𝑓𝑙𝑢𝑖𝑑 (7)
where 𝑄𝑐𝑜𝑛𝑣 is the natural convection heat transfer, ℎ𝑐𝑜𝑛𝑣 is the
convection heat transfer coefficient, 𝐴𝑠 is the heat transfer surface area, K is the
thermal conductivity of the specific material, 𝐿𝑐 is the length of the body along
the heat flow path, Ts is the surface temperature, and 𝑇𝑓𝑙𝑢𝑖𝑑 is the fluid
temperature.
37
In heat system, radiation heat transfer is comparable to natural
convection, that only applied to material which has an emissivity close to unity
like plastics and painted surface but emissivity is negligible to polish metal.
̇ = 𝜀𝐴𝑆 𝜎(𝑇𝑠 4 − 𝑇𝑠𝑢𝑟𝑟 4 )

𝑄𝑟𝑎𝑑 (W) (8)
where 𝑄𝑟𝑎𝑑 is the radiation heat transfer, 𝜀 is the Stefan-Boltzmann
constant whose value is (5.67 x 108 W/m·K4) or (0.1714 x 108 Btu/h·ft2·R4).
3.1.5 Forced Convection by Air Cooling
Similar to natural convection, forced convection is based on fluid
velocities or the rate of flow. Forced convection is applied in high-power electric
system due to large amount of heat to be dissipated. The higher the velocity, the
larger amount of flow rate and the higher heat transfer rate. Usually, if natural
convection is not tolerable, fan is added to blow air through the enclosure that
houses the electric component to resort a forced convection. Radiation heat
transfer is totally disregarded, because forced convection is significantly great.
Forced convection heat transfer expressed as.
𝑄̇ = 𝑚̇𝐶𝑃 (𝑇𝑜𝑢𝑡 − 𝑇𝑖𝑛 ) (W) (9)

38
where 𝑄̇ is the rate of heat transfer to the air, 𝑚̇ is the mass flow rate of
air, 𝐶𝑃 is the specific heat of air, 𝑇𝑖𝑛 and 𝑇𝑜𝑢𝑡 are the average temperature of air
inlet and exit of the enclosure, respectively.
3.1.6 Convective Heat Transfer Coefficient
The convective heat transfer coefficient of the two variables (material
and fluid) can be calculated, which is related to the equation of Nusselt number.
The force convective heat transfer coefficient of the air and the heat sink can
determine assuming that the heat sink model has a flat surface. The heat transfer
coefficient expressed as:
𝑘𝑎𝑖𝑟
ℎ= 𝐿
𝑁𝑢 (W/m2K) (10)
1 1
𝑁𝑢 = 0.664 ∙ (𝑃𝑟)3 ∙ (𝑅𝑒)2 (1) (11)
𝜌𝑉𝐿 𝑉𝐿
𝑅𝑒 = 𝜇
= 𝑣
(1) (12)
where h is the convective heat transfer coefficient, 𝑘𝑎𝑖𝑟 is the thermal
conductivity of air in W/m∙K, L is the length travelled of the fluid in m, Nu is the
Nusselt Number, Pr is the Prandtl number of air, Re is the Reynolds number, 𝜌 is
the density of the air in kg/m3, V is the mean velocity of the object relative to the
fluid in m/s, 𝜇 is the dynamic viscosity of the air in N∙s/m2, and v is the kinematic
viscosity of the air in m2/s. The Table 8 show the different typical range values of
the heat transfer coefficient of air, oil, water and steam.

39
Table 8. Typical Values of the Heat Transfer Coefficient of Fluid

(Source: Dassault Systemes SolidWorks Web Help, 2017)
Heat Transfer Coefficient

Type of Medium
(W/m2K)
Air (natural convection) 5-25
Air (forced convection) 25-250
Oil (forced convection) 60-1800
Water (forced convection) 300-6000
Water (boiling) 3000-60,000
Steam (condensing) 6000-120,000
3.1.7 Governing Equation
In this study, governing equation of fluid dynamics applied to determine
the change of unknown variables depending on time. Considering the heat transfer
principle is based upon the law of conservation of mass, momentum and energy,
the governing equation is in the form of the following; the incompressible
continuity equation, Navier-Stokes equation x-y and z direction momentum, and
energy equation together with equation of the state. According to (Tarvydas,
Noreika, & Staliulionis, 2013) “Navier-Stokes equations are used to characterize
the single-phase, heat-conducting and non-turbulent fluid flow interfaces”.
Governing equation expressed as:
Continuity Equation:
𝜕𝜌
+ 𝛻 ⋅ (𝜌𝑣̅ ) = 0 (13)
𝜕𝑡
40
The X, Y, and Z Momentum Equation:
𝜕(𝜌𝑢 ) 𝜕𝜌 𝜕𝜏𝑥𝑥 𝜕𝜏𝑦𝑥 𝜕𝜏𝑧𝑥

+ 𝛻 ⋅ (𝜌𝑣̅ ) = − 𝜕𝑥 + + + + 𝑆𝑀𝑥 (14)
𝜕𝑡 𝜕𝑥 𝜕𝑦 𝜕𝑧
𝜕(𝜌𝑣) 𝜕𝜌 𝜕𝜏𝑥𝑦 𝜕𝜏𝑦𝑦 𝜕𝜏𝑧𝑦

+ 𝛻 ⋅ (𝜌𝑣̅ ) = − 𝜕𝑦 + + + + 𝑆𝑀𝑦 (15)
𝜕𝑡 𝜕𝑥 𝜕𝑦 𝜕𝑧
𝜕(𝜌𝑤 ) 𝜕𝜌 𝜕𝜏𝑥𝑧 𝜕𝜏𝑦𝑧 𝜕𝜏𝑧𝑧

+ 𝛻 ⋅ (𝜌𝑣̅ ) = − 𝜕𝑧 + + + + 𝑆𝑀𝑧 (16)
𝜕𝑡 𝜕𝑥 𝜕𝑦 𝜕𝑧
Energy Equation:
𝜕(𝜌ℎ0 )
+ 𝛻 ⋅ (𝜌ℎ0 𝑣̅ ) = 𝜌𝛻 ⋅ 𝑣̅ + 𝛻 ⋅ (𝑘𝛻𝑇) + 𝛷 + 𝑆ℎ (17)
𝜕𝑡
Equation of the State:
𝑝 = 𝜌𝑅𝑇 (18)
where 𝜌 is the density, 𝑣̅ is the fluid velocity vector, 𝑢, 𝑣, and 𝑤 are
components of fluid velocity in x, y, and z directions, 𝑆 is the directional body
force, 𝜏 is the shear stresses, ℎ0 is the total enthalpy, 𝑘 is the thermal conductivity,
𝛷 is the dissipation term, 𝑝 is the pressure, 𝑅 is the ideal gas constant and 𝑇 is
the temperature.
41
3.2 Conceptual Framework of the Study
INPUT PROCESS OUTPUT

 Geometric Model  Geometric modeling of heat  Results
Design sink using SOLIDWORKS. Heat Flux or the dissipated
Dimension heat from the source.
 Thermal Simulation Maximum and minimum
 Material for Heat Sink temperature subjected to the
Aluminum The process where the design
parameters are set (material heat source.
Copper
Carb-Al properties and boundary
Graphene  Comparison of the different
condition). Mesh generation
Pitch-based materials used in heat sink for
is created.
Carbon Fiber the thermal performance
evaluation.
 Material Properties  Component will process
Thermal Conductivity under two analyses, Thermal  Conclusion about the results
Thermal Expansion Steady-State and Flow and recommendation for
Thermal Diffusivity Simulation analysis. future work related to this
Density study
Specific Heat  The results obtained will
Melting Point
scientifically compared to
 Boundary Condition determine the effective
Heat Load of Processor material for computer heat
Operating Temperature sink.
of CPU Component
Properties of Air
Ambient Temperature
Environmental Pressure
Convective Heat
Transfer Coefficient
Air Velocity of Fan
42
3.3 Flow Chart Diagram

43
3.4 Research Instrument
The following CAD software will use for this study:
 SOLIDWORKS software (2016 Premium Edition) – for geometrical
modelling of computer heat sink, thermal steady-state and flow simulation analysis.
3.5 Data Collection
The researchers will gather information from articles, journal, book, product
specification and other scientific study to provide a concrete reference in conducting
this study. These are the following data needed to gather the material’s thermal
properties, the typical design dimensions of computer heat sink and CPU’s component,
boundary condition or parameters for the system like heat load, convective heat transfer
coefficient, fan specification ambient temperature and environmental pressure.
3.6 Geometric Modeling
SOLIDWORKS software will be used for the geometric modeling of computer
heat sink. The design of heatsink to be used in geometric modeling is the typical
rectangular base plate with rectangular fins. The geometric variable of heat sink is based
from a case study of optimizing the thermal performance by means of altering the
dimension. (Arularasan & Velraj, 2008) concluded the efficient geometric variable for
heat sink model according to their range of dimension. The Table 9 show the dimension
of the heat sink will be used for the geometric modelling in SOLIDWORKS. The
dimension of the heat sink is obtained from a case study of determining the efficient
geometric structure in dissipating the heat for a rectangular heat sink. The dimension of
44
the geometric structure was specified in mm, the base dimension, fin height, fin
thickness and fin pitch.
Table 9. Geometric Variables of Heat Sink Model
Geometric Variables of Heat Sink Model

Base Dimension (W x L x H) 92 x 92 x 8 (mm)
Fin Height (h) 48 (mm)
Fin Thickness (t) 1.6 (mm)
Fin Pitch (x) 4 (mm)
3.6.1 Geometric Structure of Heat Sink
Figure 14. Heat Sink Model configured in SOLIDWORKS 2016

45
The Figure 14 show the geometrical isometric representation of the
rectangular plate heat sink configured in SOLIDWORKS 2016. The design is
configured based on the case study of (Arularasan & Velraj, 2008) with
modification of four screw holes in each corner having a diameter of 3.50 mm for
mounting function.
The Figure 15 – 17 show an orthographic view of configured heat sink
with dimensions in SOLIDWORKS, these are the front, top and side view. The
Figure 18 show an isometric view of heat sink mounted with a fan. The specified
fan dimension is based from the product specification of Mechatronics – UF92B
AC Axial Fans. It is selected due to the availability in the engineering database of
SOLIDWORKS Flow Simulation.
Figure 15. Front View of Heat Sink Model configured in SOLIDWORKS 2016
46
Figure 16. Top View of Heat Sink Model configured in SOLIDWORKS 2016
Figure 17. Side View of Heat Sink Model configured in SOLIDWORKS 2016
47
Figure 18. Heat Sink Model with fan configured in SOLIDWORKS 2016
(Computer Fan Dimension: 92mm x 92mm x 25mm)
3.6.2 Geometric Structure of Computer System Unit
The geometric structure of the computer system unit is built part by part.
SOLIDWORKS Assembly Modeling able to assemble the parts of the computer
system unit preferring to the selected product design (ASUS ROG G11CD). The
geometric structure uses an Air Cooling System which uses a fan mounted on a
Heat Sink. The dimension is based from the product specification of each
component.
48
Power Supply
Optical Drive
Motherboard
Hard Drive
Graphics Card RAM
Heat Sink
Figure 19. Configured 3D Model Assembly Computer System Unit

which used for SOLIDWORKS Flow Simulation
An image of a configured 3D Model Assembly Computer System Unit in
SOLIDWORKS is show in Figure 19 which identify the components of a
computer system. Note: The processor is located under the heat sink mounted with
a fan. The Model Assembly is used for determining the temperature of the heat
sink, processor and fluid under an operating condition in SOLIDWORKS Flow
Simulation. The Figure 20 also show an image of a configured 3D Model
Assembly Computer System Unit in SOLIDWORKS with cover case which
identify the fans installed in the computer and the location of vents (openings).
49
92 mm Fan
Vents
80 mm Fan
Figure 20. Configured 3D Model Assembly Computer System Unit

(with cover) which used for SOLIDWORKS Flow Simulation
3.7 Thermal Steady-State Simulation
3.7.1 Process of Thermal Simulation
 First step, it involves modeling goals of the heat sink and creating the
computational grid. This includes the design of the geometric model of the
heatsink to be used and the proposed materials to be compared.
 Second step where the numerical models, data and boundary conditions are set to
start up the solver. This includes setting up the initial conditions of the material
like the ambient temperature, identifying the heat load of the processor and
applying convection for the process.
 Third Step, is the meshing of the heat sink where applied and run the simulation.
After the simulation, the results are obtained. The data are compared using
different applied materials used in the study.

50
3.7.2 Boundary Condition for Thermal Steady-State Simulation
In simulation of thermal steady-state, it is important to determine and
select the right setting and boundary condition for your analysis. In the Table 10
show the selected settings and condition applied in the simulation. The solver
selection used the FFE-Plus Solver which is usually applied for thermal analysis.
Fine Mesh is selected for better results. The analysis will have used custom
material provided by the data gathered about the aluminum, copper and carbon-
based material. The heat power or heat load is set in to 140 watts which is the TDP
of a high-end processor. The convection coefficient is 15 W/m2K for natural
convection and 55 W/m2K for forced convection which calculated using the
Nusselt’s number equation. The selected ambient temperature for the condition is
30 °C.
Table 10. General Settings and Boundary Condition for Thermal Steady-State Simulation
General Settings and Boundary Condition
Solver Selection FFE-Plus Solver

Mesh Settings Standard Mesh (Fine)
Applied Material Custom Materials
Heat Power (Load) 140 Watts
Convection Coefficient (Natural Convection) 15 W/m2K
Convection Coefficient (Forced Convection) 55 W/m2K

Bulk Ambient Temperature 30 °C
51
Figure 21. Meshing of Rectangular Heat Sink Model (Standard Mesh – Fine)
Figure 22. Location of Heat Load from the Computer’s Processor

52
Figure 23. Surface subjected to the Convective Heat Transfer Condition in the Heat Sink
The Figure 21 show an image of meshed rectangular heat sink, the applied
mesh is set to a standard fine mesh. It is important to define the shape of a
polyhedral object which done by the meshing for the thermal steady-state
analysis. It is imperative to have better and refined mesh in order to generate
sufficient number of nodes and elements to make the computing much better.
Figure 22 – 23 show the surface where the heat load is applied and also the
surfaces where the convection coefficient is applied along with the ambient
temperature.
53
3.8 Flow Simulation
3.8.1 Process of Flow Simulation
 First step, it involves modeling goals of the computer system unit. This
includes the design of the geometric model of each part of the computer system
unit where the heat sink is assembled together with the other parts. The heat sink
(mounted with a fan) which subjected to the analysis is attached in the processor.
 Second step, the assembly of the computer system unit undergoes a flow
simulation to analyze the thermal behavior of the heat sink.
 Third step, the solver will require the setting needed for the simulation.
These includes the type of the analysis, the default fluid and its flow type, the
default solid, the wall conditions and the initial condition of the analysis.
 Fourth step, it is the critical part of the simulation where the boundary
condition should apply correctly for a reliable and efficient results. These includes
the selected material for the parts of the computer system unit, the environmental
pressure (openings of the unit where the air enters), the selected fan for the
circulation of the system, and especially the heat load or the temperature of the
components, also the setting of the mesh.
 Fifth step, the meshing and simulation of the computer system unit which
will take aa few hours for solving the applied numerical data and goals.
 Last step, the results obtained from the simulation can be interpret into
different topographies. These includes the cut plots (planar contour of
temperature), surface plot (temperature distribution of a specific component), and
the flow trajectories (the behavioral velocity of the fluid inside the system).
54
3.8.2 General Settings and Boundary Condition for Flow Simulation
It is important to determine the appropriate settings and boundary
condition for the flow simulation to provide a reliable result. The Table 11 show
the general setting used for the study. In this condition, a computer system unit is
an electronic structure which enclose by a case with air cooling ventilation. For
the flow simulation settings, an internal analysis type is selected which will study
the heat conduction of the solids. The default fluids use for the system is air with
a laminar and turbulent flow type. The default solid for the system is Aluminum
6061 which will be applied if the component’s material is not specified. The heat
transfer condition of the wall is “adiabatic”. The standard pressure and
temperature is preferred for the simulation. The mesh applied in the analysis is in
a medium setting which is Level 4, in order to reduce the processing time of the
simulation although refined mesh will give a much better results.
Table 11. General Settings for Flow Simulation
General Settings
Internal (Exclude Cavities without Flow Conditions)
Analysis Type
Heat Conduction in Solids
Default Fluids Air (Gases)
Flow Type Laminar and Turbulent
Default Solid Aluminum 6061
Wall Conditions Adiabatic Wall
Pressure: 101.325 KPa
Initial Conditions
Temperature: 20.05 °C
Global Mesh Level 4
55
Figure 24. Boundary Condition for the Computer System Unit

which Indicates the Applied Fan in the System
Figure 25. Boundary Condition for the Computer System Unit

which Indicates the Applied Environmetal Pressure in the System
56
The figures above show the boundary condition for the flow simulation
analysis of computer system unit. Three computer fans where applied to the flow
simulation, two types of 92mm diameter fan and one type of 80mm diameter fan
shown in Figure 24. Two of the computer fan serves as an external outlet which
blow the air inside the system and the other one is an internal fan specifically
applied in heat sink. The Figure 25 shows the applied environmental pressure on
the computer system unit. The environmental pressure serves as an opening or
vents where the air from the surrounding comes inside the computer system unit.
The standard environmental pressure applied in the flow simulaton is 101.325
KPa.
Figure 26. Applied Heat Load under Maximum Operating

Condition in the Computer System Unit
57
Figure 27. Applied Heat Load under Normal Operating

Condition in the Computer System Unit
The figure above show the applied heat load on each component of a
computer system unit under specific operating condition. The Figure 26 show
applied heat load under a maximum opearting condition. The temperature of each
components is subjected to its maximum temperature capacity. Figure 27 show
the applied heat load under an normal operating condition.
The Table 12 show the component list of computer system unit along
with the applied material and applied heat sources. The applied material use for
the components can be found in the engineering database of flow simulation. The
selection of material is based on a definite assumption which is relative to the
actual material used for the components. Note: The material use for the heat sink
is customize which the thermal properties of these material is obtained from the
references.
58
Table 12. Applied Material and its Designated Heat Sources

of each Component of Computer System Unit
Heat Sources
Components Solid Materials
Normal Maximum
Processor Typical FC CBGA 140 W 140 W
RAM Silicon 55 °C 85 °C
GPU Silicon 60 °C 71 W
PSU Aluminum 45 °C 50 °C
Hard Drive Aluminum 30 °C 60 °C
Optical Drive Aluminum 25 °C 45 °C
Heat Sink * - -
Motherboard PCB 4-Layers - -
Fan Epoxy Resin - -
CHAPTER 4
DATA AND RESULTS
4.1 Properties of Material
The Table 13 show the thermal properties of each material, the typical material
and carbon-based material, which will be used for the future simulation in thermal
steady-state analysis and flow simulation analysis. The data was gathered from the
journals and articles about the material that will be used and its thermal management.
Other data obtain is approximation which show in the table. In this study, the average
value of approximation is selected for the safest assumption of the properties of material.
Table 13. Properties of Material for Heat Sink
Coefficient of
Thermal Thermal Specific Melting
Thermal Density
Material Conductivity Diffusivity Heat Point
Expansion (g/cm3)
(W/mK) (cm2/sec) (J/g°K) (°C)
(cm/cm°K)
Copper 390 16.8 x 10-6 1.11 8.92 0.393 1083
Aluminum 215 24 x 10-6 0.84 2.70 0.95 635
Carb-Al 425 7 x 10-6 2.55 2.3 0.75 1173
Graphene ~ (800 - 5300) ~ (5–30) × 10-5 ~ 36.51 >1 0.83 4273
Pitch-based ~ (1.75-
~ (700-1000) 8.1 x 10-6 ~ 3.49 1.3 3675
Carbon Fibers 2.00)
4.2 Properties of Air
The Table 14 show the properties of air at ambient temperature of 30°C. The
data was obtained from the property tables and charts of the heat transfer book of (Y.
Cengel, 2002). The purpose of these data is for the calculation of the convective heat
transfer coefficient which is related to the Nusselt’s number equation.

60
Table 14. Properties of Air at 30°C

(Source: (Y. Cengel, 2002)
Properties of Air at 30°C
Density 1.164 kg/m3
Thermal Conductivity 0.02588 W/m·K

Dynamic Viscosity 1.872× 10−5 kg/m·s
Kinematic Viscosity 1.608× 10−5 m2/s
Prandtl Number 0.7282
4.3 Component’s Specification of Computer System Unit
4.3.1 Processor Specification
The different heat load of high-end processors and its dimension is shown
in Table 15. The Intel Core I7 series varies with different TDP, 65 Watts, 91 Watts,
and 140 Watts. The selected processor use for the analysis is the Intel Core I7-
7820X having a 140 Watts TDP which typically used for Liquid Cooling CPU
Systems.
Table 15. Different Heat Load of High End Processors
High End Processors Thermal Design Power Dimension

Intel Core I7-7700 Processor 65 Watts 45 x 45 x 4 mm
Intel Core I7-7700K Processor 91 Watts 45 x 45 x 4 mm
Intel Core I7-7820X Processor 140 Watts 45 x 45 x 4 mm
61
Figure 28. Image of Intel Core I7-7820X X-Series Processor

(Source: Intel Corporation, 2017)
4.3.2 Fan Specification
The Table 16 show the specification of the Mechatronics – UF92B AC
Axial Fans. These types of fan is normally use for the Air Cooling CPU System
mounted on a heat sink and attached at the system unit case for ventilating
function, it can served as an external inlet or outlet fan depending on the designed
system.
Table 16. Fan Specification
Air
Fan Power Fan Velocity
Fan Specification Flow
Dimension Input Speed of Fan
Rate
Mechatronics – UF92B 92 x 92 x 25
14 W 2300 RPM 25 CFM 11 m/s
AC Axial Fans mm
62
Figure 29. Image of Mechatronics – UF92B AC Axial Fan

(Source: Mechatronics Fan Group, 2017)
4.3.3 Other Components Specification
Figure 30. Image of ASUS ROG G11CD

(Source: (ASUSTeK Computer Inc., 2017b)
63
ASUS ROG G11CD is the basis for the design structure of the system
unit which operates by an Air Cooling CPU System, a representation of these
model is shown in Figure 30. The manufacturer provides the component
specification of system unit. The Table 17 show a list of ASUS ROG G11CD’s
components with its dimension, TDP and Operating Temperature (Normal and
Maximum Temperature). Each component’s data was obtained from a product
specification available in its product internet site.
Table 17. ASUS ROG G11CD’s Component Specification

Thermal Operating
Dimension
Components Design Temperature
LxHxW
Power Normal Max
System Unit – ASUS ROG 422 x 440 x 176
* *
G11CD–Tower Intel H110 mm
Motherboard – ASUS ATX 305 x 244 x 3 mm * *
RAM - HyperX Fury
133 x 34 x 7 mm * 55 °C 85 °C
DDR4-2666 16GB
GPU – PNY GeForce 178 x 112 x 40
71 Watts 97 °C 97 °C
GTX-1050 2GB G DDR5 mm
140 x 84 x 150
PSU – ASUS X-30GP 300 Watts 45 °C 50 °C
mm
Hard Drive – Seagate
147 x 20 x 102
Firecuda 6 Watts 30 °C 60 °C
mm
ST1000DX002 – 3.5
Optical Drive – ASUS 172 x 148 x 42
* 25 °C 45 °C
DRW-24B1ST mm
The Figure 31 – 35 show an image of each component listed on the Table
17, the dimension of the component will be used for the geometric modelling in
SOLIDWORKS. The design structure will be used as a preference in modeling
the components. Each image of the component is obtained from the internet site
of the product.
64
Figure 31. Image of RAM - HyperX Fury DDR4-2666 16GB

(Source: Kingston Technology Corporation, 2017)
Figure 32. Image of GPU – PNY GeForce GTX-1050 2GB G DDR5

(Source: PNY Technologies Inc., 2014)
65
Figure 33. Image of PSU – ASUS X-30GP

(Source: ASUSTeK Computer Inc., 2017)
Figure 34. Hard Drive – Seagate Firecuda ST1000DX002 – 3.5

(Source: Seagate Technology LLC, 2017)
66
Figure 35. Optical Drive – ASUS DRW-24B1ST

(Source: ASUSTeK Computer Inc., 2017)
4.4 Thermal Steady-State Simulation
4.4.1 Heat Sink under Natural Convection
Figure 36. Temperature Distribution of Graphene Heat Sink under Natural Convection
67
Figure 37. Total Heat Flux Distribution of Graphene Heat Sink

under Natural Convection
Figure 36 – 37 shows a result of Thermal Steady-State Analysis which
was carried out using SOLIDWORKS after applying all the parameters and
boundary condition in the simulation. These figures are the result of a heat sink
applied with a graphene material under natural convection where the heat transfer
coefficient is set to 15 W/m2K. The Figure 36 show the temperature distribution
from maximum to minimum, 91.75 °C to 91.21°C respectively. The maximum
temperature of the heat sink is located at the lateral face of base plate while the
minimum temperature is located at the tip of the fins. The Figure 37 show the total
heat flux distribution from maximum to minimum, 66,499 W/m2 to 920.43 W/m2.
The maximum heat flux is located at the base of fin where the convection of heat
through the air is done while the minimum heat flux is located at the tip of the fins
which has a lower temperature difference between the fin and the surrounding air.
68
4.4.2 Heat Sink under Forced Convection
Figure 38. Temperature Distribution of Graphene Heat Sink under Forced Convection

under Forced Convection
69
Figure 38 – 39 shows a result of Thermal Steady-State Analysis which
was carried out using SOLIDWORKS after applying all the parameters and
boundary condition in the simulation. These figures are the result of a heat sink
applied with a graphene material under forced convection where the heat transfer
coefficient is set to 55 W/m2K. The Figure 38 show the temperature distribution
from maximum to minimum, 46.99 °C to 46.45°C respectively. The Figure 39
show the total heat flux distribution from maximum to minimum, 66,432 W/m2 to
913.24 W/m2
Table 18 & 19 shows the result of all materials indicated in the study to
be simulate in thermal steady-state analysis under natural and forced convection.
It shows the maximum and minimum heat flux and temperature of heat sink.
Obviously, Aluminum gives the highest maximum temperature of the heat sink at
the base plate while graphene gives the lowest maximum temperature among the
five materials, their main difference was the higher thermal conductivity of
graphene which reduced the heat spreading resistance. According to the Fourier’s
law of conduction, the heat transfer rate is directly proportional to the thermal
conductivity of the material. Therefore, aluminum gives the minimum generation
of heat flux while graphene gives the highest. The difference of the maximum and
minimum temperature of aluminum heat sink is around 7°C having a more
pronounced drop off in temperature along the outer fins while the graphene heat
sink obtained a value less than of 1°C which means the heat spreads effectively
from the base plate of heat sink to the tip of the fins.
70
Table 18. Comparison of the Maximum and Minimum Numerical Results

of Heat Sink using Different Materials under Natural Convection
Temperature (°C) Heat Flux (W/m2)

Heat Sink Material
Maximum Minimum Maximum Minimum
Aluminum 96.41 88.88 66,136 885.72
Copper 94.18 89.99 66,327 902.22
Carb-Al 93.95 90.10 66,343 903.92
Graphene 91.75 91.21 66,499 920.43
Pitch-based Carbon Fiber 92.68 90.74 66,434 913.45
Table 19. Comparison of the Maximum and Minimum Numerical Results

of Heat Sink using Different Materials under Forced Convection
Temperature (°C) Heat Flux (W/m2)

Heat Sink Material
Maximum Minimum Maximum Minimum
Aluminum 51.44 44.30 65,155 699.90
Copper 49.35 45.29 65,782 821.91
Carb-Al 49.14 45.40 65,845 835.19
Graphene 46.99 46.45 66,432 913.24
Pitch-based Carbon Fiber 47.91 46.00 66,190 888.36
Figure 40 show a chart representation of maximum temperature of a rectangular heat sink
subjected with different applied material under natural and forced convection. The data
from Table 18 & 19 is interpreted in this manner to easily compared the results of the
thermal steady-state analysis. The graph shows that the maximum temperature of heat sink
under forced convection has a greater difference under natural convection because of the
fan which blows a forced air into the heat sink fins to transfer the heat in the surroundings.
The graph also shows the minimal difference of the maximum temperature of heat sink
71
using different materials however for every 2 °C increase in temperature will decrease for
about 10% of the performance of the processor. Graphene material obtained the lowest
maximum temperature of the heat sink because of its higher thermal conductivity compared
to other material.
Maximum Temperature of Heat Sink

using Different Material
100
90
Temperature °C
80
70
60
50
40
Aluminum Copper Carb-Al Graphene Pitch-based
Carbon Fiber
Materials
Natural Convection Forced Convection
Figure 40. Comparison of Maximum Temperature of Heat Sink using

Different Material under Natural Convection and Forced Convection
Figure 41 show a chart representation of maximum heat flux of a
rectangular heat sink subjected with different applied material under natural and
forced convection. An increase of thermal conductivity of the heat sink material
gives a higher heat transfer rate along the higher temperature region to the lower
temperature region. As we can see, graphene heat sink attained the highest heat
flux compared to other materials under natural and forced convection because of
the reduced thermal resistance of the material.

72
Maximum Heat Flux of the Heat Sink

using Different Material
67000
Heat Flux W/m2 66500
66000
65500
65000
64500
64000
Carbon Fiber
Materials
Natural Convection Forced Convection
Figure 41. Comparison of Maximum Temperature of Heat Sink using

Different Material under Natural Convection and Forced Convection
4.5 Flow Simulation
4.5.1 Computer System Unit under Maximum Operating Condition
Figure 42. Flow Simulation: Temperature Distribution of

Graphene Heat Sink under Maximum Operation
73
The Figure 42 shows a result of Flow Simulation: Surface Plot which
was carried out using SOLIDWORKS after applying all the settings and boundary
conditions in the simulation. The figure show the temperature distribution of a
heat sink applied with a graphene material under maximum operating condition,
from maximum to minimum, 56.12 °C to 55.01 °C respectively. For all the heat
sink, it can be stated that the hotter surface is located at the proximity of center
base plate. Graphene heat sinks show a pronounced temperature distribution
unlike the other, the temperature from the bottom plate has not reached the tip of
the fins. As we can see in the figure, the temperature has an asymmetrical
distribution of temperature due to the surrounding conditions, the correspond heat
source attached at the bottom center of the heat sink and the fan have hubs where
the air cannot pass through.
Figure 43. Cut Plot 1 – Graphene Heat Sink: Temperature Contours

in Front Plane of Computer System Unit under Maximum Operation
74

in Right Plane of Computer System Unit under Maximum Operation

in Top Plane of Computer System Unit under Maximum Operation
The Figure 43 – 45 show the temperature contours at heat sink and its
system under a maximum operating condition. The contour was cut in different
75
plane to explain the behavioral condition of the temperature inside the computer
system unit. The air enters the system is approximately 27 °C and the temperature
increase along the flow path (near the heat sources). At the inlet of the heat sink
fan, it is heated about 35 °C and further increased to 50 °C while flowing over the
heat sink. The maximum temperature of the processor and heat sink is 81.45 °C
and 56.12 °C. In these figures, it can approximately assume that the RAM gives
the highest temperature inside the computer system unit which is 85 °C. The air
exits the system is approximately 41 °C.
Figure 46. Flow Trajectory – Graphene Heat Sink: Movement of Air

and its Velocity inside the Computer System Unit under Maximum Operation
The Figure 46 shows the flow trajectory of air movement inside the
computer system unit. It describes the behavior of the air velocity under maximum
operation. The velocity of the air increases when enters the inlet fan which blow
76
the air into the heat sink and the area near the external fan which blow the air
outside the system.
The Table 20 show the global and volume goals of the computer system
unit under maximum operation, the maximum and minimum temperature of air,
velocity of air, temperature of heat sink and temperature of processor. In the
comparison of the results, graphene material outstands the other materials in terms
of dissipating the heat on the processor. When graphene material is used for the
heat sink, the processor has the lowest maximum temperature among the other
materials. The maximum and minimum temperature of the graphene heat sink has
a slight discrepancy which can be interpret that the thermal distribution of the
material is more efficient compare to other materials.
Table 20. Flow Simulation: Global and Volume Goals of the

Computer System Unit under Maximum Operation
Pitch-based
Goals Units Aluminum Copper Carb-Al Graphene
Carbon Fiber
Min. Temp. of Air [°C] 19.88 19.91 19.95 19.80 19.20
Max. Temp. of Air [°C] 85.10 85.11 85.13 85.08 85.10
Min Velocity of
[m/s] 0 0 0 0 0
Air
Max Velocity of
[m/s] 6.074 6.052 6.109 6.070 6.098
Air
Min. Temperature
[°C] 49.80 51.96 51.70 55.01 53.85
of the Heat Sink
Max. Temperature
[°C] 63.95 60.19 59.31 56.12 57.78
of the Heat Sink
Min. Temperature
[°C] 73.04 71.17 70.63 69.35 70.23
of the Processor
Max. Temperature
[°C] 87.53 84.61 83.84 81.45 82.77
of the Processor
77
4.5.2 Computer System Unit under Normal Operating Condition
Figure 47. Flow Simulation: Temperature Distribution of

Graphene Heat Sink under Normal Operation
The Figure 47 shows a result of Flow Simulation: Surface Plot which
was carried out using SOLIDWORKS after applying all the settings and boundary
conditions in the simulation. The figure show the temperature distribution of a
heat sink applied with a graphene material under normal operating condition, from
maximum to minimum, 46.93 °C to 46.08 °C respectively. Graphene material
helps the heat sink to spread the heat effectively through out to the fins because
of its high thermal conductivity which reduced the thermal resistance of the
material.
The Figure 48 – 50 show the temperature contours at heat sink and its
system under a normal operating condition. The contour was cut in different plane
78
to explain the behavioral condition of the temperature inside the computer system
unit. The air enters the system is approximately 25 °C and the temperature
increase along the flow path (near the heat sources). At the inlet of the heat sink
fan, it is heated about 28 °C and further increased to 37 °C while flowing over the
heat sink. The maximum temperature of the processor and heat sink is 66.39 °C
and 46.93 °C. In these figures, it can approximately assume that the Processor
gives the highest temperature inside the computer system unit which is 85 °C. The
air exits the system is approximately 33 °C.

in Front Plane of Computer System Unit under Normal Operation

in Right Plane of Computer System Unit under Normal Operation
79

in Top Plane of Computer System Unit under Normal Operation
Figure 51. Flow Trajectory – Graphene Heat Sink: Movement of Air

and its Velocity inside the Computer System Unit under Normal Operation
80
The Figure 51 shows the flow trajectory of air movement inside the
computer system unit. It describes the behavior of the air velocity under normal
operation. The velocity of the air increases when enters the inlet fan which blow
the air into the heat sink and the area near the external fan which blow the air
outside the system.
The Table 21 show the global and volume goals of the computer system
unit under normal operation, the maximum and minimum temperature of air,
velocity of air, temperature of heat sink and temperature of processor. In the
comparison of the results, graphene material outstands the other materials in terms
of dissipating the heat on the processor. When graphene material is used for the
heat sink, the processor has the lowest maximum temperature among the other
materials. The maximum and minimum temperature of the graphene heat sink has
a slight discrepancy which can be interpret that the thermal distribution of the
material is more efficient compare to other materials.

81
Table 21. Flow Simulation: Global and Volume Goals of the

Computer System Unit under Normal Operation
Pitch-based
Goals Units Aluminum Copper Carb-Al Graphene
Carbon Fiber
Min. Temp. of Air [°C] 19.91 19.97 19.93 19.95 19.99
Max. Temp. of Air [°C] 69.02 67.50 65.70 62.77 64.80
Min Velocity of Air [m/s] 0 0 0 0 0
Max Velocity of Air [m/s] 6.061 6.196 6.065 6.065 6.917
Min. Temperature
[°C] 43.11 45.27 44.51 46.08 45.82
of the Heat Sink
Max. Temperature
[°C] 54.82 52.06 50.57 46.93 48.95
of the Heat Sink
Min. Temperature
[°C] 62.11 60.97 59.45 57.17 58.74
of the Processor
Max. Temperature
[°C] 74.39 72.31 70.15 66.39 68.91
of the Processor
Temperature of Heat Sink under a Specific Condition

70
65
Temperature °C
60
55
50
45
40
Carbon Fiber
Materials
Max. Temp (at Max. Operation) Max. Temp (at Normal Operation)
Figure 52. Maximum Temperature of the Heat Sink under

Maximum and Normal Operating Condition
82
The Figure 52 show a graphical line representation of maximum
temperature of heat sink subjected to different materials under the maximum and
normal operating condition. The graph shows that the graphene outstands the
other materials in terms of thermal performance because it has the lowest
maximum temperature compared to the other subjected materials. From the
results, it is also observed that the carbon-based material outperforms the
commercially material used for the heat sink by attaining a lower maximum
temperature.
Temperature of Processor under a Specific Condition

90
85
Temperature °C
80
75
70
65
60
Carbon Fiber
Materials
Max. Temp (at Max. Operation) Max. Temp (at Normal Operation)
Figure 53. Maximum Temperature of the Processor

under Maximum and Normal Operating Condition
The Figure 53 show a graphical line representation of maximum
temperature of processor subjected to different materials under the maximum and

83
normal operating condition. From the results, it is observed that the maximum
temperature of the processor under maximum and normal operation meet the
critical design limit which not exceed a temperature of 100 °C. The temperature
of the processor at normal operation using carbon-based material meets the typical
permissible operating temperature of the processor which is 70 °C. In comparison
of the material, processor has a lowest temperature using graphene heat sink while
the processor using an aluminum heat sink obtain the highest temperature.
CHAPTER 5
CONCLUSION
All materials tested produced results that could provide better reliability of the
processor of the computer. Design engineers can now possibly meet the thermal needs of
modern components by using alternative material like carbon-based materials which is a
possible solution for preventing or at least reduce the overheating that can replaced the
commercially material used for heat sink. The result of the simulation shows that graphene
produced an outstanding performance on heat dissipation. The thermal steady-state and
flow simulation provided an identical outcome in accordance to their sequence, following
the material with highest to lowest thermal distribution: (1) Graphene, (2) Pitch-based
Carbon Fiber, (3) Carb-Al, (4) Copper, (5) Aluminum.
In the thermal steady state analysis, the maximum and minimum temperature of the
graphene heat sink has a minimal discrepancy compared to the others where it has a hotter
center base temperature and a more pronounced drop off in temperature along the outer
fins. In this manner, the graphene heat sink spreads the heat through all fins and has a great
thermal distribution and heat flux because of its higher thermal conductivity which results
to an increase of the overall efficiency. The maximum temperature and heat flux of
graphene heat sink under forced convection is 46.99 °C and 66,432 W/m2, while the
aluminum heat sink is 51.44 °C and 65,155 W/m2 and copper heat sink is 49.35 °C and
65,782 W/m2.
85
In the flow simulation, the computer system unit was simulated using different five
materials for the heat sink under maximum operation, all the simulation showed the
processor’s temperature has exceeded the considered benchmark temperature of 70 °C but
it not exceeded the design maximum temperature of the processor which is 99 °C. The
maximum temperature of the processor using the graphene heat sink under maximum
operation is 82.77 °C while the aluminum and copper heat sink are 87.53 °C and 84.61 °C,
respectively. The researchers simulated the computer system unit under normal operation
to determine if the processor’s temperature exceeds the benchmark temperature. Carbon-
based materials applied to the heat sink showed an incredible results regarding to the
reliability and performance of the processor. At normal operation, the maximum
processor’s temperature using the Carb-Al heat sink is approximately equal to the
benchmark temperature of processor, while using the Pitch-based Carbon Fiber and
Graphene heat sink is less than to the benchmark temperature, 68.91 °C and 66.39 °C,
respectively. The carbon-based material performs a reliable thermal dissipation compared
to the commercially used, which the processor achieved the desirable benchmark
temperature under normal operation. All results indicated that the selected carbon-based
material for heat sink is superior to commercial heat sink even though the processor’s
temperature exceed the benchmark temperature at maximum operation.

CHAPTER 6
RECOMMENDATION
The researchers recommend further study for enhancing the thermal management
of the heat sink using these carbon-based material by satisfying the design requirement
such as enhanced thermal management, confined size and weight, and low cost. A study of
configuring the geometric parameters and design of heat sink using the proposed materials
could provide a more reliable, cheaper and continuous service of the computer system unit.
Fabrication of the model heat sink using these materials is recommended to determine the
actual performance of the computer system unit and if it is truly applicable in handling
thermal management of electronic system. It is also recommended to have a series of
simulation in different application and condition to determine the difference of the thermal
behavior of the proposed heat sink material.
The researchers recommend further study about the potential of using the carbon-
based material for thermal management in different application to determine the capability
of these material in the future. Provide an efficient economical process for manufacturing
these carbon-based materials for a good quality of material and low cost.
87
GLOSSARIES
Anisotropic Exhibiting different physical properties in different
directions. In semiconductor technology, the
different directions are defined by the
crystallographic planes.
Brazed A process of soldering a nonferrous alloy having a
lower melting point than the metals being joined.
Carbonaceous Materials that are containing or composed of
carbon. Carbon is naturally abundant, nonmetallic
element that occurs in all organic compounds and
can be found in all known forms of life. Diamonds
and graphite are pure forms, and carbon is a major
constituent of coal, petroleum, and natural gas.
Heat Flux It is defined as the amount of heat transferred per
unit area per unit time from or to a surface. In a basic
sense it is a derived quantity since it involves, in
principle, two quantities viz. The amount of heat
transfers per unit time and the area from/to which
this heat transfer takes place.
Mesophase Is a state of matter intermediate
between liquid and solid. Gelatin is a common

88
example of a partially ordered structure in a
mesophase. Further, biological structures such as
the lipid bilayers of cell membranes are examples
of mesophases.
Permissible Something that is allowed or permitted. It
is considered to be acceptable because it does
not break any laws or rules.
Superb Admirably fine or excellent; extremely good.
Something that has the very best quality
of high or performance.
Synthesis The composition or combination of parts or
elements so as to form a whole. The production of a
substance by the union of chemical elements,
groups, or simpler compounds or by the degradation
of a complex compound. The combining of often
diverse conceptions into a coherent whole; also: the
complex so formed.
Thermal Design Power (TDP) It is sometimes called thermal design point, is the
maximum amount of heat generated by a computer
chip or component (often the CPU or GPU) that the
cooling system in a computer is designed to
dissipate under any workload.

89
APPENDIXES
Temperature Distribution of Heat Sink under Natural Convection
Figure 54. Temperature Distribution of Aluminum Heat Sink under Natural Convection
Figure 55. Temperature Distribution of Copper Heat Sink under Natural Convection
90
Figure 56. Temperature Distribution of Carb-Al Heat Sink under Natural Convection
Figure 57. Temperature Distribution of Graphene Heat Sink under Natural Convection
91
Figure 58. Temperature Distribution of Pitch-Based Carbon Fiber

Heat Sink under Natural Convection
Total Heat Flux Distribution of Heat Sink under Natural Convection
Figure 59. Total Heat Flux Distribution of Aluminum Heat Sink

92
Figure 60. Total Heat Flux Distribution of Copper Heat Sink under Natural Convection
Figure 61. Total Heat Flux Distribution of Carb-Al Heat Sink under Natural Convection
93

Figure 63. Total Heat Flux Distribution of Pitch-Based Carbon Fiber

Heat Sink under Natural Convection
94
Temperature Distribution of Heat Sink under Forced Convection
Figure 64. Temperature Distribution of Aluminum Heat Sink under Forced Convection
Figure 65. Temperature Distribution of Copper Heat Sink under Forced Convection
95
Figure 66. Temperature Distribution of Carb-Al Heat Sink under Forced Convection
Figure 67. Temperature Distribution of Graphene Heat Sink under Forced Convection
96

Heat Sink under Forced Convection
Total Heat Flux Distribution of Heat Sink under Forced Convection
Figure 69. Total Heat Flux Distribution of Aluminum Heat Sink

97
Figure 70. Total Heat Flux Distribution of Copper Heat Sink

Figure 71. Total Heat Flux Distribution of Carb-Al Heat Sink

98

Figure 73. Total Heat Flux Distribution of Pitch-Based Carbon Fiber Heat Sink
99
Surface Plot: Temperature Distribution of Heat Sink under Maximum Operation
Figure 74. Temperature Distribution of Aluminum Heat Sink under Maximum Operation
Figure 75. Temperature Distribution of Copper Heat Sink under Maximum Operation
100
Figure 76. Temperature Distribution of Carb-Al Heat Sink under Maximum Operation
Figure 77. Temperature Distribution of Graphene Heat Sink under Maximum Operation
101

Heat Sink under Maximum Operation
Surface Plot: Temperature Distribution of Heat Sink under Normal Operation
Figure 79. Temperature Distribution of Aluminum Heat Sink under Normal Operation
102
Figure 80. Temperature Distribution of Copper Heat Sink under Normal Operation
Figure 81. Temperature Distribution of Carb-Al Heat Sink under Normal Operation
103
Figure 82. Temperature Distribution of Graphene Heat Sink under Normal Operation

Heat Sink under Normal Operation
104
Cut Plot: Temperature Contours of CPU under Maximum Operation
Figure 84. Cut Plot 1 - Aluminum: Temperature Contours in Front Plane
Figure 85. Cut Plot 2 - Aluminum: Temperature Contours in Right Plane
Figure 86. Cut Plot 3 - Aluminum: Temperature Contours in Top Plane

105
Figure 87. Cut Plot 1 - Copper: Temperature Contours in Front Plane
Figure 88. Cut Plot 2 - Copper: Temperature Contours in Right Plane
Figure 89. Cut Plot 3 - Copper: Temperature Contours in Top Plane

106
Figure 90. Cut Plot 1 – Carb-Al: Temperature Contours in Front Plane
Figure 91. Cut Plot 2 – Carb-Al: Temperature Contours in Right Plane
Figure 92. Cut Plot 3 – Carb-Al: Temperature Contours in Top Plane

107
Figure 93. Cut Plot 1 – Graphene: Temperature Contours in Front Plane
Figure 94. Cut Plot 2 – Graphene: Temperature Contours in Right Plane
Figure 95. Cut Plot 3 – Graphene: Temperature Contours in Top Plane

108
Figure 96. Cut Plot 1 – Pitch-Based Carbon Fiber:

Temperature Contours in Front Plane

Temperature Contours in Right Plane
Figure 98. Cut Plot 3 – Pitch-Based Carbon Fiber: Temperature Contours in Top Plane
109
Cut Plot: Temperature Contours of CPU under Normal Operation
Figure 99. Cut Plot 1 - Aluminum: Temperature Contours in Front Plane
Figure 100. Cut Plot 2 - Aluminum: Temperature Contours in Right Plane
Figure 101. Cut Plot 3 - Aluminum: Temperature Contours in Top Plane

110
Figure 102. Cut Plot 1 - Copper: Temperature Contours in Front Plane
Figure 103. Cut Plot 2 - Copper: Temperature Contours in Right Plane
Figure 104. Cut Plot 3 - Copper: Temperature Contours in Top Plane

111
Figure 105. Cut Plot 1 – Carb-Al: Temperature Contours in Front Plane
Figure 106. Cut Plot 2 – Carb-Al: Temperature Contours in Right Plane
Figure 107. Cut Plot 3 – Carb-Al: Temperature Contours in Top Plane

112
Figure 108. Cut Plot 1 – Graphene: Temperature Contours in Front Plane
Figure 109. Cut Plot 2 – Graphene: Temperature Contours in Right Plane
Figure 110. Cut Plot 3 – Graphene: Temperature Contours in Top Plane

113

Temperature Contours in Front Plane

Temperature Contours in Right Plane
Figure 113. Cut Plot 3 – Pitch-Based Carbon Fiber: Temperature Contours in Top Plane
114
Flow Trajectory: Movement of Air and its Velocity inside the

Computer System Unit under Maximum Operation
Figure 114. Flow Trajectory – Velocity: Using Aluminum Heat Sink
Figure 115. Flow Trajectory – Velocity: Using Copper Heat Sink

115
Figure 116. Flow Trajectory – Velocity: Using Carb-Al Heat Sink
Figure 117. Flow Trajectory – Velocity: Using Graphene Heat Sink

116
Figure 118. Flow Trajectory – Velocity: Using Pitch-Based Carbon Fiber Heat Sink
Flow Trajectory: Movement of Air and its Velocity inside the

Computer System Unit under Normal Operation
Figure 119. Flow Trajectory – Velocity: Using Aluminum Heat Sink

117
Figure 120. Flow Trajectory – Velocity: Using Copper Heat Sink
Figure 121. Flow Trajectory – Velocity: Using Carb-Al Heat Sink

118
Figure 122. Flow Trajectory – Velocity: Using Graphene Heat Sink
Figure 123. Flow Trajectory – Velocity: Using Pitch-Based Carbon Fiber Heat Sink
119
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Thermal Performance Evaluation of Carbon Based Material For A Computer Heat Sink Using Finite Element Analysis

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Adamson University

Thermal Performance Evaluation of Carbon-based Material

A Project Study Presented to

In Partial Fulfillment of the Requirements

This thesis, entitled THERMAL PERFORMANCE EVALUATION OF CARBON

BASED MATERIAL FOR A COMPUTER HEAT SINK USING FINITE ELEMENT

ANALYSIS, prepared and submitted by ARVIN BRIAN M. DE VERA, HEINZ HAYLE

M. GUIBELONDO and JAYSON S. RETONEL, in partial fulfillment of the requirements

for the degree of BACHELOR OF SCIENCE IN MECHANICAL ENGINEERING is

ENGR. LESTER ALFRED M. OLASIMAN

Accepted as partial fulfillment of the requirements for the degree BACHELOR

OF SCIENCE IN MECHANICAL ENGINEERING.

ENGR. BASIL ALOYSIUS P. BAUTISTA

ENGR. BIENVENIDO D. MANUNTAG

ENGR. ANTONIO P. DOROLIAT

To God be the glory!

consists of Natural Convection and Forced Convection. It is observed that an effective

ACKNOWLEDGEMENT ............................................................................................................ iii

2.6 Related Work ............................................................................................................... 28

4.4.2 Heat Sink under Forced Convection .................................................................. 68

LIST OF FIGURES, ILLUSTRATIONS AND DRAWINGS

Figure 1. Model of Computer Heat Sink ............................................................................................ 1

Table 1. Physical Properties of Copper ........................................................................................... 13

FEA – Finite Element Analysis

FEM – Finite Element Method

CAD – Computer Aided Design

LED – Light Emitting Diode

CPU – Central Processing Unit

CFD – Computational Fluid Dynamics

TDP – Thermal Design Power

RAM – Random Access Memory

GPU – Graphics Processing Unit

PSU – Power Supply Unit

Heat sink, it is a thermal dissipation device comprised of a mass of material that is

material used for the structure is aluminum.

Figure 1. Model of Computer Heat Sink

different properties. Carbon-based material demonstrates an exceptional property such as

thermal conduction. In possession of these unique, it used in a wide range of fields

still encounters challenges regarding in the synthesis, uniformity and manufacturability in

The carbon-based material shows an excellent property of thermal conductivity that

1.1 Statement of the Problem

or transaction, researching, browsing, and even gaming. Heat must be efficiently

removed; to prevent the system from being damaged or unstable.

Electronic Component Failure

Temperature Humidity Vibration Dust Other

Figure 2. Distribution of Electronic Component Failure

According to (David, 2004), failures of electronic components may related to the

decreasing reliability of the electric component. The temperature contributes serious

(VORTEC: Innovative Compressed Air Technologies, 2014), states that high

expensive as you compare with the conventional heat sink.

Modern technology manufacturers nowadays are popularly using aluminum and

copper as heat sink. Aluminum’s properties provides best in composition especially

material for replacing the heat sink’s common material.

1.2 Objectives of the Problem

 Design a geometric model representation of computer heat sink.

 Simulate the thermal performance of computer heat sink using Thermal

Steady-State and Flow Simulation analysis.

 Compare which carbon-based material is effective to be used for the

computer heat sink in replacing the commercial used material.

1.3 Significance of the Study

This study intends to provide information about how these carbon-based

to thermal performance. The researchers see the importance of carbon-based material in

improving the thermal performance of electronics such as computer. Design engineers