TABLE 5—VARIOUS SCREENS AND THE DEFECTS THEY DETECT
Screen
Temperature cycling
Elevated temperature burn-in test
Stabilization bake
Resistance to soldering heat
Thermal shock
High-temperature storage
High-temperature/high-humidity
storage test
High-temperature/high-humidity
bias test
Salt-spray test
Moisture-resistance test
Water-immersion test
Humidity test
Seal-leak test
Parametric measurements
(before burn-in)
Parametric measurements
(after burn-in)
Electrical-overstress test
Vibration test
Mechanical-shock drop test,
constant acceleration
Detected defects Test conditions
Die-substrate faults, sealing defects, cracks Alternating cycles of hot and cold temperature of 140 to +125°C; 20 cycles; dwell time
in substrate minimum 10 minutes, preferably 30 minutes at temperature extremes; rate of
temperature change should be 5 to 10°C per minute.
Wire-bond defects, metallization faults 70°C for 24 to 168 hours
Metallization faults, defects in silicon
Thermal degradation, change in electrical 65°C for 106
Component immersed in solder bath at 2606 62 sec
characteristics, mechanical stress due to
application of heat
Thermomechanical stress-induced damage 140 to +125°C for 20 cycles
to seal and structural elements, leakage of
filling materials, delamination, change in
electrical characteristics
Contact defects, ingress of moisture, 150°C for plastic devices, 250°C for hermetically sealed devices for 24 hours
oxidation, metallization defects, thermal
aging, softening, physical changes
Closely simulates actual field operating 85°C, 85% relative humidity
conditions
Closely simulates actual field operating 85°C, 85% relative humidity, application of reverse bias
conditions, effect of applied bias is
observable
Simulates coastal climate, tests resistance Spray mist of 5% salt solution in water in an environmental chamber for 24 hours
to corrosion of metallic parts and coatings
Effect of humidity, resistance to corrosion Subject unit under test to alternate cycles of dampness and drying while cycling
of contacts and wires the temperature
Sealing defects, corrosion of metal Immerse unit under test in water or salt solution at several temperatures of
0 to 35°C
Corrosion of metallization, chemical action Subject unit under test to 90 to 95% relative humidity at
of pollutants in presence of moisture, 40°C for 96 hours
absorption of moisture, electrolytic
corrosion of joints of dissimilar metals
Defects in package seal Fill package with a gas under pressure, immerse in a liquid to find any leakage
Ionic contamination, surface defects, bond-
wire defects, metallization faults
Changes in electrical characteristics
Testing at bias levels higher than those Application of voltage in increasing steps from normal to 25 or 50% above normal
expected during use exposes infant- while holding temperature above ambient
mortality cases
Loose parts, wear and tear, solder joints, Vibrate unit under test from 20 Hz to 2 kHz or at the frequencies of expected
fatigue, bonding defects, mechanical faults operation
in the device, noise
Mechanical damage, leakage of electrolyte Depends on application requirement
due to sealing defect, change in electrical
characteristics, adhesion faults, bonding
defects, cracks in substrate, mechanical
strength