Number 2615
Application Note Measuring the Resistivity and Determining the
Series Conductivity Type of Semiconductor Materials
Using a Four-Point Collinear Probe and the
Model 6221 DC and AC Current Source
Introduction
Resistivity and conductivity type are fundamental properties
of semiconductors and are critical parameters in both materi-
als research and wafer fabrication. A semiconductor’s resistivity
depends primarily on the bulk doping, but can be modified
through device processing. The resistivity can affect a device’s
series resistance, threshold voltage, capacitance, and other
parameters. Measuring a semiconductor material’s resistivity
is one of the most common electrical tests. Determining the
conductivity type (or sign of the majority carrier) of a wafer is
common in both research and fabrication. A four-point collinear
probe and the appropriate test equipment can be used to deter-
mine both resistivity and conductivity type.
This application note explains how to measure resistivity
and determine conductivity type of semiconductor materials
with a four-point collinear probe and the Model 6221 DC and AC
Current Source.
The Four-Point Collinear Probe Method
for Measuring Resistivity
The four-point, or Kelvin, probe method is the most common
way to measure a semiconductor material’s resistivity. Two of the
probes are used to source current and the other two probes are
used to measure voltage. Using four probes eliminates measure-
ment errors due to the probe resistance, the spreading resistance
under each probe, and the contact resistance between each metal
probe and the semiconductor material. This technique involves
bringing four equally spaced probes into contact with the mate-
rial of unknown resistance. The probe array is usually placed in
the center of the material, as shown in Figure 1.
Current
Source
Voltmeter
Figure 1. Four-Point Collinear Probe Resistivity Method
The two outer probes source current, while the two inner
probes sense the resulting voltage drop across the sample. The
volume resistivity is calculated with this equation:
π V
ρ = ____ × ___ × t × k
ln2 I
where: ρ = volume resistivity (Ω-cm)
V = the measured voltage (volts)
I = the source current (amperes)
t = the sample thickness (cm)
k = a correction factor based on the ratio of the probe
spacing to wafer diameter and on the ratio of wafer
thickness to probe spacing1.
The Model 6220 DC Current Source or Model 6221 AC and
DC Current Source can be used with a voltmeter, such as the
Model 2000 DMM, to measure the resistivity of most normally
doped semiconductor materials. Both the Model 6220 and Model
6221 can output a wide range of current from picoamps up to
100mA. For characterizing lower resistance materials, the Model
2000 DMM can be replaced with a Model 2182A Nanovoltmeter.
A differential electrometer measurement method must be used
for characterizing higher resistance materials.
Measuring High Resistance
Semiconductor Materials
Measuring the resistivity of high resistance samples often
requires using four isolated probes and the van der Pauw meas-
urement technique. However, if the four-point probe head has
very good isolation between the probes, then these measure-
ments may be achievable. This measurement also requires sourc-
ing current with high output impedance and making differential
voltage measurements.
Figure 2 is a more realistic circuit representation of a four-
point collinear probe measurement setup. This circuit includes
a contact or spreading resistance at each probe (r1 through r4),
the finite resistance from LO to earth ground of both the current
source (RC) and the voltmeter (RV ), and the input resistance of
the voltmeter (R IN). Depending upon the material being meas-
ured, the contact resistance (r1, r2, r3, and r4) may be as much
as 300× that of the measured resistance (R 2) or more. The high
contact resistance means the current source is required to have
1 The correction factors can be found in a standard four-point probe resistivity test procedure
(such as SEMI MF84-02—Test Method for Measuring Resistivity of Silicon Wafers With an
In-Line Four-Point Probe. This standard was originally published by ASTM International as
ASTM F 84-67T.)
considerably higher compliance voltage than might be expected Figure 4 is a schematic of an actual high resistance measure-
and the voltmeter must have a much higher input resistance. ment system, which includes two electrometers (Model 6514s), a
DMM (Model 2000), and a current source (Model 6220 or 6221).
Current
Source In this circuit, the electrometers are used as unity-gain buffers.
HI RC The DMM measures the difference between the outputs of the
two electrometers. The settling time of the measurement will
AC
be much faster if the electrometers are used in guarded mode.
LO
Guarding reduces the effects of the shunt capacitance in the
circuit, so the charging time can be much faster. If feasible, triax
Voltmeter Common cables should be used to ensure that guard is connected as close
Mode
V Current to the material as possible.
RV
i
RIN Model 2000 DMM
AC Set as voltmeter to measure the
voltage difference between the
preamp outputs of the two 6514s
HI LO
HI LO
1 2 3 4

r1 r2 r3 r4

R1 R2 R3 Preamp Preamp
Output LO
LO Out LO Out
Model 6220 Model 6514 Model 6514
Figure 2. Realistic Circuit of the Four-Point Probe Method or 6221 Electrometer #1 Electrometer #2
Current Source (Voltmeter) (Voltmeter)
Turn on built-in Set to guarded Set to guarded
The common-mode current (i) is the result of the imperfect guard volts mode volts mode

isolation between the LO terminals of the voltmeter and current HI

source to earth ground. As shown in Figure 2, an AC current
will flow from the LO terminal of the current source through the
sample and to the voltmeter’s LO terminal, then back to ground.
The resulting voltage drop across r3 will cause erroneous results
when the voltmeter measures the voltage drop between probes
2 and 3. As the sample resistance increases, the errors due to the
common-mode current become more significant and it becomes
increasingly necessary to use a differential voltmeter.
As Figure 3 illustrates, using two electrometers eliminates
this common-mode problem. The voltmeter will read the differ-
ence between the buffer outputs of the two electrometers, which
is equal to the voltage across R 2. The unity-gain buffers have
very high input impedance, so little common-mode current will
flow through r3, and the value of R 2 can be calculated easily. The
buffers can be a pair of JFET op amps or two electrometers with
unity-gain outputs.
HI LO
Voltmeter
Output HI
1 2 3 4
Figure 4. High Resistance Four-Point Probe Measurement System
Both the Model 6220 and Model 6221 have very high output
impedance and a built-in guard. Just as with the electrometers,
using guarding will reduce the measurement time because the
cable capacitance will no longer affect the time constant of the
measurement.
The HI terminals of the Model 6220/6221 and the Model
6514s are three-lug female triax connectors, so it’s important to
use male triax cables to connect to the instrument. Some four-
point probes can be ordered with triax cables. Connect the LO
terminals (safety banana jacks on rear panels) from all three
instruments to probe 4. Make sure only one of the instruments’
LO terminal is connected to earth ground on the rear panel.

V
Determining Conductivity Type
of a Semiconductor Material
HI LO
There are several methods for determining conductivity type.
×1 ×1
Buffer Buffer The rectification method is used on high resistivity material; the
HI LO HI LO thermoelectric method is used on low resistivity materials. Both
methods involve using a four-point collinear probe, an AC cur-
1 2 3 4 rent source, and a DC voltmeter.
r1 r2 r3 r4 The Rectification Method. This method involves deter-
R1 R2 R3 mining the sign of the majority carrier based on the polarity of
a rectified AC signal at the point of contact with the semicon-
Figure 3. Making Differential Four-Point Probe Measurements ductor material. Figure 5 illustrates this setup. When the four-
point collinear probe comes in contact with the wafer, a metal-
semiconductor “diode” is created at the interface between each
probe and the wafer. An AC current is sourced between the first
two probes and a DC voltmeter is used to sense the polarity of
the voltage between probes 2 and 3. The metal-semiconductor
Schottky “diode” at probe 2 will be either forward- or reversed-
biased, depending on the polarity of the current, as well as the
conductivity type. As a result, the voltmeter will read a positive
voltage for p-type material and a negative voltage for n-type
material.
HI AC LO HI
Current Voltmeter
LO
Positive reading = p-type
Negative reading = n-type
1 2 3 4
Figure 5. Circuit for Determining Conductivity Type Using the Rectification Mode
To illustrate this concept further, an oscilloscope was placed
in parallel with the voltmeter. The oscilloscope produced the
waveform shown in Figure 6. Probe 2 was connected to the HI
terminal of the scope and probe 3 was connected to the LO ter-
minal. As the trace in Figure 6 indicates, the metal-semiconduc-
tor “diode” from the p-type material interfacing with probe 2 is
reverse-biased at the top of the waveform and conducting at the
bottom of the waveform. For p-type material, the metal-semicon-
ductor junction at probe 2 is reverse-biased when the AC voltage
at probe 2 is positive with respect to probe 1 (large and positive
voltage). When the AC voltage at probe 2 is negative with respect
to probe 1, then the metal-semiconductor junction at probe 2 is
forward-biased (small and negative voltage). As a result, the aver-
age DC voltage read by the voltmeter between probes 2 and 3 is
positive, indicating a p-type material.
Figure 6. Oscilloscope Trace From P-Type Material
For best results when reproducing this test setup, a line
frequency test signal of 60Hz (or 50Hz) from the Model 6221 AC
and DC Current Source should be used. Either the Model 2000
DMM or the Model 6514 Electrometer can measure the DC volt-
age drop. The voltmeter’s integration time should be set to 1 PLC
(power line cycle).
The magnitude of the AC current will depend on the resistiv-
ity of the material, but it should be large enough to forward-bias
the diode. This method works well if there is an acceptable rec-
tification action, which occurs for DC voltmeter readings greater
than 0.5V. For voltage readings less than 0.5V, the thermoelectric
mode should be used.
The Thermoelectric Voltage Method. For highly doped
(low resistivity) materials, the voltage developed between probes
2 and 3 becomes too small and the rectification mode no longer
works well. For this case, the thermoelectric voltage method
determines the conductivity type by the polarity of the ther-
moelectric (or Seebeck) voltage that is generated by a tempera-
ture gradient on the material. Figure 7 is a circuit diagram of
this setup.
HI AC LO LO HI
Current Voltmeter
Positive reading = p-type
Negative reading = n-type
1 2 3 4
Figure 7. Diagram of Thermoelectric Voltage Method
With this method, an AC current flows between probes
1 and 2 and causes joule heating of the semiconductor. The
Seebeck voltage is generated between probes 3 and 4 by the dif-
fusion of thermally generated carriers from the hot region of the
material to the cold region. This diffusion creates a non-equilib-
rium carrier concentration in the cold region, which generates
an electric field, opposing further diffusion. This diffusion of
carriers from the hot probe (probe 3) to the cold probe (probe
4) continues until the generated electric field is sufficient to
overcome the tendency of the carriers to diffuse. For example,
in p-type material, the thermally generated holes diffuse to the
cold probe, building up a positive space charge, which prevents
further diffusion. As a result, the cold probe (4) is more posi-
tive than the hot probe. Thus, for p-type material the voltmeter
will read a positive voltage. Conversely, the voltmeter will read a
negative voltage for n-type material.
Sources of Error and
Measurement Considerations
Measuring resistivity successfully requires considering sev-
eral potential sources of error, especially for high resistance
materials.
• Electrostatic Interference. Electrostatic interference occurs
when an electrically charged object is brought near an
uncharged object. Usually, the effects of the interference aren’t
noticeable because the charge dissipates rapidly at low resist-
ance levels. However, high resistance materials don’t allow the
charge to decay quickly, so measurements may be unstable.
The erroneous readings may be due to either DC or AC elec-
trostatic fields.
Building an electrostatic shield to enclose the sensitive circuit-
ry can minimize the effects of these fields. The shield is made
from a conductive material and is always connected to the low
impedance terminal of the instrument. The cabling in the cir-
cuit must also be shielded.
• Leakage Current. For high resistance samples, leakage cur-
rent may degrade measurements. The leakage current is due
to the insulation resistance of the cables, probes, and test fix-
turing. Using good quality insulators, reducing humidity, and
using guarding can minimize leakage current.
A guard is a conductor connected to a low impedance point
in the circuit that is at nearly the same potential as the high
impedance lead being guarded. Both the Model 6220/6221
and the Model 6514 can be configured to operate in guarded
mode. Refer to the instrument’s instruction manual for further
information on guard setting and connections. This guard
should be run from the instruments to as close to the sample
as possible. Using triax cabling and fixturing will ensure the
high impedance terminal of the sample is guarded. The guard
connection will also reduce measurement time, because the
cable capacitance will no longer affect the time constant of the
measurement.
• Light. Currents generated by photoconductive effects can
degrade measurements, especially on high resistance sam-
ples. To prevent this, the sample should be placed in a dark
chamber.
• Temperature. Thermoelectric voltages may also affect meas-
urement accuracy. Temperature gradients may result if the
sample temperature isn’t uniform. Thermoelectric voltages
may also be from sample heating caused by the source current.
Heating from the source current will more likely affect low
resistance samples, since a higher test current is needed to be
able to make the voltage measurements easier. Temperature
fluctuations in the lab environment may also affect measure-
ments. Semiconductors have a relatively large temperature
coefficient, so the use of correction factors may be necessary
to compensate for temperature variations in the lab.
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© Copyright 2005 Keithley Instruments, Inc.
Printed in the U.S.A.
Test System Safety
Many electrical test systems or instruments are capable of meas-
uring or sourcing hazardous voltage and power levels. It is also
possible, under single fault conditions (e.g., a programming error
or an instrument failure), to output hazardous levels even when
the system indicates no hazard is present. These high voltage and
power levels make it essential to protect operators from any of
these hazards at all times.
Protection methods include:
• Design test fixtures to prevent operator contact with any haz-
ardous circuit.
• Make sure the device under test is fully enclosed to protect
the operator from any flying debris. For example, capacitors
and semiconductor devices can explode if too much voltage or
power is applied.
• Double insulate all electrical connections that an operator
could touch. Double insulation ensures the operator is still
protected, even if one insulation layer fails.
• Use high reliability, fail-safe interlock switches to disconnect
power sources when a test fixture cover is opened.
• Where possible, use automated handlers so operators do not
require access to the inside of the test fixture or have a need
to open guards.
• Provide proper training to all users of the system so they
understand all potential hazards and know how to protect
themselves from injury.
It is the responsibility of the test system designers, integra-
tors, and installers to make sure operator and maintenance per-
sonnel protection is in place and effective.
For Further Reading
W. A. Keenan, C. P. Schneider, and C. A. Pillus, “Type-All System
for Determining Semiconductor Conductivity Type,” Solid State
Technology, 51-56, March 1971.
ASTM F42-93. Standard Test Methods for Conductivity Type of
Extrinsic Semiconducting Materials. Annual Bk. ASTM St., 1997.
SEMI MF84-02: Test Method for Measuring Resistivity of Silicon
Wafers With an In-Line Four-Point Probe.
D. K. Schroder, Semiconductor Material and Device
Characterization. New York: John Wiley & Sons, Inc., 1998.
Keithley Instruments, Inc., Low Level Measurements Handbook,
6th ed., Cleveland, Ohio, 2004.
Specifications are subject to change without notice.
All Keithley trademarks and trade names are the property of Keithley Instruments, Inc.
All other trademarks and trade names are the property of their respective companies.
No. 2615
0405