Abstract

The Electronics industry is continually strives to achieve improve performance and smaller scales. Both of these
targets result in increased heat flux densities within the electronic devices. Mainly from the portable devices
which are the market driving forces; this increasing heat flux densities are leading to new methodologies being
implemented to provide thermal management within such devices. This work addresses the potential of low
profile integrated fan and heat sink solutions to electronics thermal management issues, particularly focusing
upon possible solutions in low profile portable electronics. We investigated a heat sink design with mini-channel
features, applicable to low profile applications. After the analysis on the design the results were discussed for
given operating conditions. The operating conditions which includes operating temperatures, fan speed, etc. The
geometry of the radial heat sink was modeled in CATIA V5 design software. The analysis was performed on
ANSYS-FLUENT software.