CPU - DG35EC

Pranjal Jhaveri (15D170001)

Fatima Saleh (15D170002)
Richa Agarwal (150100070)
Kartik Bilolkar (150100036)
Mrunal Chavan (15D110011)
Aniket Hulage (183100026)
Contribution
 Power Circuit

DDR Memory

Fan

Processor +
Heat Sink

Ventilation
GMCH

I/O Chip
Ventilation
Airflow inside CPU
Intel 82G35 GMCH
Maximum Allowable Temperature 97°C

Thermal Design Power 28 W

Heat Flux 0.234 MW/m^2

Ambient Temperature 35°C

Intel 82801HB ICH8
Maximum Allowable Temperature 92°C

Thermal Design Power 3.7 W

Heat Flux 5.47 kW/m^2

Ambient Temperature 35°C

Intel Q6600 Processor
Maximum Allowable Temperature 71°C

Thermal Design Power 95 W

Heat Flux 0.154 MW/m^2

Fan flow rate 25-30 CFM (normal) -

60-70CFM(max)

Fan RPM 1000-3000

Ambient Temperature 35°C

DDR RAM
Maximum Allowable Temperature 85°C

Thermal Design Power 400 mW

(per component)

Voltage Regulator Area

Maximum Allowable Temperature 95°C
Observations
Observations :
● Dust accumulation :
Observations :
● Thermal interface materials :
Thermal Analysis of SMPS Module
 Description of the SMPS Module
● SMPS (Switched-Mode Power Supply) module transfers
power from an AC source to CPU, while converting
voltage and current characteristics.
• This is done by switching
ideally lossless storage
elements, such as
inductors and capacitors,
between different
electrical configurations.

Source: Wikipedia &

 Losses in the SMPS Module
● Rectifier voltage drop
● Switching losses in the transistors
● Equivalent series resistance in the inductor and capacitors
● Core losses in the inductor
All these effects contribute to a typical efficiency of 60–70%.
However, by optimizing the SMPS design,
• Such as choosing the optimal switching frequency
• Avoiding saturation of inductors, and active rectification
Source: Wikipedia
 Components of the SMPS Module
Primary side Transformers Secondary side
Heat Sink Heat Sink

Output filter
capacitors
Input filter
capacitors Digital – Analog
Comparator

Fan SMPS
Comparator
Top View
Components of the SMPS Module
Rectifiers
(Total No.: 6) Output Filter Coil
(Inductor)

Transistor
Side Views
 Specifications of the SMPS Module

Source: technical specification label on the module cover

 Assumptions for Thermal Modelling
• Locations of thermal power dissipation:
• Since both heat sinks are directly mounted on top of the Rectifiers, it is assumed that the majority of power is
dissipated by Rectifiers
• Assuming the power dissipated by other
components to be negligible in comparison
to Rectifiers

• Assuming an optimized electrical design of

the module, we should have the overall power
conversion efficiency of about 95%. This implies that,
0.05 * 300 W = 15 W of power is collectively dissipated through the heat sinks.

Source: Wikipedia
 Boundary conditions used for the
simulations
• Natural convection boundary condition is assumed for the top and side faces.
• Typical HTCs for natural convection are assumed to be 4.4 (W/m *K) in case of vertical plate & 5.6 (W/m *K) in case of
2 2

horizontal plate.

• The cooling fan occupies a certain portion of area of the front face and rest of the face is modelled to have a natural
convection boundary condition. HTC for this case is assumed to be 4.4 (W/m2*K).

Source: https://quickfield.com/natural_convection.htm
 Boundary conditions used for the
simulations
• The back face of module is modelled as a grill, which
allows the air to flow out of the module.
• Forced convection boundary
condition is assumed at the
bottom face due to the presence
of cooling fan for Motherboard.
Typical HTC is assumed to be 20
(W/m2*K)
• Ambient temperature is assumed
to be 25 C
Sources:
• Max. safe Temp. for Rectifier is
https://www.engineeringtoolbox.com/convective-heat-transfer-d_430.html
 Specifications of the Cooling Fan
• Cooling fan works as an
exhaust
• This is evident from the
clockwise rotation of its
blades
• Average airflow of the fan is
about 90 CFM.
• Average rated speed of the fan
is about 6600 RPM.
• Average static pressure for the
fan is 266 Pa.
Source: https://products.sanyodenki.com/en/contents/hp0213/list.php?CNo=213&ProSStyle=1&PNo=1
• Linear model of the Fan Curve
Model created for analysis in IcePak
Front
Face
Detailed view of the Model
Solutions obtained from the Simulation
• Number of iterations considered for the solutions: 25
• The solutions are observed to converge, suggesting that
the number of iterations are sufficient
Considering Different Cases

Case Presence of Presence of Presence of Other

Cooling Fan Heat Sink Components
(a) No No No
(b) No Yes No
(c) Yes No No
(d) Yes Yes No
(e) Yes Yes Yes
Effect of Addition of a Heat Sink
Case (a): Without both Heat Sink & Cooling Fan Case (b): With Heat Sink, but no Cooling Fan

Max. Temp.: 371 C (approx.) Max. Temp.: 189 C (approx.)

Effect of Addition of a Cooling Fan
Case (a): Without both Heat Sink and Cooling Fan Case (c): With Cooling Fan, but no Heat Sink

Max. Temp.: 371 C (approx.) Max. Temp.: 252 C (approx.)

Adding just a cooling fan without a heat sink is not that effective.
Effect of Addition of both a Cooling Fan
and a Heat Sink
Case (a): Without both Heat Sink and Cooling Fan Case (d): With both Cooling Fan and Heat Sink

Max. Temp.: 371 C (approx.) Max. Temp.: 135 C (approx.)

Adding both a cooling fan as well as a heat sink is quite effective
Effect of presence of other components
Case (d): With Heat Sink, Cooling Case (e): With Cooling Fan, Heat
Fan, but no other components Sink and also other components

Max. Temp.: 135 C (approx.) Max. Temp.: 125 C (approx.)

Extra turbulence in the flow seems to be a plausible explanation
 Streamlines for both the cases
Case (d): With Heat Sink, Cooling Case (e): With Cooling Fan, Heat
Fan, but no other components Sink and also other components

Max. Temp.: 135 C (approx.) Max. Temp.: 125 C (approx.)

Extra turbulence enables better mixing and hence better heat transfer
Summary of obtained Results
• For conditions of this problem, the use of just a heat sink is more effect than just using a fan for cooling.
• Addition of both heat sink and fan significantly reduces the maximum temperature in the system. For conditions of this
problem, overall cooling ensures that the operating temperatures remain within the safe temperature range.

• Effect of turbulence is observed to result in better heat transfer.

Distribution of Effort in each task

Task Kartik Bilolikar Aniket Hulage

Literature review 70 % 30 %
Resolving technical issues 50 % 50 %
IcePak Modelling 30 % 70 %
IcePak Simulations 30 % 70 %
Presentation 70 % 30 %