«2 United States Patent Shabany ‘USOOT701714B2 (10) Patent No.: US 7,701,714 B2 (45) Date of Patent: Apr. 20, 2010 6 03) 03) wo ay @y ws) (60) on) (2) 68) 36) LIQUID-AIR HYBRID COOLING IN ELECTRONICS EQUIPMENT Inveator: Younes Shabany, San Jose, CA (US) Assignee: Flextronies AP, LIC, Broomfield, CO ws) Ne: Subjet any ines, theta f hig USC. 1580 by 186 dy Appl. No. 11/623,430 Filed: Sam, 16,2007 Prior Publication Data US 200710274043. A1 Nov. 29, 2007 Related US. Application Data rat is extended of adjusted under 35 Provisional application No. 60'803,320, filed on May 26, 2006 Int.Cl. ask 720 (200601) F28F 700 (200601) HOSK 5700 (200601) F28D 23/12 (200601) us.cl. 361/698; 361/699; 961/695: 361/701; 165/80.4; 1657805: 165/108.33: 454/184; 62/2892 Fleld of Classification Search 361/695, 361/696, 698, 699, 701, 724726: 165804, 165/80.5; 454/184;" 62/3592; 285/19, 1243, 285/124 See application file for complete search history, References Cited US. PATENT DOCUMENTS Sa16M7 A * $1994 Aros Sp46191 A * $1999 Oyama 28926 31/700 {6388880 BL 52002. EL-Ghoeshy eal 646298 BL 102002 GA4ALL BO "32004 Thompson ta 714812 BL* 32004 Chie a 611609 ‘6859.235 BD 12005. Cravens ea GB7RS% BY 42008 Osborn eal ‘6888-720 BD* $2005. Phtere al 611699 {6912,129 B2 62005 Bakeret a ‘6924981 BD — £2005. Chet al {6932.66 BY 82008. Schivartz etal. (6987573 BL 12006 Frencht a 7AD8.1S1 B2* 92008 Sonnabent et a 3611699 20040087211 AL* 32001 Kondo aa 361.696, 20040221604 AL* 112004 Ow eal «22992 dosirsso22 AL 122005 Lucero etal 2oveo002084 AL 1/2006. Wei * cited by examiner Primary Exaniner—Zachary M Pope (74) Attorney, Agent, or Firn Russell T. Manning; Robert G. Crouch; Marsh Fischmana & Breyiogle, LLP on ABSTRACT Provided herein are hybrid-cooled electronics chasis and boards. Such boards may be plugged in a chassis and con- ected to a common liquicecooling loop shared by two oF ‘more of the boards inside that chassis. Liquid cooling con: duits between the electronics bourd/module andthe chassis are engaged and disengaged with fide or no manual interven- tion, Por instance, the connections between such cooling conduits may wilize quick coupling connectors that allow for ‘tomatic or near automatic engagement and disengagement pon the engagement ofthe elecronies board/module with theclectronics chassis. Inone arrangement, chassis includes ‘base portion that has fan, iguid cooling system and heat ‘exchanger mounted thereon, An electrons module is el tively engageable with thebaseportion ina manner have, isplaced aeross the electronics module when engaged as well establish liquid low through the electrics module when engaged,U.S. Patent Apr. 20, 2010 Sheet I of 11 US 7,701,714 B2U.S. Patent Apr. 20, 2010 Sheet 2 of 11 US 7,701,714 B2 Ae Module | _ PA Module i ae ee Figac 2 rion asm