Tag MC Laren

service manual
amplifier 100x5R
introduction
No part of this document may be reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, without the express written permission of TAG McLaren
Audio Limited.
This manual is for the exclusive use of TAG McLaren Audio, its approved distributors and
approved UK service agents. No part of this manual shall be transferred to any other party
without the express written permission of TAG McLaren Audio Limited.
It is the responsibility of the user to ensure that all the information contained in this manual is
current. Notification for new issues of this manual and minor updates will be given via the TAG
McLaren Audio web-site or on request.
This manual has been prepared with the greatest care, it is intended for information only and no
liability shall be accepted for errors or changes to specification.
For further service information, parts lists and updates, please contact our web-site at
www.tagmclarenaudio.com.
© 1999 TAG McLaren Audio Limited. All rights reserved.
Notification for new issues of the F3 series 100X5R

service manual will be given via the TAG McLaren
Audio web site:- www.tagmclarenaudio.com.
issue number :- GRP0000?.01

issue date :- 20.01.2000
F3 series 100X5R service manual

index
1.0 safety and servicing notes
1.1 Safety precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2 Electrostatic discharge precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.0 front and rear panel layouts

2.1 Front panel controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Rear panel connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.0 disassembly instructions

3.1 Removing case and fascia . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2 Removing components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4.0 technical outline

4.1 Technical description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.2 50 way IDC harness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.3 Desciption of pins J1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.4 100X5R block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.0 functional tests

5.1 Fault finding flow chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.2 Test equipment required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.3 Functional test procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.4 Biasing modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.5 Adding modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.0 performance tests

6.1 Test equipment required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.2 Performance test procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
7.0 upgrading software

7.1 Equipment required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.2 Upgrading software procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
8.0 diagnostics
8.1 Upgrading software diagnostic messages . . . . . . . . . . . . . . . . . . . . . . 17
8.2 Resetting parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
9.0 circuit schematics

9.1 100X5R LED PCB - 1 sheet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
9.2 100X5R IR PCB - 1 sheet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
9.3 100X5R uC PCB - 3 sheets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
9.4 100X5R AMP PCB - 2 sheets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
9.5 100X5R TAG BUS PCB - 1 sheet . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
10.0 printed circuit board layout

10.1 100X5R LED PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
10.2 100X5R uC PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
10.3 100X5R TAG BUS PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

10.4 100X5R IR BUS PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
10.5 100X5R LED PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
11.0 technical data

11.1 100X5R Technical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
11.2 International Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

1.0 safety and servicing notes
1.1 Safety precautions
1. This unit is Class II, which means that it is not connected to the protective earth
system. All live voltages are insulated from the case by double insulation.
2. Do not attempt to service unless qualified to do so.
3. Disconnect unit from AC power supply before removing cover.
4. Components marked with the symbol on the circuit schematic are safety critical
and must only be replaced with an identical component, or an alternative approved
by the manufacturer.
5. Switch unit off, and disconnect from supply before making and breaking any
connections.
6. Do not adjust any controls unless instructed to do so in this manual.
CAUTION : to reduce the risk of fire, replace the same type fuse and rating
ATTENTION : utiliser un fusible de rechange de meme type et calibre
230V : T1AL/250V
115V : T1A/125V
100V : T1A/125V
1.2 Electrostatic discharge precautions
Electrostatic discharge (ESD) is due to charges produced by insulating materials rubbing together.
Humans collect electrostatic charge through normal activities when clothes rub together and when
walking on carpet. This charge may be discharged suddenly when you touch a conductor. If the
conductor is connected to a sensitive electronic circuit, you may damage the components. It is also
possible to reduce the life of components without causing any obvious damage.
To prevent ESD damage to TAG McLaren Audio units, it is necessary to follow these guidelines.
1. Prepare work area. Place an ESD protective mat on the bench, strapped to the
protective earth circuit.
2. Prepare yourself. Put on an ESD protective wrist band, strapped to the protective
earth circuit, or to the ESD protective mat.
3. Keep all PCBs removed from unit in ESD protective bags.
4. Keep all replacement electronic components, PCBs and stock items in ESD
protective bags or boxes.
5. Be particularly careful with components marked with the following symbol:
F3 series 100X5R service manual 1

1.3 Soldering
How to de-solder components
Components should be removed, wherever possible, using a de-soldering

tool. Be careful not to damage tracks and pads by applying too much
pressure.
How to make good solder joints
1. Ensure surfaces are clean.

2. Keep soldering iron clean and wetted with solder. Use
an appropriate bit. Do not leave soldering iron on when
not in use.
3. Apply soldering iron to both component lead and pad
before applying solder. Make sure that the soldering
iron is applied long enough for the solder to wet
properly, but do not apply for too long or component
damage may occur.
4. Allow a small gap between component body and pad.
Solder must not reach the base of the component.
How to detect acceptable joints
1. Solder joints should have from a shiny to satin lustre and

a generally smooth appearance.
2. Solder should have wetted both the component lead
and pad.
3. There should be a concave meniscus between the
objects being soldered. The angle of solder to pad
should be less than 90E unless the solder joint extends
over the edge of the pad.
4. Solder should fill the component pad and wet
component lead around the full circumference (360E).
How to detect unacceptable joints
1. Poor wetting produces a bead of solder. The fillet will be convex instead of concave,
and there will not be a feather edge.
2. On double-sided PCBs, solder should wet all round plated-through hole, on both
sides of the PCB.

Cleaning up after soldering
1. Flux is very corrosive. Remove with IPA (propan-2-ol) before completing the job.
2. Remove any solder balls and splashes from the unit.
3. Check all new solder joints and ensure all PCBs are clean before replacing covers.
4. After replacing covers, clean the case and any display windows with a damp cloth.
Do not use any organic solvents. If scratched, replace display windows.

2.0 front and rear panel layouts
2.1 front panel controls
2.2 rear panel connections

3.0 disassembly instructions
To protect the unit, place on 2 foam blocks during disassembly and reassembly.
3.1 removing case and fascia
Remove cover
! Place unit on bench - rear panel facing you

! Remove cover’s 9 fixing screws
! Pull cover towards the rear of the unit gently whilst carefully pulling bottom sides out
a little
! Lift cover slightly at the rear panel, then pull cover gently towards you
Remove front panel assembly
! Disconnect the LED PCB and the IR PCB from the wiring loom.
! Place unit on bench - top up, fascia facing you
! Remove the 5 screws attaching the front panel assembly to the modules.
! Turn the unit over and remove the 4 screws fixing the assembly to the chassis
! Gently pull the front panel assembly away from the chassis, taking care with the 2
way wire to the On/Off switch.
Remove module
! Disassemble the mains wiring and ribbon from the module. Unscrew the connector
bracket and the M4 screw attached to the rear panel, taking care with the M3 nut
fixing the 10n capacitor.
! Turn the unit over and remove the M4 fixing screws.
! The Module is now free of the chassis.
3.2 removing components
Remove microcontroller PCB
CAUTION HIGH VOLTAGES
! Remove 6 fixing screws from PCB to chassis connectors on rear panel

! Lift top edge over to gain access to the rear of the PCB.
! To fully remove, disconnect all connectors and desolder mains wiring harness.
Remove IR/LED PCB
! Remove 2 fixing screws from PCB to front panel and PCB to ribbon connectors.
! Take care when re-fitting the LED PCB as the LEDs must be carefully aligned to the
holes if they are to fit easily without scratching their edges.

4.0 technical outline
4.1 technical description
Introduction
The 100x5R is a five channel amplifier, featuring five identical and independent power amplifier
modules and a microprocessor control board (wth associated input and output connections).
Each of the five amplifiers features its own mains transformer, power supply components and
heatsink assembly.
The microcontroller PCB is used to:

! power up and power down the modules in a controlled manner
! switch the mains input to each module (via PCB mounted relays)
! switch the loudspeaker outputs from each module (via the output relay)
! receive and interpret the remote control commands
! illuminate the LED displays
! monitor the fault status of each amplifier module and take action accordingly
In addition, the microcontroller module provides TAGtronic communication bus connections to

allow the unit to communicate with other equipment, and to provide a means of uploading
firmware into the amplifier.
The micro PCB forms the ‘heart’ of the amplifier, acting as mains distribution and control
(including mains fuses for the individual modules). It is best to examine the block diagram by
considering all of the connections to and from the micro controller PCB.
Micro controller PCB
Mains distribution and switching
Mains from the IEC inlet is connected to the micro controller PCB via MLIP (live) and MNIP
(neutral). There is no mains ground connection as the unit is double insulated and fully isolated
from mains power earth.
The input mains is distributed via wire links WL4 through WL11 to the mains power relays for
the amplifier modules. There are 10 relays, RL1-RL10, 2 for each channel. This is because
each channel has ‘clean’ and ‘dirty’ mains power relays.
The concept is that the ‘dirty’ relay performs all the switching on and off for mains current into
the primary of each transformer, whilst the ‘clean’ relay only carries current during normal (on)
operation. This is to ensure that the contacts of the ‘clean’ relay do not experience inrush surge
currents or inductive spikes when mains to the modules is switched on and off, thereby
protecting the contact material, prolonging life and ensuring the best possible signal integrity
to the amplifiers themselves.
The power on sequence(for each module) is as follows:

5. Dirty relay switches ON
6. After a short delay, clean relay switches ON
7. After a further short delay, dirty relay switches OFF, allowing the clean relay
to carry the mains current
The power off sequence is essentially the reverse:

1. Dirty relay switches ON

2. Clean relay switches OFF
3. After a short delay, dirty relay switches OFF
This allows the dirty relay to handle all of the ‘hard’ load conditions, with the clean relay being
protected from surges and inductive spikes. During listening evaluation it was found that relay
contacts have an effect on subjective audio quality.
Relays RL2, RL4, RL6, RL8 and RL10 are the ‘dirty’ relays.
PCB mounted 20mm fuses F1, F4, F5, F6 and F7 are the primary fuses for each of the mains
outputs for the modules 1 through 5 respectively. Each module is independently fused on the
micro controller PCB. The mains outputs from the micro controller are connected to the
transformers via soldered double insulated primary wires. SMLIVEC1 and SMNEUTRALC1
connect to live and neutral of channel one’s mains transformer respectively (and so on for the
remaining four channels).
Front Panel power switch
The power on/off switch on the amplifier front panel is connected to the micro PCB via
connector EC1. This switch does NOT switch mains potential. It switches the 5VDC power
supply to the coils of the mains relays RL1 through RL10. This isolates the channels from the
mains (as the relays switch off) but retains power to the micro controller circuits.
Micro controller auxiliary power supply
PCB mounted mains transformer T1 and its associated circuit (sheet 3 of SCH28306) provide
an auxiliary 5VDC supply which powers the microprocessor and coils of the relays mounted on
the PCB. This supply is active whenever mains is present at the IEC socket on the rear panel
of the amplifier.
The micro controller remains operational when the front panel power switch is in the OFF
position.
CAUTION - there are live voltages present on this PCB whenever the unit is connected
to a mains supply!
4.1 50 way IDC connector J1
J1 connects to a 50 way ribbon cable, which carries control signals from the micro controller to
the amplifier modules, LED display, infra-red remote receiver and TAG tronic communications
bus.
This ribbon cable is ‘split’ at various lengths so that appropriate signals may be conveniently
routed to their correct destination within the amplifier. The block diagram shows the connection
from the micro controller to each of the five amplifier modules, the array of LEDs (power and
channel status), the IR remote and the TAG bus. The pin numbers at each end of each
connection are labelled.

4.3 Description of pins of J1
No Net Name I/O Type Description

1 P5V_A - supply +5VDC
2 DMute_LED O open collector + 1K0 mute LED
3 D_IR_Rx_LED O open collector + 1K0 IR receive LED
4 DGND - ground digital 0V
6 IR_IN I micro P3.2 IR remote input
9 DChan1_LED O open collector + 470R channel 1 LED
14 DPower_LED O open collector + 470R Power on LED
15 FaultC1 I schmitt trigger + 10K channel 1 fault signal
pulldown
18 MRelay1 O open collector channel 1 mute relay
19 - - - -
20 Present1 I micro P5.15 channel 1 present (active low)
pulldown
25 - - - -
pulldown
31
pulldown
37 - - - -

pulldown
43 - - - -
45 none - Tag Bus ground +
100uH + 100R
46 none - Emitter of Q13 to MCD4 (P0L.4)
47 TAG_X2 Tag Bus to RJ socket
These notes are provided to assist you in understanding the technical operation of the 100X5R
amplifier.
4.4 100X5R block diagram

5.0 functional tests
These notes are provided to assist you in servicing the 100X5R amplifier.

5.1fault finding flow chart:
5.2 Test equipment required
Equipment Specification
Digital Multimeter Accuracy better than 0.5% in V and mV ranges
Oscilloscope Bandwidth >100 MHZ
Various Leads
With faulty modules the uC control can be bypassed by disconnecting the 6-way ribbon from the Module Under
Test (MUT). With this disconnected the uC will no allow mains to the module as it believes it to be not fitted.
Also the output relay will not close as it requires a pull down to ground to operate. Therefore both the ribbon
cable and the respective connector need linking out:
Ribbon: Link pins 2 & 6

Header: Link pins 2 & 4
N.B. Be aware, the protection is now not operational, and prolonged abuse of the module will result in
damage.
5.3 Functional test procedure
No Action Test Equipment Details
4.2.1 Disconnect all

cables from
amplifier
4.2.2 Check voltage Read ratings label on rear of

setting amplifier
4.2.3 Check fuse type Open fuse holder in power socket on

rear panel.
Rated supply Fuse Type
230 V AC T1AL 250V
115V AC T1A 125V
100V AC T1A 125V
4.2.4 Check fuse Multimeter set Fuse and spare fuse should be low
resistance to O resistance
4.2.5 Remove unit See Section 3.0

cover
4.2.5 Check fuses F1- Multimeter set Fuses are on the MicroController PCB
F7 to O

Fuses should not blow in normal use. A blown fuse is probably an indication of a more serious
problem. Before replacing the fuse check that the circuit it is connected to is not a short circuit. If it is
this will need to be corrected first.
A short circuit in the transformer primary windings could cause the mains fuse to blow. With the mains
lead removed and the unit power switch in the on position use a multimeter to check the primary
resistance across the terminals of the IEC mains input connector. The resistance should be approx
240 Ohms for a 230 V unit or 48 Ohms for a 100/115 V unit (the impedance for the individual module
transformers is 5.5 Ohms for a 230 V unit or 1.2 Ohms for a 100/115 V unit, but these are isolated
from the IEC inlet when the power is off. These points can be accessed from the microcontroller PCB
inside the unit). If it is much less than this then either the transformer or the input wiring has
developed a short circuit. Correct the wiring or replace the transformer as necessary.
4.2.6 Connect AC Switch on power button

power to unit
4.2.7 Unit powers up LEDs light and module relays
switch in sequence
4.2.8 Unit un-mutes After settling time module mute
relays close and mute light goes
out.
4.2.9 Power out DC
<±2mV
4.2.17 Gain I/O 28.8dB ±01dB
4.2.18 Check uC Multimeter set Connect negative probe to 0 V,
supply rails to V DC eg chassis
Connect positive probe to
5 V rail (TP52).
Voltage should be 5 ± 0.3 V.
4.2.19
4.2.21
5.4 Biasing Modules
If a module is to be replaced or repaired, where the repair affects any part of the amplification section, the bias
on that module will need to be re-calibrated. The bias voltage across the emitter resistor (R61) is accessible
via J1. The bias voltage takes some time to settle so the following proceedure is recommended:
1 With the lid removed, switch on the 100x5R.

2 Set the new/repaired module bias to ~100mV for 20mins with the lid upside down on the top of the
unit to ensure similar air flow through the unit. This will rapidly bring the module to quiescent
temperature.
3 Set the bias to 23mV ±0.5mV.
4 Leave to soak test overnight, then set the bias to the same as the adjacent module, ±0.5mV.
The module should be set to the same reading as a factory set unit for best results.

5.5 Adding Modules
In order to increase the number of modules in a units the upgrade pack F3 100x1 xxx (where
xxx is the voltage) is required.
1 remove cover, front panel and uC PCB as above.

2 Remove the blanking plate where the module is to be inserted:
No of Position
channels
2 1&5
3 1,3,5
4 1,2,4,5
5 1,2,3,4,5
N.B. channel 1 is the left channel when viewed from the front, and the channels are numbered
in sequence left to right.
3 Bolt in the new channel in position in the chassis, and before refitting the front panel
carefully dress the transformer wiring along with the existing module wires.
4 The wire should then be cut to length to solder onto the mains distribution section of the
uC PCB. Ensure that the wires polarity is correct and attched to the correct relay output.
Channel 1 is towards the front panel on the PCB. For continued safety approve the
wires must be fastened to each other next to the soldered joints as with the existing
modules.
5 Connect the 6 way ribbon connector to the module, cutting off the retaining tie rap.
6 Attach the axial capacitor between the phono socket ground and the rear panel. Copy
the method fitted to existing channels.
7 re-assemble the unit apart from the lid and follow the bias proceedure. Use the existing
modules as the reference.
8 Performance check.

6.0 performance tests
6.1 Test equipment required
Signal Generator 20 Hz to 20 kHZ 100mV - 2V rms
Distortion Analyser 20 Hz - 20 kHz

Distortion measurement 0.001% or better
Voltage measurement 0.003 V to 10 V
dB scale -90 dB to +10 dB
Digital Multimeter Accuracy better than 0.5% in V and mV ranges
Oscilloscope Bandwidth >100 MHZ
load 8O x2
Various Leads Signal Generator to RCA phono x2, 4mm to analyser & to load, 1KO
phono terminator
6.2 Performance test procedure
For test point (TP) references, see section 6.0 test points.
No Action Test Details

Equipment
6.2.1 Switch off AC
power button
6.2.2 Connect Audio signal Switch on and allow to unmute.
amplifier as generator Measure signal output level:
shown in Figure 1kHz, 100mV 2.83Vrms
5.1
6.2.3 Measure Distortion With equipment set up in bandpass
channel analyser mode @ 20kHz, connect input
separation output: 20 kHz, signal to one AUDIO INPUT and
1 V rms the other INPUT TERMINATED
measurement WITH 1kO, with signal OUTPUT to
mode: distortion analyser. Both outputs
Bandpass should be terminated with 8O.
amplitude. Measure signal level. Set as 0 dB
reference. Move analyser input
over to other channel. Signal level
should reduce by more than 85 dB,
typically 90 dB.

6.2.4 Frequency Distortion Measure signal level on distortion
response analyser analyser.
output: 1kHz, 1
V rms Set as 0 dB reference
measurement
mode:signal 20Hz 0.0dB ±0.02
level. 20kHz -0.16dB ±0.05
6.2.5 Measure Distortion Leave AUDIO OUTPUT connected
distortion analyser to distortion analyser input.
output: 20Hz - Measure THD on distortion
20kHz, 1 V analyser.
rms
measurement 20Hz < 0.003
mode: THD 1kHz < 0.003
wide 20kHz <0.06
bandwidth
6.2.6 Check mute Distortion Measure signal level on distortion
operation analyser analyser.
channel output: 1 kHz,
1 V rms Set as 0 dB reference.
measurement
mode: signal Mute amplifier
level.
Signal level should reduce by more
than 80 dB.
6.2.7
6.2.8 Reassemble
unit
6.2.9 Clean with
damp cloth

7.0 upgrading software
7.1 Equipment required
PC Running Windows 95/98/NT and TMA Upgrade Wizard software
TAGtronic bus F3 TAGTRONIC
adaptor
7.2 Upgrading software procedure
No Action Test Details

Equipment
8.2.1 Switch off AC
power button
8.2.2 Insert red RJ- PC
45 plug into ‘in’ TAGtronic bus
socket of adaptor
100X5R. Plug
black RJ-45
connector into
‘out’ socket of
100X5R.
Connect
TAGtronic bus
adaptor to
COM1 port of
PC.
8.2.3 Switch on AC
power button
8.2.4 Start Upgrade
Wizard
software on PC
8.2.5 Select file to be The file will be sent to the 100X5R.
sent to 100X5R This will take approximately 1
and click next minute.
8.2.6 Remove all

connections to
100X5R except
mains. Turn
100X5R off
then on again.

8.0 diagnostics
8.1 Upgrading software diagnostic messages
When upgrading the 100X5R firmware, the Upgrade Wizard program should produce bar-graph
showing the progress while downloading the new software.
If it does not, please check the following:
! The TAGtronic bus adaptor is plugged into COM1 of the PC

! The black RJ-45 connector is plugged into the ‘out’ socket of the 100X5R
! The red RJ-45 connector is plugged into the ‘in’ socket of the 100X5R
! The 100X5R has been switched off and then on again (the display should be
blank)
If none of these is the case, then there is possibly a fault with the 100X5R. Please note the error
message and contact TAG McLaren Audio for guidance.
8.2 Resetting parameters
If any channels are caused to go into protect such that a fault is detected while the output relay
is open, the microprocessor will ensure that channel will not power up again. This is to ensure
that an internally faulty module will not have power connected to it. In order to reset this,
remove power from the IEC inlet on the rear of the unit and the faulty module register will be
deleted. Any modules which do not power up on switch on after this will have a continuous
fault.

9.0 circuit schematics
9.1 100X5R LED PCB
Sheet 1 of 1: 283 LED PCB (SCH28303-01-01)
9.2 100X5R IR PCB

Sheet 1 of 1: IR RECEIVER (SCH28204-01-01)

9.3 100X5R MICROCONTROLLER PCB
Sheet
1 of 3:
2 8 3
MICR
OCON
TROL
L E R
P C B
(SCH2
8206-
01-03)

Sheet 2 of 3: 283 MICROCONTROLLER PCB (SCH28206-02-03)

Sheet 3 of 3: 283 MICROCONTROLLER PCB (SCH28206-03-03)

9.4 100X5R AMPLIFIER MODULE PCB
Sheet 1 of 2: 283 AMPLIFIER SCHEMATIC (SCH28301-01-04)

Sheet 2 of 2: 283
AMPLIFIER SCHEMATIC
(SCH28301-02-04)

9.5 100X5R TAG BUS PCB

10.0 printed circuit board layout
10.1 100X5R AMPLIFIER PCB
Amplifier Module PCB

10.3 100X5R MICROCONTROLLER PCB (4 layer - not including inner ground & +5V planes)
10.4 IR PCB
10.5 LED PCB
10.3 TAG BUS

11.0 technical data
11.1 100X5R Technical Specifications
Specification Load Conditions units
Output power 8O continuous >100 W

4O short term >150 W
2O short term >190 W
Channel Balance <0.2 dB
Sensitivity 8O 1W .103 ± 0.02 V
Gain 1kHz 28.8 ± 0.2 dB
Input impedance >20 KO
Signal/Noise ref 0dBW 20Hz - 20kHz BW >90 dB

ref 0dBW ‘A’ wtd. >93 dB
Frequency response 20Hz - 20kHz 0 -0.15 dB

-3dB 0.2 & 75k Hz
-1dB 0.4 & 48k Hz
Overload headroom 8O IHF 1kHz 8O >2.2 dB

4O IHF 1kHz >2.5 dB
2O IHF 1kHz >3.0 dB
THD+N 8O 100W 20Hz - 20kHz 80kHz/500kHz BW <0.02/<0.05 %

4O 150W 20Hz - 20kHz 80kHz BW <0.03 %
Crosstalk @ 1kHz < -80 dB
abbreviationsE=Europe/Asia, N=North America, UK=United Kingdom

general
The rated and typical performance applies when the mains supply voltage is either 230V AC
for 220 - 240 V units or 115 V AC for 110 - 120 V units.
We reserve the right to alter design and specification without notice.

Specification may vary for different countries.

11.2 International Standards
The 100X5R meets or exceeds the following legal requirements:
89/336/EEC EMC Directive (as amended by 93/23/EEC)

directives 73/23/EEC Low Voltage Directive (as amended by
93/23/EEC)
TAG McLaren Audio Ltd

The Summit, Latham Road
Huntingdon, Cambs PE18 6ZU
United Kingdom
Telephone +44 (0)1480 415600

Fax +44 (0)1480 52159
E-Mail helpdesk@tagmclarenaudio.com

Tag MC Laren

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service manual

© 1999 TAG McLaren Audio Limited. All rights reserved.

Notification for new issues of the F3 series 100X5R

issue number :- GRP0000?.01

F3 series 100X5R service manual

2.0 front and rear panel layouts

3.0 disassembly instructions

4.0 technical outline

5.0 functional tests

6.0 performance tests

7.0 upgrading software

9.0 circuit schematics

10.0 printed circuit board layout

F3 series 100X5R service manual

11.0 technical data

F3 series 100X5R service manual

ATTENTION : utiliser un fusible de rechange de meme type et calibre

1.2 Electrostatic discharge precautions

F3 series 100X5R service manual 1

How to de-solder components

Components should be removed, wherever possible, using a de-soldering

How to make good solder joints

1. Ensure surfaces are clean.

How to detect acceptable joints

1. Solder joints should have from a shiny to satin lustre and

How to detect unacceptable joints

F3 series 100X5R service manual 2

F3 series 100X5R service manual 3

2.2 rear panel connections

F3 series 100X5R service manual 4

3.1 removing case and fascia

! Place unit on bench - rear panel facing you

Remove front panel assembly

3.2 removing components

Remove microcontroller PCB

CAUTION HIGH VOLTAGES

! Remove 6 fixing screws from PCB to chassis connectors on rear panel

Remove IR/LED PCB

F3 series 100X5R service manual 5

The microcontroller PCB is used to:

In addition, the microcontroller module provides TAGtronic communication bus connections to

Micro controller PCB

Mains distribution and switching

The power on sequence(for each module) is as follows:

The power off sequence is essentially the reverse:

F3 series 100X5R service manual 7

Front Panel power switch

Micro controller auxiliary power supply

4.1 50 way IDC connector J1

F3 series 100X5R service manual 8

No Net Name I/O Type Description

F3 series 100X5R service manual 9

4.4 100X5R block diagram

F3 series 100X5R service manual 10

F3 series 100X5R service manual 11

Digital Multimeter Accuracy better than 0.5% in V and mV ranges

Oscilloscope Bandwidth >100 MHZ

Ribbon: Link pins 2 & 6

5.3 Functional test procedure

No Action Test Equipment Details

4.2.1 Disconnect all

4.2.2 Check voltage Read ratings label on rear of

4.2.3 Check fuse type Open fuse holder in power socket on