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Specification
Freq.
B a n d [ M Hz ] 8 2 4 ~8 4 9 8 8 0 ~9 1 5 1 7 1 0 ~1 7 8 5 1 8 5 0 ~ 1 9 1 0 1 9 2 2 ~ 1 9 7 7 1 8 5 0 ~1 9 1 0 8 2 4 ~8 4 9 8 8 0 ~9 1 5
U pl i nk / 8 6 9 ~8 9 4 9 2 5 ~9 6 0 1 8 0 5 ~1 8 8 0 1 9 3 0 ~ 1 9 9 0 2 1 1 2 ~ 2 1 6 7 1 9 3 0 ~1 9 9 0 8 6 9 ~8 9 4 9 2 5 ~9 6 0
D ow nl i nk
UL:
9612~9888 UL : UL : UL :
A R FC N 0 ~1 2 4 & 9 2 6 2 ~9 5 3 8 4 1 3 2 ~4 2 3 3 2 7 1 2 ~2 8 6 3
range 1 2 8 ~2 5 1 5 1 2 ~8 8 5 512~810 DL: DL :
975~1023 10562~ DL : DL :
10838 9 6 6 2 ~9 9 3 8 4 3 5 7 ~4 4 5 8 2 9 3 7 ~3 0 8 8
T x/ Rx
s p a ci n g
45MHz 45MHz 95MHz 8 0 M Hz 190MHz 80MHz 4 5 M Hz 4 5MH z
F r a m e L e n g F ra m e L e n g F ra m e L e n g F ra m e L e n g
T i me S l o t
th: th: th: th:
P e rio d / 576.9us 576.9us 576.9us 576.9us
1 0 ms 10ms 10ms 10ms
F ra me 4.6 1 5 m s 4.615ms 4.615ms 4.615ms
S l o t l e n g t h : S lo tl e n g t h : S lo tl e n g t h : S lo tl e n g t h :
Period
0.667ms 0.667ms 0.667ms 0 . 6 67ms
Q P S K HQ P QP S K H Q P QP S K H Q P QP S K H Q P
Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK
SK SK SK SK
3 3 d B m ~5 d 3 3 d B m ~5 d 3 0 d B m ~0 d 3 0 d B m ~ 0 d 24dBm~ 2 4 d Bm ~ 2 4 d Bm ~ 2 4dB m~
MS P o w e r
Bm Bm Bm Bm -50dBm -50dBm -50dBm -50dBm
T DM A M u x 8 8 8 8 8 8 8 8
Ce ll
35Km 35Km 2Km 2Km 2Km 2Km 2Km 2Km
Radius
2-1
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Specification
2-2
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Specification
L T E B an d 1 L T E B an d 3 L T E B an d 5 L T E B an d 7 L T E B an d 8 L TE B an d2 0
F r eq .
Band[MHz] 1 92 0~ 19 80 1 71 0~1 78 5 82 4~8 49 2 50 0~2 57 0 8 80 ~91 4.9 83 2~8 62
U pl i n k / 2 11 0~ 21 70 1 80 5~1 88 0 86 9~8 94 1 80 5~1 88 0 9 25 ~95 9.9 79 1~8 21
D o wn l i nk
U L:
U L: U L: U L: U L: U L:
ARFCN 18 00 0~18 59 9 19 20 0~1 99 50 20 40 0~2 06 49 2 50 0~2 57 0 2 14 50 -2 17 99 24 15 0~2 44 50
r an ge D L: D L: D L: D L: D L: D L:
0 ~5 99 1 80 5~1 88 0 2 62 0~2 69 0 34 50 -3 79 9 6 15 0~6 45 0
2 40 0~2 64 9
T x/R x
19 0MH z 9 5MH z 4 5MH z 12 0MH z 45 MH Z 4 1MH z
spacing
Mo du la tio n QPSK , 16 / 6 4 QAM QPS K, 1 6/6 4 QAM QPS K, 1 6/6 4 QAM QPS K, 1 6/6 4 QAM QPS K, 1 6/6 4 QAM QPS K, 1 6/6 4 QAM
MS P ower
- 35 ~2 5.7 dB m - 35 ~2 5.7 dB m - 35 ~2 5.7 dB m - 35 ~2 5.7 dB m - 35 ~2 5.7 dB m - 35 ~2 5.7 dB m
(M PR )
Sensitivit
(QPS K)
-9 4 d Bm -9 2 d Bm -9 2 d Bm -9 5d Bm -9 5d Bm -9 4d Bm
(BW
1 0M H z )
C el l
>5 K m >5 K m >5 K m >5 K m >5 K m >5 K m
R a di us
2-3
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3. Operation Instruction and Installation
Main Function
Item Description
OS Android V5.1 (Lolipop)
RF LTE Cat.4 (150/50Mbps)
Battery 2,600mAh
Base Band 1.2GHz Quad
Other RF A-GPS, Glonass, BT 4.0, USB 2.0, NFC, WIFI 802.11 b/g/n
Camera 8MP A/F,(Main) with LED Flash, 5MP(Front)
LCD 5.0" 540 x 960 qHD LCD
RAM 1GB
Sensor Accelerometer, Proximity, Magnetic
Charger: 5V/1A
Accessory Data cable: 3pi, 0.8m
Ear phone: 3.5pi, 4pin
3-1
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9. Reference Abbreviate
Reference Abbreviate
9-1
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1. Safety Precautions
Before attempting any repair or detailed tuning, shield the device from RF noise or static
electricity discharges.
Use only demagnetized tools that are specifically designed for small electronic repairs,
as most electronic parts are sensitive to electromagnetic forces.
Use only high quality screwdrivers when servicing products. Low quality screwdrivers can
easily damage the heads of screws.
Use only conductor wire of the properly gauge and insulation for low resistance, because of
the low margin of error of most testing equipment.
We recommend 22-gauge twisted copper wire.
Hand-soldering is not recommended, because printed circuit boards (PCBs) can be easily
damaged, even with relatively low heat. Never use a soldering iron with a power rating of
more than 100 watts and use only lead-free solder with a melting point below 250°C (482°F).
Prior to disassembling the battery charger for repair, ensure that the AC power is disconnected.
Always use the replacement parts that are registered in the SEC system. Third-party replac
ement parts may not function properly.
1-1
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Safety Precautions
Many semiconductors and ESDs in electronic devices are particularly sensitive to static discha
rge and can be easily damaged by it. We recommend protecting these components with cond
uctive anti-static bags when you store or transport them.
Always use an anti-static strap or wristband and remove electrostatic buildup or dissipate
static electricity from your body before repairing ESDs.
Ensure that soldering irons have AC adapter with ground wires and that the ground wires are
properly connected.
Use only desoldering tools with plastic tips to prevent static discharge.
Properly shield the work environment from accidental electrostatic discharge before opening
packages containing ESDs.
The potential for static electricity discharge may be increased in low humidity environments,
such as air-conditioned rooms. Increase the airflow to the working area to decrease the
chance of accidental static electricity discharges.
1-2
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6. Level 1 Repair
6-1. S/W installation
※ Settings
6-1
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Level 1 Repair
6-2
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Level 1 Repair
6-3
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Level 1 Repair
VOLUME
UP
VOLUME
DOWN POWER
ON/OFF
OK
6-4
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Level 1 Repair
6-5
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Level 1 Repair
4. Start downloading the binary files into the device by clicking Start button on the
screen. The green colored "PASS!" sign will appear on the upper-left box if the
binary files have been successfully downloaded into the device.
6. Once the device boots up, you can check the version of the binary file or name
by pressing the following code in sequence;
*#1234#
You can perform Factory Reset by Settings → Accounts → Backup and reset
6-6
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Level 1 Repair
6-2-1 Preparation
- New IMEI writing Program has been released.
- Supported Model : Models which CAB files are uploaded on HHPsvc INI File
category, instead of ini file.
- Refer to below IMEI writing procedure.
- H/W
Serial Cable
Power PC
Supply
Anyway
JIG
- S/W
① Library Install To use Daseul, library files should be installed.
Refer to SVC Bulletin
“(11-82) Daseul (New IMEI writing Program) Library Install gui
de_rev1.0”
②Launcher DASEUL_SVC_Launcher_v3_0_10 or higher
-Uploaded on HHPsvc Notice
③ Runtime File 1. DASEUL_IMEI_ALL_Runtime_129_r00165 .CAB or higher
-Uploaded on HHPsvc Notice
2. Make ‘ModelName’ folder at the same position with
launcher & Runtime file.
④Model File Copy Model File under the ‘Model Name’ folder
6-7
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Level 1 Repair
SM-G531F
6-8
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Level 1 Repair
4. Select Model
SM-G531F
※Once you setup the setting, you don’t have to do it again, unless there is ch
ange. From second run of the IMEI program, check IMEI and click ‘Extract & Run’.
SM-G531F ②
①
SM-G531F_COMMON(CSC)_IMEI_Ver_3.1.137.1.CAB
6-9
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Level 1 Repair
6. Check ‘IMEI Write / IMEI Check’, and click ‘IMEI SVC & Repair Option’
6-10
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Level 1 Repair
6-11
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Level 1 Repair
11.Click OK to proceed
6-12
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Level 1 Repair
SM-G531F
6-13
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Level 1 Repair
13. Click OK
6-14
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Level 1 Repair
16. ① Click Start, and input IMEI writing ID and Password →②input Ticket No
6-15
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Level 1 Repair
6-16
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Level 1 Repair
6-4. RF Calibration
E3632A
Power Supply
CMW GPIB Cable
500 (2ea)
RF
Cable
6-17
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Level 1 Repair
6-18
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Level 1 Repair
3. Check the 'CAL' and open the model file, then select 'Start' button.
6-19
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Level 1 Repair
4. Change the Line Type to 'Block Cell' and disable 'Smart Cloud Cell'.
6-20
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Level 1 Repair
6-21
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Level 1 Repair
6-22
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