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MECHENG 405
K.C. Aw
Note: Some of the materials are based on Prof. Mark Bachman of UCI
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Surface micromachined pressure sensor
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Capacitive based MEMS pressure sensors
Optical patch changes with membrane deflection and is measured using spectrometer.
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MEMS Microphone
Technology
Array of Teflon-like
diaphragms on Si substrate
Uses FM modulation for
read-out
Issues
Close spacing of
diaphragms is difficult for
beam forming methods to
obtain directionality (at
1kHz, wavelength = 85 mm)
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Commercial MEMS Microphone
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MEMS microphone (piezoelectric)
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Accelerometer
Automotive application requirements:
Anti-lock braking system ± 1 g
Vertical body motion ± 2 g
Wheel motion ±40 g
Air bag deployment ±50 g
Steering feedback ± 100o/s
Shock survivability 500 g, 1 m drop to concrete
Frequency response
0 - 5 Hz vertical
0.5 - 50 Hz, horizontal
1 kHz, air bags
Temperatures
-40 C to 85 C
-40 C to 125 C under hood
Miscellaneous 200 V/m, hermetic seal
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Accelerometer – Basic Principles
(Spring-mass device)
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Modern accelerometer with strain gauge. Note use of bulk etched silicon
and glass (bonded by anodic bonding). Lucas NovaSensor.
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Accelerometer with strain gauge
Bulk etched silicon and pyrex glass bonded together. Used for monitoring
heart wall accelerations. Roylance and Angell (1979)
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Accelerometer with piezo-electric sensing
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Typical calculations
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Typical calculations
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Typical calculations
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MEMS Accelerometers
Surface micromachining: Analog Devices, e.g.
ADXL-50
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Force balanced-capacitive accelerometer
ADXL-50
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3-axis accelerometer
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MEMS Resonator
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Resonator
E – Young’s modulus
ρ - density
tc – cantilever thickness
lc – cantilever length
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Resonator
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MEMS Accelerometer
Silicon Designs, Inc
Silicon Design's accelerometers use capacitance
change due to acceleration force as the sensed
parameter.
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MEMS Accelerometer
The sense element wing is a flat plate of nickel
supported above the substrate surface by two
torsion bars attached to a central pedestal.
The structure is asymmetrically shaped so that one
side is heavier than the other, resulting in a center
of mass that is offset from the axis of the torsion
bars.
When an acceleration force produces a moment
around the torsion bar axis, the plate or wing is free
to rotate, constrained only by the spring constant of
the torsion bars.
On the substrate surface, beneath the sense
element wing, two conductive capacitor plates are
symmetrically located on each side of the torsion
bar axis. The upper wing and the two lower
capacitor plates on the substrate form two air-gap
variable capacitors with a common
connection. This creates a fully active capacitance
bridge. When the wing rotates about the torsion bar
axis, the average distance between the wing and
one surface plate decreases, increasing the
capacitance for that plate, while the distance to the
other plate increases, decreasing its capacitance.
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Optical MEMS
Application
Scanners
Projectors
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MEMS microphone (optical)
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What is a Gyroscope?
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Gyroscope Principles
Principle of operation
The simplest gyroscopes
use a high speed,
rotating inertial disk that
is loosely coupled to the
frame holding it.
A rotation in the frame
imparts a torque
(rotation) on the spinning
disk, which precesses
(rotates) as a result
(conservation of angular
momentum).
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Gyroscope Principles
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Problems for MEMS gyroscopes
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Coriolis effect
Motion in a rotating
reference frame leads to
“sideways” movement.
Can’t walk a straight line
in a rotating reference
(merry-go-round) without
exerting a sideways force
(or acceleration).
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MEMS Gyroscope principles
Constrained motion
means a force is
imparted.
By measuring the
imparted force (or its
effect on an oscillator),
we can measure the
angular velocity. Almost
all MEMS gyroscopes
use this feature.
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MEMS Gyroscope principles
Vibrating ring gyroscope
A ring is flexured back and
forth in resonant mode. The
Coriolis effect induces
flexure that is sideways
(and out of phase) with the
driving flexure.
Since the Coriolis force
vibrates the ring sideways,
it produces a second mode
of vibration which adds to
the first. The result is a
“rotation” of the mode
pattern of the ring. Most
MEMS gyros use this
method in closed-loop
mode.
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MEMS Gyroscope-Examples
Delco Electronics
Corp.
Vibrating ring assembly
electroformed on CMOS
substrate.
Device is freestanding
metal. High precision
capacitance circuits
monitor ring vibration and
provide electrostatic
actuation for closed loop
operation.
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MEMS Gyroscope-Examples
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MEMS Gyroscope-Examples
Daimler Benz AG
Tuning fork sensor
(process flow).
Device is fabricated from
silicon with piezoelectric
actuator (Al Nitride) and
piezoresistive (diffused)
sensor. SOI wafers are
fusion bonded together to
form final device.
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MEMS Gyroscope-Examples
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MEMS Gyroscope-Examples
cont/-
Process flow
Device is fabricated from
silicon using surface and
bulk micromachining
methods.
Deep silicon etch
processes and MEMS
level packaging.
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MEMS Gyroscope-Examples
University of
California, Irvine
Device made at UCI and
at Microfabrica
Deep etched
micromachined vibrating
ring gyroscope.
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Segway
Silicon Sensing Systems
VSG ring sensor
“Dynamic Stabilization”
Five sensors used to
monitor orientation of the
scooter, sampled at 100
times/second. Sensors
include VSG ring
gyroscopes and liquid-
filled tilt sensors.
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MEMS Gyroscope-Example Applications
Human motion
sensing
Virtual Reality,
Human/Machine
interface/Gaming
Consumer and game
markets require lower
performance specs and
lower costs.
These represent an
emerging market for
inertial MEMS devices.
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