Professional Documents
Culture Documents
- nr J
NORME EUROPEENNE
“ľ,
EUROPÂISCHE NORM May 2017
English Version
0)
(IEC 61340-5-1 :2016/COR1 :2017)
EIectrostatiue PaMie 5-1 Protection des dispositifs
- Elektrostatik TeiI 5-1. Schutz von elektronischen
-
This corrigendum becomes effective on 26 May 2017 for incorporation in the English Ianguage version of the EN,
n
c
n
E
o
c
•0
o
m
N
•0
m
0
c
n
0)
O
•0
m
n
o
o
CEHELEC
Europeun Comîiiittee for Elcclrokchnical Statidarclization
Cornité Européen đe Nortiial salion IĹlectrotcchniquc
Etiropüisclies Koiiiitee flir Elektrotcchnische NormLlng
© 2017 CENELEC AII rights of exploitation n any form and by any means reserved worldwide for CENELEC Members
Endonement noUce
The 1e4 oi flie canlgendwn IEC 61340-5-1:20161C0R1:2017 was approved by CENELEC n EN 61340-5-1:2O1WAC:201745 *iihout aiy
modiHcaUoa
J
IEC 61340-5-1:2016[CORI:2017 — 1 —
01EC2017 -
ELECTROSTATICS — ÉLEcTROSTATIQUE —
Part 5-1: Protection of electronic devices from Partie 5-1: Protection des dispositifs
olectrostatic phenomena General roquirements
— électroniques contre es phénoměnes
électrostatiquos Exigences générales
—
x
114
0-
o
CORRIGENDUM 1
I
Corrections only apply to the French
Lors de ľětablissement dun plan de contröle ESD, si un conducteur entrant en contact avec
un élément ESDS ne peut pas ětre relié ä Ia terre ou équipotentiellement, Ie processus doit
sassurer que Ia dfférence de potentiel entre le conducteur et le contact de Iélément ESDS
est inférieure ä 35 V.
a
O
Ct1
9
o
D
o
9
(0
o
o
.7
(0
o
w
--
ş7ţ3' —
ICS 17.20099; 29.020
SR EN6134051
Titlu Electrostatică
Partea 5-1: Protecţia dispozitivetor electronice
împotriva fenomenelor electrostatice
Prescripţii generale
N
Electrostatics Parf 5-1: Protection of electron,c dev,ces ĺrom electrostaţ,c
-
o
7 EÍec(rostatique PaMîe 5-1: Protection des dîspositifs électroniques contre Ies
-
o
Ĺt
s
c
E
o
c
I
Str. Mendeleov nr. 21-25, cod 010362, Bucureşti P www.asro.ro
@ ASRO Reproducerea sau utilizarea inteDrală sau paiaIă a prezentuîui standard în orice publicaţii
şi prin orice procedeu (electronic, mecanic, fotocopiere, rnicrofilmare etc.) este interzisă
dacă nu există acordul scris prealabil aI ASRO
English Version
o
o Electrostatics Part 5-1: Protection of electronic devices from
-
o
electrostatic phenomena General requirements -
o
N (IEC 61340-5-1:2016)
0,
Electrostatique Fartie 5-1 Protection des dispositifs Elektrostabk TeiI 5-1 Schutz von elektronischen
w - -
I This European Standard was approved by CEŃELEC on 2016-07-01. CENELEC members are bound to comply wilh lhe CENJCENELEC
o Internal Regulations which stipulate the condÉtions for giving this European $tandard the status of a natianal standard without any alteration.
Ć1)
w
o Up-to-date Iists and bihliographical references concerning such national standards may be obtaŕned ori application to the CEN-CENELEC
I
o Management Cenţre or to any CENELEC member
x
n
c This European Standard exjsts in three official versions (English, French, Gerrnan). P version in any other tanguage made by translation
n undor the responsibility of a CENELEC member into its own Ianguage and notied to the CEN-CENELEC Management Centre has the
E same statuş as the offciaI versions.
o
x
c
•0 CENELEC members are the national electrotechnical commttees of Austra, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
c
1-
Oenmark Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy. Latvia,
n Lithuania, Luxembourg, Malta, the Netherlands, Norway, Foland, Podugat, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
N
Turkey and the United Kingdom.
n
c
n
0,
c
t
n
m
o
o
0)
CEHELEC
Europcan Commitiee for Electrotechiiical Standardization
Comitć Européini de Nornwlisation Electrotechnique
Etiropäisches Komiţee Qir Llektroteehnisclie Normunr
@ 2016 CENELEC AII rights of exploitation in any form and by any means reserved wortdwide for CENELEC Members.
The text of document 101/505/FDIS, future edÉtion 2 of IEC 61340-5-1, prepared by iEC/TC 101
“Electrostatics" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as
EN 61340-5-1:2016,
• Iatest date by which the naUonal standards conflicting with (dow) 2019-11-18
the document have to be withdrawn
o
o
c'J
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CENJ shall not be held responsible for identifying any or aIL such
patent rights.
r
o
0)
Endorsement notice
x
o
The text of the International Standard IEC 61340-5-1:2016 was approved by CENELEC as a
European Standard without any modification.
o
In the official version, for Bibliography, the following notes have to be added for the standard ndicated
0
O
ca IEC 60749-26 NOTE Harmonzed as EN 60749-26.
0
IEC 60749-27 NOTE Harmonized as EN 60749-27.
c
ca
IEC 60364 (Seríes) NOTE Harmonized as EN 60364 (Sertes).
o
t
2
EN 61340-5-1:2016
Annex ZA
(normative)
The following documents in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the Iatest edition of the referenced document (including any amendments) applies.
NQTE 1 When an International Publication has been moditied by common moditicatíons, indicated by (mod), the relevant
ENHD applies.
x NOTE 2 Up-to-date information on the Iatest versions oĺ Ihe European Stanđards tisted in this annex is availabte here:
nceneIereu.
o
Pubhcation Year lltIe EN/HD Year
IEC 61343-2-3 - Electrostatics Part 2-3: Methods of testEN 61340-2-3
- -
Footwear
EC 61340-4-5 - Electrostatics Part 4-5: Standard testEN 61340-4-5
-- -
straps
E IEC 61340-4-7 - Electrostatics Part 4-7: Standard test-
- -
Ionization
IEC 61340-4-9 - Electrostatics Fart 4-9: Standard testEN 61340-4-9
- -
G arments
IEC 61340-5-3 - Electrostatics Part 5-3: Protection ofEN 61340-5-3
- -
3
IEC 61340-5-1
Edition 2.0 2016-05
INTERNATIONAL
STANDARD
NORME
MNTERNATIONALE
Electrostatics—
j General requirements
.2 Electrostatique —
0)
o
tb
o
N
o
w
THIS PUBLICATION 1$ COPYRIGHT PROTECTED
Copyright @ 2016 IEC, Geneva, Switzerland
AH rights reserved. Unless otherwise specified, no parl of Ihis publication may be reproduced or utilized n any form
or by any means, electronic or mechanical, including photocopying and m,crofilm, without permission in wriiing from
e,lher IEC or JECs member NalionaJ Committee in the counlry of the requesler. 1ľ you have any queslions aboul IEC
copyright or have an enquiry about obtaining addiiional righis to this publication. please contact the address below or
your Iocal IEC member National Committee far further nĺormaiion.
Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite
ni utilisée sous quelque forme que ce soit et par aucun procedé. électronique ou mécanique, y compris Ia photocopie
eI Ies mjcrofilms, sans I'accord écrit de IIEC ou du Comité nalional de ľIEC du pays du demandeur. $i vous avez des
s questions sur le capyright de ‘IEC ou si vous désirez ollenir des droits supplémentaires sur cetie publication. utilisez
7-
o les caordonnées ci-aprés ou contaclez Ie Comité national de IIEC de volre pays de résidence.
c'J
o
o IEC Central Office TeI.: 41 229190211
N 3, rue de Varembë Fax +41 229190300
c CH-1211 Geneva2o i n fo i e c c h
0, Swilzerland www.iecch
x
tu
0 About the IEC
o The International Electrolechnical Commission (IEC) is Ihe Ieading gIobal organization that prepares and publishes
N lnternational $tandards for aII electrical, electronic and related lechnalogies.
c About IEC publications
I The technical content of IEC publications is kept under conslant review by the IEC. Please make sure that you have the
o
0,
Iatest edilion, a corrigenda or an amendment might have been published.
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
N
r
o
to
06
w
o
r
o Electrostatics —
c
1- Partie 5-1; Protection des dispositifs électroniques contre Ies phénomônes
o
N
t électrostatiques Exigences générales
—
o
•0
n
to
4)
0
m
o
0.)
c
(0
INTERHATIQNAL
ELECTROTECHNţCAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
I NTERNATIQNALE
arning! Make sure that you obtained this publication from an authorized distributor.
Attention! Veuiflez vous assurer que vous avez obtenu cette pubication via un di5tributeur agróé.
CONTENTS
FOREWORD 3
NTRODUCTION 5
1 Scope 7
2 Normative reĺerences 7
3 Terms and definitions B
4 Personnel safety 9
5 ESD control program 10
5.1 General 10
5.1.1 ESD control program requirements 10
5.1.2 ESD coordinator 10
5.1.3 Tailoring 10
5.2 ESD control program administrative requirements 10
5.2.1 ESD control program plan 10
5.2.2 Train ing plan 10
5.2.3 Product qualification 11
0,
5.2.4 Compliance verification plan 11
5.3 ESD control program plan technical requirements 11
5.3.1 General 11
5.3.2 Groundingĺequipotential bonding systems 12
5.3.3 Personnel grounding 14
5.3.4 ESD protected areas (EPA) 15
5.3.5 Packaging 17
5.3.6 Marking 17
Annex A (normative) Test methods 19
Bibliography 20
ELECTROSTATICS —
J FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standard,zation comprlsing
national electrotechnical committees (l&C National Committees). The object of IEC is to promole
alI
- -
inlernationat co-operation on aII queslions concerning standardization in the etectrical and electronic fields. To
* this end and in addition to other activities, IEC publishes International Standards, Technicat Specifications,
Technicat Reports, Pubticly Availabte Specifications (PAS) and Guides (hereatter referred to as IEC
o Publication(sfl. Their preparation is entrusted to lechnical committees: any IEC National Committee interested
1— in (he subject dealt with may participate in this preparatory work. Internattonat. governmentat and non
9overnmentat organizations Iiaising with the IEC atso participate in this preparation. tEC coltaborales closely
with the International Organization for Standardization (ISO) in accordance with conditions delermined by
agreement between the two organizations.
2) The formal decisions or agreements of tEC on technical matters express. as nearty as possibte. an inlernational
consensus of opinion on the retevant subjects since each technicat commitlee has representation from alt
interested IFC National Committees.
3) IEC Publications have the form of recommendations for internationat use and are accepted by tEC Nationat
Committees in that sense. White atl reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate. IEC cannot be held responsibte for the way in which they are used or for any
E misinterpretation by any end
m
E 4) tn order to promote international uniformity. IEC Nationat Committees undertake to apply IEC Publ,cations
& transparentty to the maximum extent possibte in their national and regonat publications. Any divergence
between any IEC Pubtication and the corresponding national or regional publication shatl be ctearty indicated in
c
the Iatter.
5) tEC itself does noI provide any attestalion of conformily. Independent certification bodies provide conformity
assessment services and. in some areas. access to IEC marks of conformity IEC is not responibte for any
E serv,ces carried out by independent certification bodies,
6) AtI users should ensure that they have the latest edition of this publ'cation.
m
7) No Iiabitity shalt attach to IEC or ils directors. employees. servants or agents including individuat experls and
m members of its Iechnical committees and tEC National Committees for any personat injury, property damage or
other damage of any nature whatsoever. whether direct or ndirect, or for ccsts (including Iegat fees) and
expenses arising out of the publica;ion. use of, or reliance upon. this IEC Publication or any other tEC
Pubtications.
8) Attention is drawn to Ihe Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of th,s publication.
9) Altention is drawn to the possibility that some of the elements of this IEC Publicalion may be the subjecl of
patent rights, IEC shalţ not be held responsbIe for idenlifying any or aII such patent rights.
International Standard IEC 61340-5-1 has been prepared by IEC technical commÉttee 101:
Electrostatics.
This second edition cancels and replaces the first edition published in 2007. This edition
constËtutes a technical revision.
This edition ncludes the following significant technícal changes with respect to the previous
edition:
a) Technical requirements were changed to align IEC 61340-5-1 with other industry ESD
standards;
b) Reference documents were updated to reflect newly released IEC standards;
c) A section on product qualification was added;
d) Table 4 was deleted and detailed packaging reqtUrements were deferred to
IEC 61340-5-3;
—4— 1EC61340-5-1;2016©1EC2016
FuII information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
w
This pubication has been drafted in accordance with the ISOJIEC Directives, Part 2.
A Iist of aII parts in the IEC 61340 series, published under the general title Electrostatics, can
be found on the IEC website.
(1)
x
The committee has decided that the contents of this publication wiII remain unchanged until
the stability date indicated on the IEC website under http://webstore.iec.ch in the data
related to the specific publication. At this date, the publication wiII be
• reconfirmed,
• withdrawn.
• replaced by a revised edition, or
r
• amended.
o
c
n
E
o
Ćr
c
t
o
1-
o
N
o
•0
E
n
o
t
n
u
o
01
IEC 61340-5-1:2016 @ IEC 2016 — 5 —
INTRODUCTION
This part of IEC 61340 covers the requirements necessary to design, establish, implement
and maintajn an electrostatic discharge (ESD) control program for activities that: manufacture,
process, assemble, install, package, label, service, test, inspect, transport or otherwise
handle electrical or electronic parts, assemblies and equipment susceptible to damage by
electrostatic discharges greater than or equal to ioo v human body modeL (HBM), 200 V
charged device model (CDM) and 35 v on isolated conductors. lsolated conductors were
historically represented by machine model (MM), The 35 v limit is related to the Ievel
achievable using ionizers specified in this standard. The MM test is no Ionger required for
qualification of devices, only the HBM and CDM tests are. The MM test is retained in this
standard for process control of isolated conductors only,
Any contact and physical separation oĺ materials or flow of solids, Liquids, or particle-laden
gases can generate electrostatic charges. Common sources of ESD include charged:
personnel. conductors, common polymeric materials. and processing equipment. ESD
damage can occur when:
• a charged person or object comes into contact with an ESD sensitive device (ESDS):
• an ESDS comes into direct contact with a highly conductive surface while exposed to an
r electrostatic field;
o
• a charged ESDS comes into contact with another conductive surface which is at a different
electrical potential. This surface may or may not be groundeď
r
Examples of ESDS are microcircuits, discrete semiconductors, thick and thin film resistors,
hybrid devices, printed circuit boards and piezoelectric crystals. lt is possible to determine
device and item susceptibility by exposing the device to simulated ESD events. The ESD
withstand voltage determined by sensitivity tests using simulated ESD events does not
necessarily represent the ability of the devŕce to withstand ESD from real sources at that
voltage level. However. the Ievels of sensitivity are used to establish e baseline of
susceptibility data for comparison of devices with equivalent part numbers from different
manufacturers. Three different models have been used for qualification of eíectronic
E components — human body model (HBM). machine model (MM), and charged device model
(CDM). ln current practice devíces are qualified only using HBM and CQM susceptibility tests.
This standerd covers the ESD control program requirements necessary for setting tip a
program to handle ESDS. based on the historical experience of both military and commercial
E organizations, The fundamental ESD control principles that form the basis of this standard are
as follows.
w
Avoid a discharge from any charged. conductive object (personnel and especially
automated handling equipment) into the ESDS. This can be accomplished by bonding or
electrically connecting all conductors in the environment, including personnel, to a known
ground or contrived ground (as on board ship or on aircraft). This attachment creates an
equipotential balance between all conducting objects and personnel. Electrostatic
protection can be maintained at a potential different from a zero voltage ground potential
as long as all conductive objects in the system are at the same potential.
• Avoid a discharge from any charged ESD sensitive device. Charging can result from direct
contact and separation or it can be induced by an electric field. Necessary insulators in
the environment cannot lose their electrostatic charge by attachment to ground. lonization
systems provide neutralization of charges on these necessary insulators (circuit board
materials and some device packages are examples of necessary insulators). The ESD
hazard created by electrostatic charges on the necessary insulators in the work place is
assessed to ensure that appropriate actions are implemented, according to the risk.
• Once outside of an electrostatic discharge protected area (hereinafter referred to as an
EPA) it is generally not possible to control the above items, therefore, ESD protective
packaging may be required. ESD protection can be achieved by enclosing ESD sensitive
products in static protective materials, although the type of material depends on the
situation and destination. lnside an EPA, static dissipative materials may provide
— 6 — IEC 61340-5-1:2016 © IEC 2016
Each company has different processes, and so wiII require a different blend of ESD
prevention measures for an optimum ESD control program. Measures should be selected.
based on technical necessity and carefully documented in an ESD control program plan. so
that aU concerned can be sure of the program requirements.
Training is an essential part of an ESD control program in order to ensure that the personnel
involved understand the equipment and procedures they are to use in order to be in
compliance with the ESD control program plan. Training s also essential in raising awareness
and understanding of ESD issues. Without training. personnel are often a major source of
ESO risk. With training, they become an eřfective first Iine of defence against ESO damage.
w Regular compliance verification checks and tests are essential to ensure that equipment
o remains effective and that the ESD control program is correctly implemented in compliance
with the ESD control program plan.
z
o
0)
w
o
I
o
x
m
c
n
E
o
x
c
t
o
n
N
m
t
c
n
c
t
n
n
o
o
to
1EC61340-5-1:2016©1Eć2016 —7—
ELECTROSTATICS —
1 Scope
This part oĺ IEC 61340 applies to activities that: manufacture. process. assemble. install.
package. Iabel, service, test. inspect, transport or otherwise handle electrical or electronic
parts, assemblies and equipment with withstand voltages greater than or equal to ioo V HBM,
200 v CDM and 35 V for isolated conductors. ESDS with Iower withstand voltages may
require additional control elements or adjusted Iimits. Processes designed to handle items
that have lower ESD withstand voltage(s) can still claim compliance to this standard.
This ştandard provides the requirements for an ESD control program. IEC TR 61340-5-2 [9]1
provides guidance on the implementation of this standard.
This standard does not apply to electrically nitiated explosive devices, flammable Iiquids.
gases and powders.
The purpose of ţhis standard is to provide the administrative and technical requirements for
ci establishing, implementing and maintaining an E5D control program (hereinafter referred to
as the “program"),
2 Normative references
The following documents, ín whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applíes. For
CD undated references, the latest edition of the referenced document (including any
amendments) applies.
(t
IEC 61340-2-3, Electrostetics Pert 2-3: Methods of test for determining the resistance and
—
IEC 61340-4-1, Electrostatics Part 4-1: Standard test methods for specific applications
— —
IEC 61340-4-3. Electrostatics — Part 4-3: Standard test methods for specific applications —
Footwear
IEC 61340-4-5, Electrostatics Part 4-5: Standard test methods for specific applications
— —
Methods for characterizing the electrostatic protection of footwear and flooring in combination
with a person
IEC 61340-4-6. Electrostatics — Part 4-6: Standard test methods for specific applications —
Wrist straps
IEC 61340-4-7, Eĺectrostatics — Part 4-7: Standard test methods for specific applications —
lonization
IEC 61340-4-9, Electrostatics — Part 4-9: Standard test methods for specific applications —
Garme n ts
IEC 61340-5-3, Electrostatics Part 5-3: Protection of eiectronic devices from ejectrostatic
—
For the purposes of this document, the following terms and definitions apply.
x NOTE For the purposes of this đocument “earth" and ground' have the same meaning.
3.1
N charged device model
CDM
ESD stress model that approximates the discharge event that occurs when a charged
c component is quickly discharged to another object at a different electrostatic potential
3.2
E common grouna point
grounded device or Iocation where the conductors of two or more ESD control items are
E bonded
0
2
c
N 3.3
common connection point
device or Iocation where the conductors of two or more ESD control items are connected in
S order to bring the ESD protective items to the same electrical potential through equipotential
bonding
8 equipotential bond
electrical connection of conductive parts (or items used to control ESD) so that they are at
substantially the sarne voltage under normal and fault conditions
3-5
eiectrostatic discharge
ESD
rapid transfer of charge between bodies that are at different electrostatic potentials
3.6
ESD control items
materials or products designed to prevent the generation of static charge and/or dissipate
static charges that have been generated so as to prevent damage to ESD sensitive devices
3.7
ESD protected area
EPA
area in which an ESDS can be handled with accepted risk of damage as a result of
e!ectrostatic discharge or fields
IEC 61340-5-1:2016 © IEC 2016 — 9 —
3.8
ESD sensitive device
ESDS
sensitive device, integrated circuit or assembly that may be damaged by electrostatic fields or
electrostatic discharge
3.9
E$D withstand voltage
highest voltage level that does not cause device failure
functional
ground
x terminal used to connect parts to ground for reasons other than safety
3.11
human body model
HBM
x ESD stress model that approximates the discharge from the fingertip of a typical human being
onto a pin of a device with another pin grounded
3.12
machine model
MM
ESD stress model that approximates the discharge to a device pin due to contact of
equípment or tools such as those found in the manufacturing Iine
= organization
company, group or body that handles ESDS
3.14
protective earth
terminal used to connect parts to earth for safety reasons
4 Personnel safety
The procedures and equipment described in this standard may expose personnel to
hazardous electrical conditions. Users of this standard are responsible for seIectin
equipment that complies with applicable aws, regulatory codes and both external and internal
policy. Users are cautioned that this standard cannot replace or supersede any requirements
for personnel safety.
Electrical hazard reduction practices shall be exercised and proper grounding instructions for
equipment shall be followed.
— 1Ü — IEC 61340-5-1:2016 © IEC 2016
5.1 General
The ESD control program shall include aII the administrative and technical requirements of
this standard. The ESD control program shall document the Iowest ESD withstand voltage(s)
that can be handled. The organization shall establish. document, implement, maintain and
verify the compliance of the program in accordance with the requirements of this standard.
A person shall be assigned by the organization with the responsibility for implementing the
requirements of this standard includíng establishing, documenting, maintaining and verifying
the compliance of the program.
5.1.3 Tailoring
This standard, or portions of it, may not apply to aII applications. Tailoring is accomplished by
evaluating the applicability of each requirement for the specific application. Upon completion
of the evaluation, requirements may be added, modified or deleted. Tailoring decisions,
including rationale and technical justification, shall be documented.
w
o
5.2 ESD control program administrative requirements
The organization shall prepare an ESD control program plan that addresses each of the
requirements of the program. Those requirements are:
• training,
• product qualification,
• compliance verification,
• grounding/honding systems.
• personnel grounding.
• EPA requirements,
• packaging systems,
marking.
The plan is the principal document for implementing and verifying the program. The goal is a
fully implemented and integrated program that conforms to internal quality system
requirements. The plan shall apply to aII applicable facets of the organizations work.
The training plan shall define aII personnel that are required to have ESD awareness and
prevention training. At a minimum, initial and recurrent ESD awareness and prevention
training shall be provided to aII personnel who handle or otherwise come into contact with any
ESDS. Initial training shall be provided before personnel handle ESD sensitive devices. The
type and frequency of ESD training for personnel shall be defined in the training plan. The
training plan shall include a requirement for maintaining employee training records and shall
document where the records are stored. Training methods and the use of specific techniques
are at the organizations discretion. The training plan shall include methods used by the
organization to ensure trainee comprehension and training adequacy.
IEC 61340-5-1:2016 © ÉC 2016 — VI —
The organization shall qualify aII ESD control items that are selected for use as part of the
ESD control program. Tables 2 and 3 list the required product qualiĺication test methods,
associated Iimits for each ESD control item and other requirements as stated in this standard.
a) Product data sheets published by the manufacturer of the ESD control item:
1) The data sheet shall reference the required IEC test method for that item.
2) The data sheet limits shall, at a minimum, comply with the limits for that ESD control
em
b) Test reports from an independent laboratory: the test report shall reference the applicable
IEC test method and the limits shall comply with the Iimits for that item as specified in this
standard.
x
c) Test reports generated internally by the organization for its own use the test report shall
Ę reĺerence the applicable IEC test method and the limits shall comply with the Iimits for that
N item.
d) For ESD control items that were installed by the organization before the adoption of this
r standard, on-going compliance verification records can be used as evidence of product
qualification.
w
For ESD control items that are not Iisted in Tables 2 and 3, but are considered to be a part of
o the ESD control program, the organization using such items shall qualify these products prior
to use, The test method used for product qualification and the user defined acceptance limits
for each item shall be documented in the ESD control program plan.
E
NOTE IEC TR 61340-5-2 contains guidance for items not isted in Tables 2 and 3 or this document.
The test equipment selected shall be capable of making the measurements defined in the
compliance verification plan.
Consideration should be taken regarding the lowest relative humidity Ievels experienced by
the organization; some of the measurements should be made under these conditions.
5.3.1 General
The following subclauses describe the essential technical requirements used in the
development of an ESD control program.
The required Iimits are based on the test methods or standards listed in Table 1, Table 2 and
Table 3. The compliance verification plan shall document the methods used to verify the
limits. These procedures may or may not be based on the test methods in each table. Test
— 12 — IEC 61340-5-1:2016 © IEC 2016
methods and corresponding Iimits used by the organization that differ from the test methods
or references in Tables 1 to 3 shall be documented with a technical justification that supports
their use.
Some of the technical elements Iísted in Tables 1 to 3 do not have a defined Iower resistance
Limit. However, a minimum resistance value may be required for safety reasons.
See relevant national requirements and/or IEC 60364(4] series, ÍEC TS 60479-1(5].
IEC TS 60479-2[6], IEC 6101 0-1 [7]. and IEC 61140(8].
o
N
o
o
N
0,
x
In
0.
o EC
1—
N
r Key
(3
0) 1 Wrist strap (banđ and ground cord)
In
o 2 Work surface
r
o 3 Common ground point
m 4 Floor mat
c
n 5 Floor
E
o 6 Protective oarth or functional ground (functional ground, f used, shall be bondeđ to protective oarth)
c
•0 Figure 1 — Schematic of an EPA with a ground reference
n
N
t CAUTION: Users are advised to consult Iocal and national electrical codes and regulations
m
•0
beĺore making any connections to facility electrical wiring systems.
c
m
0,
t
n
n
u
o
— 14 — IEC 61340-5-1:2016 © IEC 2016
J
4 J
c
t'1
o I J
O
r.J
/
x — I
tu
0-
o IEC
1-
N
Qt
Key
o
1 Wrist strap and cord
w
o 2 Work surface
z
o $ Cammon cannection point
cr
m 4 Floor mat
E
m 5 F(cor
E
O
Figure 2 — Schematic of an equipotential bonding system
E
o
1.- Table 1 — Grounding/bonding requirements
n
N
•0
Technical requirement Grounding method Test methodlstandard Réquired IImtt(s)
m
t
c Groundinglbanding system Protect,ve earth National eleclrical system National electrical code
m
standard Iimils
w
o Functianal graund NatonaI electrical system NationaI eleclrical cade
t
m standard Iimits
m
o lf the natianal electrical
o cade daes not specify a
requirement, then the
resistance between
functional graund and
protective earlh shall not
exceed 25 O
Equipotential bonding See applicable See Iimits for each ESD
mplementing pracess fram control item ĺrom Tables 2
Tables 2 and 3 and 3
• the total resistance of the system (from the person. through the footwear and flooring to
ground) shall be less than 1,0 x io n;
• the maximum body voltage generation shall be Iess than 100 V.
NOTE An EPA can, for example, consist of a building, an entire room or a single workstation.
Access to the EPA shall be limited to personnel who have completed appropriate ESD
training. Untrained individuals shall be escorted by trained personnel while in an EPA.
5.3.4.2 Insulators
AII non-essential insulators and items (plastics and paper), such as coffee cups, food
wrappers and personal items shall be removed from the workstation or any operation where
unprotected ESDS are handled.
— 16 — IEC 61340-5-1:2016 © IEC 2016
The ESD threat associated with process essential insulators or electrostatic field sources
shall be evaluated to ensure that:
• the electrostatic field at the position where the ESDS are handled shall not exceed
5 000 Vfm;
or
• if the electrostatic potential measured at the surface of the process required insulator
exceeds 2 000 V, the item shall be kept a minimum of 30 cm from the ESDS; and
• if the electrostatic potential measured at the surface of the process required insulator
exceeds 125 V, the item shall be kept a minimum of 2,5 cm from the ESDS.
if the measured electrostatic field or surface potential exceeds the stated limits, ionization or
other charge mËtigating techniques shall be used.
Some of the measurements should be taken at the Iowest expected relative humidity
experienced by the facility.
1—
N
NQTE 1 These measurements are made based 011 ihe frequency defined in the compliance verification plan.
r ŃOTE 2 An ESQ Ihreat s considered a metal to metat contact while the ESDS is in the presence of the field
o
0)
od NQTE 3 The acçurate measuremcnt of electroslatic fields requires that the person making the measurement is
familiar wth the operation of the measuring equipment. Most hand held meters require that the reading te taken at
r a fixed distance from the object. They also normatly specify that the abject has a minimum dimension of fixed size
in order to obtain an accurate reading.
When establishing an ESD control plan, if a conductor that comes into contact with an ESDS
item cannot be grounded or equipotentially bonded together, then the process shaíl ensure
that the difference in potential between the conductor and the contact of the ESDS item is
less than 35 V.
This can be accomplished by measuring the ESDS item and the conductor by using: a non
contact etectrostatic voltmeter ora high impedance contact electrostatic voltmeter.
(1)
NOTE The 35 V imiţ is çelated to the Ievel achievable using ionízers specified in this standard.
An EPA shall be established wherever ESD sensitive products are handled without ESD
protective covering or packaging. However, there are many different ways to establish an
ESD control program. Table 3 lists some optional ESD control items which can be used to
control static electricity. For those ESD control items that are selected for use in the ESD
control program, the required range for that item becomes mandatory.
If the Iimits in Table 3 are exceeded, the ESD control program shall incluđe a tailoring
statement as required by 5.1.3.
IEC 61340-5-1:2016 © IEC 2016 — 17—
and trolley9
Wrist strap R9 c 5 x io O
bonđing point
o
--
Flooring IEC 61340-4-ť' e R9 c 1 x io O IEC 61340-4-1 c 1 x io
o Decay (1 ooo v to
o Ionization Oecay (1 ooo V to
lOOVand lOOVand
—1 000Vto —1 000Vto
(1) —100 V) c 20 s —100 V) c 20 s or
IEC 61340-4-7 IEC 61340-4-7
w user defined
0. Offset voltage
o c ± 35 V Offset vottage
1- c ± 35 V
N
Seating tEC 61340-2-3 R9 c l x io° n IFC 61340-2-3 R9 c l x l0 fl
(resistance to (resistance Io
r groundabte point ground
o measurements) measurements)
0)
r garmenls
or or or or
o
user defined user defineđ Iimit user defined user defined timit
m method method
c
m
E Groundable tEC 61340-4-9 R c 1 io n IEC 61340-4-9 7? l io n
c static control
garmenls
c
t
For prođuct quatification. the environmentat conditions for testing should be (12 ± 3) % RH anđ 23 C ± 2 C.
m
m When not specified in the referenced IEC standard, the minimum environmentat conditioning time for product
N quatification shoutd be 48 hours.
m b The test methods in the compliance verification column refer to the basic test procedure only. tt is not
t
E expected that the test method wiII be followeđ in its entirety.
m
C
0) Symbots used in Ihis tabte: R refers to point to point resistance. R. refers to resstance to ground and R9
-p
m refers to resistance to grounďable point.
t
n d
The maximum test voltage atlowed for measuring ESD flooring that shoutd be used for an ESD program
m complying wilh this standard is 100 V.
o e
(0 tf flooring is used for grounding personnel that handte ESOS refer to the system requirements in Table 2.
In situations where charged device model (CDM) damage is a concern, a minimum point to point resistance
Iimit of l x l0 n is recommendeđ.
9 Worksurfaces are defined as any surface on which an unprotected ESO sensitive item s ptaced.
5.3.5 Packaging
ESD protective packaging and package marking shall be in accordance with customer
contracts, purchase orders, drawing or other documentation. When the contract purchase
order, drawing or other documentation does not define ESD protective packaging, the
organization shall define ESD protective packaging requirements for ESDS within the plan
based on IEC 61340-6-3. Packaging, when required, shall be defŕned for aII material
movement within EPAs, between EPAs, between job sites, ĺield service operations and to the
customer.
5.3.6 Marking
drawing or other documentation does not define ESDS, system or packaging marking, the
organization, in developing the ESD control program plan, shall consider the need for
marking. If it is determined that marking is required, it shall be documented as part of the
plan.
o
c
N
o
o
N
cJ,
x
w
o
1—
N
cc
r
o
w
w
o
r
o
n
c
n
E
O
Ot
c
t
n
N
•0
m
c
n
o
n
n
o
O
co
IEC 61340-5-1:2015 IEC 2016
Annex A
(normative)
Test methođs
The operator shall stand with one foot on the conductive footwear electrode. The hand contact
plate shall be pressed to verify that the person/footwear system resistance s within
acceptable parameters (see Figure A.1), The test shall be repeated for the other foot, The test
apparatus can be an integrated, commercially available tester or other nstrumentation that is
capable of measuring resistance from 5,0 x i04 Ĺ) to at Ieast 1,0 x io o. The tester open
1
• o
nl
crcuit voltage is typically between 9 V d.c. and ioo V d.c.
o
o Apparatus
CJ
w
0
o
1-
N
x
r
o
(‚7
w
o
r
o
x
m
c
n
E
O
x
c
o
c
N
0
m
•0
c
m
0)
0
n
n
U
o
to
Foolwear
electrcde
IEC
Bibliography
[2] IEC 50749-26, Sem/conductor dev;ces Mechanical and climatic test methods
—
—
Part 26: Eĺectrostatic discharge (ESD) sensitivity testing Human body model (HBM)
—
(3] IEC 60749-27, Semiconductor devices Mechanical and cĺimatic test methods
—
—
(5] IEC TS 60479-1. Effects of ctrrent on human beings and iivestock — Pafl 1: Generai
aspects
w
[6] IEC TS 60479-2. Effects of current on human beings and iívestock — Pad 2: Special
aspects
[7] IEC 61010-1, Safety requŕrements for electrical equipment fcr measurement, control
and Iaboratory use Part 1: General requirements
—
(8] IEC 61140, Protect;on against electnc shock — Common aspects for instaflation and
Z equ/pment
m
[9] IEC TR 61340-6-2, Eţectrostatics Part 5-2: Protection of &ectronic devices from
—
SOMMAIRE
AVANT-PROPOS 23
INTRQDUCTION 25
1 Domaine d'application 27
2 Réfërences normatives 27
3 Termes et děfinitions 28
4 Sécurité du personnel 30
5 Programme de maîtrise des ESD 30
5.1 Généralités 30
5.1.1 Exigences du programme de maîtrise des ESD 30
5.1.2 Coordinateur du programme de maîtrise des ESD 30
5.1.3 PersonnalÉsation 30
5.2 Exgences administratives du programme de maitrise des ESD 30
5.2.1 Plan du programme de maîtrise des ESD 30
5.2.2 Plan de formation 31
5.2.3 QualifÉcation produit 31
5.2.4 PIan de vérification de conformité 32
5.3 Exigences techniques du plan du programme de maîtrise des ESD 32
o 32
5.3.1 Seneralites
5.3.2 Systémes de mise á Ia terre/liaison équipotentielle 32
5.3.3 Mise á Ia terre du personnel 34
5.3.4 Zones protégées contre Ies ESD (EPA) 36
5.3.5 Emballage 38
5.3.6 Marquage 38
Annexe A (normative) Méthodes d'essai 39
Sibliographie 40