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Serial EEPROM
Powered for Automotive
www.microchip.com/memory
Microchip Serial EEPROM Memory Products
What is the best way to build a zero-defect automobile? By using Zero field returns for bit failures during the past
zero-defect components. How, then does one achieve zero-defect several years, across several billion units shipped,
components? The quality must be designed-in; manufactured-in; and is testimony to Microchip’s commitment to quality
any remaining defects tested out. and reliability. This along with Microchip’s broad
Microchip Technology has developed industry-leading processes for EEPROM portfolio and commitment to excellence in
each step in the design, manufacturing and testing phases of its support and delivery, ensures a one-stop solution
serial EEPROMs, and has become one of the most respected leaders for truly robust, world class products.
in supply of these devices to the automotive industry – worldwide.
Quality Performance
Microchip Serial EEPROM ■ ESD Protection at all pins >4 kV
■ Microchip delivers highest quality
Advantages EEPROMs in the world ■ ESD Induced Latch Up Protection –
■ Long history in Automotive Sector ■ World-class line yields (over 99%) Ensures device protection against
– proven, tried and trusted transients with respect to VDD and
■ ISO/TS16949-compliant GND
■ Long Product Life Cycle ■ Industry leader with Triple Test ■ Brown-Out Reset – Protects device
■ Custom parts to suit your needs Flow – Every cell of every part is from false writes during BOR
■ Excellent delivery tested three times ■ Input Filters – Better Noise
■ Microchip owned fab ■ Zero PPM field bit fails Immunity
■ In-house testing and assembly ■ Record PPM levels across nearly ■ Data Retention >200 Years
a billion EEPROMs shipped every ■ Endurance in excess of 1M cycles
■ Industry’s shortest lead times year
■ Excellent engineering and ■ E-Temp and custom made H-Temp
■ Statistical Process Control and
customer support parts available
continuous improvement
■ Wide selection of packages procedures in all facilities ■ Industry’s Fastest SPI bus at
(SOT-23, SC-70, T-DFN, MSOP) ■ Robustness and reliability 20 MHz
■ Complete tools support designed in ■ Lowest operating current
Wafer-level Burn-in For Quality and Reliability
Microchip’s Triple Test Flow is currently the most robust testing procedure for serial EEPROM devices in the industry. It tests
each cell of each die three times and also performs extensive E/W endurance and data retention tests to ensure quality and
reliability.
Infant mortality of Microchip serial EEPROMs is among the lowest in the industry due to this extensive testing, excellent
fabrication and highly reliable memory cell design.
Microchip Serial EEPROM Field Return Data Microchip Serial EEPROM Endurance QUALITY
Serial EEPROM Field Return Data 24C16 Competitive Endurance Data
150K Process 100
2.0 Supplier ‘A’
Oxide Fails 90 Supplier ‘B’
1.8 Bad Bits Supplier ‘C’
Percentage of Defective Units
Die Level Supplier ‘D’
80
(Sample Size = 128 Units)
1.6 MICROCHIP
PPM (Field Returns)
70
1.4
1.2 60
1.0 50
0.8 40
0.6 30
0.4 20
0.2 10
0 PPM No Fails
0 0
1H-2005 2H-2005 1H-2006 2H-2006 1H-2007 2H-2007 0 500,000 1,000,000 1,500,000 2,000,000
Year E/W Cycles at 85°C
■ Zero PPM EEPROM returns due to bad bits ■ All devices from supplier A and B failed
■ Very low infant mortality (<0.8PPM) ■ Testing shows zero Microchip EEPROM fails even at
■ Industry lowest field return numbers – best suited for 2 million E/W cycles at 85ºC
automotive applications
Retention Bake
1: Wafer Probe Main Goals
Full functional 2: Wafer Probe 3:
tests on 100% of 2nd 100% bit Assembly ■ Full verification of data
die and bits; test (25ºC) & Final
85ºC or 125ºC full-functional Test sheet parameters for
5000 erase/write screen functional compliance at die
cycles on all bits
• 250ºC up to 24 hours and package level.
• Equivalent to 100 ■ Screen out all manufacturing
years at 85ºC
Key Aspects: defects to ensure highest
Endurance Testing Any die with charge loss in Key Aspects: quality and reliability.
LVHF any cell between the Functional Test
HVST 2 probes is failed to Verify Margins
TVPP prevent infant mortality GBN
Microchip tests every cell of every die twice! Then we perform a final test after assembly:
1. First Wafer Probe: All die are checked to ensure conformance to data sheet specs. A high temperature sort is performed where all bits
are erased and written 5,000 times to weed out any failures, weak cells or single-point defects.
Retention Bake: A high temperature stress test that helps accelerate charge loss. The wafers are baked at 250ºC for up to 24 hours.
2. Second Wafer Probe: All die are again tested to make sure that the data from the first wafer probe is still correct – after 5000 E/W
cycles and a high-temperature bake. Failed bits are identified as well as cells that have lost any charge throughout the process. These
die are also rejected as they may have a propensity to fail.
3. Assembly and Final Test: Final test done after assembly. 100% tested while maintaining world class line yields.
Additional Testing Procedures and Tools
Microchip performs additional in-house testing to ensure all Good Die in a Bad Neighborhood (GBN)
parts are of the highest quality and eliminate any devices
that show a possibility of failure. Before GBN After GBN
F F F F F F
High Voltage Stress Test (HVST) − (Top View)
F P F F P F
F F F F F F
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