Supplier Guidance--RoHS Checklist

Revision Date: December 2007

RoHS Checklist Requirement
Met
1. General Yes No
a. Lenovo Environmental Requirement: Supplier must meet Requirements of Lenovo's Environmental Specification,
Specification 41A7731
Affected Parts: Electronic Hardware parts / Products
Supplier must Lenovo Supplier Material Declaration
declare compliance
by:
b. European Union RoHS Requirement: Mandatory for new Lenovo products worldwide*. Supplier must meet
Compliance Requirements of the EU RoHS Directive and Lenovo's RoHS Specification 41A7733
Affected Parts: Electronic Hardware parts / products except batteries. Does not apply to spare
parts for equipment put on the market before July 1, 2006. *Temporary exception
for handsets for the China-only market
Supplier must Lenovo Supplier Material Declaration
declare compliance
by:
c. "China RoHS" Requirement: Mandatory for new Products for the People’s Republic of China. Supplier must
Compliance meet Requirements of the EU RoHS Directive and Lenovo's RoHS Specification
41A7733
Affected Parts: Electronic hardware parts / products except batteries,
Supplier must 1. EPuP Mark on the product/option (or on the Pubs if the product is small)
declare compliance 2. Substance Disclosure Table inside the product box shipping into China (must be
by: in Chinese, except "O", "X")
3. Date of manufacture in YYYY-MM-DD format on the product or on the product's
sales package
4. “China RoHS” Packaging Recycle Marks
d. EPEAT 4.1.2.1 Requirement: Required for EPEAT Products or when requested by Lenovo. See
Elimination of intentionally http://www.epeat.net for more information
added Cadmium (Cd) Shall not exceed 50 ppm in homogeneous material
Affected Parts: All parts except battery *1
Supplier must Lenovo Supplier Material Declaration
declare compliance
by:
RoHS exempt Include in ppm calculation
substances:
Remarks *1: AC adapter, Power cord and Package which the notebook computer is composed
are in the scope. FRUs and Options are not in scope.
e. EPEAT 4.1.4.1 Lead - Requirement: Required for Visual Display Units (VDUs)
Required for Visual Required for EPEAT Products or when requested by Lenovo. See
Display Units Only http://www.epeat.net for more information
Shall not contain lead greater than 50 ppm by weight
Affected Parts: LCD and LCD front/rear cover only
Supplier must Lenovo Supplier Material Declaration
declare compliance
by:
RoHS exemption Can be removed from ppm calculation
substance:
f. EPEAT 4.1.5.1 Requirement: Required for EPEAT Products or when requested by Lenovo. See
Elimination of intentionally http://www.epeat.net for more information
added Hexavalent Shall not exceed 500 ppm in homogenous materials
Chromium (Cr6) Affected Parts: Hardware parts -- especially metals, fasteners
Supplier must Lenovo Supplier Material Declaration
declare compliance
by:
g. EPEAT 4.2.1.1, 4.2.1.2, Requirement: Required for EPEAT Products or when requested by Lenovo. See
4.2.1.3 Percentage of http://www.epeat.net for more information
post-consumer recycled Declare % by weight
plastic Affected Parts: Plastic parts
Supplier must Lenovo Supplier Material Declaration
declare compliance
by:
h. EPEAT 4.2.2.1, 4.2.2.1 Requirement: Required for EPEAT Products or when requested by Lenovo. See
Percentage of renewable / http://www.epeat.net for more information
biobased plastic Declare % by weight
Affected Parts: Plastic parts
Supplier must Lenovo Supplier Material Declaration
declare compliance
by:
i. No Mercury present in Mandatory Supplier Lenovo Supplier Material Declaration
the part / product (except must declare
in lamps) compliance by:

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 Supplier Guidance--RoHS Checklist

RoHS Checklist Requirement

Met
1. General (continued) Yes No
j. No PBBs, PBDEs present, Supplier must Lenovo Supplier Material Declaration
including DecaBDE. declare the
compliance by:
No Brominated Flame
Retardants (BFRs) other
than PBB, PBDE > 1000
ppm
k. Product and Part Supplier • Supplier has effective product and part identification and separation processes
Identification responsibility: • Supplier issues unique part numbers to differentiate non-RoHS-compliant and
RoHS-compliant materials, parts and products
• Suppliers may use JEDEC Standard JESD97 "Marking, Symbols and Labels for
Identification of Lead (Pb)
Free Assemblies, Components and Devices" for part or label marking
• Printed Circuit Boards Suppliers may use the IPC Standard IPC-1066 "Marking,
Symbols and Labels for Identification of Lead-Free and Other Reportable Materials
in Lead-Free Assemblies, Components and Devices" in defining PCB or marking
l. Product Change Notices Supplier • Supplier Product change notices (PCNs) are provided in advance of change from
(PCN) responsibility: non-RoHS to RoHS-parts
• End-of-life (EOL) Product Change Notices must inform Lenovo whether new
RoHS-compliant or lead (Pb)-free
parts are backward compatible with lead (Pb) manufacturing process or not.
m. Supplier RoHS- Supplier Supplier maintains effective compliance process including technical documentation
compliance responsibility which demonstrates actions to verify RoHS-compliance. Upon request by Lenovo
the supplier will verify compliance of materials, parts, components, and/or
products to Lenovo's RoHS Specification via analytical testing or other suitable
means.

RoHS Checklist (continued) Requirement

Met
2. “Lead (Pb)-free” Solder Yes No N/A
a. Lenovo approved lead (Pb)-free solders:
• Tin-silver-copper (Sn-Ag-Cu (SAC)) solder
• Other lead (Pb)-free solders must be approved by Lenovo, on a case by case basis
b. Ball Grid Array (BGA) Products:
• The balls of any Ball Grid Array (BGA) component must be tin-silver-copper (SnAgCu), tin-silver (SnAg) or tin-copper
(SnCu) alloy.
c. Lenovo approved lead (Pb)-free Printed Circuit Boards finishes:
• Organic Solder Preservatives (OSP)
• Other materials may be approved by Lenovo, on a case by case basis
• Printed circuit board laminate material must be compatible with lead (Pb)-free assembly processes and temperatures. The
surface finish must be compatible with the lead (Pb)-free solder alloy(s).
d. Lenovo approved lead (Pb)-free AOP, Logic and Memory component finishes:
• Nickel-Palladium (NiPd) with or without a gold (Au) flash
• 100% matte tin (Sn) over a 1 micron minimum Nickel (Ni)
• 100% matte tin (Sn) over Copper (Cu) annealed at 150 C for a minimum of 1 hour within 2 weeks (24 hours preferred) of
the tin (Sn) plating, where the lead pitch < 1.0 mm
• 100% matte tin (Sn) over Alloy 42 (FeNi) base metal, with or without copper (Cu) underlay and anneal is not required
• 100% matte tin (Sn) fused, reflowed, or hot dip
• 100% matte tin (Sn) with no anneal or underplate for lead pitches > or = 1.0 mm
• Noble metal plating is acceptable except for silver (Ag)
• Tin-Bismuth (SnBi) plating over copper (Cu), Nickel (Ni) or
• Alloy 42 (FeNi) with a nominal bismuth (Bi) concentration of 2-4%
• Tin-Bismuth (SnBi) plating over copper (Cu), Nickel (Ni) or
• Alloy 42 (FeNi) with a total bismuth (Bi) concentration range of 1-6%
• Tin-Copper (SnCu) over copper with anneal
• Tin-Silver (SnAg) over copper (Cu) or Alloy 42 (Fe Ni) with a minimum silver (Ag) concentration of 1%
• Other materials may be approved by Lenovo, on a case by case basis
• Finishes Lenovo does not approve: Bright Tin
e. Backward Compatibility
• RoHS-compliant parts should be backward compatible with their non-RoHS, lead (Pb) versions. Only BGAs are exempted.

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 Supplier Guidance--RoHS Checklist

RoHS Checklist Requirement

Met
3. Whisker Mitigation Yes No N/A
a. Whisker Mitigation
Lenovo recommends testing for components with termination pitch less than 0.5 mm whisker mitigation practices per iNEMI
recommendations (www.inemi.org)
Suppliers should implement whisker growth countermeasures. For 100% tin interface material, regardless of the use of brightener,
Lenovo reserves the right to request tin whisker test data for specific product.
b. Plating processes are under strict control
• Plating thickness meets applicable Lenovo requirements
• Supplier checks plating thickness in their sampling check process
• Supplier checks the plating bath at defined intervals -- maintenance records are checked
c. Whisker Testing is performed by Parts Suppliers:
• Recommend that Whisker Test be done by all Lenovo component suppliers (e.g., JEDEC Standard JESD22-A121, “Test
Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes”
• Test conditions and results are made available upon Lenovo request
• Lenovo reserves the right to request tin whisker test data for parts and products it purchases
d. If Whisker is found, the following information is verified:
• Specification compliance
• Whisker length, diameter, number found, where, lead spacing
• Base and under plate material
• Plating Material and thickness
• Whisker mitigation practices implemented
• Whisker testing was performed
• Recommended solution to prevent recurrence

4. Ball Grid Array (BGA) General Requirement

met
Description Yes No N/A
a. Products and devices that use ball-grid arrays (BGAs) are protected from mechanical damage during handling, assembly,
manufacturing, transportation, storage and use
b. Lead (Pb)-free BGA material is tin-silver-copper (SnAgCu) or a tin-silver (SnAg) or tin-copper (SnCu) alloy approved by Lenovo
• Solder alloy compositions not approved by Lenovo require Lenovo approval before use
c. BGA planar assembly is not "mixed"
• Lead(Pb)-free BGAs must not be assembled with tin-lead (SnPb) solder
• Lead-(Pb) BGA must not be assembled with lead (Pb)-free solder
• Unique part numbers are used for BGA components to differentiate any Pb-free metallurgies other than SAC 305 or SAC 405,
including low silver, added dopants
d. Suppliers should measure the strain in processes and put them under strict control

5. Components Requirement
met
Description Yes No N/A
a. Are Ball Grid Array (BGA) components composed of tin (Sn) - silver (Ag) - copper (Cu) (SAC) or a tin - silver alloy: SnAg (1-4%)
Cu (0.5 - 0.7%), SnAg3.5%.
b. Do BGA products comply with Lenovo Specifications?
c. Are low speed shear qualification tests performed to assess BGA quality for components?
d. Are high speed qualification shear tests performed to assess BGA quality?
e. Are X-Ray inspections performed?
f. Are cross sections performed (Are voids permitted- criteria)?
g. Are vibration tests done?
h. Are bend tests done?
i. Are torque tests performed?
j. Are twist tests performed?
k. Are push tests done (tip breaking) to assess package cracking?
l. Are pull tests done to assess overall strength of BGA?
m. Are parts preconditioned prior to life tests?
n. Are Temperature Cycling tests done? (Conditions, Ramp time, dwell rate, cycles per hour)
o. Are Temperature/Humidity tests done?
p. Are "stress" performed?
q. Is Highly Accelerated Stress Testing (HAST) performed?
r. Are die and pry tests done to assess weak solder joints after stress testing?
s. Is there criteria established which defines the need for outrigger balls, or other strengthening techniques?
t. Are substrate metallization incoming quality control tests performed?
u. Are any other mechanical done to assess the strength of the different interfaces: Interposer Core – Copper Pad, IMC Solder Bulk?
v. Are strain measurements performed to ensure strain is not exceeded during typical installation?
w. Is there a handling procedure for internal use?
x. Is there a handling guideline for customers?
y. Are there training programs in place to train operators on BGA handling?
z. Are production controls in place to monitor/audit handling procedures?
Ongoing reliability monitoring?

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 Supplier Guidance--RoHS Checklist

6. Electronic Card Assembly and Test (ECAT) Manufacturing Process Requirement met
Description Yes No N/A
a. Are ICT/FT Fixture qualification processes in place?
b. Do Strain Gauge measurement methodologies conform to Lenovo Specifications?
c. Is ongoing process monitoring system for Strain Gauge in place?
d. Is ECAT product reliability testing done in every new project phase, including Cross Section analysis?
e. Is Lead (Pb)-free reflow profile performed and not exceed ECAT/Component recommended profile?
f. Is Reflow Profiling board prepared in correct method (thermal couple position/method...?
g. Is Wettability specification defined?
h. Is motherboard being baked before component removal such as BGAs to follow moisture sensitivity component handling
guideline?
i. Do you have Dye Stain test capability?

7. Storage Requirement
met
Description Yes No N/A
a. Avoid PCBA being flexed in the process
b. There strain and stress concentration tests in the process
c. Strain specification is not exceeded during the PCBA installation
d. There is a PCBA handling Procedure for Operators
e. A fixture is used when the barcode is being pasted on the PCBA
f. There is a process for the PCBA being loaded on the ICT fixture
g. There are methods to train Operators on BGA impacts on HDDs
h. Operators are trained, on the BGA impacts, every quarter? If no, how often?
i. Is BGA being used on both 3.5" and 2.5" PCBAs?
If no, which form factor is BGA being used today?
j. Techniques are in place to prevent the BGA damage
k. BGA Preventive Measures are included in the Supplier Quality Plan

8. Box Assembly / Manufacturing Requirement

met
Description Yes No N/A
a. RoHS-compliant and Non-RoHS-compliant Materials, Parts and Products Part Separation
• Unique part number and Field Replacement Unit (FRU) numbers are used to prevent inadvertent mixing of RoHS-compliant and
non-RoHS-compliant parts, FRUs, spare parts and FRUs to avoid inadvertent mixing of parts
• Special product segregation controls for “lead (Pb)-free” product
• Product Bills of Material (BoM) are reviewed
• Review Finished Goods Inventory
• Supplier has processes in place to prevent fulfilling orders for non-RoHS electronic products into the EU or other RoHS markets
b. Review Returns Process
• Controls for returned, unused Non-RoHS Equipment from the RoHS markets
• Segregation of Non-RoHS and RoHS-returns
• Identification of New vs Used inventory
c. Procedures, training materials, quality acceptance criteria have been updated for RoHS-compliant processes?
d. Supplier has a RoHS manufacturing ramp plan:
• Low volume RoHS product should be shipped for at least 90 days
• Rapid production ramp will be required for most commodities
• Manufacturing and rework equipment converted to lead-free process
• Non-RoHS materials (new and rework supplies) are removed from the manufacturing process
• Qualification process for each new manufacturing line and operators
• Transition plan to ramp RoHS supply without impacting leaded product supply
• Process to check in-bound material before use? Process to check finished goods?
e. Supplier conducts audits of RoHS Materials, Parts and Products on manufacturing lines:
• Weekly Stock Status: parts, finished goods -- in stock, in transit Review verification process by product by site worldwide
• Outbound Finished goods check in Distribution
• Inbound checks in Distribution
• Sites confirm implementation date for RoHS break-in via PCN
• Excess inventory is reviewed and effectively managed
f. Training is transferred to entire organization
g. Rework Process Qualification:
• Effective repair, rework and return processes
• Factory rework operations have been qualified as part of the factory lead-free process qualification Forced rework samples are
required for testing
• Rework operations outside the factory have been qualified separately
• Rework operations have passed rework lead-free Quality Process Audits
• Supplier should provide lead-free assemblies for rework qualification builds

9. Product Packaging Requirement met

Description Yes No N/A
a. Mandatory: Packaging meets Lenovo Packaging Specification requirements
b. Is a packaged strain test performed for the planar boards? (JEDEC 9704)
c. Is there a complete test report for the packaged planar strain test? (JEDEC 9704)
d. Are strain measurement specifications known for printed circuit planar boards?

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 Supplier Guidance--RoHS Checklist

10. Service Requirement

met
Description Yes No N/A
a. RoHS-compliant FRUs are backward compatible with their non-RoHS versions (only FRUs containing BGAs are exempted)

Product Change Notices must inform Lenovo whether new RoHS-compliant FRUs are backward compatible with their non-RoHS
versions

Non-RoHS- FRUs" may not be used in new product placed on the EU market beginning July 1, 2006, and may never be used in a
RoHS-compliant product.
b. When replacing or handling printed circuit boards, care is taken:
• Not to drop the board or apply excessive force
• Avoid rough handling of any kind
• Avoid bending a system board and hard pushing to prevent cracking at each BGA (Ball Grid Array) chipset
c. Rework Process Qualification:
• Factory rework operations have been qualified as part of the factory lead-free process qualification Forced rework samples are
required for testing
• Rework operations outside the factory have been qualified
• Rework operations have passed rework lead-free Quality Process Audits
• Supplier should provide lead-free assemblies for rework qualification builds

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