ELE 643

SEMICONDUCTOR MANUFACTURING TECHNOLOGY

INDUSTRIAL VISIT REPORT

ON SEMICONDUCTOR
23 FEB 2011

PREPARED BY
Mr. Mohamad Faiz Omar Bin Hj Mahmud
2009286466

PREPARED FOR
Madam Dr Sukreen Hana

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 Acknowledgment

Assalamualaikum w.b.t

First and foremost, special thanks to Allah, our god. The only one god
in this universe, The administer and The Planner of this Universes
include all skies and this world.

Second, thanks to my lecturer, Miss Sukreen Hana for teach on this

course, Semiconductor Manufacturing Technology. The lecturer that
very appreciated for her kindness.

Third, conguratulations to myself on your new bahaviors. Because

very strong to survive your life with people’s surrounding that really
have different life as you. Goodluck on your way to success. We have
to proud of ourself because that’s the way to ensure our mind and
motivation is maintain strong enough. Although this report is not
perfect as well because we haven’t permission to record all images or
datas by camera or softcopy. But, i am very satisfy of it because this
report was written on what i had wrote down in my notes.
Nevertheless, this is what i can provide for whom need indicator on
industrial visit report. Thanks.

Regards,
Mr. Mohamad Faiz Omar Al-Qadiri Bin
Haji Mahmud Al-Bahri
+6013-3157933
Faiz.omaq@gmail. com

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TABLE OF CONTENTS

Index Page

Company’s Background 1

Introduction 1

Study visit framework and main objectives 1

Experience from ON Semiconductor 2

Conclusion 8

Appendices 9

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1. Company’s background
On Semiconductor is a preffered supplier of power and signal management products and
solutions to customers throughout the world. With best in class service and world class supply
chain, they enable their customers to meet their design challanges successfully. Our broad
portfolio of industry leading products including power- management, analog, DSP, mixed
signal, Advanced logic, clock management, Circuit protection and standard component
devices provide their customers a single supplier that’s complete, effective and efficient.

2. Introduction
Todays, the growth of semiconductor technologies are increased critically due to achieve
customers needs, companies competition and to get the most prominent companies name.
Many new technologies introduced in production such as new design patterns, new de sign
rules, new fabrication and others that are parellel in technologies. According to Moore’s Law,
the number of transistors on a chip roughly doubles every two years. As a result the scale gets smaller
and smaller. For decades, Intel has met this formidable challenge through investments in technology
and manufacturing resulting in the unparalleled silicon expertise that has made Moore’s Law a reality.

3. Study visit framework and main objectives

This study tour was held in the framework of the subject "Semiconductor Manufacturing Devices"
(SMT), that is curently learn in this semester 6. In this subject, we learned on fabrication process from
front end until backend. Those introduces 6 subtopics and include SILVACO TCAD mini project.
Students also exposed on fabrication of MOSFET by using simulation by Silvaco software that are
currently used in certain designs and fabrications company nowdays.

The main objectives are :

1. To expose students in real fabrication process.
2. To provide opportunities for students to have better understanding in fabrication
process.
3. To introduced students on new technologies in semiconductor and Ics fabrication.
4. To provide opportunities for students in future job in field of semiconductor’s
technology.

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4. Experience from ON Semiconductor
ON SEMICONDUCTOR SEREMBAN, NEGERI SEMBILAN.
WEDNESDAY
23.02.2011
1.00PM-5.00PM

The ON Semiconductor based at America, then open its branches in Malaysia since its
production was 40% sold in Malaysia. The company has started operates in Malaysia since
1987.
The companiy’s production covered in:

1. Automative
2. computing
3. consumer
4. industrial
5. portable/ wireless
6. Medical
7. Militry/ Aerospace
8. Networking

Since their production based on customers requirement, they have to achieve the goals of
reducing power consumption and reducing size of chips. The company need the best of
engineers to make new developement of design and introduce new technologies.

Requirements in an engineering development:

1. Problems solving
2. Being creative
3. Building things
4. Making discoveries
5. Communicating with peoples
6. Technology development
7. Helping people

Those of requirements of engineering development will produce better development and will
meet customer’s demands.

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4.1 Job designation at ON Semiconductor

1. NPI Engineer
 Stands for New Product Introduction, that resnponsible to develop new
enhancement in designing. NPI engineer have to consider to design smaller
dimension that can accommodate many function in a design. They also have to
consider to reduce cost in designning.

2. Test Development Engineer

 Have to test all the dies and chips. If there have failures, must be fixed and
saperates by the good ones.

3. Process Engineer
 To troubleshoot all problems occured during process. It can be machines failures
or product failures.

4. Equipment Engineer
 Keep mentainence on all machines and process.

5. QA Engineer
 Quality Assurance, that to control quality system mentainence. They also have to
look up at customer’s requirements.

6. FA engineer
 Failure Analysis Engineer, have to make analysis of electrical and physical.

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4.2 Company’s Production And Fabrication Process

Development Flow

Before go further to fabrication, we have to know on procedure to making chip or new

product by follow company’s rules.

CUSTOMER  INVESTIGATION  REQUIREMENT DEVELOPMENT 

FEASIBILITY  COMMERCIAL AGREEMENT  INTERACTIVE DESIGN 

PROTOTYPE  ENSURING QUALITIFICATION  PRODUCTION RELEASE

Front end

Making wafers
 Wafers produced by this company is 6 inch diameter. The wafer is made from
silicon that extracte from sands (SiO 2 ). This wafer is then sliced into small pieces
(chip) in sawing process that will be brief in next session.

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Back end process

After the silicon is ready, it is then sent to the backend process.

We not exposed on oxidation, photolithography and lithography process. We only briefed on

packaging process that includes testing process.

Process involved

1 Leadframes

 Packages consisting of a lead frame embedded in a vitreous paste layer between

flat ceramic top and bottom covers are more convenient than metal/glass packages
for some products, but give equivalent performance.

2 DA Adhesives (Die Attach Adhesives)

 Die attachment using paste type epoxy is a traditional method for die-to substrate
bonding. Upon epoxy dispensed, the units are cured using a stand-alone oven.
Paste dispensing and curing is repeated for multi- thin die stack application. In the
DA film process, DA films were cut and pressed to a bo ttom die. Top die was then
placed and thermal compressed on the DA film. The same process of attaching
film, pressing die, wire bonding was repeated until multiple dies were stacked.

DA paste with spacers exhibiting a uniform

75um
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3 Methylenediphenyldianiline (MDA) compound

 The MDA is uded to protect wires in Ic’s from connected each other.

4 wafer mounting, wafer sawing

 Wafer mounting is a step that is performed during the die preparation of a wafer as
part of the process of semiconductor fabrication. During this step, the wafer is
mounted on a plastic tape that is attached to a ring. Wafer mounting is performed
right before the wafer is cut into separate dies. The adhesive film on which the
wafer is mounted ensures that the individual dies remain firmly in place during
'dicing', as the process of cutting the wafer is called.
 Wafer dicing or sawing is the process by which die are separated from a wafer of
semiconductor following the processing of the wafer. The dicing process can be
accomplished by scribing and breaking, by mechanical sawing (normally with a
machine called a dicing saw) or by laser cutting.

Wafer sawing process

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5 Wire Bonding

 Wire bonding is the primary method of making interconnections between an

integrated circuit (IC) and a printed circuit board (PCB) during semiconductor
device fabrication.

6 Molding
 The bonded chip on the lead frame is encased in a synthetic resin or ceramic package in
the moulding process. Each mould is managed with a unique ID. The moulds are heated
up to melt the resin.
In this process, the compound is put in Ic then with high pressure, that compound will
melt.

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4.3 IC Testing

The main objective in Ic Testing is to get the Ic that function as needed with ecxat value
without any failure. Ic is test using testing machine, controlled by computers. All the nodes in
Ic is test to read the parameter produced. During testing process, a tray of Ics are inserted into
machine. The machine will do all testing method. Any failure Dies will be left and the success
dies is collected and separated.

Inking is one method to seperate failure dies from it to be tested. This is old method because it
increased cost in using inks. The latest technology in separating dies is done by programs in
the machine. They add wafer mapping program or coordinating in machine to determine the
location of failure dies. So, this will reduce cost in producion.

4.4 Miscellaneous

By using no lead (leadless), the space in Ic can be reduced. Hence, the cost also can be
reduced.
Leadless Chip Carrier [LCC], A surface mount device [SMD] that uses surfaces on the side of
its body for board attachment and has no leads or legs. A chip carrier has terminals on all four
sides of the package. Also called an LLCC, as in Lead Less Chip Carrier. The manufacturer
may have an issue working with a Leadless Chip Carrier on the PWB, sometimes the solder
fillet will break. So check with production first before specifying a Leadless Chip Carrier
package.

5. Conclusion

In this industrial visit, i had learn more than what i ecpected before. From the first briefing by
Director, Manager and Engineers, they are very stressed about attitude during working.
Besides, the intelligent engineers is needed in this company to ensure that company could
achieve to the higher level across the times. I learned much in fabrication process from front
end until back end process. So, i hope, the knowledges about MOSFET technologies either
designation or fabrication will influence me to join in contributing semiconductor
technologies.

“Your attitude, not your aptitude will determine your altitude”

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6. Appendices

Front view of Site 2 Awards of ON Semiconductor company

Briefing from Director and Senior M anager

Having Tea Break Lecturers meets M anagements

Inside Briefing Room

Company’s Logo
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