TOPIC: SOLDERING PRINCIPLES & PRACTICES

INTRODUCTION:

Soldering has played a significant but

comparatively unrecognized role in the field of
electronics and other industries, it has made possible
the production of low cost, reliable television and radio
set, communication and medical equipment, telephone
and telegraph systems, and virtually an endless variety
of business, commercial, industrial and military
products.

DEFINITION OF TERMS:

1. Solder – comes from the Latin word “Soldare”

which means to make solid. It is defined as the
metallurgical joining of two or more metals at
temperatures below their melting points by means
of low-melting-temperature filler materials. This
material is called solder and it’s primarily an alloy
of tin and lead. Solder joints are made of a
temperature lower than 80 0F.
 2.Solidus – The temperature at which the solder
begins to melt.
3.Liquids – The temperature at which the solder is
completely molten
4.Eulectic Composition – The single point at which
the solder both melts and solidify
5. Soldering flux - The chemical agent used to
remove compounds from the surface of the metal
during the soldering process.
6.Pasty consistency – Temperature between solidus
and liquidus where part of the solder is molten and
part is solid.

Other Solder Alloy

1.Antimony 3. Cadmium
2. Zinc 4. Indium 5. Bismuth

Solder Properties
1. Corrosion resistance 2. Hardened
3. Service operating temperature 4.Melting point
ADVANTAGES OF SOLDERING PROCESS OVER
SELECTED ALTERNATIVE JOINING METHODS:
(i.e. adhesive bonding, welding, brazing, and
mechanical joining)
1.Easy and economically automated with a low
capital expense outlay.
2.Low energy input is required for soldering.
3.Joint reliability is high.
4.Solders various melting ranges can be selected to
fit the application.
5.Sequential assembly is possible.
6.Solders have good thermal-and electrical
conductivity.
7.Solder joints are impermeable to gas and liquid.
8.Joints are easily repaired and reworked.
9.Precise control is possible over the amount of
solder used.
10. Long shelf life is common.
11. A variety of heating methods can be used.
12. Solder alloy can be selected for service in
differing environments.
SELECTION OF SOLDER:

Care should be taken in specifying the correct

solder for the job since each alloy is unique with regard
to its composition and in general, its properties. Table
1 gives the melting characteristics of some of tin/lead
solders and list of their physical applications.

SELECTING OF FLUXES

The chemical agent used to remove compounds

from the surface of metals during the soldering
process is called a soldering flux. Ideally, the flux to be
selected should be chemically enough to remove the
surface compounds. Stable enough to prevent
oxidation during soldering, and leaves a residue which
is non-corrosive and con-conductive. The following are
the three major types of fluxes.

1. Inorganic fluxes – solutions of one or more

inorganic salts, being the halide or phosphate of
zinc, aluminum, calcium, magnesium or tin. The
most corrosive and conductive of all fluxes and are
effective on all metals except aluminum and
magnesium. Inorganic fluxes, including soldering
paste are not suitable for electronics and electrical
works.
2. Organic fluxes – Made up of mild organic acids
and bases and thin hydro halides. Example is
glutamic acid or stearic acid dissolved in water or
alcohol. These fluxes have shorter period of activity.
They are useful where fast soldering is essential and
where a certain minimal amount of corrosion can be
tolerated, or where the flux residue can be easily
removed.
3. Rosin fluxes – It is produced from pine trees and
become active as flux when heated and returns to an
inactive state when cooled. It is corrosive in the
heated liquid form and capable of removing oxides,
but in the solid form it is absolutely inert and non-
conducting. Rosin is the base for fluxes used for
electronic soldering. Rosin and certain resins come
close to being the perfect flux for electronic work
because they do a good job of oxide removal and
 because their residues are non-corrosive and non-
conductive.

SELECTING THE RIGHT SOLDERING ROOL

In selecting the right soldering tool foe certain job
or for particular range of job, the following factors must
be considered:
1.The size of the material to be soldered.
2.The kind of material to be soldered
3.The type of solder to be used
4.The sensitivity of the job to heat, magnetic and
static charges
5.The volume of work to be done

KINDS OF SOLDERING TOOLS USED IN

ELECTRONICS WORK
1. Soldering gun – made up of step down transformer
housed in a pistol shaped plastic casing.
2. Soldering iron – the most popular and widely used
soldering tool
3. Soldering Torch – miniature torches are self
contained torches using small oxygen and LPG
 cylinder that produce a pinpoint flame up to 6000
degrees Fahrenheit

Types of Soldering iron:

a. Pencil Type – for light and delicate electronic
works (10 to 50 watts and works at line voltage
of 6, 12, 24 V)
b. General Purpose – works at 50-150 watts
c. Heavy Duty Type – works at 200 watts and up

PROPER SOLDERING TECHNIQUES:

1.Tinning Soldering Tip
a. Turn the soldering tool on and allow the tip
to reach its normal service temperature.
b. After the tip has reached its operating
temperature file the tapered surface until it
is clean, smooth and even.
c. Apply a thin coat of 60/40 resin core solder
on the tapered surface of the tip.
d. After applying, wipe off any excess solder
with a brush, steel wool or a course non-
 flammable cloth. The tip will have a bright
and silvery surface ready to face any
soldering job.
2.Proper Wiring Techniques
a. Cut the wire to its proper length. Long
wires cut longer than necessary, after
longer path and resistance and also have
high tendency in picking up unwanted
signals. Wires cut too short could cause
inconvenience and difficulty during hook-
up and soldering operation.

DESOLDERING TOOLS AND TECHNIQUES

In electronics, soldering and desoldering of the
different components is a continuous process.
Soldering is required for assembly work while
desoldering is necessary in service work.

DESOLDERING TOOLS
1.Special desoldering tips
2.Suction bulb
 3.Soldapult desoldering tool
4.Desoldering wick

PROCEDURES WHEN REMOVING COMPONENTS

FROM THE BOARD
1. Heat the connection on the foil side of the PC
Board. As the solder melts and begins to flow,
remove the iron and quickly apply the desoldering
tool to remove the solder. If all of the solder is not
removed, reheat the joint and apply the
desoldering tool again until the leads are free.
2.Insert a knife leads or a wedge shaped tool
between the foil and component lead and raise it
straight up until the lead is at right angles to the
board. Re-apply the iron and pull the component
from the board.
3.When the component has been removed from the
board, a thin film of solder usually remains over
the hole. Heat this solder file and brush it away. Be
careful that it does not splatter and bridge other
foil.
 Composition
Solder Alloy Temperature (F)
(Wt%) USES
Classification SSTY
LEAD TIN SOLIDUS LIQUIDUS
RANGE

Side seem for can

2/98 2 98 601 611 10
manufacturing

5/95 5 95 581 594 13 -do-

10/90 10 90 514 576 62 For coating & joining metals

15/85 15 85 440 550 110 -do-

For coating & joining metals
20/80 20 89 361 531 170 for filling dents or seams in
automobile bodies.
For machine & torch
25/75 25 75 361 511 150
soldering

For machine & torch

30/70 30 70 361 491 130
soldering
 Composition
Solder Alloy Temperature (F)
(Wt%) USES
Classification SSTY
LEAD TIN SOLIDUS LIQUIDUS
RANGE
General purpose & wiping
35/65 35 65 361 471 116
solder
Wiping solder for joining
lead pipes & cable sheaths.
40/60 40 60 361 460 99
For automobile radiator
cores & heating units.
For automobile radiator
45/55 45 55 361 441 80
cores and roofing seams.

For gen. Purpose most

50/50 50 50 361 421 60
popular of all.
Primarily used for
electronics soldering
60/40 60 40 361 374 13
application where soldering
temp low is required.
Lowest melting (Eulectic)
63/37 63 37 361 361 0 solder for electronics
applications.