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Spring 2007
Semiconductor Memories
Outline
Basic SRAM Cell and Operation
Type of SRAM Cells
Scaling in SRAM Technology
Advanced SRAM Technology
Race between 4T and 6T
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Read-Write Memories (RAM)
STATIC (SRAM)
Data stored as long as supply is applied
Large (6 transistors/cell)
Fast
Differential
DYNAMIC (DRAM)
Periodic refresh required
Small (1-3 transistors/cell)
Slower
Single Ended
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Introduction
A SRAM is a matrix of static, volatile memory cells
and address decoding functions to allow access to
each cell for read and write operations
Use positive feedback in form of cross-coupled
inverters to store logic data in “one” or ‘zero” state.
The active elements in a memory cell require a
constant power source to remain latched in the
desired state.
The basic SRAM Cell made up of cross-coupled
inverter has several variations with tradeoffs between
cell size, noise immunity and standby power.
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6-transistor CMOS SRAM Cell
WL
V DD
M2 M4
Q
M5 Q M6
M1 M3
BL BL
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CMOS SRAM Analysis (Read)
WL
V DD
BL M4
BL
Q= 0
Q= 1 M6
M5
V DD M1 V DD V DD
Cbit Cbit
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CMOS SRAM Analysis (Read)
1.2
1
Voltage Rise (V)
0.8
0.6
0.4
0.2
V o l t a g e r i s e [ V ]
0
0 0.5 1 1.2 1.5 2 2.5 3
Cell Ratio (CR)
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CMOS SRAM Analysis (Write)
WL
V DD
M4
Q= 0 M6
M5 Q= 1
M1
V DD
BL = 1 BL = 0
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CMOS SRAM Analysis (Write)
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6T-SRAM — Layout
VDD
M2 M4
Q Q
M1 M3
GND
M5 M6 WL
BL BL
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Resistance-load SRAM Cell
WL
V DD
RL RL
Q Q
M3 M4
BL M1 M2 BL
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SRAM Characteristics
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General SRAM Schematic
The load devices can be depletion mode transistors or
PMOS transistor or resistors.
Write Sequence
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Data Storage in SRAM Storage
Basic six-transistor SRAM
cell and its layout
Logic “1” when T1 is off and
T2 is on, C5 is at Vdd,C6 is at
Vss
Logic “0” when T3 is off and
T4 is on, C5 is at Vss ,C6 is at
Vdd
When the wordline is
selected, T5 and T6 is on and
the level stored in C5 and C6
are passed to the bitlines
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6-T SRAM Operation Scheme
Read operation:
B and B-bar are set to high
At state “1, T1 is off and T2 is on
When wordline is selected, T5 and T6 is
on, C2 is then pull down by discharging
through T6 and T2.
B-bar is then lower then B, the
differential signal between the two
bitlines is detected by the sense
amplifier.
Write Operation:
Data are place in B and B-bar lines
When the wordline is raised, causing
the cell to flip into the desired state
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CMOS SRAM Cell
CMOS 6-T Cell
Larger cell size
Lower standby leakage current ~ nA
Better Static Noise Margin
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N-SRAM with Depletion-Load
Smaller cell size, no n-well needed
Higher standby leakage current ~ µA Depletion-mode NMOS
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Resistor-Load SRAM Cell
Smaller Cell area Cell Schematics
No n-well and pMOSFET
Poly resistors lay on top of other
transistors
No contact to join n+, p+ diffusion
Issues
High resistance needed for low
static current
Typical RL=1GΩ
Write Sequence
Current in 1MB SRAM @ 3V
I=1M*3V/1GΩ=3mA
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Poly PMOS Load Cell
Features
Standby leakage < pA
R~80MΩ
Cell high node time
constant ~0.8µsec
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Comparison of Various Cells
In CMOS SRAM cell, R-load cell with poly-silicon
there is essentially no resistors allows up at a 30%
current flow through the reduction in cell size in double
cell except during poly-silicon technology using
switching buried contacts.
The depletion load and R-load NMOS SRAM cell
resistive load have a non- combined with CMOS
zero static current, hence peripheral circuits allowed the
the standby power
dissipation is always benefit of lower standby
higher than that of a power consumption while
CMOS cell retaining a smaller chip area
of NMOS SRAMs.
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Memory Scaling Trend
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1st Gen. 1Mb SRAM Technology
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Scaling Parameters in SRAM
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Cell Design Considerations
Cell ratio = driver transistor current/ access transistor
current
Cell ratio↑⇒ Static Noise Margin↓
Access transistor current↓ ⇒ Static Noise Margin↑ ⇒
read time↓
At same cell ratio
Access transistor current ↑ ⇒ read speed ↑ ⇒
driver transistor size ↑ ⇒ cell size ↑
Storage node capacitance design
As technology scales, VDD ↓, CS ↓, QS ↓, more
vulnerable to soft error induced by alpha particles
Increased CS can be improve SER
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Scaling of R-load SRAM
Polysilicon load resistors are commonly used in
< 1Mb SRAM designs
R-load cell are hard to design to achieve both
high density and low power
Small cell size limit the sized of the polyresistors
The standby power on the other hand set a
minimum value of the load resistor
Density↑⇒ Cell size ↓ ⇒ Resistor size ↓ ⇒ Standby leakage ↑
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Noise Margins for Full CMOS and
R-load Cells
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1MB Poly-load SRAM Cell Layout
Features
2P2M Process
Cell size 6x11µm2
Poly1: Vss, gates
Poly2: R-load and Vdd
M1: bitlines
M2: wordlines
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High-Valued Poly-Si Load
Resistor
To minimize power consumption and maintain an
optimum soft-rate, load current is set at about 30pA
R ↑ ⇒ Standby Power ↓ ⇒ SER ↑
Memory Feature VDD Load Standby RL L/W of R Tpoly
size size (V) current current (GΩ) RL (GΩ/) (nm)
(µm) (pA) (µA)
256k 1.2 5 30 8 164 4/1.2 47 70
1M 0.8 3 30 33 97 3/0.8 26 50
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Poly-Resistor Engineering
To maintain small cell size, high sheet resistance poly-
film must be used.
The resistor are normally formed by poly2 layer.
The remainder of the layer ( not for high resistive poly ) is
implanted with a much higher dose so form ohmic
contact or served as interconnect path.
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Poly-Resistor Engineering
Undoped polysilicon film with implant doses from 1x1013 to 1x1015/cm2 can
from 104Ω/ to 1012Ω/
Adjacent higher-doped regions can significantly alter the resistance value
if lateral diffusion take place over a large enough fraction of the resistor
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Layout of Full CMOS Cells
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Buried Contact Schemes
Layout Rules
metal
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Shared Contact Using Poly2
Allows Further Reduction of SRAM Cell Size
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Area Reduction by Local TiN
Interconnect
TiN
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Titanium Silicide Process
Titanium Deposition
Ti/Si Reaction &
Nitridation of Ti
Interconnect
Patterning
Etch TiN
TiN/TiSi2 Annealing
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The Race Between 4T and 6T
Major tradeoffs in SRAM
design: size & process
complexity
4T cells dominates the
stand-alone SRAM market
due to its small size
6T cells are typically used in
on-chip storage is MPUs
4T cells
Smaller
Complex process
Poor stability at low VDD Simple 6T: basic logic process
Advanced 6T: self-aligned contact,
local interconnect
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Ref: IEDM 1996 – p.271 2007/4/29
Estimated Processing Cost
Comparison
A more complex process
can still produce a
cheaper product when
the increase number of
die can compensate for
the increase wafer cost
The reason why all
manufacturers are
pushing for smaller cell
size
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SRAM Cell Comparison
SAC : self-aligned contact are used in both 4T and 6T
cells to reduce cell size
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SNM Comparison
6T cells have much better stability, especially at low supply
voltage
Better SNM in 6T allows for low cell ratio, β, allows for
smaller size
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Enhanced 4T
Designs
Resistor using LDD region
increase SNR without increase
cell ratio
Boosted WL improves read
current and and SNM
TFT load improve cell stability
and reduce SER
Diode inherited in the cell need to
be optimized to improved on
current
Supply voltage > 1.8 can still
provide reasonable SNM
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Summary
4T SRAM enjoys smaller size but the supply
voltage cannot be scaled too low
6T SRAM allows for low supply voltage and
provide better SNR
Further enhancement in process and device
structure can further scaled the SRAM cell for
high density memories
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