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Commission
Continued….
No Exemption Scope and Dates
Mercury in cold cathode fluorescent lamps and external
3 electrode fluorescent lamps (CCFL and EEFL) for special
purposes not exceeding (per lamp):
No limitation of use until 31 December 2011;
3 (a) Short length (≤ 500 mm) 3,5 mg may be used per lamp after
31 December 2011.
No limitation of use until 31 December 2011;
3 (b) Medium length ( > 500 mm and ≤ 1 500 mm) 5 mg may be used per lamp after
31 December 2011.
No limitation of use until 31 December 2011;
3 (c) Long length ( > 1 500 mm) 13 mg may be used per lamp after
31 December 2011.
No limitation of use until 31 December 2011;
4 (a) Mercury in other low pressure discharge lamps ( per lamp) 15 mg may be used per lamp after
31 December 2011.
Mercury in High Pressure Sodium (vapour) lamps for
4 (b) general lighting purposes not exceeding (per burner) in
lamps with improved colour rendering index Ra > 60:
No limitation of use until 31 December 2011;
4 (b) I P ≤ 155 W 30 mg may be used per burner after
31 December 2011.
No limitation of use until 31 December 2011;
4 (b) II 155 W < P < 405 W 40 mg may be used per burner after
31 December 2011.
No limitation of use until 31 December 2011;
4 (b) III P > 405 W 40 mg may be used per burner after
31 December 2011.
Mercury in High Pressure Sodium (vapour) lamps for
4 (c)
general lighting purposes not exceeding (per burner):
No limitation of use until 31 December 2011;
4 (c) I P ≤ 155 W 25 mg may be used per burner after
31 December 2011.
No limitation of use until 31 December 2011;
4 (c) II 155 W < P < 405 W 30 mg may be used per burner after
31 December 2011.
No limitation of use until 31 December 2011;
4 (c) III P > 405 W 40 mg may be used per burner after
31 December 2011.
4 (d) Mercury in High Pressure Mercury (vapour) lamps (HPMV) Expires on 13 April 2015.
Continued….
No Exemption Scope and Dates
Lead in solders for servers, storage and storage array
systems, network infrastructure equipment for switching,
7 (b)
signalling, transmission, and network management for
telecommunications
Electrical and electronic components containing lead in a
glass or ceramic other than dielectric ceramic in capacitors,
7 (c) I
e.g. piezoelectronic devices, or in a glass or ceramic matrix
compound
Lead in dielectric ceramic in capacitors for a rated voltage of
7 (c) II
125 V AC or 250 V DC or higher
Expires on 1 January 2013 and after that date
Lead in dielectric ceramic in capacitors for a rated voltage of
7 (c) III may be used in spare parts for EEE placed on
less than 125 V AC or 250 V DC
the market before 1 January 2013.
Expires on 1 January 2012 and after that date
Cadmium and its compounds in one shot pellet type thermal
8 (a) may be used in spare parts for EEE placed on
cut-offs
the market before 1 January 2012.
8 (b) Cadmium and its compounds in electrical contacts
Hexavalent chromium as an anticorrosion agent of the
9 carbon steel cooling system in absorption refrigerators up to
0,75 % by weight in the cooling solution
Lead in bearing shells and bushes for refrigerant-containing
9 (b) compressors for heating, ventilation, air conditioning and
refrigeration (HVACR) applications
May be used in spare parts for EEE placed on
11 (a) Lead used in C-press compliant pin connector systems
the market before 24 September 2010.
Expires on 1 January 2013 and after that date
Lead used in other than C-press compliant pin connector
11 (b) may be used in spare parts for EEE placed on
systems
the market before 1 January 2013.
Lead as coating material for the thermal conduction module May be used in spare parts for EEE placed on
12
C-ring the market before 24 September 2010.
13 (a) Lead in white glasses used for optical applications
Cadmium and lead in filter glasses and glasses used for
13 (b)
reflectance standards
Lead in solders consisting of more than two elements for the
Expires on 1 January 2011 and after that date
connection between the pins and the package of
14 may be used in spare parts for EEE placed on
microprocessors with a lead content of more than 80 % and
the market before 1 January 2011.
less than 85 % by weight
Lead in solders to complete a viable electrical connection
15 between semiconductor die and carrier within intergrated
circuit flip chip packages
16 Lead in linear incandescent lamps with silicate coated tubes Expires on 1 September 2013.
Lead halide as radiant agent in high intensity discharge
17
(HID) lamps used for professional reprography applications
Lead as activator in the fluorescent powder ( 1 % lead by
weight or less) of discharge lamps when used as specialty
18 (a) lamps for diazoprinting reprography, lithography, insect Expires on 1 January 2011.
traps, photochemical and curing processes containing
phosphorssuch as SMS (( Sr, Ba)2 MgSi2O7; Pb)
Lead as activator in the fluorescent powder ( 1 % lead by
weight or less) of discharge lamps when used as sun
18 (b)
tanning lamps containing phosphors such as BSP
(BaSi2O5;Pb)
Lead with PbBiSn-Hg and PbInSn-Hg in specific
compositions as main amalgam and with PbSn-Hg as
19 Expires on 1 June 2011.
auxiliary amalgam in very compact energy saving lamps
(ESL)
Lead oxide in glass used for bonding front and rear
20 substrates of flat fluorescent lamps used for Liquid Crystal Expires on 1 June 2011.
Displays (LCDs)
Continued….
No Exemption Scope and dates
Lead and Cadmium in printing inks for the application of
21 enamels on glasses, such as borosilicate and soda lime
glasses
Lead in finishes of fine pitch components other than May be used in spare parts for EEE placed on
23
connectors with a pitch of 0,65 mm and less the market before 24 September 2010.
26 Lead oxide in the glass envelope of black light blue lamps Expires on 1 June 2011.
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Copyright © 2010 Bureau Veritas Consumer Products Services, Inc. All Rights Reserved. October 2010, 10B-167