Professional Documents
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VIRUDHUNAGAR
COURSE PLAN
Sl. No. Topic Books Page Number Periods Cumulative Teaching aids
Referred periods
1 Introduction to heat transfer, One- R1 726-729 2 50 Board
dimensional Heat Conduction: Plane
wall
2 Cylinder – Sphere R1 729-732 1 51 Board
3 Composite walls – Critical thickness of T1 5.7-5.14 2 53 Board
insulation
4 Heat transfer through extended surfaces T1 5.14-5.21 2 55 Board and
(simple fins). OHP
5 Free convection and forced convection - T1 5.66-5.78 2 57 Board
Internal and external flow
6 Determination of convection heat R1 739-742 1 58 Board
transfer co-efficient by using
Dittus–Baetter equation.
7 Black–Gray bodies - Radiation Shape T1 5.96-5.102 1 59 Board
Factor (RSF)
8 Cooling of electronic components: T1 5.164-5.166 1 60 Board
Thermoelectric cooling – Chip
cooling and Conclusion