Winstar Display Co.

, LTD
華凌光電股份有限公司
住址: 407 台中市中清路 163 號 WEB: http://www.winstar.com.tw
No.163 Chung Ching RD., E-mail: winstar@winstar.com.tw
Taichune, Taiwan, R.O.C Tel:886-4-24262208 Fax：886-4-24262207

SPECIFICATION

CUSTOMER :

MODULE NO.: WF35CTIACDA#

APPROVED BY:
( FOR CUSTOMER USE ONLY )

PCB VERSION: DATA:

SALES BY APPROVED BY CHECKED BY PREPARED BY

ISSUED DATE:

第 1 頁，共 36 頁
 Winstar Display Co., LTD MODLE NO：
華凌光電股份有限公司

DOC. FIRST ISSUE

RECORDS OF REVISION
REVISED
PAGE NO. SUMMARY
VERSION DATE

0 2007.12.05 First issue

第 2 頁，共 36 頁
Contents
1. Module Classification Information

2. SUMMARY

3. General Specification

4. Absolute Maximum Ratings

5.Electrical Characteristics

6. DC CHARATERISTICS

7. AC Characteristics

8. OPTICAL CHARATERISTIC

9. INTERFACE

10. BLOCK DIAGRAM

11. Reliability

12. Contour Drawing

13. Inspection specification

第 3 頁，共 36 頁
1.Module Classification Information

WF 35 C T I A C D A #
cd e f g h i j k l ○
11

c Brand：WINSTAR DISPLAY CORPORATION

d Display Type：H→Character Type, G→Graphic Type F→TFT Type
e Size: 3.5inch
f Model serials no.
g Backlight Type： F→CCFL, White T→LED, White

h LCD Mode： C→Transmissive, N. T, 6:00 I →Transmissive, W. T, 6:00

F→Transmissive, N. T, 12:00 L→Transmissive, W. T, 12:00
O→Transmissive, N. T, 3:00 U→Transmissive, W. T, 3:00
R→Transmissive, N. T, 9:00 X→Transmissive, W. T, 9:00

i Module type: A : TFT LCD

B : TFT+ FR+CONTROL BOARD
C : TFT + FR+ A/D BOARD
D : TFT + FR+A/D BOARD + CONTROL BOARD

j Resolution A : 128 * 160 Dots

B : 320 * 234 Dots
C : 320 * 240 Dots
D : 480 * 234 Dots
k Interface type D : Digital Input A : Analog Input
l Reversion:
○
11 Special code: # : Fit in with the ROHS Directions and regulations

第 4 頁，共 36 頁
2.SUMMARY
This technical specification applies to 3.45“ color TFT-LCD panel. The 3.45“ color TFT-LCD panel is
designed for camcorder, digital camera application and other electronic products which require high quality flat
panel displays. This module follows RoHS.
FEATURES
High Resolution :230,400 Dots (320 RGB x 240) . Image Reversion: Up/Down and Left/Right.

3.General Specification
Item Dimension Unit
Dot Matrix 320 x RGBx240(TFT) dots
Module dimension 76.9 x 63.9 x 3.3 mm
Active area 70.08 x 52.56 mm
Dot pitch 0.073 x 0.219 mm
LCD type TFT, Negative, Transmissive
View direction 6 o’clock
Backlight Type LED,Normally White

*Color tone slight changed by temperature and driving voltage.

4.Absolute Maximum Ratings

Item Symbol Min Typ Max Unit
Operating Temperature TOP -20 － +70 ℃
Storage Temperature TST -30 － +80 ℃

Power Supply Voltage DVDD,AVDD -0.3 － 5.0 V

Input signal voltage VIN -0.3 － VDD+0.3 V

Logic output voltage VOUT -0.3 － VDD+0.3

Note: Device is subject to be damaged permanently if stresses beyond those absolute maximum
ratings listed above
1. Temp. ≦600C, 90% RH MAX. Temp. ＞ 600C , Absolute humidity shall be less than 90% RH at 600C

第 5 頁，共 36 頁
5.Electrical Characteristics
5.1. Operating conditions:
Item Symbol Condition Min Typ Max Unit
Supply Voltage For Logic VCC － 3.0 3.3 3.6 V
Digital operation current Icc 8.6 mA
VGH Ta=25℃ 14 15 18 V
Power Supply Voltage
VGL Ta=25℃ -11 -10 -8 V

VCOM High voltage VCOM H 3.7 Note1

VCOM Low voltage VCOM L -1.6 Note1
VCOM level voltage VCOM A 6
Note：VcomH& VcomL_Adjust the color with gamma data. Vp-p should be higher then 4V.(Option 5V)
Note 1：Please power on following the sequence VCC → VDD

5.2 LED driving conditions

Note 2 : Ta = 25 _
Note 3 : Brightess to be decreased to 50% of the initial value

第 6 頁，共 36 頁
6. DC CHARATERISTICS

第 7 頁，共 36 頁
7. AC Characteristics
Digital Parallal RGB interface
Signal Item Symbol Min Typ Max Unit
Frequency Tosc - 156 - ns
Dclk High Time Tch - 78 - ns
Low Time Tcl - 78 - ns
Setup Time Tsu 12 - - ns
Data
Hold Time Thd 12 - - ns
Period TH - 408 Tosc
Pulse Width THS 5 30 - Tosc
Back-Porch Thb 38 Tosc
Hsync
Display Period TEP - 320 - Tosc
Hsync-den time THE 36 68 88
Front-Porch Thf - 20 - Tosc
Period Tv - 262 - TH
Pulse Width Tvs 1 3 5 TH
Vsync Back-Porch Tvb - 15 - TH
Display Period Tvd - 240 - TH
Front-Porch Tvf 2 4 - TH

Note: 1. Thp + Thb = 68, the user is make up by yourself.

2. Tv = Tvs + Tvb + Tvd + Tvf , the user is make up by yourself.
3.When SYNC mode is used,1st data start from 68th Dclk after Hsync falling

Digital Serial RGB interface

Signal Item Symbol Min Typ Max Unit
Frequency Tosc - 52 - ns
Dclk High Time Tch - 78 - ns
Low Time Tcl - 78 - ns
Setup Time Tsu 12 - - ns
Data
Hold Time Thd 12 - - ns
Period TH - 1224 Tosc
Pulse Width THS 5 90 - Tosc
Back-Porch Thb 114 Tosc
Hsync
Display Period TEP - 960 - Tosc
Hsync-den time THE 108 204 264
Front-Porch Thf - 60 - Tosc
Period Tv - 262 - TH
Pulse Width Tvs 1 3 5 TH
Vsync Back-Porch Tvb - 15 - TH
Display Period Tvd - 240 - TH
Front-Porch Tvf 2 4 - TH
Note: 1. Thp + Thb = 204, the user is make up by yourself.
2. Tv = Tvs + Tvb + Tvd + Tvf , the user is make up by yourself.
3. When SYNC mode is used,1st data start from 204th Dclk after Hsync falling

第 8 頁，共 36 頁
CCIR601/656 Interface
Signal Item Symbol Min Typ Max Unit
Frequency Tosc - 37 - ns
Dclk High Time Tch - 78 - ns
Low Time Tcl - 78 - ns
Setup Time Tsu 12 - - ns
Data
Hold Time Thd 12 - - ns

7.1 Waveform

第 9 頁，共 36 頁
第 10 頁，共 36 頁
7.1.1 Standby ON/OFF Control
LQ35HC112 has a power ON/OFF sequence control function. When STB pin is pulled L,blank data is
outputted for 5-frames first, form the falling edge of the following VSYNC signal. The blank data would be
gray level 255 for normally white LC.

7.1.2 Clock and Sync waveforms

第 11 頁，共 36 頁
7.2 Reset Timing Chart
The RESET input must be held at least 1ms after power is stable

第 12 頁，共 36 頁
7.3 Digital RGB timing waveform
Hsync and Vsync timing

第 13 頁，共 36 頁
7.3.1 Hsync and horizontal control timing waveform

7.3.2 Hsync and vertical shift clock timing waveform

7.3.3 Hsync and vertical control timing waveform

第 14 頁，共 36 頁
7.3.4 CCIR601 timing waveform

第 15 頁，共 36 頁
7.3.5 Source Driver Timing Chart

第 16 頁，共 36 頁
第 17 頁，共 36 頁
7.3.6 Gate Driver Timing Chart

第 18 頁，共 36 頁
8. OPTICAL CHARATERISTIC

Ta=25±2_, IL=20mA
Note 1: Definition of viewing angle range

Fig. 8-1 Definition of viewing angle

Note 2: Test equipment setup:
After stabilizing and leaving the panel alone at a driven temperature for 10 minutes, the measurement
should be executed. Measurement should be executed in a stable, windless, and dark room. Optical
specifications are measured by Topcon BM-7 luminance meter 1.0° field of view at a distance of 50cm
and normal direction.

第 19 頁，共 36 頁
Fig. 8-2 Optical measurement system setup

Note 3: Definition of Response time:

The response time is defined as the LCD optical switching time interval between “White” state and
“Black” state. Rise time, Tr, is the time between photo detector output intensity changed from 90%to
10%. And fall time, Tf, is the time between photo detector output intensity changed from 10%to 90%

Note 4: Definition of contrast ratio:

The contrast ratio is defined as the following expression.

Note 5: White Vi = Vi50 ± 1.5V

Black Vi = Vi50 ± 2.0V
“±” means that the analog input signal swings in phase with VCOM signal.
“±” means that the analog input signal swings out of phase with VCOM signal.
The 100% transmission is defined as the transmission of LCD panel when all the input terminals of
module are electrically opened.

第 20 頁，共 36 頁
Note 6: Definition of color chromaticity (CIE 1931)
Color coordinates measured at the center point of LCD
Note 7: Measured at the center area of the panel when all the input terminals of LCD panel are
electrically opened.

第 21 頁，共 36 頁
9. INTERFACE
9.1. LCM PIN Definition
Pin Symbol I/O Function Remark
1 VBL- I Backlight LED Ground
2 VBL- I Backlight LED Ground
3 VBL+ I Backlight LED Power
4 VBL+ I Backlight LED Power
5 Y1 I Top electrode
6 X1 I Right electrode
7 NC Not use
8 /RESET - Hardware reset
9 SPENA I SPI interface Data Enable signal
10 SPCLK I SPI interface Data Clock
11 SPDAT I SPI interface Data
12 B0 I Blue Data Bit 0
13 B1 I Blue Data Bit 1
14 B2 I Blue Data Bit 2
15 B3 I Blue Data Bit 3
16 B4 I Blue Data Bit 4
17 B5 I Blue Data Bit 5
18 B6 I Blue Data Bit 6
19 B7 I Blue Data Bit 7
20 G0 I Green Data Bit 0
21 G1 I Green Data Bit 1
22 G2 I Green Data Bit 2
23 G3 I Green Data Bit 3
24 G4 I Green Data Bit 4
25 G5 I Green Data Bit 5
26 G6 I Green Data Bit 6
27 G7 I Green Data Bit 7
28 R0 I Red Data Bit0/DX0
29 R1 I Red Data Bit1/DX1
30 R2 I Red Data Bit2/DX2
31 R3 I Red Data Bit3/DX3
32 R4 I Red Data Bit4/DX4
33 R5 I Red Data Bit5/DX5
34 R6 I Red Data Bit6/DX6
35 R7 I Red Data Bit7/DX7
36 HSYNC I Horizontal sync input
37 VSYNC I Vertical sync input
38 DCLK I Dot Data Clock
39 NC Not use
40 NC Not use
41 Vcc I Digital power
42 Vcc I Digital power
43 Y2 I Bottom electrode
44 X2 I Left electrode
45 NC Not use
46 NC Not use
47 NC Not use
48 IF2 I Control the input data format /floating
第 22 頁，共 36 頁
49 IF1 I Control the input data format
50 IF0 I Control the input data format
51 NC Not use
52 DE I Data Enable input
53 GND I Ground
54 GND I Ground

Note:
1. The mode control (IF2) not use, it can’t control CCIR601 interface, If not use CCIR601, it can floating.
2. For digital RGB input data format, both SYNC mode and DE+SYNC mode are supported. If DE signal
is fixed low, SYNC mode is used. Otherwise, DE+SYNC mode is used. Suggest used SYNC mode!!_
3. Usually pull high._
4. IF select serial RGB or CCIR601/656 input mode is selected, only DX0-DX7 used, and the other short
to GND, Only selected serial RGB_CCIR601/656 interface, DX BUS will enable, Digital input mode DX0
is LSB and DX7 is MSB.
5. Control the input data format.

9.2 SPI timing Characteristics

第 23 頁，共 36 頁
9.3 SPI Register Description
Will be showing on Application Note From Chilintech.
9.4 Basic Display Color and Gray Scale

第 24 頁，共 36 頁
第 25 頁，共 36 頁
10. BLOCK DIAGRAM

第 26 頁，共 36 頁
11.Reliability
Content of Reliability Test (Wide temperature, -20℃~70℃)
Environmental Test
Test Item Content of Test Test Condition Note
High Temperature storage Endurance test applying the high storage temperature for a long 80℃ 2
time. 200hrs
Low Temperature Endurance test applying the high storage temperature for a long -30℃ 1,2
storage time. 200hrs
High Temperature Endurance test applying the electric stress (Voltage & Current) 70℃ ——
Operation and the thermal stress to the element for a long time. 200hrs
Low Temperature Endurance test applying the electric stress under low temperature -20℃ 1
Operation for a long time. 200hrs
High Temperature/ The module should be allowed to stand at 60℃,90%RH max 60℃,90%RH 1,2
Humidity Operation For 96hrs under no-load condition excluding the polarizer, 96hrs
Then taking it out and drying it at normal temperature.
Thermal shock resistance The sample should be allowed stand the following 10 cycles of -20℃/70℃ ——
operation 10 cycles
-20℃ 25℃ 70℃

30min 5min 30min

1 cycle
Vibration test Endurance test applying the vibration during transportation and Total fixed amplitude : 3
using. 15mm
Vibration Frequency :
10~55Hz
One cycle 60 seconds to 3
directions of X,Y,Z for
Each 15 minutes
Static electricity test Endurance test applying the electric stress to the terminal. VS=800V,RS=1.5kΩ ——
CS=100pF
1 time

Note1: No dew condensation to be observed.

Note2: The function test shall be conducted after 4 hours storage at the normal
Temperature and humidity after remove from the test chamber.
Note3: Vibration test will be conducted to the product itself without putting it in a container.

第 27 頁，共 36 頁
 76.9±0.2
1.94 73.03±0.2(VA)
3.41 70.08(AA) 3.26±0.2

3.82
2.35
紅色空心標誌

52.56(AA)

63.9±0.2
55.5±0.2(VA)
12.Contour Drawing

26.92±0.2

20.95±0.2
16.01±0.2

第 28 頁，共 36 頁
8.6±0.2

Componnent Side
28.2±0.2

55.62±0.15
34.6±0.2 25.0±0.2

4.0±0.5
Supporting tape Contact side

0.30±0.05
27.50±0.2

39.94±0.2 3.0±0.3

R0
.2 W=0.35
0
P0.5*53=26.5
Contact Side
SCALE 2/1
 1 VBL- 21 G1 41 VCC
2 VBL- 22 G2 42 VCC
3 VBL+ 23 G3 43 Y2
4 VBL+ 24 G4 44 X2
5 Y1 25 G5 45 NC
6 X1 26 G6 46 NC
7 NC 27 G7 47 NC
8 /RESET 28 R0 48 IF2
9 SPENA 29 R1 49 IF1
10 SPCLK 30 R2 50 IF0
11 SPDAT 31 R3 51 NC
12 B0 32 R4 52 DE
13 B1 33 R5 53 GND
14 B2 34 R6 54 GND
15 B3 35 R7
16 B4 36 Hsync
17 B5 37 Vsync
18 B6 38 DATA CLK
19 B7 39 NC
20 G0 40 NC

第 29 頁，共 36 頁
13. Inspection specification

NO Item Criterion AQL

1.1 Missing vertical, horizontal segment, segment contrast defect.

1.2 Missing character , dot or icon.
1.3 Display malfunction.
Electrical 1.4 No function or no display.
01 0.65
Testing 1.5 Current consumption exceeds product specifications.
1.6 LCD viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.

Black or white 2.1 White and black spots on display ≦0.25mm, no more than
02 spots on LCD three white or black spots present. 2.5
(display only) 2.2 Densely spaced: No more than two spots or lines within 3mm

3.1 Round type : As following drawing

Φ=( x + y ) / 2 SIZE Acceptable Q TY
Φ≦0.10 Accept no dense
2.5
0.10＜Φ≦0.20 2
LCD black 0.20＜Φ≦0.25 1
spots, white 0.25＜Φ 0
03 spots,
contamination
3.2 Line type : (As following drawing)
(non-display)
Length Width Acceptable Q TY
--- W≦0.02 Accept no dense
L≦3.0 0.02＜W≦0.03 2.5
2
L≦2.5 0.03＜W≦0.05
--- 0.05＜W As round type

If bubbles are visible, Size Φ Acceptable Q TY

judge using black spot Φ≦0.20 Accept no dense
Polarizer specifications, not easy
04 0.20＜Φ≦0.50 3 2.5
bubbles to find, must check in
specify direction. 0.50＜Φ≦1.00 2
1.00＜Φ 0
Total Q TY 3

第 30 頁，共 36 頁
NO Item Criterion AQL
05 Scratches Follow NO.3 LCD black spots, white spots, contamination
Symbols Define:
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: LCD side length
L: Electrode pad length:

6.1 General glass chip :

6.1.1 Chip on panel surface and crack between panels:

z: Chip thickness y: Chip width x: Chip length

Chipped Z≦1/2t Not over viewing area x≦1/8a
06 2.5
glass 1/2t＜z≦2t Not exceed 1/3k x≦1/8a
☉If there are 2 or more chips, x is total length of each chip.

6.1.2 Corner crack:

z: Chip thickness y: Chip width x: Chip length

Z≦1/2t Not over viewing area x≦1/8a
1/2t＜z≦2t Not exceed 1/3k x≦1/8a
☉If there are 2 or more chips, x is the total length of each chip.

第 31 頁，共 36 頁
NO Item Criterion AQL
Symbols :
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: LCD side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :

y: Chip width x: Chip length z: Chip thickness

y≦0.5mm x≦1/8a 0 ＜ z≦t
6.2.2 Non-conductive portion:

Glass
06 2.5
crack

y: Chip width x: Chip length z: Chip thickness

y≦ L x≦1/8a 0 ＜ z≦t
☉If the chipped area touches the ITO terminal, over 2/3 of the ITO must
remain and be inspected according to electrode terminal specifications.
☉If the product will be heat sealed by the customer, the alignment mark
not be damaged.
6.2.3 Substrate protuberance and internal crack.
y: width x: length
y≦1/3L x≦a

第 32 頁，共 36 頁
NO Item Criterion AQL
07 Cracked glass The LCD with extensive crack is not acceptable. 2.5

8.1 Illumination source flickers when lit. 0.65

Backlight 8.2 Spots or scratched that appear when lit must be judged. Using 2.5
08
elements LCD spot, lines and contamination standards.
8.3 Backlight doesn＇t light or color wrong. 0.65

9.1 Bezel may not have rust, be deformed or have fingerprints, stains
2.5
09 Bezel or other contamination.
0.65
9.2 Bezel must comply with job specifications.

10.1 COB seal may not have pinholes larger than 0.2mm or 2.5
contamination.
10.2 COB seal surface may not have pinholes through to the IC. 2.5
0.65
10.3 The height of the COB should not exceed the height indicated
in the assembly diagram. 2.5
10.4 There may not be more than 2mm of sealant outside the seal
area on the PCB. And there should be no more than three
10 PCB、COB places. 2.5
10.5 No oxidation or contamination PCB terminals. 0.65
10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts, missing
parts or excess parts. 0.65
10.7 The jumper on the PCB should conform to the product
characteristic chart. 2.5
10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw
hold pad, make sure it is smoothed down.

11.1 No un-melted solder paste may be present on the PCB. 2.5

11.2 No cold solder joints, missing solder connections, oxidation or 2.5
11 Soldering icicle.
2.5
11.3 No residue or solder balls on PCB.
0.65
11.4 No short circuits in components on PCB.

第 33 頁，共 36 頁
NO Item Criterion AQL

12.1 No oxidation, contamination, curves or, bends on interface Pin 2.5

(OLB) of TCP.
12.2 No cracks on interface pin (OLB) of TCP. 0.65
2.5
12.3 No contamination, solder residue or solder balls on product.
2.5
12.4 The IC on the TCP may not be damaged, circuits. 2.5
12.5 The uppermost edge of the protective strip on the interface pin
must be present or look as if it cause the interface pin to sever. 2.5
General 12.6 The residual rosin or tin oil of soldering (component or chip
12 2.5
appearance component) is not burned into brown or black color.
12.7 Sealant on top of the ITO circuit has not hardened. 0.65
0.65
12.8 Pin type must match type in specification sheet.
0.65
12.9 LCD pin loose or missing pins.
12.10 Product packaging must the same as specified on packaging 0.65
specification sheet.
12.11 Product dimension and structure must conform to product
specification sheet.

第 34 頁，共 36 頁
 winstar LCM Sample Estimate Feedback Sheet
Module Number： Page: 1
1、Panel Specification：
1. Panel Type： □ Pass □ NG ,
2. View Direction： □ Pass □ NG ,
3. Numbers of Dots： □ Pass □ NG ,
4. View Area： □ Pass □ NG ,
5. Active Area： □ Pass □ NG ,
6. Operating Temperature： □ Pass □ NG ,
7. Storage Temperature： □ Pass □ NG ,
8. Others：
2、Mechanical Specification：
1. PCB Size： □ Pass □ NG ,
2. Frame Size： □ Pass □ NG ,
3. Material of Frame： □ Pass □ NG ,
4. Connector Position： □ Pass □ NG ,
5. Fix Hole Position： □ Pass □ NG ,
6. Backlight Position： □ Pass □ NG ,
7. Thickness of PCB： □ Pass □ NG ,
8. Height of Frame to PCB： □ Pass □ NG ,
9. Height of Module： □ Pass □ NG ,
10. Others： □ Pass □ NG ,
3、Relative Hole Size：
1. Pitch of Connector： □ Pass □ NG ,
2. Hole size of Connector： □ Pass □ NG ,
3. Mounting Hole size： □ Pass □ NG ,
4. Mounting Hole Type： □ Pass □ NG ,
5. Others： □ Pass □ NG ,
4、Backlight Specification：
1. B/L Type： □ Pass □ NG ,
2. B/L Color： □ Pass □ NG ,
3. B/L Driving Voltage (Reference for LED Type)： □ Pass □ NG ,
4. B/L Driving Current： □ Pass □ NG ,
5. Brightness of B/L： □ Pass □ NG ,
6. B/L Solder Method： □ Pass □ NG ,
7. Others： □ Pass □ NG ,
＞＞ Go to page 2 ＜＜

第 35 頁，共 36 頁
 winstar
Module Number： Page: 2
5、Electronic Characteristics of Module：
1. Input Voltage： □ Pass □ NG ,
2. Supply Current： □ Pass □ NG ,
3. Driving Voltage for LCD： □ Pass □ NG ,
4. Contrast for LCD： □ Pass □ NG ,
5. B/L Driving Method： □ Pass □ NG ,
6. Negative Voltage Output： □ Pass □ NG ,
7. Interface Function： □ Pass □ NG ,
8. LCD Uniformity： □ Pass □ NG ,
9. ESD test： □ Pass □ NG ,
10. Others： □ Pass □ NG ,
6、Summary：

Sales signature：
Customer Signature： Date： / /

第 36 頁，共 36 頁