SIM300

Application Note
Deskphone design

SIMCOM Ltd,.
21th Dec 2005
SIM300 deskphone design
Confidential SIMCOM
Document Name: SIM300 deskphone design

Version: 01.02
Date: 2005-12-21
Doc Id: SIM300_AN_01_V1.02
Status: Release

General Notes
Simcom offers this information as a service to its customers, to support application and
engineering efforts that use Simcom products. The information provided is based upon
requirements specifically provided to Simcom by the customers. Simcom has not undertaken any
independent search for additional relevant information, including any information that may be in
the customer’s possession. Furthermore, system validation of this Simcom product within a larger
electronic system remains the responsibility of the customer or the customer’s system integrator.
All specifications supplied herein are subject to change.

Copyright
This document contains proprietary technical information which is the property of SIMCOM
Limited., copying of this document and giving it to others and the using or communication of the
contents thereof, are forbidden without express authority. Offenders are liable to the payment of
damages. All rights reserved in the event of grant of a patent or the registration of a utility model
or design. All specification supplied herein are subject to change without notice at any time.

Copyright © SIMCOM Limited. 2005

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Contents

Contents ............................................................................................................................................3
Version History .................................................................................................................................4
1 Introduction....................................................................................................................................5
2 Product concept..............................................................................................................................5
3．Description of design ..................................................................................................................5
3．1．Description of the power supply ...................................................................................5
3．2．Reference design of power on circuit............................................................................7
3．3．Reference design of SIM card circuit............................................................................7
3．4．Reference design of the audio circuit ............................................................................8
3．5．Reference design of the I/O circuit .............................................................................10
3．6．Reference design of layout..........................................................................................10
3．7．Reference design of the PCB ...................................................................................... 11
3．8．Reference design of the circuit diagram......................................................................12

Figure Index

FIGURE 1：VBAT INPUT......................................................................................................................6

FIGURE 2：VBAT VOLTAGE DROP AT THE TRANSMIT PHASE ...................................................6
FIGURE 3：POWER ON CIRCUIT .......................................................................................................7
FIGURE 4：REFERENCE CIRCUIT OF 8PIN SIM CARD..................................................................8
FIGURE 5：REFERENCE CIRCUIT OF 6PIN SIM CARD..................................................................8
FIGURE 6：MICROPHONE CIRCUIT .................................................................................................9
FIGURE 7：AUDIO CIRCUIT LAYOUT ..............................................................................................9
FIGURE 8：REFERENCE PCB ABOUT THE AUDIO TRACE.........................................................10
FIGURE 9：BLOCK FIGURE OF THE SIM300 ................................................................................. 11
FIGURE 10：REFERENCE FIGURE OF CONNECTOR LAYOUT .................................................. 11
FIGURE 11：REFERENCE LAYOUT OF PCB...................................................................................12

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Version History

Data Version Description of change Author

2005-08-04 01.00 Origin anthony
2005-12-05 01.01 Add the power on circuit anthony
2005-12-21 01.02 Add the serial port and software upgrade anthony

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1 Introduction

This document describes the design reference of the SIMCOM SIM300 module that used to
design for deskphone. The document mainly is about design notes, reference circuit and PCB
layout reference .

Reference document:
SIM300_HD_V1.05(051122)

2 Product concept

Designed for global market, SIM300 is a Tri-band GSM/GPRS engine that works on frequencies
EGSM 900 MHz, DCS 1800 MHz and PCS1900 MHz. SIM300 provides GPRS multi-slot class
10 capability and support the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4.

With a tiny configuration of 40mm x 33mm x 2.85 mm , SIM300 can fit almost all the space
requirement in your application, such as Smart phone, PDA phone and other mobile device.

The physical interface between SIM300 and the mobile application is through a 60 pins
board-to-board connector, which provides all hardware interfaces from module to customers’
boards except the RF antenna interface.
z The keypad and SPI LCD interface will give you the flexibility to develop customized
applications.
z Two serial ports can help you easily develop your applications.
z Two audio channels include two microphones inputs and two speaker outputs. These
audio interfaces can be easily configured by AT command.
z One ADC input
z Two GPIO ports and SIM card detection port

3．Description of design

3．1．Description of the power supply

The power supply of SIM300 is from a single voltage source of VBAT= 3.4V...4.5V. In some
case, the ripple in a transmit burst may cause voltage drops when current consumption rises to
typical peaks of 2A, So the power supply must be able to provide sufficient current up to 2A.
For the VBAT input, a local bypass capacitor is recommended. A capacitor (about 100µF, low

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ESR) is recommended. Multi-layer ceramic chip (MLCC) capacitors can provide the best
combination of low ESR and small size but may not be cost effective. A lower cost choice may be
a 100 µF tantalum capacitor (low ESR) with a small (1 µF to 10µF) ceramic in parallel, which is
illustrated as following figure. And the capacitors should put as closer as possible to the SIM300
VBAT pins. The following figure is the recommended circuit.

Figure 1：VBAT input

The following figure is the VBAT voltage ripple wave at the maximum power transmit phase,
the test condition is VBAT=4.0V, VBAT maximum output current =2A, CA=100 µF tantalum
capacitor (ESR=0.7Ω) and CB=4.7µF.
B

Figure 2：VBAT voltage drop at the transmit phase

Note:
Because of the large current consumption at the transmit phase, the trace width is too thin may
cause the voltage drop when PCB layout, that:
1. Power supply may be larger than 2A.
2. The power supply trace length may be as short as possible, trace width as wide as possible

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3．2．Reference design of power on circuit

You can turn on the module by driving the PWRKEY to a low level voltage for period time.
The automatic power on circuit illustrate as following figure. The PWRKEY pin is the NO.34 pin
of the module interface. The value of the capacitor C155 is recommended as 330uF/16V. The
diode D2（1N4148）is used for current discharge when power down. The diode can be modified to
the other type part which discharge capability is better. You can make a decision by some
experiments yourself.

Figure 3：power on circuit

3．3．Reference design of SIM card circuit

Following is the reference circuit about SIM interface. We recommend an electrostatic discharge
device ST (www.st.com ) ESDA6V1W5 or ON SEMI (www.onsemi.com ) SMF05C for “ESD
ANTI”. The resistances (R204-R206) showed in the figure 3 should be added in series in the IO
line between the module and the SIM card for matching the impedance. The SIM_PRESENCE pin
is used for detecting the SIM card removal.
Note: the pull up resistance R207 must be added.
You can select the 8 pins SIM card. The reference circuit about SIM card illustrates as following
figure.

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Figure 4：Reference circuit of 8PIN SIM card

If you don’t use the SIM card detection function, you can let the SIM_PRESENCE pin NC or
connect to the GND. The reference circuit about 6 pins SIM card illustrates as following figure.

Figure 5：Reference circuit of 6PIN SIM card

3．4．Reference design of the audio circuit

The peripheral microphone power supply circuit used in the SIM100S peripheral circuit can be
deleted in SIM300. Because it has put internal to SIM300 for reduce the custom’s BOM.you can
connect the microphone directly to the MIC pin by differential mode or single-ended mode. The
reference circuit is showed as the following figure.

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Figure 6：Microphone circuit

The differential trace is recommended to reduce the RF noise when the audio trace layout, such
as the following figure. The analogy GND and the digital GND must be divided. The audio filter
should be put nearest the input part. Please refer to the white flag in the following figure.

Figure 7：Audio circuit layout

The differential trace is recommended about microphone trace, because the microphone sign
is so weakly and its’ anti-interference is so bad. The trace width is recommended 0.2mm and be
surrounded with analogy GND. Please refer to the following figure, the blue part is digital GND
and the gray part is analogy GND in the bottom layer. The more digital GND should be put in
the top layer.

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Figure 8：Reference PCB about the audio trace

3．5．Reference design of the I/O circuit

Because the IO level of the SIM300 is 3.0V, please note the matching level between the
customer IO and the SIM300 IO.

About the serial port and software upgrade

The TXD、RXD、DBG_TXD、DBG_RXD、GND must be connected to the IO connector
when user need to upgrade software and debug softwane,the TXD、RXD should be used for
software upgrade and the DBG_TXD、DBG_RXD for software debug. The PWRKEY pin is
recommended to connect to the IO connector; the user also can add a switch between the
PWRKEY and the GND. The PWRKEY should be connected to the GND when SIM300 is
upgrading software. Please refer to SIM300_HD_V1.05 for the detail.

3．6．Reference design of layout

The block of the SIM300 module is showed as the following figure. Please keep away from
the RF part and the antenna when layout the audio trace. The top layer had better few trace and put
the more digital GND. The underside of the module in top copper layer should show the copper,
because the cover of the SIM300 can be connected to GND better. Please refer to the figure 9, the
blue part is GND, the red part is trace in the top layer, the green part is trace in the bottom layer.
The audio trace should be shielded by GND.

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Figure 9：Block figure of the SIM300

Top layer Bottom layer

Figure 10：Reference figure of connector layout

3．7．Reference design of the PCB

The layout of the PCB may affect the total capability of the SIM300. Please refer to the
following figure, the white block is the module, the gray block is the power supply and the
peripheral circuit, the blue block is the audio circuit, the yellow block is peripheral circuit, the
brown block is GND copper. The brown block should be put fewer trace, and the trace may be put

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in the bottom layer. Please note the isolation between the audio circuit and the digital circuit, and
add the more via between the top layer and the bottom layer.

Figure 11：Reference LAYOUT of PCB

3．8．Reference design of the circuit diagram

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商务电话_SIM300_V1.03_DL(050923).sch-2 - Wed Nov 16 09:51:04 2005
商务电话_SIM300_V1.03_DL(050923).sch-3 - Wed Nov 16 09:51:04 2005
 受
产 品 BOM 表
BOM名称： 商务电话_SIM300_PCBA_BOM BOM编号：
【产品名称: 商务电话_SIM300 产品料号： PCB版本：V1.03
拟制： 审核： 批准：

序号 型号 物料描述 单耗 单位 位号 备注
1 MCR03EZPJ220 电阻22R(0603) 3 个 R304,R305,R306
2 MCR03EZPJ101 电阻100R(0603) 16 个 R104,R307-R316,R320-R324
3 MCR03EZPJ471 电阻470R(0603) 2 个 R103,R319
4 MCR03EZPJ222 电阻2.2K(0603) 1 个 R317
5 MCR03EZPJ103 电阻10K(0603) 3 个 R204,R302,R318
6 MCR03EZPJ203 电阻20K(0603) 4 个 R201,R202,R203,R205
7 MCR03EZPJ433 电阻43K(0603) 1 个 R101
8 MCR03EZPJ104 电阻100K(0603) 4 个 R102,R301,R303,R326
9 C1608COG1H100D(TDK) 电容10pF(0603) 1 个 C206
C104,C201,C202,C211-C225,C227,C304,
10 C1608COG1H220D(TDK) 电容22pF(0603) 34 个
C310-C324
C1608COG1H330J(TDK)
11 电容33pF(0603) 1 个 C205
CM105CG330J10AT
12 C1608X7R1H104K(TDK) 电容100nF(0603) 11 个 C102,C106-C110,C208,C210,C303,C306,C325
13 CM105X7R224K10AT 电容220nF(0603) 1 个 C309
14 CM105X7R394K10AT 电容390nF(0603) 2 个 C203,C204
15 电容1uF(0603) 1 个 C207
16 T491V107M010AS 电容100uF 3 个 C103,C209,C305
17 电容330uF 1 个 C301
18 电容1000uF 1 个 C101
19 电容2200uF 1 个 C302
20 电感39nH 1 个 L202
21 电感100nH 4 个 L203,L204,L205,L206
22 电感10uH 1 个 L201
23 MIC29302BT 电源芯片 1 个 U101
24 SMF05CT1 ESD保护器 1 个 FV301
25 SP3243ECA(SSOP28) 串口芯片 1 个 U102
26 音频放大器 LM4890MM 1 个 U201
27 1SS400-TE61 开关二极管 1 个 D301
28 晶体管 1 个 T301

商务电话-SIM300 PCBA基准BOM 第 1 页
序号 型号 物料描述 单耗 单位 位号 备注
29 60PIN连接器(公） 1 个 U301
30 C707-10M006-512-2U SIM卡插座 1 个 X302
31 D-SUB 9M RS232串口连接器 1 个 J102
32 两芯插座 2 个 LS1,MK1
33 DC-JACK Φ2.0mm 电源插座 1 个 J101
34 拨动开关 1 个 S101
35 叉簧开关 1 个 X301
36 10芯插座 2 个 J301,J302

商务电话-SIM300 PCBA基准BOM 第 2 页