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Pentacene thin-film transistor 共TFT兲 circuits have been and aligned to the next shadow mask. Fiducial marks on each
investigated during the past decade with promising results mask provided a means to align the different layers to within
and exciting progress.1– 4 Field-effect mobilities have ⫾30 m. Fabrication began with 3 nm of titanium and 50
steadily increased as a result of gate dielectric surface nm of gold, which were vacuum evaporated through the first
treatments,5 improved pentacene deposition processes,3 and polymer shadow mask to serve as the bottom gate metal.
pentacene purification. Although a number of other organic Aluminum oxide was then electron-beam evaporated through
semiconductor materials have been used to prepare transis- a second shadow mask to provide a gate dielectric and an
tors and circuits,6 –9 pentacene continues to be an attractive interlayer dielectric with a specific capacitance of
material choice because of the relatively high mobilities. 250 pF/mm2 . A styrene-based polymeric surface treatment
A variety of applications have been proposed and, in was solution cast onto the gate dielectric to improve transis-
some cases, demonstrated, for organic-semiconductor cir- tor mobilities.19 Pentacene purchased from Aldrich, and pu-
cuits, including display backplanes,5,10,11 sensors,12 and rf rified using thermal gradient sublimation, was thermally
identification 共RFID兲 transponders 共tags兲.13 The work pre- evaporated at a rate of about 0.05 nm/s through a shadow
sented here is focused on RFID applications, although the mask. The pentacene film thickness was measured using
circuit powering scheme and patterning approach are appli- atomic force microscopy and found to be approximately 30
cable to display backplane circuitry and other applications. nm. Finally, 60 nm of gold was deposited through a shadow
Many different patterning techniques for organic- mask to form the source and drain electrodes of the transis-
semiconductor-based transistors and integrated circuits have tors and to complete metal connections throughout the cir-
been examined, including stamping,14 ink jet patterning,15 cuit.
cold-welding,16 and photolithography.17 Brody details the Transistors were characterized using a Hewlett Packard
shadow-mask patterning of inorganic-semiconductor-based 4145A semiconductor parameter analyzer. A representative
TFT circuits,18 wherein the layers are patterned using thin drain current versus gate voltage plot is shown in Fig. 2.
metal stencil masks. An advantage of shadow-mask pattern- Typical values for the effective mobility, extracted from the
ing is that, in principle, the masks can be placed and aligned
within the deposition system without breaking vacuum. We
have employed a polymeric shadow-mask patterning scheme
to fabricate organic-semiconductor-based integrated circuits.
Flexible shadow masks were fabricated in 25-m-thick Kap-
ton®, using excimer laser (⫽248 nm) ablation. This tech-
nique provides relatively rugged, large-area masks with a
current resolution capability of about 15 m. We report here
a simple pentacene-based rf transponder circuit patterned
completely using these shadow masks. A photomicrograph of
the completed circuit is shown in Fig. 1. The inset shows a
close-up section of the ring-oscillator. The metal lines are
nominally 30 m wide.
The circuits were formed on 2 in.⫻2 in. glass plates.
The substrate was nominally at room temperature during all
of the vacuum deposition steps. After each deposition, the
substrate was removed from the vacuum deposition chamber
FIG. 1. Shadow-masked circuit photomicrograph. The inset is a close-up
a兲
Author to whom correspondence should be addressed; electronic mail: showing one end of the ring-oscillator. The width of the image is approxi-
pfbaude@mmm.com mately 2.5 mm.
FIG. 2. Drain current as a function of gate bias for pentacene TFT. W/L
⫽300 m/20 m. The drain–source potential was ⫺40 V.
5
Higher rf frequencies were explored and we found we were H. Klauk, D. J. Gundlach, J. A. Nichols, and T. N. Jackson, IEEE Trans.
able to obtain detectable load modulation with frequencies Electron Devices 46, 1258 共1999兲.
6
W. Fix, A. Ullmann, J. Ficker, and W. Clemens, Appl. Phys. Lett. 81, 1735
up to about 6.5 MHz. The upper limit of the practical rf 共2002兲.
frequency is determined, in part, by the mobility of the tran- 7
G. H. Gelinck, T. C. T. Geuns, and D. M. de Leeuw, Appl. Phys. Lett. 77,
sistors, drive voltage, and channel length. 1487 共2000兲.
8
In summary, we have demonstrated pentacene based A. Facchetti, Y. Deng, A. Wang, Y. Koide, H. Sirringhaus, T. Marks, and
R. Friend, Angew. Chem., Int. Ed. Engl. 39, 4547 共2000兲.
thin-film integrated RFID circuits patterned with polymer 9
H. E. Katz, J. Johnson, A. J. Lovinger, and Wenjie Li, J. Am. Chem. Soc.
shadow masks. The circuits were powered directly with rf, 122, 7787 共2000兲.
10
without a rectification stage, and shown to operate at 125 C. D. Sheraw, L. Zhou, J. R. Huang, D. J. Gundlach, and T. N. Jackson,
kHz and as high as 6.5 MHz. Appl. Phys. Lett. 80, 1088 共2002兲.
11
P. Mach, S. J. Rodriguez, R. Nortrup, P. Wiltzius, and J. A. Rogers, Appl.
Phys. Lett. 78, 3592 共2001兲.
The authors thank J. Thomas and R. Jesme for invalu- 12
T. Someya, H. E. Katz, A. Gelperin, A. J. Lovinger, and A. Dodabalapurd,
able discussions. We are grateful to P. Fleming for expertise Appl. Phys. Lett. 81, 3079 共2002兲.
13
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T. K. Kelley, D. V. Muyres, P. F. Baude, T. P. Smith, and T. D. Jones,
4
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