NOTE: This is a highly abbreviated, confidential version.

The full version is a

vailable upon request.
PROCESS - CHEMICAL - MATERIALS ENGINEER
Creative, intuitive Chemical Process Engineer with extensive experience in diver
se, world-class semiconductor manufacturing and academic research. Exceptional
technical and interpersonal communication skills. Ability to accurately evaluat
e and improve complex manufacturing processes, equipment, and operations to skil
lfully reduce materials, inventory, and logistics costs. Consistently meets str
ingent implementation and production deadlines. Especially effective in fluid,
high-pressure environments. An exemplary, proactive team player who encourages
and actively recognizes peak performance from team members. Uncompromising atte
ntion to detail. Known for seizing initiatives, and devotion to corporate goals
.
AREAS OF EXPERTISE
SAFIER Shrink
Metal Lift-Off
DUV 248 Photolithography
Technology Transfer
Troubleshooting & Root-Cause
Inventory Control & Purchasing
Process Development
Preventative Maintenance
Tool Down-Selection
DoE, FMEA, GFA
Project Management
High Volume Manufacturing
Six-Sigma SPC
Management Experience
Lean Manufacturing
PROFESSIONAL EXPERIENCE
MAJOR COMPOUND III-V SEMICONDUCTOR MANUFACTURER
Metal Lift-Off engineer. Tool down-selection, process design, process developme
nt, and sustaining activities.
> Conducted a rigorous, tool down-selection by which to recommend new lift-off
tools:
> Initiated and performed a comprehensive evaluation of photoresist (PR) stripp
ers (multiple NMP- and DMSO-based stripers) for the new LO processes to suppleme
nt the tool down-selection process:
> Conducted feasibility and cost analysis studies for bulk delivery of the phot
oresist stripper:
+ The study indicates a savings of ~$45K per year.
> Developed a new Metal Lift-Off process recipe:
> Redesigned a production mask to include more cells, increasing potential yiel
d by ~4%.
MAJOR SEMICONDUCTOR MANUFACTURER
Lithography Engineer. Process development and sustaining activities.
> 100% excursion-free processing from both production and safety perspectives.
> Beat cycle-time and tool-availability goals in 15 out of 16 quarters.
> Performed or directly supervised all maintenance, repairs, trouble-shooting,
and root-cause investigations on all tools, employing DOE, FMEA, SPC, and GFA te
chniques, among others.
Devised and implemented process development, optimization, and efficiency projec
ts to improve yield and reduce operating expenses.
> Initiated, created, piloted, and brought into production two major quality-as
surance projects to improve defect monitor reliabilities, and thereby improve yi
elds:
> Solved a very chronic, oven pressure issue by writing four new cleaning PMs.
> Implemented multiple, chemical-related cost-saving projects that saved ~$100,
000:
> Certified clean tracks during technology transfer to a HVM foundry.
Created and updated Training Manuals, PM Procedures, Automation checklists, Fing
er Print Documents, and Specification (SPEC) documents.
> Rewrote a training manual entirely.
> Devised, tested, and implemented four new PM Procedures to address the oven p
ressure issue.
Served as both a leader and active participant in regular passdown meetings, Tec
hnician mentoring, and training activities, contributing many suggestions to imp
rove communications and operations.
Managers to ensure accountability, and to establish a direct line of responsibil
ity for operational issues.
+ Protocol Implemented Across the Entire Foundry in Every Functional Area
.
> Trained four sets of engineers.
Played a key role with respect to chemical handling, inventory control, batch ch
anges, and batch qualifications. Created and implemented procedures to improve
safety, efficiency, and reduce costs.
> Developed and implemented new procedures to ensure proper delivery and pickup
of chemical bottles.
+ Procedures Were Subsequently Implemented at the Three Other Oregon Foun
dries.
> Worked with a Microcontamination Group Leader to introduce a new low-Titanium
6% IPA pre-saturated wipe to reduce the likelihood of process-excursions:
+ Requested a redesigned bag with a better seal (zip-lock) and fewer wipe
s per bag.
~ TexWipe Created an Entirely New Product (TX8691) to Accommodate O
ur Request.
PH.D. in CHEMICAL ENGINEERING, UNIVERSITY OF CALIFORNIA, DAVIS
SANDIA NATIONAL LABS - Intern
M.S. in CHEMICAL ENGINEERING, UNIVERSITY OF CALIFORNIA, DAVIS
B.S.E. in CHEMICAL ENGINEERING, ARIZONA STATE UNIVERSITY
TECHNICAL PROFICIENCIES

COMPUTATIONAL (selected)
> Expert user of molecular modeling Cerius2 (UNIX) and Materials Studio (WIN) s
oftware, running Molecular Mechanics, Molecular Dynamics, and DFT simulation rou
tines for scientific investigation.
> Programming experience in Fortran, C, TCL, Visual Basic, Pascal, and Assembly
(MOT).
> Expert user of Mathcad (Mathsoft), instrumental (in part) to the creation of
the Mathcad 7.01A Patch.
> Familiar with Matlab, AspenPlus, Mathematica, and Honeywell TDC 3000, and CAD
.
EXPERIMENTAL (selected)
> Semiconductor Processing Metro Tools: Hitachi CD-SEM; KLA-Tencor Thin Film Me
asurements, Patterned Wafer Inspections, and Unpatterned Surface Inspection; Rud
olph Thin Film Measurements; Leica Imaging.
> Ultra-sensitive drop-solution calorimetry (custom built twin-Calvet type).
> Hydrothermal zeolite synthesis:
+ Parr bombs, high-temp dehydration furnaces.
+ Designed quartz heating tube for dehydration.
> XRD (Scintag, Inel), NMR (Chemagnetics), TEM (Phillips), DSC/TGA thermal anal
yses (Netzsch).
PATENTS (in process)
> Oven Panel (became a TEL patent).
> Nozzle centering device for TEL Lithius Clean Tracks.
> Air-sensitive sample holder for ultra-sensitive high-temperature calorimetry.
> Air-sensitive XRD sample holders for Scintag and Inel diffractometers.