WIS 10 Interp Exe

SWI 3.
2
TECHNOLOGY
Radiographic Interpretation
Radiographs of Welds
Course reference WIS 10
Copyright © 2004 TWI Ltd M.S.Rogers
SWI 3.2
Radiographic Interpretation of Welds
TECHNOLOGY
Lack of root
penetration
What’s the defect?

SWI 3.2
TECHNOLOGY
Lack of root
Fusion

SWI 3.2
TECHNOLOGY
Excess Penetration
Piping
MAG Process What’s the defect?

SWI 3.2
TECHNOLOGY
Lack of root
fusion with
misalignment

SWI 3.2
TECHNOLOGY
Excessive root
penetration

SWI 3.2
TECHNOLOGY
Concave root

SWI 3.2
TECHNOLOGY
Cluster porosity

SWI 3.2
TECHNOLOGY
Burn through
What’s the defects?

SWI 3.2
TECHNOLOGY
Cap undercut

SWI 3.2
TECHNOLOGY
Wormholes/Piping

SWI 3.2
Note: Grinding marks on parent plate
TECHNOLOGY
Cap undercut intermittent
Concave root
SWI 3.2
TECHNOLOGY
Hard Stamping Blow hole/piping
MAG process Lack of root fusion

SWI 3.2
Note: Grinding marks on parent plate Porosity
TECHNOLOGY
Root undercut
Arc strike
Porosity What’s the defects?
indication
SWI 3.2
TECHNOLOGY
Root undercut

SWI 3.2
TECHNOLOGY
Incomplete filled
groove

SWI 3.2
TECHNOLOGY
Longitudinal
crack

SWI 3.2
Cap Undercut Intermittent
TECHNOLOGY
Slag Line

SWI 3.2
TECHNOLOGY
Slag line Poor stop/start

Slag line

SWI 3.2
TECHNOLOGY
Elongated slag
lines

SWI 3.2
TECHNOLOGY
Linear
misalignment

SWI 3.2
TECHNOLOGY
Lack of sidewall
fusion

SWI 3.2
TECHNOLOGY
Transverse
cracking

SWI 3.2
TECHNOLOGY
Cap undercut intermittent Slag inclusions
Root piping
SWI 3.2
TECHNOLOGY
Lack of sidewall
fusion + slag

SWI 3.2
TECHNOLOGY
Lack of sidewall
fusion + slag

SWI 3.2
TECHNOLOGY
Lack of root penetration
Burn through

SWI 3.2
Note: Re-shoot lead letters in weld area
TECHNOLOGY
Cluster porosity throughout weld

SWI 3.2
TECHNOLOGY
Crater crack or
Star crack

SWI 3.2
TECHNOLOGY
Worm holes
Do you see anything else

Hard stamping

SWI 3.2
TECHNOLOGY
HAZ crack

SWI 3.2
TECHNOLOGY
Copper inclusions
MAG Process What’s the defects?

SWI 3.2
Note: Grinding marks throughout
TECHNOLOGY
Excess root penetration
Root undercut What’s the defect?

SWI 3.2
TECHNOLOGY
Crater cracks
+ crater pipe
No weld metal

SWI 3.2
TECHNOLOGY
Root undercut
Unfused filler wire

SWI 3.2
TECHNOLOGY
Excess penetration
Flush weld

SWI 3.2
TECHNOLOGY
Silica inclusions
MAG Process What’s the defect?

SWI 3.2
TECHNOLOGY
Cluster porosity

SWI 3.2
TECHNOLOGY
Cap undercut
Arc strike

SWI 3.2
Do you see anything else?
TECHNOLOGY
Spatter / Debris
Excess Root
Penetration

SWI 3.2
What else can you see ?
TECHNOLOGY
Spatter
Piping
Gas pore

SWI 3.2
TECHNOLOGY
Root undercut

SWI 3.2
TECHNOLOGY
Burn Through
MAG Process
Copper inclusions Lack of Root Penetration
Can you see anything else?

SWI 3.2
TECHNOLOGY
Lack of root fusion Incomplete filled groove
Lack of root Penetration Lack of root Penetration

SWI 3.2
What's the defects?
TECHNOLOGY
Wormholes/piping
Cap Undercut
Lack of Root Penetration

SWI 3.2
What defects can you see?
TECHNOLOGY
Parallel slag lines
Porosity

SWI 3.2
What defects can you see?
TECHNOLOGY
Porosity
Crack Lack of sidewall fusion

SWI 3.2
TECHNOLOGY
Interpass slag
inclusions

SWI 3.2
TECHNOLOGY
Re-Shoot Lead letter in weld area
Transverse Cracks
Porosity Excess penetration What’s the defects?

SWI 3.2
TECHNOLOGY
Incomplete filled groove Copper inclusions Incomplete

filled groove
SWI 3.2
TECHNOLOGY
Tungsten
inclusions
TIG Process
SWI 3.2
TECHNOLOGY
Herringbone porosity

SWI 3.2
Note: Grinding marks
TECHNOLOGY
Root concavity
Note: weld repair
Arc strike
SWI 3.2
Note: Re-shoot lead letter in weld area
TECHNOLOGY
Lack of root penetration Excess penetration
Tungsten inclusions
TIG Process

SWI 3.2
Gas cavities Concave root intermittent
TECHNOLOGY
Slag inclusions
SWI 3.2
TECHNOLOGY
Light Fog
Light Leaks
What’s the Artefact?

SWI 3.2
TECHNOLOGY
What’s the Defect?
Cap undercut
Yellow Fog

SWI 3.2
TECHNOLOGY
Crimping Mark
After Exposure

SWI 3.2
TECHNOLOGY
Film Scratch

SWI 3.2
TECHNOLOGY
Static Discharge

SWI 3.2
TECHNOLOGY
Chemical Mark

SWI 3.2
TECHNOLOGY
Chemical Mark

SWI 3.2
TECHNOLOGY
Water Marks

SWI 3.2
TECHNOLOGY
Dust/Grime Marks

SWI 3.2
TECHNOLOGY
Reticulation

SWI 3.2
TECHNOLOGY
Diffraction Mottle

SWI 3.2
Any Questions
TECHNOLOGY
Copyright
Copyright©©2003
2004TWI
TWILtd
Ltd
? M.S.Rogers
M.S.Rogers

WIS 10 Interp Exe

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SWI 3.

What’s the defect?

What’s the defect?

MAG Process What’s the defect?

What’s the defect?

What’s the defect?

What’s the defect?

What’s the defect?

What’s the defects?

What’s the defect?

What’s the defect?

MAG process Lack of root fusion

What’s the defects?

What’s the defect?

What’s the defect?

What’s the defect?

What’s the defects?

Slag line Poor stop/start

What’s the defect?

What’s the defect?

What’s the defect?

What’s the defect?

What’s the defect?

What’s the defect?

What’s the defect?

What’s the defects?

Cluster porosity throughout weld

What’s the defect?

What’s the defect?

Do you see anything else

What’s the defect?

What’s the defect?

Lack of root penetration

Lack of root penetration

MAG Process What’s the defects?

Excess root penetration

Root undercut What’s the defect?

What’s the defect?

Unfused filler wire

What’s the defect?

What’s the defect?

MAG Process What’s the defect?

What’s the defect?

What’s the defects?

What’s the defects?

What’s the defects?

What’s the defects?

Copper inclusions Lack of Root Penetration

Can you see anything else?

Lack of root Penetration Lack of root Penetration

Lack of Root Penetration

Copyright © 2004 TWI Ltd M.S.Rogers

Copyright © 2004 TWI Ltd M.S.Rogers

Crack Lack of sidewall fusion

What’s the defects?

Porosity Excess penetration What’s the defects?

Incomplete filled groove Copper inclusions Incomplete

What’s the defects?

What’s the defects?

What’s the Artefact?

What’s the Artefact?

Copyright © 2004 TWI Ltd M.S.Rogers

What’s the Artefact?