FCO (Field Change Order) S/N 1396

E-Chuck Pin Replacement

PDC Process Diagnostics and Control

E-Chuck Pin Replacement

FCO (Field Change Order) S/N 1396

Document Revision: Revision A

Owner: Boris Malamud

Department: CD

Date: June 2011

System Profile: Verity4i

Software Version: N/A

Wafer Size: N/A

Related Area: N/A

Purpose: Replacement of the E-Chuck pins. This improves the wafer back-side contact to
the ground and bias voltage lines, resulting in better discharge and CD
measurement stability.

General Description:
Replacement of the E-Chuck pins. This must be perfomed annually as part of
preventative maintenance, or whenever a failure occurs.
The following types of pins must be replaced:
• Pins with TiB2 metal tips
• Pins with rubber tips

Prerequisite N/A
Conditions:

Required Items: • ESC GND Shaft Assembly Replacement Kit, P/N MA 0010-F7460
(see Figure 1).
• Isopropyl Alcohol
• Wipes
• Small wipe sticks

Estimated Time: 6 hours

Certification Level: CE

Safety: Follow all applicable safety instructions provided in the Training and Product
Manuals. Do not proceed if you are unsure of the proper steps to take regarding
personnel or equipment safety.
• Voltage Hazard Type: 2
• LOTO Type: Local
• Interlock Status: Active

Applicability: Verity4i Tools

FCO (Field Change Order) S/N 1396

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E-Chuck Pin Replacement
PDC Process Diagnostics and Control

Figure 1. ESC GND Shaft Assembly Replacement Kit

FCO (Field Change Order) S/N 1396

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 FCO (Field Change Order) S/N 1396
E-Chuck Pin Replacement
PDC Process Diagnostics and Control

1. Replacing Pins
1. Perform Reference Capacitance Measurement. See “Reference
Capacitance Measurement” on page 7.

2. Remove the two ground rubber assemblies from the ESC – the
assemblies far from the ITU arm. For this purpose, use the jig, P/N MP
0270-B0130, from the ESC GND Shaft Assembly Replacement Kit
(see Figure 1).

Figure 2. Removing the Ground Rubber Assemblies

If the PPEK cover pulls out without the entire shaft

assembly, perform one of the following options:
• Replace only the shaft (remove the shaft from the new
replacement assembly and use only that).
NOTE or
• Rotate the chuck upside-down and use a screw driver to push
out the shaft (see Figure 3).

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E-Chuck Pin Replacement
PDC Process Diagnostics and Control

Figure 3. Pushing Out the Shaft from the Chuck

3. Thoroughly clean the shaft assembly opening with isopropyl alcohol

and a small wipe stick.

Figure 4. Cleaning the Shaft Assembly Opening

FCO (Field Change Order) S/N 1396

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E-Chuck Pin Replacement
PDC Process Diagnostics and Control

4. Throughly clean the new shaft assembly, outer spring, and jigs with
isopropyl alcohol and small wipe sticks.

Figure 5. Separate Shaft Assembly Outer Spring and Jigs

5. Verify that the new shaft assembly functions smoothly.

Only if it does not, disassemble the shaft assembly and clean it
internally.

Figure 6. Shaft Assembly Disassembled

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E-Chuck Pin Replacement
PDC Process Diagnostics and Control

6. Install the TiB2 shaft assembly (P/N MA0010-F7450) or the rubber

shaft assembly (P/N MA0010-F7440) onto the chuck using the GND
Shaft Jig (P/N MP0270-B0130).

Figure 7. Installing a Shaft Asssembly onto the Chuck

7. Align the tips’ heights to 150 microns above the E-chuck top surface
using the Jig, ESC GND Pin Go/NoGo (P/N MP00270-B0010).

NoGo Position Go Position

Figure 8. Aligning the Tip Heights

FCO (Field Change Order) S/N 1396

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E-Chuck Pin Replacement
PDC Process Diagnostics and Control

Figure 9. Go/NoGo Pin Diagram

8. Check the electrical conductivity between each of the new tips to the
bias line resolution target or Z stage (rear) stubs.

9. Perform Reference Capacitance Measurement. See “Reference

Capacitance Measurement” below.

10. Run three to five clean bare wafers, 10 times each, before performing
back side particles and metal contamination customer measurements.

1.1 Reference Capacitance Measurement

Before and after every pin replacement, perform the following test:

1. Load a wafer into the chamber - depending on the tool’s configuration,

the wafer should be either 200 mm or 300 mm.

2. Set the Z-Stage to the down position.

FCO (Field Change Order) S/N 1396

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E-Chuck Pin Replacement
PDC Process Diagnostics and Control

3. Perform the following:

Table 1. Reference Capacitance Tests

Num Test Cap Before Upgrade Cap After Upgrade
(Under Vacuum) (Under Vacuum)

1 200mm (or 300mm) RLS

no wafer (Z stage down)

2 200mm (or 300mm) CHK

no wafer (Z stage down)

3 200mm (or 300mm) RLS

with wafer (Z stage up)

4 200mm (or 300mm) RLS

with wafer (Z stage up)

1.2 Critical Voltage Test

Check the voltage before and after every Voltage change. “Critical voltage” is
the voltage which clamps the wafer against the GND shaft’s springs force; it
should be under 450 volts.

Table 2. Critical Voltage Tests

Num Test Before Upgrade After Upgrade

1 Cap 100 volts with wafer after chuck

2 Cap 200 volts with wafer after chuck

3 Cap 300 volts with wafer after chuck

4 Cap 400 volts with wafer after chuck

5 Cap 500 volts with wafer after chuck

6 Cap 600 volts with wafer after chuck

7 Cap 700 volts with wafer after chuck

8 Cap 800 volts with wafer after chuck

FCO (Field Change Order) S/N 1396

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