PRINTED CIRCUIT BOARDS

Also referred as Printed Wiring Board @ Etched Wiring Board Use to mechanically support & electrically connect electronic components using pathway or traces Can be divided into 2 type : rigid & flexible PCB origin : US, therefore Non-SI (oz, mil, inch) have been adopted Board Dimension in inches (1 inches = 25.4mm) Dielectric thickness and conductor width/spacing in mils (1mil=0.001) Conductor (copper) thickness in ounces (oz) { 0.5oz (17.5m)

BASE
thin board insulating material, rigid or flexible which support conductor or components

CONDUCTOR
High purity copper, provide electrical connection between component & also solderable attachment points for the same

CONSUMER
Use in consumer products such as radio, television and cheap test and measuring equipment

PROFESSIONAL
Made of better quality of material to achieve tighter electrical and environmental specifications

RELIABILITY BOARD

 RIGID

FLESIBEL

1. SINGLE SIDED (PAPAN LITAR BERCETAK SATU MUKA)

2. DOUBLE SIDED (PAPAN LITAR BERCETAK DUA MUKA)

3. MULTILAYER BOARD

SINGLE SIDED
Wiring is available only 1 side Circuit pattern solder side, other called component side Mostly use in simple circuitry & manufacturing cost minimum

DOUBLE SIDED
Wiring pattern is available on both side Two type of double sided boards

Double sided with plated through hole connection (PTH) Double sided without plated through hole connection (non-PTH)

Double sided PTH board circuitry both side which is connected Popular in case the circuit complexity and density is high Double sided non-PTH board extension single sided, cost lower In this case, through contacts are made by soldering component on both side.

MULTI LAYER BOARDS

Use where the density connection is too high to be handled by 2 layer or other reason such as accurate control of line impedance Use more than two PCB with thin layer prepreg placed between each layer Development of lamination technology 4@6 layer can be made almost same ease as double sided. Improvement in reliability and cost reduction no longer limit for high technology product, has spread most common application ( entertainment electronic )

RIGID AND FLEXIBLE

Also can be classified base of the insulating material use. Rigid boards variety of material (FR4,CEM) Flexible boards polyester or polyamide The base material very thin, usually in the range 0.1mm Laminate use in flexible boards available with copper on one or both side in rolls. Flexible PCB may be single, double or multilayer.

smaller components fewer holes need to be drilled through abrasive board simpler automated assembly component can be fitted to both side of the circuit board SMT parts are generally cost less than through part Ease in automation results in higher production throughput & better yield

 Electromagnetic

interference (EMI) is a major problem in modern electronic circuits. overcome the interference - designer has to either remove the source of the interference, or protect the circuit being affected.

To

The

ultimate goal is to have the circuit board operating as intended to achieve electromagnetic compatibility (EMC).

 A simple

EMI model consists of three elements: EMI source Coupling path Receptor

 EMI

SOURCE Include microprocessors, microcontrollers, electrostatic discharges, transmitters, switching power supper, lighting and etc PATH The simplest way noise can be coupled into a circuit is through conductors. If a wire runs through a noisy environment, the wire will pick up the noise inductively and pass it into the rest of the circuit An example of this type of coupling is found when noise enters a system through the power supply leads. Noise carried on the power supply lines are conducted to all circuits.

COUPLING

 RECEPTOR

All electronic circuits are receptive to EMI transmissions Most EMI are received from conductive transients, although some are received from direct radio frequency (RF) transmissions.

To design for EMC and to meet EMC standards, the designer should minimize emissions (RF energy exiting from products), and increase susceptibility or immunity from emissions (RF energy entering into the products).

EMC Design Consideration

Component selection and circuit design are major factors that will affect board level EMC performance. Each type of electronic components has its own characteristics, and therefore requires careful design considerations. There are basically two types of packages for all electronic components: leaded and leadless. Leaded components have parasitic effects, especially at high frequencies. The lead forms a low value inductor, about 1nH/mm per lead. The end terminations can also produce a small capacitive effect, in the region of 4pF. Therefore, it is usually the lead length that should be reduced as much as possible.

EMC Design Consideration

Leadless and surface mount components have less parasitics compared with leaded components. Typically, 0.5nH of parasitic inductance with a small end termination capacitance of about 0.3pF. From an EMC viewpoint, surface mount components is preferred

RESISTOR

Surface mount resistors are always preferred over leaded types because of their low parasitic elements. For the leaded type, the carbon film type is the preferred choice, followed by the metal film, then the wire wound. The metal film resistor, parasitic elements at relatively low frequencies (in the MHz), therefore suitable for high power density or high accuracy circuits. The wire wound resistor is highly inductive, therefore it should be avoided in frequency sensitive applications

CAPACITOR

Not easy to select due - many types and behaviors. Nevertheless, the capacitor is one component that can solve many EMC problems. Aluminium electrolytic capacitors usually constructed by winding metal foils spirally between a thin layer of dielectric, - gives high capacitance per unit volume but increases internal inductance of the part. Tantalum capacitors - gives a lower internal inductance than aluminium electrolytic capacitors Ceramic capacitors - usually dominates the impedance for most types

CAPACITOR

Low frequency application - Aluminium and tantalum electrolytic Mid-frequency - ceramic capacitor Very high frequency - ceramic and mica capacitors

Provide interface between PCB designer and computer A CAD system offers advantages over manual methods Advantages Reduce time for the layout procedure Capability to make circuit modification is simple Complex circuitry with large number of ICs

Hardware Personal computer to workstation has more computing power and network In network the user can share the common database to component libraries and peripheral devices (plotter, printer) Software Selection CAD software is often difficult Selecting consideration capabilities, cost

Started with schematic & logic diagram sketch / electronic form the system can check design error (space violations, land to hole size ratio, clearance for automated insertion Followed by merging of the netlist with the physical layout Then board outline is created The placement technique is then selected for placing the component Design the routing outline

Provide the functional flow and graphical representation of an electronic circuit Consist of electrical connection (net) and junction Schematic diagram must consist

Symbol representing discrete component (resistor, IC, transistor) Power and ground symbol Test supporting the diagram Component reference name Input/output connector

Represent the printed wiring, physical size and location of all electronic and mechanical component, the routing of conductor In practice, must incorporate all information before can go for artwork preparation To ensure a good layout, circuit designer must provide :

well drawn schematic with minimum number of cross over or loop boards contact should be designed numerically/alphabetically the number & position of the external connection determine input, output, ground

Making layout was very important and specialized task in past performed manually

The computer is programmed to control the machine. Can divided into drilling and routing machine Drilling automatically changes the drill adjustment, drill speed, and feed rate and bring to the correct X-Y coordinate

CNC ADVANTAGES
Can use continuously 24h, 365day and only to switch off for maintenance Less skilled/trained people can operate One person can supervise many machine as once they are programmed Are programmed with a design which can be manufactured hundreds or even thousands of times Can be updated by improving the software used to drive the machines Training is available through use of virtual software

PCB panel
PCB boards are fabricate in panels to minimize cost of PCB manufacturer and assembly manufacturer Typical panel dimensions are 18*24 inches

PCB data preparation

Laminate preparation

Drilling & Cleaning

Final Fabrication

Surface Finish

Outer layer image transfer

Testing & Inspection

1. PCB data preparation 2. Laminate preparation 3. Drilling & Cleaning 4. Plate through holes 5. Outer layer image transfer

6. Surface Finish 7. Final fabrication 8. Testing & inspection

1. PCB data preparation 2. Laminate preparation 3. Inner layer image transfer 4. Lamination 5. Drilling & Cleaning

6. Plate through holes 7. Outer layer image transfer 8. Surface Finish 9. Final fabrication 10. Testing & inspection

PCB data acquisition

Files transfer from PCB design house to PCB manufacturing #gerber files, drill files, fabrication drawing, customer specification File review by PCB manufacturer Creation of PCB tooling # photo-tool for image transfer image created by PCB software is reproduced on film using laser photoplotters # Drill files # Profile routing files # All tooling is stepped and repeated for optimum utilization of standard panel (24x18)

Preparation of PCB laminate

Dielectric material : woven glass fiber or paper Material depends on the function of the PCB. Some perform better some environment than other (heat, humidity), more suitable for particular manufacturing process (hole punching). Most widely use is FR4/CEM Copper foil is rolled or electrolytically deposited on the base laminate Core laminate is sheared to panel size Core material is cleaned mechanically and/or chemically Removal of surface contamination required to promote subsequent adhesion of photoresist

Inner layer image transfer photo lithography

Purpose : transfer circuit image to core through print-and-etch process Coat copper foils with photoresist. Place phototool and expose to light after expose PR is developed. Polymerised area remain, unexposed area are washed away Etching Selectively remove exposed copper area. Acid : ferric cloride & ammonium persulfate

Lamination
Core are pinned in a stack with sheet of prepreg separating the copper layer. Outer layer are made with a foil of copper. Stack is pinned between heavy metal plates creating a book Book is put it a heated hydraulic press for about 2h Prepreg is available in different styles with varying amounts of resin and glass fibers. This allow the manufacturer to control thickness between layers and thickness of the overall PCB

Lamination

Drilling and Cleaning

Purpose : holes are drilled through PCB to interconnect layer (vias) allow the insertion of PTH components Drilling is performed with CNC equipment Using drill files. Alternative method use punching or laser Multiple panels can be drilled together Drilling of complex boards can take several hours per load Desmear remove the melted resin smear Panels are deburred/scrubbed after drilling

Drilling - Vias
Vias interconnect layers through vias (plated holes) Via dimensions standard min finished holes sizes 8mil Vias require pads on each layer to which they connect. This to ensure that the copper wont be broken by drilling operation Pads on inner vias are larger than outer pads to allow for greater dimensional tolerances Special vias available for high volume PCB

Drilling - Vias
Blind vias connection of outer layer to inner layer Buried vias connection of inner layer preferably on same core.

Plated Through Hole : make holes conductive

PCB substrate is not conductive. Therefore a non-electrolytic deposition method is required Process : electroless copper

Outer Layer Image Transfer

Most common process : print, pattern plate and etch Coat copper foils with photoresist Place phototool and expose to light Outer layer phototools are positive image of the circuit. Circuit image is developed away exposing the copper. PR remaining on the panel will act as plating resist Etching

Surface Finish
Purpose : prevent copper oxidation Most popular surface finish process : SMOBC/HASL SMOBC = Solder-mask-over-bare-copper HASL = Hot-air-solder-leveling Purpose of solder mask : insulate those portions where no solder is required HASL Panels are dipped into molten solder (237^C). Exposed copper is coated with solder. Masks areas remain solder-free. Panels are then cleaned in hot water.

Final Fabrication
Routing done through CNC machines De-penalization - Most of the circuit is routed out of the panel, but tabs remains to hold the circuit in place. This allow machine to populate boards at once. Afterwards, the circuit can be broken out of the panel. Such panel are called array, breakaway. - Alternative de-penalization is to have the panel v-scored. It done through a thin rotating scoring blade that will route across the top & bottom of the panel with about 30% of the thickness. V-scoring allows more circuits per panel. (no spacing is required for router bits)

Final Fabrication

All protective devices such as goggles, face mask, gas mask, gloves etc must be available Highly concentrated chemicals use. Handle carefully, stored properly in tightly closed bottled and containers, kept well ventilated room. No smoking & eating Wear impermeable and acid-proofs aprons, gloves face masks Always observe and act upon the known and recommended safety rules. In case of accident, call the doctor immediately

Automated Optical Inspection (AOI) - inspect inner layer circuit before lamination X-ray & scanning laser system - monitor registration accuracy and pinpoint defect after lamination Final inspection ( manual , automated ) - manual operator visually inspecting the boards via optics and making judgments - automated employs computer added image analysis for determining defects

When PCB inspected and tested evaluate the cost-effectiveness of repairing the board Re-paired/rework is not allowed in high reliability and military application. Only for commercial application is allowed Repaired must meet the original design requirement, reliability and quality standards Plate through holes simple tools (soldering iron, wicked braid) SMT special rework station required (hot air re-flow soldering)

TESTING OF PCBs & FINISHED PRODUCT

Automatic Test Equipment (ATE) Burn In & Accelerated life test Boundary Scanning Mean time to failure (MTTF)

Computer controlled equipment that test & measure electronic devices for functionality and performance Conduct testing with minimal human interaction ATE includes the control hardware, sensors and software that collect and analyzes the test results ATE is considered cost efficient for high-volume testing

The advantages of this kind of test is that they are repeatable and cost efficient in high volume ATE can test components, printed circuit boards, interconnections and verification Test type component : logic, memory, linear or mixed signal, passive & active component Logic : microprocessor, gate arrays

Memory : SDRAM Linear or mixed signal : analog to digital converter (ADCs), DACs, comparators Passive : capacitor, resistor, inductor Active : transistors, diodes, MOSFETs

PCB testers include manufacturing defect analyzers, in-circuit test and functional test. Manufacturing defect : short & missing component (also referred as analog circuit test) In-circuit test : test component that are part of a board assembly (component under test are in circuit) referred as digital circuit test

Functional test : simulates an operating environment and test a board against its functional specification ATE include : Bed-of-nails, flying probe.

Bed-of-nails (BON) BON configuration each circuit net on the board is connected to tester (typically one nail per net) BONs typically require a vacuum or mechanical BONs tester is an array of spring loaded pins (pogo pins) that accept a circuit board The board is pressed down onto the pins, and each pins makes contact on the PCB The others side of the pin connects to circuitry used to the test the PCB

Bed-of-nails (BON) used in PCB fabrication to make sure all the traces and vias are complete, test operation of the circuit or others part after assembly. BON

Flying Probe Uses a low number of moving probes rather than the high number of fixes probes in the BON The test times may be slower due to probe movement Depending upon the system, two or more probes mounted onto tiny heads move freely in an X-Y plane to test points as directed by CAD/Gerber file The probe move independently

Flying Probe Only able to test 2 or 4 points at a time Flying probe, 1, 2, 3

Burn-in test equipment uses elevated voltages, temperatures and power cycling to evaluate high power chips, boards or products. The burn-in process tests the quality of the semiconductor device before it is incorporated into a finished device. Burn-in test equipment accelerates any potential failures in substandard products, known as the "infant mortality". Devices that survive a burn-in period are usually free of early failures and other operational problems.

Burn-in test equipment to test the quality of an integrated circuit (IC), printed circuit board (PCB), application-specific integrated circuits (ASICs), and other microprocessors Companies that conduct burn-in testing typically configure the burn-in testing equipment to perform at a particular temperature or temperature range, depending on the customers specifications. Burn-in test equipment includes ovens that typically operate between -55 degrees and 150 degrees C.

Is a method for testing interconnects (wire line) on printed circuit boards or sub-blocks inside an integrated circuit The Joint Test Action Group (JTAG) developed specification scan testing that was standardized in 1990 Test interconnects and clusters of logic, memories without using physical test probes It add one or more test cells connected to each pin of the device that can selectively override the functionality of that pin.

Test Cells can be programmed via JTAG scan chain to drive a signal onto a pin and across individual trace on the board The cell at the board trace can be programmed to read the value at the pin, verifying the board trace properly connects the two pin If trace is shorted or open, the correct value will not show up at the destination pin board will known to have a fault .

CASING & HOUSINGS Design consideration

material
- aluminum, cold rolled steel

Appearance
- Casing to look good by visually appealing - Outer finish contribute the most type of paint, labeling

design? Size and shape

-not appearance but to function and ease of repair or fabricate -size determine by electronic

Safe of use
- 2 consider (protect project & protect us from the project

Ease of fabrications
Keep it simple

Cost
-prototype 2nd consideration -mass primary consideration

SHEET METAL DESIGN & OVERVIEW Tolerance

Tolerance

should not be tighter than necessary make the part functional tolerances raise the cost of manufacturing

Tight

Practical

tolerances vary according to the design requirement of +/-.010 should be minimum

Tolerances Linear

tolerances should be held as loose as possible, recommend +/-.020

BEND ALLOWANCE
The

following illustrations shows the equation / calculation for determining the bend allowance when forming sheet metal. From Bend Line to Mold Line:

Distance Bend Bend

Allowance:

Allowance of Corner flanges at Angles other than 90 deg.

BEND ALLOWANCE
Distance From Bend Line to Mold Line:

BEND ALLOWANCE
Bend Allowance:

BEND ALLOWANCE
Bend Allowance of Corner flanges at Angles other than 90 deg.

FABRICATION SHEET METAL

Involves

methods & process which are quite different from those used for fabricating machined parts designer must understand these differences cut out of flat stock using developed patterns (templates) & formed to finished parts

Frequently

FABRICATION SHEET METAL

Common

fabrication processes applied to sheet metal Stretching Drawing Bending & flanging Punching Spinning Press forming

Design drawing - redraw the pattern on sheet of construction paper - as a guide for cutting, drilling and punching and folding the box Sheet metal pattern cut out and holes are drilled or punched - aluminium alloy (readily available & provides enough strength) - Tools foot-operated squaring shear & hand-held tin snip - make holes via drilling or punching, diameter > is punched Formed into shape - bending brake

Surface Finish - lay on a protective and attractive coating, label the appropriate area, (number, letter, graphic indicators) - method : spray painting or self-adhesive vinyl