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Abstract
In this work, the porous silicon layer was prepared by the electrochemical anodization etching process on n-type and p-type silicon
wafers. The formation of the porous layer has been identified by photoluminescence and SEM measurements. The optical absorption,
energy gap, carrier transport and thermal properties of n-type and p-type porous silicon layers were investigated by analyzing the
experimental data from photoacoustic measurements. The values of thermal diffusivity, energy gap and carrier transport properties have
been found to be porosity-dependent. The energy band gap of n-type and p-type porous silicon layers was higher than the energy band
gap obtained for silicon substrate (1.11 eV). In the range of porosity (50–76%) of the studies, our results found that the optical band-gap
energy of p-type porous silicon (1.80–2.00 eV) was higher than that of the n-type porous silicon layer (1.70–1.86 eV). The thermal
diffusivity value of the n-type porous layer was found to be higher than that of the p-type and both were observed to increase linearly
with increasing layer porosity.
r 2008 Elsevier B.V. All rights reserved.
0921-4526/$ - see front matter r 2008 Elsevier B.V. All rights reserved.
doi:10.1016/j.physb.2008.01.029
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C.K. Sheng et al. / Physica B 403 (2008) 2634–2638 2635
carrier transport properties of the PSi layers prepared at measurements. Porosity was measured using a gravimetric
various surface porosities. technique. The formation of the PSi layer on Si substrate in
the present work was verified by measuring photolumines-
cence intensity using a fiber optics spectrophotometer
2. Experimental details
(Ocean Optics USA). A scanning electron micrograph
(SEM) and EDX measurements were also carried out to
PSi samples were prepared on p-type and n-type Si
study the surface morphology and atomic information of
wafers in an electrolyte mixture of HF containing ethanol
the PSi samples.
in the proportion 1:1. The etching duration was fixed at
The PA measurements were carried out by the gas-
20 min and the etching process was done at room
microphone detection technique. The xenon light beam,
tempterature. A direct current (dc) bias voltage was applied
after being mechanically modulated by an optical chopper
between the Pt electrode that served as the cathode and the
(SR540), was focused onto the sample kept inside a non-
Al–Si wafer as the anode. The generation process of PSi is
resonant PA cell. The sound wave generated from the
termed as anodization since Si acts as the anode during the
sample could be subsequently detected and converted into
etching process. Five different current densities were used
PA signal by a highly sensitive electret microphone fixed in
in the preparation of PSi, i.e. 16.98, 22.64, 28.29, 33.96 and
the PA cell. The PA signal was then amplified by a low-
39.62 mA/cm2, respectively. In this work, the PSi layers on
noise preamplifier (SR560) and further processed using a
p-type and n-type Si substrates are referred to as p-PSi and
lock-in amplifier (SR530). A personal computer was
n-PSi, respectively. After anodization, the PSi samples were
interfaced to the system for automatic data collection and
dried in air and stored in the dark for 24 h prior to PA
analysis. Fig. 1 shows the schematic diagram of the PA
experimental set-up for optical absorption and energy-gap
Xenon arc Lamp
Chopper measurement of the PSi layer. For carrier transport
properties measurements the same set-up was used where
Monochromator the xenon light source was replaced by 75 mW (632.8 nm)
He–Ne laser (Melles Griot, 05LHR991). The PA phase
signal was measured by changing the chopping frequency
Lens from 30 to 100 Hz. A vibration-free experimental set-up
with a good normalization using high-quality carbon black
Personal Lock-in has been used throughout the measurements to enhance the
Amplifier signal–noise ratio. In addition, the measurement was
Computer
repeated several times by keeping the beam intensity and
the sample at the same position.
Preamplifier 3. Results
0.16 1.6
40 minutes
0.12 1.2
35 minutes
0.10 30 minutes 1.0 23 Hz
(Ihv)1/2
25 minutes
0.08 20 minutes 0.8
0.06 0.6 33 Hz
0.04 0.4
0.02 0.2
Silicon Substrate 1.11 eV
2.00 eV
0.00 0.0
1.5 1.8 2.1 2.4 2.7 3.0 3.3 3.6 1.0 1.5 2.0 2.5 3.0
Photon Energy (eV) Photon Energy (eV)
Fig. 2. Normalized PA signal-intensity spectra for (a) p-PSi samples prepared at six different anodization durations (modulation frequency of 33 Hz),
(b) typical plot of (Ihn)1/2 versus photon energy for p-PSi samples.
ARTICLE IN PRESS
2636 C.K. Sheng et al. / Physica B 403 (2008) 2634–2638
Fig. 2(a) are obviously shifted to the higher photon energy, substrate. Fig. 4 shows typical SEM and EDX spectra
which implies that the energy gap increased with the for porous layer on different substrates and prepared at
increase of porosity. Fig. 2(b) demonstrates the plots of PA different current densities. The SEM images show the
absorption versus photon energy for evaluating the band- existence of small micropores surrounded by Si crystalline
gap energy of the PSi layer. The relationship between boundaries as confirmed by the presence of oxygen
sample porosity and the current density of PSi layers atom beside the Si peak of the EDX spectrum as shown
prepared on p-type and n-type Si substrates is shown in in Fig. 4(e) and (f).
Fig. 3. The porosity is linearly dependent on the current Plots of PA phase signal as a function of modulation
density used in the electrochemical etching process. It was frequency for p-PSi and n-PSi samples are presented in
also observed that for the same current density, p-type Si Fig. 5. Since the measurements were carried out in the
substrates produced higher porosity than the n-type frequency range of 30–100 Hz, the PA phase was indepen-
dent of the thickness of the porous layer due to the shorter
thermal diffusion length phenomenon. This has been
80
confirmed by the (Ihn)1/2 plot as a function of photon
76 energy as shown in Fig. 2(b), where at a chopping
frequency 433 Hz the excitation beam was totally on the
72
p-PSi porous layer. Thus, it is confirmed that the PA technique
68 has an advantage compared with the convention optical
Porosity (%)
Fig. 4. Typical scanning electron micrographs (SEM) at magnification of 2000 for (a) p-PSi (J ¼ 33.96 mA/cm2), (b) p-PSi (J ¼ 22.64 mA/cm2) and
(c) n-PSi (J ¼ 22.64 mA/cm2), and typical EDX spectra for: (d) Si substrate, (e) p-PSi and (f) n-PSi samples with J ¼ 28.29 mA/cm2.
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C.K. Sheng et al. / Physica B 403 (2008) 2634–2638 2637
1.05 1.00
39.62 mA/cm2 39.62 mA/cm2
1.00 33.96 mA/cm2 0.96
33.96 mA/cm2
28.29 mA/cm2 28.29 mA/cm2
Phase (Rad.)
Phase (Rad.)
0.95 22.64 mA/cm2 0.92
22.64 mA/cm2
16.98 mA/cm2 16.98 mA/cm2
0.90 0.88
0.85 0.84
0.80 0.80
0.75 0.76
20 40 60 80 100 120 20 40 60 80 100 120
Modulation Frequency (Hz) Frequency (Hz)
Fig. 5. PA phase signal versus modulation frequency for (a) p-PSi and (b) n-PSi samples prepared at five different anodization current densities. The solid
lines represent the theoretical curves.
4.2 370 90
4. Discussion 5. Conclusion
The reduction of thermal diffusivity and diffusion The PA technique has been used to investigate the thermal
coefficient may be due to the thermal insulating effect of and carrier transport properties of PSi prepared on p-type
the PSi layer. This behavior may come from the presence of and n-type Si substrates within the porosity range of 50–76%.
air inside the micropores. The sponge-like spherical or The study shows that the thermal diffusivity and diffusion
columnar morphology of micropores may also reduce the coefficient decrease uniformly; the recombination process was
thermal transport and carrier diffusion process [11]. The enhanced with higher surface recombination velocity and
consistent reduction of thermal diffusivity and diffusion shorter recombination lifetime with the increase of sample
coefficient values against sample porosity could also be due porosity. The measured thermal diffusivity and diffusion
to the enhancement of air and oxygen molecules impreg- coefficient values of p-PSi samples were much lower than that
nated inside the enlarged micropores that possess higher of n-PSi samples, this may be due to the thermal insulation of
thermal resistance as compared to the Si substrate. air and oxygen molecules impregnated inside the enlarged
Low thermal transport feature of PSi allows this material micropores of p-PSi. However, the p-PSi shows a faster
to be used as a new Si-based thermal insulator, which is recombination rate when compared to n-PSi as indicated by a
compatible with the recent semiconductor technology as reduction of recombination lifetime and the increase of
suggested by Bernini [11]. On the other hand, reducing air surface recombination velocity. For the same porosity value,
and oxygen impregnated inside the smaller micropores at the energy band-gap values for p-PSi are always higher than
lower porosity decreases the thermal diffusivity and the energy-gap values obtained for the n-PSi layer.
diffusion coefficient. This explains that the thermal
diffusivity and diffusion coefficient values of p-PSi samples
Acknowledgments
are lower than n-PSi samples in the porosity ranging from
50% to 76%. The rise of recombination lifetime as
The financial support by the Malaysian Government
compared to Si substrate indicates that a slower recombi-
through IRPA and NSF funding are acknowledged. The
nation process occurred in the p-PSi sample. This could be
authors would also like to acknowledge the Department of
due to the formation of a spherical crystallite boundary
Physics, Universiti Putra Malaysia, for providing the research
surrounding the micropores, which also lead to the facilities for this research to be carried out successfully.
widening of the band gap. Typical carrier recombination
lifetimes of PSi were estimated in the order of 10–100 ms, as
reported by Bernini [11]. The increase in the surface References
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