Professional Documents
Culture Documents
&
Evaluation
WLBG-MPBQA/Jeffrey Chen
Purpose
Page:2 Confidential
Thinking of Dye Penetration
Page:3 Confidential
Dye Penetration Testing
Purpose:
To identify solder joints that have cracked during reliability
testing or field exposure.
Method:
Red die is allowed to wet into the cracks and then dry. The
stained areas indicate cracks that existed prior to component
removal.
Advantage:
The distribution of opens can be found for the entire package
in less time than is required to cross-section all rows of
solder joints.
Page:4 Confidential
Thermal Cycled BGA Joints
Page:5 Confidential
Thermal Cycled BGA Joints
Page:6 Confidential
Dye Penetration Test – Method
Page:7 Confidential
Dye Penetration Test - Method
Page:8 Confidential
Part Removal for Inspection
BGAs
BGAs are pried off the PWB using a screwdriver to reveal red
fracture surfaces which cracked prior to prying.
CSPs
CSPs have a relatively thin and fragile substrate and cannot be pried
off the PWB but rather the PWB section must be twisted in
alternating directions until the CSP can be removed with light
pulling.
Page:9 Confidential
Evaluation results
Page:10 Confidential
Sample-1
Page:11 Confidential
Sample- 2
Page:12 Confidential
Conclusion
Page:13 Confidential