USB 2.

0
USB 2.0 Design Guide

Solid State System Co., LTD.



USB

Differential Impedance

Differential Impedance

EMI20H

USB Cable

Cable


VCC
Tx

Unbalance Mode
Common Mode
Single Ended

VCC
Rx

Balance Mode
Differential

VCC

VCC

Tx+

Rx+

Tx-

Rx-

USB

Low Speed
USB 1.0

1.5M BPS

73 ~ 300 ns

2V

Differential

Full Speed
USB 1.1

12M BPS

4 ~ 20 ns

2V

Differential

High Speed
USB 2.0

480M BPS

0.5 ns

400mV

45

Differential

1. 100MHz Ohms Law

2. 200MHz Micro Strip/Strip Line

3. 800MHz

4. USB 2.0 480M BPSHighLow

240MHz

NRZI Coding
RZReturn to Zero
1

NRZINone Return to Zero Inversed

1

NRZI

0
1

Micro Strip/Strip Line

Trace

D+

D-

D+
D-

Plan

Plan

RLC

Return Loss
Z1

Z2

Z1 = Z2

Return Loss= = PIncident / PReflection

20 log

Z1 + Z2
Z1 Z2

Micro Strip/Strip Line

Micro Strip
D+
w

Strip Line
D-

D+
h

D-

t
w

sTrace Space
wTrace Width
tTrace Thickness
hDistance Between Signal and Copper Plan
bThickness of PCB Laminate or Substrate
rDielectric Constant

h
b

Micro Strip Differential Impedance

Single Line Trace Impedance
Z0 = 60/(0.475r+0.67)1/2 ln[4h/0.67/(0.8w+t)]

Z0 = 87/(r+1.41)1/2 ln[5.98h/(0.8w+t)]
1 < r < 15 and 0.1 < h/w < 2.0
Signal Pair Differential Impedance
Zdiff = 2Z0(1-0.48e-0.96 s/h)

rmm

Strip Line Differential Impedance

Single Line Trace Impedance
Z0 = 60/r1/2 ln[4b/0.67//(0.8w + t)]

Z0 = 60/r1/2 ln[1.9b/(0.8w + t)]

w/h < 0.35 and t/h < 0.25
Signal Pair Differential Impedance
Zdiff = 2Z0(1-0.347e-2.9 s/h)

rmm

Micro Strip 1.6mm

Z0

Zdiff

4.5

0.184mm

0.184mm

0.035mm

0.11mm

46

82

4.5

0.4mm

0.4mm

0.04mm

0.3mm

57

106

4.5

0.7mm

0.3mm

0.04mm

0.3mm

39

63

1.
USB 2.0 80 ~ 100
2.
82Trace
90

 D+ D-

D+

D+

D-

D-

Stub

39

D+
D-

39

D+
39

D-

39

Pad


PCB

VCC1
DGND

D+

D+

D-

D-

VCC2
AGND

PCB
D+ DDGND

AGND

VCC1

VCC2


D+ / D-

D+ / D-

Through Hole

USB 2.0
Low Speed/Non-Periodic Signal

20mil
GND

SignalTop Side
D+
D7.5mil 7.5mil 7.5mil

High Speed / Periodic SignalClock

1 ounce0.035mm
50mil
4.5mil

PrepregFR4 r = 4.5

Substrate or Laminate

63mil1.6mm

53mil

Vcc
PrepregFR4 r = 4.5

4.5mil

SignalBottom Side

1 mil = 1/1000 inch = 0.0254mm

Intel 1.6mm

1. 5%

2.
X7RY5V Z5U

NPO

XIN

C1

R1

XOUT

Y1

R2

C2

1. SMD
Crystal

2.

3. 8mil ~ 12 mil
5mil PCMCIA
30%

4.

MLCC

NPOC0G

X7R

Y5V

Z5U

0.25% ~ 10%

5% ~ 20%

20%
-20% ~ +80%

20%
-20% ~ +80%

-55 ~ +125

-55 ~ +125

-30 ~ +85

+10 ~ +85

30ppm ~ 0.5pF

15%

+22% ~ -82%

+22% ~ -56%

2.5%

7.5%

20%

20%

X-55
Y-30
Z+10

4+65
5+85
6+105
7+125
8+150

A0.1%
B1.5%
C2.2%
D3.3%
E4.7%
F7.5%
P10%
R15%
S22%
T+22%~33%
U+22%~-56%
V+22%~-82%

Bypass Capacitor
IC
VCC

VCC

IC
VCC

VC

VCC

0.1uF

0.1uF

GND
GND

1. Bypass Capacitor IC
2. IC

ESD

ESD

LED

2%

0.5mm ComponentTraceCopper Plan

Pad

TSOP 48
WSOP 48

TSOP 48
WSOP 48

TSOP 48
WSOP 48

20H

EMI
20h
h

Vcc
GND

20h
D+

D-

VccGND
Prepreg

USB
Pin 1 VBUS
Pin 2 DPin 3 D+
Pin 4 GND

PVC

65%
PE

DVBUS

GND

D+

28 AWG 20 AWG

Drain WireLow
Speed/USB 1.0/1.5M bps

PE

Cable
























VBUS GND 28 28 AWG

D+ D- 28 28 AWG
60mm 80mmUSB 1.0 Low Speed 1.5M bps USB 1.1 Full Speed 12M bps
VBUSGND 125mV
Differential Impedance 90 +/- 15%
Delay 5.2ns/mTotal Delay 26ns
65%
Shielding Resistance 0.6 ASDM-D-4566
DCR 5%
USB 2.0 7.1.17 Cable Attenuation Table 7-6
0 50 -20 +60 +20
UL 94V-0
USB 2.0 6.7 Electrical, Mechanical, and Environmental Compliance
Standards, Table 6-7
USB 1.0 Low Speed 1.5M bps USB 1.1 Full Speed 12M bps D+ D-
Drain Wire

USB 2.0 Cable Attenuation

Frequency

Maximum Attenuation

64KHz

0.08dB

256KHz

0.11dB

512KHz

0.13dB

772KHz

0.15dB

1MHz

0.20dB

4MHz

0.39dB

8MHz

0.57dB

12MHz

0.67dB

24MHz

0.95dB

48MHz

1.35dB

96MHz

1.90dB

200MHz

3.20dB

400MHz

5.80dB

ASTM-D-4566
AWG

/100 m

28

23.20

26

14.60

24

9.09

22

5.74

20

3.58

Cable Delay
USB 2.0 Maximum One-Way Signal Propagation Delay
30ns
Cable Delay< 5.2ns/m
Total Cable Delay< 26ns

Host Delay
< 3ns

Device Delay
< 1ns Max.

Shielding DC Resistance< 0.6

Layout