Virtex 2 Data Sheet

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Virtex-II Platform FPGAs: Complete Data Sheet

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DS031 October 14, 2003
Product Specification
This document includes all four modules of the Virtex-II Platform FPGA data sheet.
Module 1: Introduction and Overview

DS031-1 (v2.0) August 1, 2003 7 pages Summary of Features General Description Device/Package Combinations and Maximum I/O Ordering Information
Module 3: DC and Switching Characteristics

DS031-3 (v3.1) October 14, 2003 38 pages Electrical Characteristics Performance Characteristics Switching Characteristics Pin-to-Pin Output Parameter Guidelines Pin-to-Pin Input Parameter Guidelines DCM Timing Parameters
Module 2: Functional Description

DS031-2 (v3.1) October 14, 2003 40 pages Detailed Description Digitally Controlled Impedance (DCI) Configurable Logic Blocks (CLBs) Sum of Products 3-State Buffers 18-Kb Block SelectRAM Resources 18-Bit x 18-Bit Multipliers Global Clock Multiplexer Buffers Digital Clock Manager (DCM) Active Interconnect Technology Creating a Design Configuration
Module 4: Pinout Information

DS031-4 (v2.0) August 1, 2003 225 pages Pin Definitions Pinout Tables - CS144 Chip-Scale BGA Package - FG256 Fine-Pitch BGA Package - FG456 Fine-Pitch BGA Package - FG676 Fine-Pitch BGA Package - BG575 Standard BGA Package - BG728 Standard BGA Package - FF896 Flip-Chip Fine-Pitch BGA Package - FF1152 Flip-Chip Fine-Pitch BGA Package - FF1517 Flip-Chip Fine-Pitch BGA Package - BF957Flip-Chip BGA Package
IMPORTANT NOTE: The Virtex-II Platform FPGA data sheet is created and published in separate modules. This complete version is provided for easy downloading and searching of the complete document. Page, figure, and table numbers begin at 1 for each module, and each module has its own Revision History at the end. Use the PDF "Bookmarks" pane for easy navigation in this volume.
2003 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS031 October 14, 2003 Product Specification
www.xilinx.com 1-800-255-7778
Virtex-II Platform FPGAs: Introduction and Overview

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DS031-1 (v2.0) August 1, 2003
Summary of Virtex-II Features

Industry First Platform FPGA Solution IP-Immersion Architecture - Densities from 40K to 8M system gates - 420 MHz internal clock speed (Advance Data) - 840+ Mb/s I/O (Advance Data) SelectRAM Memory Hierarchy - 3 Mb of dual-port RAM in 18 Kbit block SelectRAM resources - Up to 1.5 Mb of distributed SelectRAM resources High-Performance Interfaces to External Memory - DRAM interfaces SDR / DDR SDRAM Network FCRAM Reduced Latency DRAM - SRAM interfaces SDR / DDR SRAM QDR SRAM - CAM interfaces Arithmetic Functions - Dedicated 18-bit x 18-bit multiplier blocks - Fast look-ahead carry logic chains Flexible Logic Resources - Up to 93,184 internal registers / latches with Clock Enable - Up to 93,184 look-up tables (LUTs) or cascadable 16-bit shift registers - Wide multiplexers and wide-input function support - Horizontal cascade chain and sum-of-products support - Internal 3-state bussing High-Performance Clock Management Circuitry - Up to 12 DCM (Digital Clock Manager) modules Precise clock de-skew Flexible frequency synthesis High-resolution phase shifting - 16 global clock multiplexer buffers Active Interconnect Technology - Fourth generation segmented routing structure - Predictable, fast routing delay, independent of fanout SelectIO-Ultra Technology - Up to 1,108 user I/Os - 19 single-ended and six differential standards Programmable sink current (2 mA to 24 mA) per I/O Digitally Controlled Impedance (DCI) I/O: on-chip termination resistors for single-ended I/O standards - PCI-X compatible (133 MHz and 66 MHz) at 3.3V - PCI compliant (66 MHz and 33 MHz) at 3.3V - CardBus compliant (33 MHz) at 3.3V - Differential Signaling 840 Mb/s Low-Voltage Differential Signaling I/O (LVDS) with current mode drivers Bus LVDS I/O Lightning Data Transport (LDT) I/O with current driver buffers Low-Voltage Positive Emitter-Coupled Logic (LVPECL) I/O Built-in DDR input and output registers - Proprietary high-performance SelectLink Technology High-bandwidth data path Double Data Rate (DDR) link Web-based HDL generation methodology Supported by Xilinx Foundation and Alliance Series Development Systems - Integrated VHDL and Verilog design flows - Compilation of 10M system gates designs - Internet Team Design (ITD) tool SRAM-Based In-System Configuration - Fast SelectMAP configuration - Triple Data Encryption Standard (DES) security option (Bitstream Encryption) - IEEE 1532 support - Partial reconfiguration - Unlimited reprogrammability - Readback capability 0.15 m 8-Layer Metal Process with 0.12 m High-Speed Transistors 1.5V (VCCINT) Core Power Supply, Dedicated 3.3V VCCAUX Auxiliary and VCCO I/O Power Supplies IEEE 1149.1 Compatible Boundary-Scan Logic Support Flip-Chip and Wire-Bond Ball Grid Array (BGA) Packages in Three Standard Fine Pitches (0.80 mm, 1.00 mm, and 1.27 mm) 100% Factory Tested -
2001-2002 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS031-1 (v2.0) August 1, 2003 Product Specification
Module 1 of 4 1
Table 1: Virtex-II Field-Programmable Gate Array Family Members CLB (1 CLB = 4 slices = Max 128 bits) System Gates 40K 80K 250K 500K 1M 1.5M 2M 3M 4M 6M 8M Array Row x Col. 8x8 16 x 8 24 x 16 32 x 24 40 x 32 48 x 40 56 x 48 64 x 56 80 x 72 96 x 88 112 x 104 Maximum Distributed RAM Kbits 8 16 48 96 160 240 336 448 720 1,056 1,456 Multiplier Blocks 4 8 24 32 40 48 56 96 120 144 168 SelectRAM Blocks 18 Kbit Blocks 4 8 24 32 40 48 56 96 120 144 168 Max RAM (Kbits) 72 144 432 576 720 864 1,008 1,728 2,160 2,592 3,024 Max I/O Pads(1) 88 120 200 264 432 528 624 720 912 1,104 1,108
Device XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000
Slices 256 512 1,536 3,072 5,120 7,680 10,752 14,336 23,040 33,792 46,592
DCMs 4 4 8 8 8 8 8 12 12 12 12
Notes: 1. See details in Table 2, Maximum Number of User I/O Pads.
General Description
The Virtex-II family is a platform FPGA developed for high performance from low-density to high-density designs that are based on IP cores and customized modules. The family delivers complete solutions for telecommunication, wireless, networking, video, and DSP applications, including PCI, LVDS, and DDR interfaces. The leading-edge 0.15 m / 0.12 m CMOS 8-layer metal process and the Virtex-II architecture are optimized for high speed with low power consumption. Combining a wide variety of flexible features and a large range of densities up to 10 million system gates, the Virtex-II family enhances programmable logic design capabilities and is a powerful alternative to mask-programmed gates arrays. As shown in Table 1, the Virtex-II family comprises 11 members, ranging from 40K to 8M system gates. Table 2 shows the maximum number of user I/Os available. The Virtex-II device/package combination table (Table 6 at the end of this section) details the maximum number of I/Os for each device and package using wire-bond or flip-chip technology. Table 2: Maximum Number of User I/O Pads Device XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 Wire-Bond 88 120 200 264 328 392 516 Flip-Chip 432 528 624 720 912 1,104 1,108
Packaging
Offerings include ball grid array (BGA) packages with 0.80 mm, 1.00 mm, and 1.27 mm pitches. In addition to traditional wire-bond interconnects, flip-chip interconnect is used in some of the BGA offerings. The use of flip-chip interconnect offers more I/Os than is possible in wire-bond versions of the similar packages. Flip-chip construction offers the combination of high pin count with high thermal capacity.
Module 1 of 4 2
Architecture
Virtex-II Array Overview
Virtex-II devices are user-programmable gate arrays with various configurable elements. The Virtex-II architecture is optimized for high-density and high-performance logic designs. As shown in Figure 1, the programmable device is comprised of input/output blocks (IOBs) and internal configurable logic blocks (CLBs). Programmable I/O blocks provide the interface between package pins and the internal configurable logic. Most popular and leading-edge I/O standards are supported by the programmable IOBs.
DCM Global Clock Mux
DCM
IOB
Configurable Logic
Programmable I/Os CLB Block SelectRAM Multiplier

DS031_28_100900
Figure 1: Virtex-II Architecture Overview The internal configurable logic includes four major elements organized in a regular array. Configurable Logic Blocks (CLBs) provide functional elements for combinatorial and synchronous logic, including basic storage elements. BUFTs (3-state buffers) associated with each CLB element drive dedicated segmentable horizontal routing resources. Block SelectRAM memory modules provide large 18 Kbit storage elements of dual-port RAM. Multiplier blocks are 18-bit x 18-bit dedicated multipliers. DCM (Digital Clock Manager) blocks provide self-calibrating, fully digital solutions for clock distribution delay compensation, clock multiplication and division, coarse- and fine-grained clock phase shifting. cells. These values are loaded in the memory cells during configuration and can be reloaded to change the functions of the programmable elements.
Virtex-II Features
This section briefly describes Virtex-II features.
Input/Output Blocks (IOBs)

IOBs are programmable and can be categorized as follows: Input block with an optional single-data-rate or double-data-rate (DDR) register Output block with an optional single-data-rate or DDR register, and an optional 3-state buffer, to be driven directly or through a single or DDR register Bidirectional block (any combination of input and output configurations)
A new generation of programmable routing resources called Active Interconnect Technology interconnects all of these elements. The general routing matrix (GRM) is an array of routing switches. Each programmable element is tied to a switch matrix, allowing multiple connections to the general routing matrix. The overall programmable interconnection is hierarchical and designed to support high-speed designs. All programmable elements, including the routing resources, are controlled by values stored in static memory
These registers are either edge-triggered D-type flip-flops or level-sensitive latches. IOBs support the following single-ended I/O standards: LVTTL, LVCMOS (3.3V, 2.5V, 1.8V, and 1.5V) PCI-X compatible (133 MHz and 66 MHz) at 3.3V PCI compliant (66 MHz and 33 MHz) at 3.3V CardBus compliant (33 MHz) at 3.3V
Module 1 of 4 3
Virtex-II Platform FPGAs: Introduction and Overview A multiplier block is associated with each SelectRAM memory block. The multiplier block is a dedicated 18 x 18-bit multiplier and is optimized for operations based on the block SelectRAM content on one port. The 18 x 18 multiplier can be used independently of the block SelectRAM resource. Read/multiply/accumulate operations and DSP filter structures are extremely efficient. Both the SelectRAM memory and the multiplier resource are connected to four switch matrices to access the general routing resources.
GTL and GTLP HSTL (Class I, II, III, and IV) SSTL (3.3V and 2.5V, Class I and II) AGP-2X
The digitally controlled impedance (DCI) I/O feature automatically provides on-chip termination for each I/O element. The IOB elements also support the following differential signaling I/O standards: LVDS BLVDS (Bus LVDS) ULVDS LDT LVPECL
Global Clocking
The DCM and global clock multiplexer buffers provide a complete solution for designing high-speed clocking schemes. Up to 12 DCM blocks are available. To generate de-skewed internal or external clocks, each DCM can be used to eliminate clock distribution delay. The DCM also provides 90-, 180-, and 270-degree phase-shifted versions of its output clocks. Fine-grained phase shifting offers high-resolution phase adjustments in increments of 1/256 of the clock period. Very flexible frequency synthesis provides a clock output frequency equal to any M/D ratio of the input clock frequency, where M and D are two integers. For the exact timing parameters, see Virtex-II Electrical Characteristics. Virtex-II devices have 16 global clock MUX buffers, with up to eight clock nets per quadrant. Each global clock MUX buffer can select one of the two clock inputs and switch glitch-free from one clock to the other. Each DCM block is able to drive up to four of the 16 global clock MUX buffers.
Two adjacent pads are used for each differential pair. Two or four IOB blocks connect to one switch matrix to access the routing resources.
Configurable Logic Blocks (CLBs)

CLB resources include four slices and two 3-state buffers. Each slice is equivalent and contains: Two function generators (F & G) Two storage elements Arithmetic logic gates Large multiplexers Wide function capability Fast carry look-ahead chain Horizontal cascade chain (OR gate)
The function generators F & G are configurable as 4-input look-up tables (LUTs), as 16-bit shift registers, or as 16-bit distributed SelectRAM memory. In addition, the two storage elements are either edge-triggered D-type flip-flops or level-sensitive latches. Each CLB has internal fast interconnect and connects to a switch matrix to access general routing resources.
Routing Resources
The IOB, CLB, block SelectRAM, multiplier, and DCM elements all use the same interconnect scheme and the same access to the global routing matrix. Timing models are shared, greatly improving the predictability of the performance of high-speed designs. There are a total of 16 global clock lines, with eight available per quadrant. In addition, 24 vertical and horizontal long lines per row or column as well as massive secondary and local routing resources provide fast interconnect. Virtex-II buffered interconnects are relatively unaffected by net fanout and the interconnect layout is designed to minimize crosstalk. Horizontal and vertical routing resources for each row or column include: 24 long lines 120 hex lines 40 double lines 16 direct connect lines (total in all four directions)
Block SelectRAM Memory

The block SelectRAM memory resources are 18 Kb of dual-port RAM, programmable from 16K x 1 bit to 512 x 36 bits, in various depth and width configurations. Each port is totally synchronous and independent, offering three "read-during-write" modes. Block SelectRAM memory is cascadable to implement large embedded storage blocks. Supported memory configurations for dual-port and single-port modes are shown in Table 3. Table 3: Dual-Port And Single-Port Configurations 16K x 1 bit 8K x 2 bits 4K x 4 bits 2K x 9 bits 1K x 18 bits 512 x 36 bits
Module 1 of 4 4
Boundary Scan
Boundary scan instructions and associated data registers support a standard methodology for accessing and configuring Virtex-II devices that complies with IEEE standards 1149.1 1993 and 1532. A system mode and a test mode are implemented. In system mode, a Virtex-II device performs its intended mission even while executing non-test boundary-scan instructions. In test mode, boundary-scan test instructions control the I/O pins for testing purposes. The Virtex-II Test Access Port (TAP) supports BYPASS, PRELOAD, SAMPLE, IDCODE, and USERCODE non-test instructions. The EXTEST, INTEST, and HIGHZ test instructions are also supported.
Readback and Integrated Logic Analyzer

Configuration data stored in Virtex-II configuration memory can be read back for verification. Along with the configuration data, the contents of all flip-flops/latches, distributed SelectRAM, and block SelectRAM memory resources can be read back. This capability is useful for real-time debugging. The Integrated Logic Analyzer (ILA) core and software provides a complete solution for accessing and verifying Virtex-II devices.
Virtex-II Device/Package Combinations and Maximum I/O

Wire-bond and flip-chip packages are available. Table 4 and Table 5 show the maximum possible number of user I/Os in wire-bond and flip-chip packages, respectively. Table 6 shows the number of available user I/Os for all device/package combinations. CS denotes wire-bond chip-scale ball grid array (BGA) (0.80 mm pitch). FG denotes wire-bond fine-pitch BGA (1.00 mm pitch). FF denotes flip-chip fine-pitch BGA (1.00 mm pitch). BG denotes standard BGA (1.27 mm pitch). BF denotes flip-chip BGA (1.27 mm pitch).
Configuration
Virtex-II devices are configured by loading data into internal configuration memory, using the following five modes: Slave-serial mode Master-serial mode Slave SelectMAP mode Master SelectMAP mode Boundary-Scan mode (IEEE 1532)
A Data Encryption Standard (DES) decryptor is available on-chip to secure the bitstreams. One or two triple-DES key sets can be used to optionally encrypt the configuration information.
The number of I/Os per package include all user I/Os except the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, and RSVD) and VBATT.
Table 4: Wire-Bond Packages Information Package Pitch (mm) Size (mm) I/Os CS144 0.80 12 x 12 92 FG256 1.00 17 x 17 172 FG456 1.00 23 x 23 324 FG676 1.00 27 x 27 484 BG575 1.27 31 x 31 408 BG728 1.27 35 x 35 516
Table 5: Flip-Chip Packages Information Package Pitch (mm) Size (mm) I/Os FF896 1.00 31 x 31 624 FF1152 1.00 35 x 35 824 FF1517 1.00 40 x 40 1,108 BF957 1.27 40 x 40 684
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Table 6: Virtex-II Device/Package Combinations and Maximum Number of Available I/Os (Advance Information) Available I/Os Package CS144 FG256 FG456 FG676 FF896 FF1152 FF1517 BG575 BG728 BF957 XC2V 40 88 88 XC2V 80 92 120 XC2V 250 92 172 200 XC2V 500 172 264 XC2V 1000 172 324 432 328 XC2V 1500 392 528 392 XC2V 2000 456 624 408 624 XC2V 3000 484 720 516 684 XC2V 4000 824 912 684 XC2V 6000 824 1,104 684 XC2V 8000 824 1,108 -
Notes: 1. All devices in a particular package are pinout (footprint) compatible. In addition, the FG456 and FG676 packages are compatible, as are the FF896 and FF1152 packages.
Virtex-II Ordering Information

Example: XC2V1000-5FG456C
Device Type Temperature Range C = Commercial (Tj = 0C to +85C) I = Industrial (Tj = 40C to +100C) Number of Pins Package Type
DS031_35_033001
Speed Grade (-4, -5, -6)
Figure 2: Virtex-II Ordering Information
Module 1 of 4 6
Revision History
This section records the change history for this module of the data sheet. Date 11/07/00 12/06/00 01/15/01 01/25/01 04/02/01 07/30/01 10/02/01 07/16/02 09/26/02 08/01/03 Version 1.0 1.1 1.2 1.3 1.5 1.6 1.7 1.8 1.9 2.0 Early access draft. Initial release. Added values to the tables in the Virtex-II Performance Characteristics and Virtex-II Switching Characteristics sections. The data sheet was divided into four modules (per the current style standard). Skipped v1.4 to sync up modules. Reverted to traditional double-column format. Made minor changes to items listed under Summary of Virtex-II Features. Minor edits. Updated Virtex-II Device/Package Combinations shown in Table 6. Updated Table 2 and Table 6 to reflect supported Virtex-II Device/Package Combinations. All Virtex-II devices and speed grades now Production. See Table 13, Module 3. Revision
Virtex-II Data Sheet

The Virtex-II Data Sheet contains the following modules: Virtex-II Platform FPGAs: Introduction and Overview (Module 1) Virtex-II Platform FPGAs: Detailed Description (Module 2) Virtex-II Platform FPGAs: DC and Switching Characteristics (Module 3) Virtex-II Platform FPGAs: Pinout Information (Module 4)
Module 1 of 4 7
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Virtex-II Platform FPGAs: Detailed Description

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DS031-2 (v3.1) October 14, 2003
Detailed Description
Input/Output Blocks (IOBs)
Virtex-II I/O blocks (IOBs) are provided in groups of two or four on the perimeter of each device. Each IOB can be used as input and/or output for single-ended I/Os. Two IOBs can be used as a differential pair. A differential pair is always connected to the same switch matrix, as shown in Figure 1. IOB blocks are designed for high performances I/Os, supporting 19 single-ended standards, as well as differential signaling with LVDS, LDT, Bus LVDS, and LVPECL. Table 1: Supported Single-Ended I/O Standards
I/O Standard LVTTL LVCMOS33 LVCMOS25 LVCMOS18 LVCMOS15
IOB PAD4 Differential Pair IOB PAD3 Switch Matrix IOB PAD2 Differential Pair IOB PAD1
DS031_30_101600
Output VCCO 3.3 3.3 2.5 1.8 1.5 3.3 3.3 3.3 Note (1) Note (1) 1.5 1.5 1.5 1.5 1.8 1.8 1.8 1.8 1.8 1.8 2.5 2.5 3.3 3.3 3.3
Input VCCO 3.3 3.3 2.5 1.8 1.5 3.3 3.3 3.3 Note (1) Note (1) N/R N/R N/R N/R N/R N/R N/R N/R N/R N/R N/R N/R N/R N/R N/R
Input VREF N/R (3) N/R N/R N/R N/R N/R N/R N/R 0.8 1.0 0.75 0.75 0.9 0.9 0.9 0.9 1.1 1.1 0.9 0.9 1.25 1.25 1.5 1.5 1.32
Board Termination Voltage (VTT) N/R N/R N/R N/R N/R N/R N/R N/R 1.2 1.5 0.75 0.75 1.5 1.5 0.9 0.9 1.8 1.8 0.9 0.9 1.25 1.25 1.5 1.5 N/R
PCI33_3 PCI66_3 PCI-X GTL GTLP HSTL_I HSTL_II HSTL_III HSTL_IV HSTL_I_18 HSTL_II_18 HSTL_III _18 HSTL_IV_18 SSTL18_I (2) SSTL18_II SSTL2_I SSTL2_II SSTL3_I SSTL3_II AGP-2X/AGP
Figure 1: Virtex-II Input/Output Tile

Note: Differential I/Os must use the same clock.
Supported I/O Standards

Virtex-II IOB blocks feature SelectI/O-Ultra inputs and outputs that support a wide variety of I/O signaling standards. In addition to the internal supply voltage (VCCINT = 1.5V), output driver supply voltage (VCCO) is dependent on the I/O standard (see Table 1). An auxiliary supply voltage (VCCAUX = 3.3 V) is required, regardless of the I/O standard used. For exact supply voltage absolute maximum ratings, see DC Input and Output Levels in Module 3.
Notes: 1. VCCO of GTL or GTLP should not be lower than the termination voltage or the voltage seen at the I/O pad. 2. SSTL18_I is not a JEDEC-supported standard. 3. N/R = no requirement.
DS031-2 (v3.1) October 14, 2003 Product Specification
Module 2 of 4 1
Table 2: Supported Differential Signal I/O Standards

I/O Standard LVPECL_33 LDT_25 LVDS_33 LVDS_25 LVDSEXT_33 LVDSEXT_25 BLVDS_25 ULVDS_25 Output VCCO 3.3 2.5 3.3 2.5 3.3 2.5 2.5 2.5 Input VCCO N/R (1) N/R N/R N/R N/R N/R N/R N/R Input VREF N/R N/R N/R N/R N/R N/R N/R N/R Output VOD 490 mV to 1.22V 0.430 - 0.670 0.250 - 0.400 0.250 - 0.400 0.330 - 0.700 0.330 - 0.700 0.250 - 0.450 0.430 - 0.670
Table 3: Supported DCI I/O Standards

I/O Standard LVDCI_33 (1) LVDCI_DV2_33 (1) LVDCI_25 (1) LVDCI_DV2_25 (1) LVDCI_18 (1) LVDCI_DV2_18 (1) LVDCI_15 (1) LVDCI_DV2_15 (1) GTL_DCI GTLP_DCI HSTL_I_DCI HSTL_II_DCI Output VCCO 3.3 3.3 2.5 2.5 1.8 1.8 1.5 1.5 1.2 1.5 1.5 1.5 1.5 1.5 1.8 1.8 1.8 1.8 1.8 1.8 2.5 2.5 3.3 3.3 3.3 2.5 3.3 2.5 Input VCCO 3.3 3.3 2.5 2.5 1.8 1.8 1.5 1.5 1.2 1.5 1.5 1.5 1.5 1.5 1.8 1.8 1.8 1.8 1.8 1.8 2.5 2.5 3.3 3.3 3.3 2.5 3.3 2.5 Input VREF N/R (4) N/R N/R N/R N/R N/R N/R N/R 0.8 1.0 0.75 0.75 0.9 0.9 0.9 0.9 1.1 1.1 0.9 0.9 1.25 1.25 1.5 1.5 N/R N/R N/R N/R Termination Type Series Series Series Series Series Series Series Series Single Single Split Split Single Single Split Split Single Single Split Split Split Split Split Split Split Split Split Split
Notes: 1. N/R = no requirement.
All of the user IOBs have fixed-clamp diodes to VCCO and to ground. As outputs, these IOBs are not compatible or compliant with 5V I/O standards. As inputs, these IOBs are not normally 5V tolerant, but can be used with 5V I/O standards when external current-limiting resistors are used. For more details, see the 5V Tolerant I/Os Tech Topic at www.xilinx.com. Table 3 lists supported I/O standards with Digitally Controlled Impedance. See Digitally Controlled Impedance (DCI), page 8.
HSTL_III_DCI HSTL_IV_DCI HSTL_I_DCI_18 HSTL_II_DCI_18 HSTL_III_DCI_18 HSTL_IV_DCI_18 SSTL18_I_DCI (3) SSTL18_II_DCI SSTL2_I_DCI (2) SSTL2_II_DCI (2) SSTL3_I_DCI (2) SSTL3_II_DCI (2) LVDS_33_DCI LVDS_25_DCI LVDSEXT_33_DCI LVDSEXT_25_DCI
Notes: 1. LVDCI_XX and LVDCI_DV2_XX are LVCMOS controlled impedance buffers, matching the reference resistors or half of the reference resistors. 2. These are SSTL compatible. 3. SSTL18_I is not a JEDEC-supported standard. 4. N/R = no requirement.
Module 2 of 4 2
Logic Resources
IOB blocks include six storage elements, as shown in Figure 2. Each storage element can be configured either as an edge-triggered D-type flip-flop or as a level-sensitive latch. On the input, output, and 3-state path, one or two DDR registers can be used. Double data rate is directly accomplished by the two registers on each path, clocked by the rising edges (or falling edges) from two different clock nets. The two clock signals are generated by the DCM and must be 180 degrees out of phase, as shown in Figure 3. There are two input, output, and 3-state data signals, each being alternately clocked out.
Reg OCK1 Reg ICK1 Reg OCK2 3-State Reg ICK2 DDR mux Reg OCK1 PAD Reg OCK2 Output IOB DDR mux Input
DS031_29_100900
Figure 2: Virtex-II IOB Block
DCM 180 0 FDDR D1 Q1 CLOCK CLK1 D1 Q1 CLK1 FDDR
DDR MUX
DDR MUX
D2 Q2 CLK2
D2 Q2 CLK2
(50/50 duty cycle clock)
DS031_26_100900
Figure 3: Double Data Rate Registers For each storage element, the SRHIGH, SRLOW, INIT0, and INIT1 attributes are independent. Synchronous or asynchronous set / reset is consistent in an IOB block. All the control signals have independent polarity. Any inverter placed on a control input is automatically absorbed. Each register or latch (independent of all other registers or latches) (see Figure 4) can be configured as follows: No set or reset Synchronous set Synchronous reset Synchronous set and reset Asynchronous set (preset) Asynchronous reset (clear) Asynchronous set and reset (preset and clear)
The synchronous reset overrides a set, and an asynchronous clear overrides a preset.
Module 2 of 4 3
(O/T) 1 Attribute INIT1 INIT0 SRHIGH SRLOW
FF LATCH (O/T) CE (O/T) CLK1 SR Shared by all registers REV FF LATCH D2 Q2 D1 Q1
CE CK1 SR REV FF1 DDR MUX FF2 (OQ or TQ)
(O/T) CLK2
CE CK2 SR REV
Attribute INIT1 INIT0 SRHIGH SRLOW
(O/T) 2
Reset Type SYNC ASYNC

DS031_25_110300
Figure 4: Register / Latch Configuration in an IOB Block
Input/Output Individual Options

Each device pad has optional pull-up and pull-down in all SelectI/O-Ultra configurations. Each device pad has optional weak-keeper in LVTTL, LVCMOS, and PCI SelectI/O-Ultra configurations, as illustrated in Figure 5.
VCCO OBUF Clamp Diode
Values of the optional pull-up and pull-down resistors are in the range 10 - 60 K, which is the specification for VCCO when operating at 3.3V (from 3.0 to 3.6V only). The clamp diode is always present, even when power is not.
VCCO Program Current 10-60K
Weak Keeper
PAD VCCO 10-60K VCCAUX = 3.3V VCCINT = 1.5V IBUF

DS031_23_011601
Program Delay
Figure 5: LVTTL, LVCMOS or PCI SelectI/O-Ultra Standards The optional weak-keeper circuit is connected to each user I/O pad. When selected, the circuit monitors the voltage on the pad and weakly drives the pin High or Low. If the pin is connected to a multiple-source signal, the weak-keeper
Module 2 of 4 4
Virtex-II Platform FPGAs: Detailed Description LVTTL sinks and sources current up to 24 mA. The current is programmable for LVTTL and LVCMOS SelectI/O-Ultra standards (see Table 4). Drive-strength and slew-rate controls for each output driver, minimize bus transients. For LVDCI and LVDCI_DV2 standards, drive strength and slew-rate controls are not available.
holds the signal in its last state if all drivers are disabled. Maintaining a valid logic level in this way eliminates bus chatter. An enabled pull-up or pull-down overrides the weak-keeper circuit.
Table 4: LVTTL and LVCMOS Programmable Currents (Sink and Source) SelectI/O-Ultra LVTTL LVCMOS33 LVCMOS25 LVCMOS18 LVCMOS15 2 mA 2 mA 2 mA 2 mA 2 mA Programmable Current (Worst-Case Guaranteed Minimum) 4 mA 4 mA 4 mA 4 mA 4 mA 6 mA 6 mA 6 mA 6 mA 6 mA 8 mA 8 mA 8 mA 8 mA 8 mA 12 mA 12 mA 12 mA 12 mA 12 mA 16 mA 16 mA 16 mA 16 mA 16 mA 24 mA 24 mA 24 mA n/a n/a
Figure 6 shows the SSTL2, SSTL3, and HSTL configurations. HSTL can sink current up to 48 mA. (HSTL IV)
VCCO OBUF Clamp Diode
Input Path
The Virtex-II IOB input path routes input signals directly to internal logic and / or through an optional input flip-flop or latch, or through the DDR input registers. An optional delay element at the D-input of the storage element eliminates pad-to-pad hold time. The delay is matched to the internal clock-distribution delay of the Virtex-II device, and when used, assures that the pad-to-pad hold time is zero. Each input buffer can be configured to conform to any of the low-voltage signaling standards supported. In some of these standards the input buffer utilizes a user-supplied threshold voltage, VREF. The need to supply VREF imposes constraints on which standards can be used in the same bank. See I/O banking description.
PAD
Output Path
VREF VCCAUX = 3.3V VCCINT = 1.5V
DS031_24_100900
Figure 6: SSTL or HSTL SelectI/O-Ultra Standards All pads are protected against damage from electrostatic discharge (ESD) and from over-voltage transients. Virtex-II uses two memory cells to control the configuration of an I/O as an input. This is to reduce the probability of an I/O configured as an input from flipping to an output when subjected to a single event upset (SEU) in space applications. Prior to configuration, all outputs not involved in configuration are forced into their high-impedance state. The pull-down resistors and the weak-keeper circuits are inactive. The dedicated pin HSWAP_EN controls the pull-up resistors prior to configuration. By default, HSWAP_EN is set high, which disables the pull-up resistors on user I/O pins. When HSWAP_EN is set low, the pull-up resistors are activated on user I/O pins. All Virtex-II IOBs support IEEE 1149.1 compatible boundary scan testing.
The output path includes a 3-state output buffer that drives the output signal onto the pad. The output and / or the 3-state signal can be routed to the buffer directly from the internal logic or through an output / 3-state flip-flop or latch, or through the DDR output / 3-state registers. Each output driver can be individually programmed for a wide range of low-voltage signaling standards. In most signaling standards, the output High voltage depends on an externally supplied VCCO voltage. The need to supply VCCO imposes constraints on which standards can be used in the same bank. See I/O banking description.
I/O Banking
Some of the I/O standards described above require VCCO and VREF voltages. These voltages are externally supplied and connected to device pins that serve groups of IOB blocks, called banks. Consequently, restrictions exist about which I/O standards can be combined within a given bank. Eight I/O banks result from dividing each edge of the FPGA into two banks, as shown in Figure 7 and Figure 8. Each bank has multiple VCCO pins, all of which must be con-
Module 2 of 4 5
Virtex-II Platform FPGAs: Detailed Description All VREF pins for the largest device anticipated must be connected to the VREF voltage and not used for I/O. In smaller devices, some VCCO pins used in larger devices do not connect within the package. These unconnected pins can be left unconnected externally, or, if necessary, they can be connected to VCCO to permit migration to a larger device.
nected to the same voltage. This voltage is determined by the output standards in use.
Bank 0 Bank 7
Bank 1 Bank 2
Rules for Combining I/O Standards in the Same Bank

The following rules must be obeyed to combine different input, output, and bi-directional standards in the same bank: 1. Combining output standards only. Output standards with the same output VCCO requirement can be combined in the same bank.
Compatible example: SSTL2_I and LVDS_25_DCI outputs Incompatible example: SSTL2_I (output VCCO = 2.5V) and LVCMOS33 (output VCCO = 3.3V) outputs
Bank 6
Bank 5
Bank 4
ug002_c2_014_112900
Figure 7: Virtex-II I/O Banks: Top View for Wire-Bond Packages (CS, FG, & BG) Some input standards require a user-supplied threshold voltage (VREF), and certain user-I/O pins are automatically configured as VREF inputs. Approximately one in six of the I/O pins in the bank assume this role.
Bank 3
2. Combining input standards only. Input standards with the same input VCCO and input VREF requirements can be combined in the same bank.
Compatible example: LVCMOS15 and HSTL_IV inputs Incompatible example: LVCMOS15 (input VCCO = 1.5V) and LVCMOS18 (input VCCO = 1.8V) inputs Incompatible example: HSTL_I_DCI_18 (VREF = 0.9V) and HSTL_IV_DCI_18 (VREF = 1.1V) inputs
Bank 1 Bank 2
Bank 0 Bank 7
Bank 3
Bank 6
3. Combining input standards and output standards. Input standards and output standards with the same input VCCO and output VCCO requirement can be combined in the same bank.
Compatible example: LVDS_25 output and HSTL_I input Incompatible example: LVDS_25 output (output VCCO = 2.5V) and HSTL_I_DCI_18 input (input VCCO = 1.8V)
Bank 4
Bank 5
ds031_66_112900
Figure 8: Virtex-II I/O Banks: Top View for Flip-Chip Packages (FF & BF) VREF pins within a bank are interconnected internally, and consequently only one VREF voltage can be used within each bank. However, for correct operation, all VREF pins in the bank must be connected to the external reference voltage source. The VCCO and the VREF pins for each bank appear in the device pinout tables. Within a given package, the number of VREF and VCCO pins can vary depending on the size of device. In larger devices, more I/O pins convert to VREF pins. Since these are always a superset of the VREF pins used for smaller devices, it is possible to design a PCB that permits migration to a larger device if necessary.
4. Combining bi-directional standards with input or output standards. When combining bi-directional I/O with other standards, make sure the bi-directional standard can meet rules 1 through 3 above. 5. Additional rules for combining DCI I/O standards. a. No more than one Single Termination type (input or output) is allowed in the same bank.
Incompatible example: HSTL_IV_DCI input and HSTL_III_DCI input
b.
No more than one Split Termination type (input or output) is allowed in the same bank.
Incompatible example: HSTL_I_DCI input and HSTL_II_DCI input
The implementation tools will enforce these design rules.
Module 2 of 4 6
Table 5 summarizes all standards and voltage supplies. Table 5: Summary of Voltage Supply Requirements for All Input and Output Standards
VCCO I/O Standard LVDS_33 LVDSEXT_33 LVPECL_33 N/R SSTL3_I SSTL3_II AGP LVTTL LVCMOS33 LVDCI_33 LVDCI_DV2_33 PCI33_3 PCI66_3 PCIX LVDS_33_DCI LVDSEXT_33_DCI SSTL3_I_DCI SSTL3_II_DCI LVDS_25 LVDSEXT_25 LDT_25 ULVDS_25 BLVDS_25 SSTL2_I SSTL2_II 2.5 LVCMOS25 LVDCI_25 LVDCI_DV2_25 LVDS_25_DCI LVDSEXT_25_DCI SSTL2_I_DCI SSTL2_II_DCI 2.5 N/R N/R N/R N/R N/R 1.25 1.25 N/R Series Series N/R N/R N/R Split N/R N/R N/R Split Split Split Split N/R 3.3 3.3 1.5 1.5 1.32 N/R N/R N/R N/R N/R N/R N/R N/R N/R 1.5 1.5 N/R N/R N/R N/R N/R 1.25 1.25 N/R N/R N/R N/R N/R Series Series N/R N/R N/R N/R N/R N/R Split N/R N/R N/R N/R N/R N/R N/R N/R N/R N/R N/R N/R N/R N/R N/R N/R N/R Split Split Split Split N/R N/R N/R N/R N/R N/R N/R Output Input VREF Input N/R (1) N/R N/R Termination Type Output N/R N/R N/R Input N/R N/R N/R I/O Standard HSTL_III_18 HSTL_IV_18 HSTL_I_18 N/R HSTL_II_18 SSTL18_I SSTL18_II LVCMOS18 LVDCI_18 LVDCI_DV2_18 HSTL_III_DCI_18 HSTL_IV_DCI_18 HSTL_I_DCI_18 HSTL_II_DCI_18 SSTL18_I_DCI SSTL18_II_DCI HSTL_III HSTL_IV N/R HSTL_I HSTL_II LVCMOS15 LVDCI_15 1.5 LVDCI_DV2_15 GTLP_DCI 1.5 HSTL_III_DCI HSTL_IV_DCI HSTL_I_DCI HSTL_II_DCI GTL_DCI GTLP N/R GTL Notes: 1. N/R = no requirement. N/R 0.8 N/R N/R 1.2 1.2 0.9 0.9 0.75 0.75 0.8 1 N/R Single N/R Split Single N/R Single Single Split Split Single N/R N/R 1 Series Single N/R Single 0.75 0.75 N/R N/R N/R N/R N/R Series N/R N/R N/R N/R 1.8 1.8 0.9 0.9 0.9 N/R N/R N/R 1.1 1.1 0.9 0.9 0.9 0.9 0.9 0.9 N/R N/R N/R N/R Series Series N/R Single N/R Split N/R Split N/R N/R N/R N/R N/R N/R N/R N/R Single Single Split Split Split Split N/R N/R
Table 5: Summary of Voltage Supply Requirements for All Input and Output Standards (Continued)
VCCO Output Input VREF Input 1.1 1.1 0.9 Termination Type Output N/R N/R N/R Input N/R N/R N/R
Module 2 of 4 7
Digitally Controlled Impedance (DCI)

Todays chip output signals with fast edge rates require termination to prevent reflections and maintain signal integrity. High pin count packages (especially ball grid arrays) can not accommodate external termination resistors. Virtex-II XCITE DCI provides controlled impedance drivers and on-chip termination for single-ended and differential I/Os. This eliminates the need for external resistors, and improves signal integrity. The DCI feature can be used on any IOB by selecting one of the DCI I/O standards. When applied to inputs, DCI provides input parallel termination. When applied to outputs, DCI provides controlled impedance drivers (series termination) or output parallel termination. DCI operates independently on each I/O bank. When a DCI I/O standard is used in a particular I/O bank, external reference resistors must be connected to two dual-function pins on the bank. These resistors, voltage reference of N transistor (VRN) and the voltage reference of P transistor (VRP) are shown in Figure 9.
1 Bank DCI DCI
Controlled Impedance Drivers (Series Termination)

DCI can be used to provide a buffer with a controlled output impedance. It is desirable for this output impedance to match the transmission line impedance (Z). Virtex-II input buffers also support LVDCI and LVDCI_DV2 I/O standards.
IOB Z Z
Virtex-II DCI VCCO = 3.3 V, 2.5 V, 1.8 V or 1.5 V

DS031_51_110600
Figure 10: Internal Series Termination Table 6: SelectI/O-Ultra Controlled Impedance Buffers VCCO 3.3 V 2.5 V 1.8 V 1.5 V DCI LVDCI_33 LVDCI_25 LVDCI_18 LVDCI_15 DCI Half Impedance LVDCI_DV2_33 LVDCI_DV2_25 LVDCI_DV2_18 LVDCI_DV2_15
DCI DCI VCCO RREF (1%) VRN VRP RREF (1%) GND
DS031_50_101200
Controlled Impedance Drivers (Parallel Termination)

DCI also provides on-chip termination for SSTL3, SSTL2, HSTL (Class I, II, III, or IV), and GTL/GTLP receivers or transmitters on bidirectional lines. Table 7 lists the on-chip parallel terminations available in Virtex-II devices. VCCO must be set according to Table 3. Note that there is a VCCO requirement for GTL_DCI and GTLP_DCI, due to the on-chip termination resistor. Table 7: SelectI/O-Ultra Buffers With On-Chip Parallel Termination I/O Standard SSTL3 Class I SSTL3 Class II SSTL2 Class I SSTL2 Class II HSTL Class I HSTL Class II HSTL Class III HSTL Class IV GTL GTLP
Notes: 1. SSTL Compatible
External Termination SSTL3_I SSTL3_II SSTL2_I SSTL2_II HSTL_I HSTL_II HSTL_III HSTL_IV GTL GTLP
On-Chip Termination SSTL3_I_DCI (1) SSTL3_II_DCI (1) SSTL2_I_DCI (1) SSTL2_II_DCI (1) HSTL_I_DCI HSTL_II_DCI HSTL_III_DCI HSTL_IV_DCI GTL_DCI GTLP_DCI
Figure 9: DCI in a Virtex-II Bank When used with a terminated I/O standard, the value of resistors are specified by the standard (typically 50 ). When used with a controlled impedance driver, the resistors set the output impedance of the driver within the specified range (25 to 100 ). For all series and parallel terminations listed in Table 6 and Table 7, the reference resistors must have the same value for any given bank. One percent resistors are recommended. The DCI system adjusts the I/O impedance to match the two external reference resistors, or half of the reference resistors, and compensates for impedance changes due to voltage and/or temperature fluctuations. The adjustment is done by turning parallel transistors in the IOB on or off.
Module 2 of 4 8
Figure 11 provides examples illustrating the use of the HSTL_I_DCI, HSTL_II_DCI, HSTL_III_DCI, and HSTL_IV_DCI I/O standards. For a complete list, see the Virtex-II User Guide.
HSTL_I HSTL_II HSTL_III HSTL_IV
VCCO/2
VCCO/2 R Z0
VCCO/2 R Z0
VCCO R
VCCO R Z0
VCCO R
Conventional
R Z0
DCI Transmit Conventional Receive

Virtex-II DCI
VCCO/2 R Z0
VCCO 2R Z0 2R Virtex-II DCI
VCCO/2 R Z0 Virtex-II DCI
VCCO R
VCCO R Z0 Virtex-II DCI
VCCO R
VCCO
VCCO/2 R Z0
VCCO 2R Z0 Virtex-II DCI VCCO R 2R Virtex-II DCI VCCO R Z0 Virtex-II DCI VCCO R
Conventional Transmit DCI Receive
2R Z0 2R Virtex-II DCI
VCCO
VCCO 2R Z0 2R Virtex-II DCI
VCCO 2R Z0 Virtex-II DCI
DCI Transmit DCI Receive

Virtex-II DCI
2R Z0 2R Virtex-II DCI
VCCO R
VCCO R Z0
VCCO R
2R Virtex-II DCI
Virtex-II DCI
Virtex-II DCI
Virtex-II DCI
VCCO 2R
VCCO 2R Z0 2R
VCCO R
VCCO R Z0
Bidirectional
N/A
2R
N/A
Virtex-II DCI
Virtex-II DCI
Virtex-II DCI
Virtex-II DCI
Reference Resistor Recommended Z0(1)
VRN = VRP = R = Z0 50
Note:
VRN = VRP = R = Z0 50
VRN = VRP = R = Z0 50
VRN = VRP = R = Z0 50
DS031_65a_100201
1. Z0 is the recommended PCB trace impedance.
Figure 11: HSTL DCI Usage Examples
Module 2 of 4 9
Figure 12 provides examples illustrating the use of the SSTL2_I_DCI, SSTL2_II_DCI, SSTL3_I_DCI, and SSTL3_II_DCI I/O standards. For a complete list, see the Virtex-II User Guide.
SSTL2_I
VCCO/2 R VCCO/2 R VCCO/2 R Z0 R/2 Z0 R/2
SSTL2_II
SSTL3_I
SSTL3_II
VCCO/2 R VCCO/2 R Z0 VCCO/2 R
Conventional
R/2
Z0 R/2
VCCO/2
DCI Transmit Conventional Receive
VCCO 25
(1)
VCCO/2 R Z0 25
(1)
25(1) Z0
VCCO/2 R Z0
2R 2R
25(1)
VCCO 2R Z0 2R
VCCO/2 R
Virtex-II DCI
Virtex-II DCI
Virtex-II DCI
Virtex-II DCI
VCCO
VCCO/2 R Z0 R/2
VCCO 2R Z0 2R Virtex-II DCI R/2
VCCO 2R
VCCO/2 R Z0 R/2
VCCO 2R
Conventional Transmit DCI Receive
2R Z0 R/2 2R Virtex-II DCI
2R Virtex-II DCI
2R Virtex-II DCI
VCCO 25(1) 2R Z0 2R Virtex-II DCI Virtex-II DCI 25
(1)
VCCO 2R Z0 2R
VCCO 2R 25(1) Z0 2R Virtex-II DCI Virtex-II DCI
VCCO 2R 25
(1)
VCCO 2R Z0 2R
VCCO 2R
DCI Transmit DCI Receive
2R Virtex-II DCI
2R Virtex-II DCI
Virtex-II DCI
Virtex-II DCI
25
(1)
VCCO 2R Z0 2R
VCCO 2R 2R
25(1)
VCCO 2R Z0 2R
VCCO 2R 2R
Bidirectional
N/A
25
(1)
N/A
25(1)
Virtex-II DCI
Virtex-II DCI
Virtex-II DCI
Virtex-II DCI
Reference Resistor
VRN = VRP = R = Z0 50
Notes:
VRN = VRP = R = Z0 50
VRN = VRP = R = Z0 50
VRN = VRP = R = Z0 50
Recommended Z0(2)
1. The SSTL-compatible 25 series resistor is accounted for in the DCI buffer, and it is not DCI controlled. 2. Z0 is the recommended PCB trace impedance.
DS031_65b_112502
Figure 12: SSTL DCI Usage Examples
Module 2 of 4 10
Figure 13 provides examples illustrating the use of the LVDS_DCI and LVDSEXT_DCI I/O standards. For a complete list, see the Virtex-II User Guide.
LVDS_DCI and LVDSEXT_DCI Receiver
Z0
Conventional
2R
Z0
Virtex-II LVDS
VCCO 2R
Z0
2R Conventional Transmit DCI Receive

Z0
VCCO 2R 2R Virtex-II LVDS DCI
Reference Resistor Recommended Z0
VRN = VRP = R = Z0 50
NOTE: Only LVDS25_DCI is supported (VCCO = 2.5V only)
DS031_65c_022103
Figure 13: LVDS DCI Usage Examples
Module 2 of 4 11
Configurable Logic Blocks (CLBs)

The Virtex-II configurable logic blocks (CLB) are organized in an array and are used to build combinatorial and synchronous logic designs. Each CLB element is tied to a switch matrix to access the general routing matrix, as shown in Figure 14. A CLB element comprises 4 similar slices, with fast local feedback within the CLB. The four slices are split in two columns of two slices with two independent carry logic chains and one common shift chain.
TBUF X0Y1 TBUF X0Y0 COUT Slice X1Y1 Slice X1Y0 SHIFT Slice X0Y1 Slice X0Y0 CIN CIN Fast Connects to neighbors
DS031_32_101600
Configurations
Look-Up Table Virtex-II function generators are implemented as 4-input look-up tables (LUTs). Four independent inputs are provided to each of the two function generators in a slice (F and G). These function generators are each capable of implementing any arbitrarily defined boolean function of four inputs. The propagation delay is therefore independent of the function implemented. Signals from the function generators can exit the slice (X or Y output), can input the XOR dedicated gate (see arithmetic logic), or input the carry-logic multiplexer (see fast look-ahead carry logic), or feed the D input of the storage element, or go to the MUXF5 (not shown in Figure 16). In addition to the basic LUTs, the Virtex-II slice contains logic (MUXF5 and MUXFX multiplexers) that combines function generators to provide any function of five, six, seven, or eight inputs. The MUXFX are either MUXF6, MUXF7 or MUXF8 according to the slice considered in the CLB. Selected functions up to nine inputs (MUXF5 multiplexer) can be implemented in one slice. The MUXFX can also be a MUXF6, MUXF7, or MUXF8 multiplexers to map any functions of six, seven, or eight inputs and selected wide logic functions. Register/Latch The storage elements in a Virtex-II slice can be configured either as edge-triggered D-type flip-flops or as level-sensitive latches. The D input can be directly driven by the X or Y output via the DX or DY input, or by the slice inputs bypassing the function generators via the BX or BY input. The clock enable signal (CE) is active High by default. If left unconnected, the clock enable for that storage element defaults to the active state. In addition to clock (CK) and clock enable (CE) signals, each slice has set and reset signals (SR and BY slice inputs). SR forces the storage element into the state specified by the attribute SRHIGH or SRLOW. SRHIGH forces a logic 1 when SR is asserted. SRLOW forces a logic 0. When SR is used, a second input (BY) forces the storage element into the opposite state. The reset condition is predominant over the set condition. (See Figure 17.) The initial state after configuration or global initial state is defined by a separate INIT0 and INIT1 attribute. By default, setting the SRLOW attribute sets INIT0, and setting the SRHIGH attribute sets INIT1.
Switch Matrix
COUT
Figure 14: Virtex-II CLB Element
Slice Description
Each slice includes two 4-input function generators, carry logic, arithmetic logic gates, wide function multiplexers and two storage elements. As shown in Figure 15, each 4-input function generator is programmable as a 4-input LUT, 16 bits of distributed SelectRAM memory, or a 16-bit variable-tap shift register element. The output from the function generator in each slice drives both the slice output and the D input of the storage element. Figure 16 shows a more detailed view of a single slice.
RAM16
ORCY MUXFx
SRL16 LUT G RAM16 MUXF5 SRL16 LUT F CY Register CY Register
For each slice, set and reset can be set to be synchronous or asynchronous. Virtex-II devices also have the ability to set INIT0 and INIT1 independent of SRHIGH and SRLOW. The control signals clock (CLK), clock enable (CE) and set/reset (SR) are common to both storage elements in one slice. All of the control signals have independent polarity. Any inverter placed on a control input is automatically absorbed.
www.xilinx.com 1-800-255-7778 Module 2 of 4 12
Arithmetic Logic
DS031_31_100900
Figure 15: Virtex-II Slice Configuration
SHIFTIN
COUT
SOPIN 0 Dual-Port Shift-Reg G4 G3 G2 G1 WG4 WG3 WG2 WG1 ALTDIG MULTAND 1 0 BY SLICEWE[2:0] G2 PROD G1 CYOG BY A4 LUT A3 RAM A2 ROM A1 D WG4 G WG3 WG2 MC15 WG1 WS DI
ORCY SOPOUT
YBMUX 1 MUXCY 1 0
YB
GYMUX
Y DY
XORG FF LATCH DYMUX CE CLK D Q
Y CE CK SR REV
WSG WE[2:0] WE CLK WSF
SHIFTOUT
SR DIG MUXCY 1 0
CE CLK SR CIN
DS031_01_112502
Shared between x & y Registers
Figure 16: Virtex-II Slice (Top Half)
Module 2 of 4 13
Virtex-II Platform FPGAs: Detailed Description Distributed SelectRAM memory modules are synchronous (write) resources. The combinatorial read access time is extremely fast, while the synchronous write simplifies high-speed designs. A synchronous read can be implemented with a storage element in the same slice. The distributed SelectRAM memory and the storage element share the same clock input. A Write Enable (WE) input is active High, and is driven by the SR input. Table 8 shows the number of LUTs (2 per slice) occupied by each distributed SelectRAM configuration. Table 8: Distributed SelectRAM Configurations RAM
XQ Attribute INIT1 INIT0 SRHIGH SRLOW Reset Type SYNC ASYNC
DS031_22_110600
FFY FF LATCH DY D Q YQ Attribute INIT1 INIT0 SRHIGH SRLOW
CE CK SR REV BY FFX FF LATCH DX CE CLK SR BX D CE CK SR REV Q
Number of LUTs 1 2 2 4 4 8 8
16 x 1S 16 x 1D 32 x 1S 32 x 1D 64 x 1S 64 x 1D 128 x 1S
Figure 17: Register / Latch Configuration in a Slice The set and reset functionality of a register or a latch can be configured as follows: No set or reset Synchronous set Synchronous reset Synchronous set and reset Asynchronous set (preset) Asynchronous reset (clear) Asynchronous set and reset (preset and clear)
Notes: 1. S = single-port configuration; D = dual-port configuration
For single-port configurations, distributed SelectRAM memory has one address port for synchronous writes and asynchronous reads. For dual-port configurations, distributed SelectRAM memory has one port for synchronous writes and asynchronous reads and another port for asynchronous reads. The function generator (LUT) has separated read address inputs (A1, A2, A3, A4) and write address inputs (WG1/WF1, WG2/WF2, WG3/WF3, WG4/WF4). In single-port mode, read and write addresses share the same address bus. In dual-port mode, one function generator (R/W port) is connected with shared read and write addresses. The second function generator has the A inputs (read) connected to the second read-only port address and the W inputs (write) shared with the first read/write port address.
The synchronous reset has precedence over a set, and an asynchronous clear has precedence over a preset. Distributed SelectRAM Memory Each function generator (LUT) can implement a 16 x 1-bit synchronous RAM resource called a distributed SelectRAM element. The SelectRAM elements are configurable within a CLB to implement the following: Single-Port 16 x 8 bit RAM Single-Port 32 x 4 bit RAM Single-Port 64 x 2 bit RAM Single-Port 128 x 1 bit RAM Dual-Port 16 x 4 bit RAM Dual-Port 32 x 2 bit RAM Dual-Port 64 x 1 bit RAM
Module 2 of 4 14
Figure 18, Figure 19, and Figure 20 illustrate various example configurations.
RAM 16x1S DPRA[3:0] A[3:0] 4 4 (BY) WSG (SR) WE CK (optional) RAM A[4:1] WG[4:1] WS D DI A[3:0] D D Q Output Registered Output D (BY) 4 4
RAM 16x1D
dual_port RAM G[4:1] D WG[4:1] WS DI
DPO
WSG WE CK
WE WCLK
DS031_02_100900
Figure 18: Distributed SelectRAM (RAM16x1S)
A[3:0]
dual_port RAM G[4:1] D WG[4:1] WS DI
SPO
RAM 32x1S A[4] A[3:0] (BX) 4 RAM G[4:1] WG[4:1] WS D (BY) WSG WE0 WE CK WSF WS DI RAM D F[4:1] WF[4:1] DI
DS031_04_110100
WSG D WE WCLK (SR) WE CK
Figure 20: Dual-Port Distributed SelectRAM (RAM16x1D)

Output F5MUX D Q Registered Output
WE WCLK
(SR)
(optional)
Similar to the RAM configuration, each function generator (LUT) can implement a 16 x 1-bit ROM. Five configurations are available: ROM16x1, ROM32x1, ROM64x1, ROM128x1, and ROM256x1. The ROM elements are cascadable to implement wider or/and deeper ROM. ROM contents are loaded at configuration. Table 9 shows the number of LUTs occupied by each configuration. Table 9: ROM Configuration
DS031_03_110100
ROM Figure 19: Single-Port Distributed SelectRAM (RAM32x1S) 16 x 1 32 x 1 64 x 1 128 x 1 256 x 1
Number of LUTs 1 2 4 8 (1 CLB) 16 (2 CLBs)
Module 2 of 4 15
Shift Registers Each function generator can also be configured as a 16-bit shift register. The write operation is synchronous with a clock input (CLK) and an optional clock enable, as shown in Figure 21. A dynamic read access is performed through the 4-bit address bus, A[3:0]. The configurable 16-bit shift register cannot be set or reset. The read is asynchronous, however the storage element or flip-flop is available to implement a synchronous read. The storage element should always be used with a constant address. For example, when building an 8-bit shift register and configuring the addresses to point to the 7th bit, the 8th bit can be the flip-flop. The overall system performance is improved by using the superior clock-to-out of the flip-flops.
1 Shift Chain in CLB IN
DI D SRLC16 MC15
FF
DI D SRLC16 MC15 SLICE S3
FF
SHIFTOUT
SHIFTIN SHIFTIN SRLC16 DI D SRLC16 MC15 FF
SHIFT-REG A[3:0] 4 A[4:1] D MC15 D WS D(BY) WSG CE (SR) CLK WE CK (optional) SHIFTIN DI D SRLC16 MC15
DS031_05_110600
Output Q Registered Output SLICE S2
DI D SRLC16 MC15
FF
DI
SHIFTOUT
FF
SHIFTOUT
Figure 21: Shift Register Configurations An additional dedicated connection between shift registers allows connecting the last bit of one shift register to the first bit of the next, without using the ordinary LUT output. (See Figure 22.) Longer shift registers can be built with dynamic access to any bit in the chain. The shift register chaining and the MUXF5, MUXF6, and MUXF7 multiplexers allow up to a 128-bit shift register with addressable access to be implemented in one CLB.
DI D SRLC16 MC15
FF SLICE S1 SHIFTOUT
SHIFTIN DI D SRLC16 MC15 FF
DI D SRLC16 MC15
FF SLICE S0 OUT CASCADABLE OUT

DS031_06_110200
CLB
Figure 22: Cascadable Shift Register
Module 2 of 4 16
Virtex-II Platform FPGAs: Detailed Description Each Virtex-II slice has one MUXF5 multiplexer and one MUXFX multiplexer. The MUXFX multiplexer implements the MUXF6, MUXF7, or MUXF8, as shown in Figure 23. Each CLB element has two MUXF6 multiplexers, one MUXF7 multiplexer and one MUXF8 multiplexer. Examples of multiplexers are shown in the Virtex-II User Guide. Any LUT can implement a 2:1 multiplexer.
Multiplexers Virtex-II function generators and associated multiplexers can implement the following: 4:1 multiplexer in one slice 8:1 multiplexer in two slices 16:1 multiplexer in one CLB element (4 slices) 32:1 multiplexer in two CLB elements (8 slices)
F8
Slice S3
G F F5
MUXF8 combines the two MUXF7 outputs (Two CLBs)
F6
F7
F5
Slice S2
MUXF6 combines the two MUXF5 outputs from slices S2 and S3
G F F5
Slice S1
F6
G F F5
Slice S0
CLB
DS031_08_100201
Figure 23: MUXF5 and MUXFX multiplexers Fast Lookahead Carry Logic Dedicated carry logic provides fast arithmetic addition and subtraction. The Virtex-II CLB has two separate carry chains, as shown in the Figure 24. The height of the carry chains is two bits per slice. The carry chain in the Virtex-II device is running upward. The dedicated carry path and carry multiplexer (MUXCY) can also be used to cascade function generators for implementing wide logic functions. Arithmetic Logic The arithmetic logic includes an XOR gate that allows a 2-bit full adder to be implemented within a slice. In addition, a dedicated AND (MULT_AND) gate (shown in Figure 16) improves the efficiency of multiplier implementation.
Module 2 of 4 17
COUT to S0 of the next CLB
COUT to CIN of S2 of the next CLB
O I LUT (First Carry Chain)
MUXCY FF
SLICE S3 O I LUT MUXCY FF
CIN COUT O I LUT MUXCY FF
SLICE S2 O I O I LUT MUXCY FF LUT MUXCY FF
O I LUT
MUXCY FF
SLICE S1
CIN COUT O I LUT MUXCY FF
(Second Carry Chain)
O I LUT
MUXCY FF
SLICE S0
CIN
CIN
CLB
DS031_07_110200
Figure 24: Fast Carry Logic Path
Module 2 of 4 18
Sum of Products
Each Virtex-II slice has a dedicated OR gate named ORCY, ORing together outputs from the slices carryout and the ORCY from an adjacent slice. The ORCY gate with the dedicated Sum of Products (SOP) chain are designed for implementing large, flexible SOP chains. One input of each ORCY is connected through the fast SOP chain to the output of the previous ORCY in the same slice row. The second input is connected to the output of the top MUXCY in the same slice, as shown in Figure 25. LUTs and MUXCYs can implement large AND gates or other combinatorial logic functions. Figure 26 illustrates LUT and MUXCY resources configured as a 16-input AND gate.
ORCY 4 4
ORCY 4
ORCY 4
ORCY SOP
LUT
MUXCY
LUT
MUXCY
LUT
MUXCY
LUT
MUXCY
Slice 1 4 LUT
MUXCY
Slice 3 4 LUT
MUXCY
Slice 1 4 LUT
MUXCY
Slice 3 4 LUT
MUXCY
LUT
MUXCY
LUT
MUXCY
LUT
MUXCY
LUT
MUXCY
Slice 0 4 LUT
MUXCY
Slice 2 4 LUT
MUXCY
Slice 0 4 LUT
MUXCY
Slice 2 4 LUT
MUXCY
VCC
VCC CLB
VCC
VCC CLB
ds031_64_110300
Figure 25: Horizontal Cascade Chain

OUT
4 LUT
MUXCY 0 1 0 Slice
4 LUT
MUXCY 0 1 0 16 AND OUT
4 LUT
MUXCY 0 1 0 Slice
4 LUT
MUXCY 0 1 VCC
DS031_41_110600
Figure 26: Wide-Input AND Gate (16 Inputs)
Module 2 of 4 19
3-State Buffers
Introduction
Each Virtex-II CLB contains two 3-state drivers (TBUFs) that can drive on-chip busses. Each 3-state buffer has its own 3-state control pin and its own input pin. Each of the four slices have access to the two 3-state buffers through the switch matrix, as shown in Figure 27. TBUFs in neighboring CLBs can access slice outputs by direct connects. The outputs of the 3-state buffers drive horizontal routing resources used to implement 3-state busses.
Locations / Organization
Four horizontal routing resources per CLB are provided for on-chip 3-state busses. Each 3-state buffer has access alternately to two horizontal lines, which can be partitioned as shown in Figure 28. The switch matrices corresponding to SelectRAM memory and multiplier or I/O blocks are skipped.
Number of 3-State Buffers

Table 10 shows the number of 3-state buffers available in each Virtex-II device. The number of 3-state buffers is twice the number of CLB elements. Table 10: Virtex-II 3-State Buffers 3-State Buffers per Row 16 16 32 48 64 80 96 112 144 176 208 Total Number of 3-State Buffers 128 256 768 1,536 2,560 3,840 5,376 7,168 11,520 16,896 23,296
TBUF
TBUF
Slice S3 Slice S2
Device XC2V40 XC2V80 XC2V250 XC2V500
Switch Matrix Slice S1 Slice S0
XC2V1000
DS031_37_060700
XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000
Figure 27: Virtex-II 3-State Buffers The 3-state buffer logic is implemented using AND-OR logic rather than 3-state drivers, so that timing is more predictable and less load dependant especially with larger devices.
3 - state lines
Switch matrix CLB-II
Programmable connection
Switch matrix CLB-II
DS031_09_032700
Figure 28: 3-State Buffer Connection to Horizontal Lines
CLB/Slice Configurations
Table 11 summarizes the logic resources in one CLB. All of the CLBs are identical and each CLB or slice can be implemented in one of the configurations listed. Table 12 shows the available resources in all CLBs.
Module 2 of 4 20
Table 11: Logic Resources in One CLB Slices 4 LUTs 8 Flip-Flops 8 MULT_ANDs 8 Arithmetic & Carry-Chains 2 SOP Chains 2 Distributed SelectRAM 128 bits Shift Registers 128 bits TBUF 2
Table 12: Virtex-II Logic Resources Available in All CLBs CLB Array: Row x Column 8x8 16 x 8 24 x 16 32 x 24 40 x 32 48 x 40 56 x 48 64 x 56 80 x 72 96 x 88 112 x 104 Number of Slices 256 512 1,536 3,072 5,120 7,680 10,752 14,336 23,040 33,792 46,592 Number of LUTs 512 1,024 3,072 6,144 10,240 15,360 21,504 28,672 46,080 67,584 93,184 Max Distributed SelectRAM or Shift Register (bits) 8,192 16,384 49,152 98,304 163,840 245,760 344,064 458,752 737,280 1,081,344 1,490,944 Number of Flip-Flops 512 1,024 3,072 6,144 10,240 15,360 21,504 28,672 46,080 67,584 93,184 Number of Carry-Chains (1) 16 16 32 48 64 80 96 112 144 176 208 Number of SOP Chains (1) 16 32 48 64 80 96 112 128 160 192 224
Device XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000
Notes: 1. The carry-chains and SOP chains can be split or cascaded.
18 Kbit Block SelectRAM Resources

Introduction
Virtex-II devices incorporate large amounts of 18 Kbit block SelectRAM. These complement the distributed SelectRAM resources that provide shallow RAM structures implemented in CLBs. Each Virtex-II block SelectRAM is an 18 Kbit true dual-port RAM with two independently clocked and independently controlled synchronous ports that access a common storage area. Both ports are functionally identical. CLK, EN, WE, and SSR polarities are defined through configuration. Each port has the following types of inputs: Clock and Clock Enable, Write Enable, Set/Reset, and Address, as well as separate Data/parity data inputs (for write) and Data/parity data outputs (for read). Operation is synchronous; the block SelectRAM behaves like a register. Control, address and data inputs must (and need only) be valid during the set-up time window prior to a rising (or falling, a configuration option) clock edge. Data outputs change as a result of the same clock edge.
Configuration
The Virtex-II block SelectRAM supports various configurations, including single- and dual-port RAM and various data/address aspect ratios. Supported memory configurations for single- and dual-port modes are shown in Table 13. Table 13: Dual- and Single-Port Configurations 16K x 1 bit 8K x 2 bits 4K x 4 bits 2K x 9 bits 1K x 18 bits 512 x 36 bits
Module 2 of 4 21
Single-Port Configuration
As a single-port RAM, the block SelectRAM has access to the 18 Kbit memory locations in any of the 2K x 9-bit, 1K x 18-bit, or 512 x 36-bit configurations and to 16 Kbit memory locations in any of the 16K x 1-bit, 8K x 2-bit, or 4K x 4-bit configurations. The advantage of the 9-bit, 18-bit and 36-bit widths is the ability to store a parity bit for each eight bits. Parity bits must be generated or checked externally in user logic. In such cases, the width is viewed as 8 + 1, 16 + 2, or 32 + 4. These extra parity bits are stored and behave exactly as the other bits, including the timing parameters. Video applications can use the 9-bit ratio of Virtex-II block SelectRAM memory to advantage. Each block SelectRAM cell is a fully synchronous memory as illustrated in Figure 29. Input data bus and output data bus widths are identical.
18 Kbit Block SelectRAM DI DIP ADDR WE EN SSR CLK
Dual-Port Configuration
As a dual-port RAM, each port of block SelectRAM has access to a common 18 Kbit memory resource. These are fully synchronous ports with independent control signals for each port. The data widths of the two ports can be configured independently, providing built-in bus-width conversion. Table 14 illustrates the different configurations available on ports A & B.
DO DOP
DS031_10_071602
Figure 29: 18 Kbit Block SelectRAM Memory in Single-Port Mode Table 14: Dual-Port Mode Configurations Port A Port B Port A Port B Port A Port B Port A Port B Port A Port B Port A Port B 16K x 1 16K x 1 8K x 2 8K x 2 4K x 4 4K x 4 2K x 9 2K x 9 1K x 18 1K x 18 512 x 36 512 x 36 16 K-bit block is accessible from Port A or Port B. All other configurations result in one port having access to an 18 Kbit memory block and the other port having access to a 16 K-bit subset of the memory block equal to 16 Kbits. 16K x 1 8K x 2 8K x 2 4K x 4 4K x 4 2K x 9 2K x 9 1K x 18 1K x 18 512 x 36 16K x 1 4K x 4 8K x 2 2K x 9 4K x 4 1K x 18 2K x 9 512 x 36 16K x 1 2K x 9 8K x 2 1K x 18 4K x 4 512 x 36 16K x 1 1K x 18 8K x 2 512 x 36 16K x 1 512 x 36
If both ports are configured in either 2K x 9-bit, 1K x 18-bit, or 512 x 36-bit configurations, the 18 Kbit block is accessible from port A or B. If both ports are configured in either 16K x 1-bit, 8K x 2-bit. or 4K x 4-bit configurations, the
Module 2 of 4 22
Each block SelectRAM cell is a fully synchronous memory, as illustrated in Figure 30. The two ports have independent inputs and outputs and are independently clocked.
18 Kbit Block SelectRAM DIA DIPA ADDRA WEA ENA SSRA CLKA
Table 15: 18 Kbit Block SelectRAM Port Aspect Ratio

Width 1 2 4 9 18 Depth 16,384 8,192 4,096 2,048 1,024 512 Address Bus ADDR[13:0] ADDR[12:0] ADDR[11:0] ADDR[10:0] ADDR[9:0] ADDR[8:0] Data Bus DATA[0] DATA[1:0] DATA[3:0] DATA[7:0] DATA[15:0] DATA[31:0] Parity Bus N/A N/A N/A Parity[0] Parity[1:0] Parity[3:0]
DOA DOPA
36
Read/Write Operations
DIB DIPB ADDRB WEB ENB SSRB CLKB
DOB DOPB
DS031_11_071602
The Virtex-II block SelectRAM read operation is fully synchronous. An address is presented, and the read operation is enabled by control signals WEA and WEB in addition to ENA or ENB. Then, depending on clock polarity, a rising or falling clock edge causes the stored data to be loaded into output registers. The write operation is also fully synchronous. Data and address are presented, and the write operation is enabled by control signals WEA or WEB in addition to ENA or ENB. Then, again depending on the clock input mode, a rising or falling clock edge causes the data to be loaded into the memory cell addressed. A write operation performs a simultaneous read operation. Three different options are available, selected by configuration: 1. WRITE_FIRST The WRITE_FIRST option is a transparent mode. The same clock edge that writes the data input (DI) into the memory also transfers DI into the output registers DO as shown in Figure 31.
Figure 30: 18 Kbit Block SelectRAM in Dual-Port Mode
Port Aspect Ratios

Table 15 shows the depth and the width aspect ratios for the 18 Kbit block SelectRAM. Virtex-II block SelectRAM also includes dedicated routing resources to provide an efficient interface with CLBs, block SelectRAM, and multipliers.
Data_in
DI
Internal Memory
DO
Data_out = Data_in
CLK WE Data_in Address RAM Contents Data_out New aa Old New New
DS031_14_102000
Figure 31: WRITE_FIRST Mode
Module 2 of 4 23
2. READ_FIRST The READ_FIRST option is a read-before-write mode. The same clock edge that writes data input (DI) into the memory also transfers the prior content of the memory cell addressed into the data output registers DO, as shown in Figure 32.
Internal Memory
Data_in
DI
DO
Prior stored data
CLK WE Data_in Address RAM Contents Data_out New aa Old New Old
DS031_13_102000
Figure 32: READ_FIRST Mode 3. NO_CHANGE The NO_CHANGE option maintains the content of the output registers, regardless of the write operation. The clock edge during the write mode has no effect on the content of the data output register DO. When the port is configured as NO_CHANGE, only a read operation loads a new value in the output register DO, as shown in Figure 33.
Data_in
DI
Internal Memory
DO
No change during write
CLK WE Data_in Address RAM Contents Data_out New aa Old New Last Read Cycle Content (no change)
DS031_12_102000
Figure 33: NO_CHANGE Mode
Module 2 of 4 24
Virtex-II Platform FPGAs: Detailed Description number of CLBs in a column divided by four. Column locations are shown in Table 17. Table 17: SelectRAM Memory Floor Plan SelectRAM Blocks Device XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 Columns 2 2 4 4 4 4 4 6 6 6 6 Per Column 2 4 6 8 10 12 14 16 20 24 28 Total 4 8 24 32 40 48 56 96 120 144 168
Control Pins and Attributes

Virtex-II SelectRAM memory has two independent ports with the control signals described in Table 16. All control inputs including the clock have an optional inversion. Table 16: Control Functions Control Signal CLK EN WE SSR Function Read and Write Clock Enable affects Read, Write, Set, Reset Write Enable Set DO register to SRVAL (attribute)
Initial memory content is determined by the INIT_xx attributes. Separate attributes determine the output register value after device configuration (INIT) and SSR is asserted (SRVAL). Both attributes (INIT_B and SRVAL) are available for each port when a block SelectRAM resource is configured as dual-port RAM.
Locations
Virtex-II SelectRAM memory blocks are located in either four or six columns. The number of blocks per column depends of the device array size and is equivalent to the
SelectRAM Blocks
SelectRAM Blocks
n CLB columns
2 CLB columns
2 CLB columns
2 CLB columns
2 CLB columns
n CLB columns
2 CLB columns
SelectRAM Blocks
n CLB columns
n CLB columns
n CLB columns
2 CLB columns
2 CLB columns
2 CLB columns
n CLB columns
ds031_38_101000
Figure 34: Block SelectRAM (2-column, 4-column, and 6-column)

DS031-2 (v3.1) October 14, 2003 Product Specification www.xilinx.com 1-800-255-7778 Module 2 of 4 25
2 CLB columns
2 CLB columns
2 CLB column
2 CLB column
Total Amount of SelectRAM Memory

Table 18 shows the amount of block SelectRAM memory available for each Virtex-II device. The 18 Kbit SelectRAM blocks are cascadable to implement deeper or wider single- or dual-port memory resources. Table 18: Virtex-II SelectRAM Memory Available Total SelectRAM Memory Device XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 Blocks 4 8 24 32 40 48 56 96 120 144 168 in Kbits 72 144 432 576 720 864 1,008 1,728 2,160 2,592 3,024 in Bits 73,728 147,456 442,368 589,824 737,280
DS031_33_101000
Switch Matrix
Switch Matrix 18-Kbit block SelectRAM Switch Matrix
Switch Matrix
884,736 1,032,192 1,769,472 2,211,840 2,654,208 3,096,576
Figure 35: SelectRAM and Multiplier Blocks
Association With Block SelectRAM Memory

The interconnect is designed to allow SelectRAM memory and multiplier blocks to be used at the same time, but some interconnect is shared between the SelectRAM and the multiplier. Thus, SelectRAM memory can be used only up to 18 bits wide when the multiplier is used, because the multiplier shares inputs with the upper data bits of the SelectRAM memory. This sharing of the interconnect is optimized for an 18-bit-wide block SelectRAM resource feeding the multiplier. The use of SelectRAM memory and the multiplier with an accumulator in LUTs allows for implementation of a digital signal processor (DSP) multiplier-accumulator (MAC) function, which is commonly used in finite and infinite impulse response (FIR and IIR) digital filters.
18-Bit x 18-Bit Multipliers

Introduction
A Virtex-II multiplier block is an 18-bit by 18-bit 2s complement signed multiplier. Virtex-II devices incorporate many embedded multiplier blocks. These multipliers can be associated with an 18 Kbit block SelectRAM resource or can be used independently. They are optimized for high-speed operations and have a lower power consumption compared to an 18-bit x 18-bit multiplier in slices. Each SelectRAM memory and multiplier block is tied to four switch matrices, as shown in Figure 35.
Configuration
The multiplier block is an 18-bit by 18-bit signed multiplier (2's complement). Both A and B are 18-bit-wide inputs, and the output is 36 bits. Figure 36 shows a multiplier block.
Multiplier Block A[17:0]
MULT 18 x 18 B[17:0]
18 x 18 Multiplier P[35:0]
DS031_40_100400
Figure 36: Multiplier Block
Module 2 of 4 26
Locations / Organization
Multiplier organization is identical to the 18 Kbit SelectRAM organization, because each multiplier is associated with an 18 Kbit block SelectRAM resource. In addition to the built-in multiplier blocks, the CLB elements have dedicated logic to implement efficient multipliers in logic. (Refer to Configurable Logic Blocks (CLBs)).
Table 19: Multiplier Floor Plan Multipliers Device XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 Columns 2 2 4 4 4 4 4 6 6 6 6 Per Column 2 4 6 8 10 12 14 16 20 24 28 Total 4 8 24 32 40 48 56 96 120 144 168
Multiplier Blocks
Multiplier Blocks
n CLB columns
2 CLB columns
2 CLB columns
2 CLB columns
2 CLB columns
n CLB columns
2 CLB columns
Multiplier Blocks
n CLB columns
n CLB columns
n CLB columns
2 CLB columns
2 CLB columns
2 CLB columns
n CLB columns
DS031_39_101000
Figure 37: Multipliers (2-column, 4-column, and 6-column)

DS031-2 (v3.1) October 14, 2003 Product Specification www.xilinx.com 1-800-255-7778 Module 2 of 4 27
2 CLB columns
2 CLB columns
2 CLB column
2 CLB column
Global Clock Multiplexer Buffers

Virtex-II devices have 16 clock input pins that can also be used as regular user I/Os. Eight clock pads are on the top edge of the device, in the middle of the array, and eight are on the bottom edge, as illustrated in Figure 38. The global clock multiplexer buffer represents the input to dedicated low-skew clock tree distribution in Virtex-II devices. Like the clock pads, eight global clock multiplexer buffers are on the top edge of the device and eight are on the bottom edge. can also be driven by local interconnects. The DCM has clock output(s) that can be connected to global clock buffer inputs, as shown in Figure 39. Global clock buffers are used to distribute the clock to some or all synchronous logic elements (such as registers in CLBs and IOBs, and SelectRAM blocks. Eight global clocks can be used in each quadrant of the Virtex-II device. Designers should consider the clock distribution detail of the device prior to pin-locking and floorplanning (see the Virtex-II User Guide).
8 clock pads
Clock Pad I Clock Buffer
Clock Pad
CLKIN
Virtex-II Device
DCM
CLKOUT
0 8 clock pads Clock Distribution
I Clock Buffer
DS031_42_101000
Figure 38: Virtex-II Clock Pads Each global clock buffer can either be driven by the clock pad to distribute a clock directly to the device, or driven by the Digital Clock Manager (DCM), discussed in Digital Clock Manager (DCM), page 30. Each global clock buffer
0 Clock Distribution
DS031_43_101000
Figure 39: Virtex-II Clock Distribution Configurations Figure 40 shows clock distribution in Virtex-II devices.
8 BUFGMUX
NW
NE
8
NW
8 BUFGMUX
NE
8 max
16 Clocks
8
16 Clocks
SW
8 BUFGMUX
SE
SW
SE
8 BUFGMUX
DS031_45_120200
Figure 40: Virtex-II Clock Distribution
Module 2 of 4 28
In each quadrant, up to eight clocks are organized in clock rows. A clock row supports up to 16 CLB rows (eight up and eight down). For the largest devices a new clock row is added, as necessary. To reduce power consumption, any unused clock branches remain static. Global clocks are driven by dedicated clock buffers (BUFG), which can also be used to gate the clock (BUFGCE) or to multiplex between two independent clock inputs (BUFGMUX). The most common configuration option of this element is as a buffer. A BUFG function in this (global buffer) mode, is shown in Figure 41.
BUFGMUX
BUFGMUX can switch between two unrelated, even asynchronous clocks. Basically, a Low on S selects the I0 input, a High on S selects the I1 input. Switching from one clock to the other is done in such a way that the output High and Low time is never shorter than the shortest High or Low time of either input clock. As long as the presently selected clock is High, any level change of S has no effect .
BUFGMUX I0 I1 O
BUFG I O
S
DS031_63_112900 DS031_61_101200
Figure 43: Virtex-II BUFGMUX Function If the presently selected clock is Low while S changes, or if it goes Low after S has changed, the output is kept Low until the other ("to-be-selected") clock has made a transition from High to Low. At that instant, the new clock starts driving the output. The two clock inputs can be asynchronous with regard to each other, and the S input can change at any time, except for a short setup time prior to the rising edge of the presently selected clock; that is, prior to the rising edge of the BUFGMUX output O. Violating this setup time requirement can result in an undefined runt pulse output. All Virtex-II devices have 16 global clock multiplexer buffers. Figure 44 shows a switchover from CLK0 to CLK1.
Wait for Low S CLK0 Switch CLK1
Figure 41: Virtex-II BUFG Function The Virtex-II global clock buffer BUFG can also be configured as a clock enable/disable circuit (Figure 42), as well as a two-input clock multiplexer (Figure 43). A functional description of these two options is provided below. Each of them can be used in either of two modes, selected by configuration: rising clock edge or falling clock edge. This section describes the rising clock edge option. For the opposite option, falling clock edge, just change all "rising" references to "falling" and all "High" references to "Low", except for the description of the CE or S levels. The rising clock edge option uses the BUFGCE and BUFGMUX primitives. The falling clock edge option uses the BUFGCE_1 and BUFGMUX_1 primitives.
BUFGCE
If the CE input is active (High) prior to the incoming rising clock edge, this Low-to-High-to-Low clock pulse passes through the clock buffer. Any level change of CE during the incoming clock High time has no effect.
BUFGCE I CE O
DS031_62_101200
OUT
DS031_46_112900
Figure 42: Virtex-II BUFGCE Function If the CE input is inactive (Low) prior to the incoming rising clock edge, the following clock pulse does not pass through the clock buffer, and the output stays Low. Any level change of CE during the incoming clock High time has no effect. CE must not change during a short setup window just prior to the rising clock edge on the BUFGCE input I. Violating this setup time requirement can result in an undefined runt pulse output.
Figure 44: Clock Multiplexer Waveform Diagram The current clock is CLK0. S is activated High. If CLK0 is currently High, the multiplexer waits for CLK0 to go Low. Once CLK0 is Low, the multiplexer output stays Low until CLK1 transitions High to Low. When CLK1 transitions from High to Low, the output switches to CLK1. No glitches or short pulses can appear on the output.
Module 2 of 4 29
Local Clocking
In addition to global clocks, there are local clock resources in the Virtex-II devices. There are more than 72 local clocks in the Virtex-II family. These resources can be used for many different applications, including but not limited to memory interfaces. For example, even using only the left and right I/O banks, Virtex-II FPGAs can support up to 50 local clocks for DDR SDRAM. These interfaces can operate beyond 200 MHz on Virtex-II devices.
Digital Clock Manager (DCM)

The Virtex-II DCM offers a wide range of powerful clock management features. Clock De-skew: The DCM generates new system clocks (either internally or externally to the FPGA), which are phase-aligned to the input clock, thus eliminating clock distribution delays. Frequency Synthesis: The DCM generates a wide range of output clock frequencies, performing very flexible clock multiplication and division. Phase Shifting: The DCM provides both coarse phase shifting and fine-grained phase shifting with dynamic phase shift control. The DCM has the following general control signals: RST input pin: resets the entire DCM LOCKED output pin: asserted High when all enabled DCM circuits have locked. STATUS output pins (active High): shown in Table 20. Status Pin 0 1 2 3 4 5 6 7 Function Phase Shift Overflow CLKIN Stopped CLKFX Stopped N/A N/A N/A N/A N/A
Table 20: DCM Status Pins
The DCM utilizes fully digital delay lines allowing robust high-precision control of clock phase and frequency. It also utilizes fully digital feedback systems, operating dynamically to compensate for temperature and voltage variations during operation. Up to four of the nine DCM clock outputs can drive inputs to global clock buffers or global clock multiplexer buffers simultaneously (see Figure 45). All DCM clock outputs can simultaneously drive general routing resources, including routes to output buffers.
Clock De-Skew
The DCM de-skews the output clocks relative to the input clock by automatically adjusting a digital delay line. Additional delay is introduced so that clock edges arrive at internal registers and block RAMs simultaneously with the clock edges arriving at the input clock pad. Alternatively, external clocks, which are also de-skewed relative to the input clock, can be generated for board-level routing. All DCM output clocks are phase-aligned to CLK0 and, therefore, are also phase-aligned to the input clock. To achieve clock de-skew, the CLKFB input must be connected, and its source must be either CLK0 or CLK2X. Note that CLKFB must always be connected, unless only the CLKFX or CLKFX180 outputs are used and de-skew is not required.
DCM
CLKIN CLKFB RST DSSEN CLK0 CLK90 CLK180 CLK270 CLK2X CLK2X180 CLKDV
PSINCDEC CLKFX PSEN CLKFX180 PSCLK LOCKED STATUS[7:0] clock signal control signal PSDONE
DS031_67_112900
Frequency Synthesis
The DCM provides flexible methods for generating new clock frequencies. Each method has a different operating frequency range and different AC characteristics. The CLK2X and CLK2X180 outputs double the clock frequency. The CLKDV output creates divided output clocks with division options of 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, 5.5, 6, 6.5, 7, 7.5, 8, 9, 10, 11, 12, 13, 14, 15, and 16. The CLKFX and CLKFX180 outputs can be used to produce clocks at the following frequency: FREQCLKFX = (M/D) * FREQCLKIN
Figure 45: Digital Clock Manager The DCM can be configured to delay the completion of the Virtex-II configuration process until after the DCM has achieved lock. This guarantees that the chip does not begin operating until after the system clocks generated by the DCM have stabilized.
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Virtex-II Platform FPGAs: Detailed Description Fine-phase adjustment affects all nine DCM output clocks. When activated, the phase shift between the rising edges of CLKIN and CLKFB is a specified fraction of the input clock period. In variable mode, the PHASE_SHIFT value can also be dynamically incremented or decremented as determined by PSINCDEC synchronously to PSCLK, when the PSEN input is active. Figure 46 illustrates the effects of fine-phase shifting. For more information on DCM features, see the Virtex-II User Guide. Table 21 lists fine-phase shifting control pins, when used in variable mode. Table 21: Fine-Phase Shifting Control Pins Control Pin PSINCDEC PSEN PSCLK PSDONE Direction in in in out Function Increment or decrement Enable phase shift Clock for phase shift Active when completed
where M and D are two integers. Specifications for M and D are provided under DCM Timing Parameters in Module 3. By default, M=4 and D=1, which results in a clock output frequency four times faster than the clock input frequency (CLKIN). CLK2X180 is phase shifted 180 degrees relative to CLK2X. CLKFX180 is phase shifted 180 degrees relative to CLKFX. All frequency synthesis outputs automatically have 50/50 duty cycles (with the exception of the CLKDV output when performing a non-integer divide in high-frequency mode). Note that CLK2X and CLK2X180 are not available in high-frequency mode.
Phase Shifting
The DCM provides additional control over clock skew through either coarse or fine-grained phase shifting. The CLK0, CLK90, CLK180, and CLK270 outputs are each phase shifted by of the input clock period relative to each other, providing coarse phase control. Note that CLK90 and CLK270 are not available in high-frequency mode.
CLKIN CLKOUT_PHASE_SHIFT CLKFB = NONE
CLKIN CLKOUT_PHASE_SHIFT CLKFB = FIXED (PS/256) x PERIODCLKIN (PS negative) (PS/256) x PERIODCLKIN (PS positive)
CLKIN CLKOUT_PHASE_SHIFT = VARIABLE
CLKFB
(PS/256) x PERIODCLKIN (PS negative)
(PS/256) x PERIODCLKIN (PS positive)

DS031_48_101201
Figure 46: Fine-Phase Shifting Effects Two separate components of the phase shift range must be understood:
PHASE_SHIFT attribute range FINE_SHIFT_RANGE DCM timing parameter range
lute range is guaranteed to be as specified under DCM Timing Parameters in Module 3. Absolute range (fixed mode) = FINE_SHIFT_RANGE Absolute range (variable mode) = FINE_SHIFT_RANGE/2 The reason for the difference between fixed and variable modes is as follows. For variable mode to allow symmetric, dynamic sweeps from -255/256 to +255/256, the DCM sets the "zero phase skew" point as the middle of the delay line, thus dividing the total delay line range in half. In fixed mode, since the PHASE_SHIFT value never changes after configuration, the entire delay line is available for insertion into either the CLKIN or CLKFB path (to create either positive or negative skew).
The PHASE_SHIFT attribute is the numerator in the following equation: Phase Shift (ns) = (PHASE_SHIFT/256) * PERIODCLKIN The full range of this attribute is always -255 to +255, but its practical range varies with CLKIN frequency, as constrained by the FINE_SHIFT_RANGE component, which represents the total delay achievable by the phase shift delay line. Total delay is a function of the number of delay taps used in the circuit. Across process, voltage, and temperature, this absoDS031-2 (v3.1) October 14, 2003 Product Specification
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Virtex-II Platform FPGAs: Detailed Description If PERIODCLKIN = FINE_SHIFT_RANGE, then PHASE_SHIFT in fixed mode is limited to 255, and in variable mode it is limited to 128. If PERIODCLKIN 0.5 * FINE_SHIFT_RANGE, then PHASE_SHIFT is limited to 255 in either mode.
Taking both of these components into consideration, the following are some usage examples: If PERIODCLKIN = 2 * FINE_SHIFT_RANGE, then PHASE_SHIFT in fixed mode is limited to 128, and in variable mode it is limited to 64.
Operating Modes
The frequency ranges of DCM input and output clocks depend on the operating mode specified, either low-frequency mode or high-frequency mode, according to Table 22. (For actual values, see Virtex-II Switching Characteristics in Module 3). The CLK2X, CLK2X180, CLK90, Table 22: DCM Frequency Ranges Low-Frequency Mode Output Clock
CLK0, CLK180 CLK90, CLK270 CLK2X, CLK2X180 CLKDV CLKFX, CLKFX180
and CLK270 outputs are not available in high-frequency mode. High or low-frequency mode is selected by an attribute.
High-Frequency Mode CLKIN Input

CLKIN_FREQ_DLL_HF NA NA CLKIN_FREQ_DLL_HF CLKIN_FREQ_FX_HF
CLKIN Input
CLKIN_FREQ_DLL_LF CLKIN_FREQ_DLL_LF CLKIN_FREQ_DLL_LF CLKIN_FREQ_DLL_LF CLKIN_FREQ_FX_LF
CLK Output
CLKOUT_FREQ_1X_LF CLKOUT_FREQ_1X_LF CLKOUT_FREQ_2X_LF CLKOUT_FREQ_DV_LF CLKOUT_FREQ_FX_LF
CLK Output
CLKOUT_FREQ_1X_HF NA NA CLKOUT_FREQ_DV_HF CLKOUT_FREQ_FX_HF
Locations/Organization
Virtex-II DCMs are placed on the top and bottom of each block RAM and multiplier column. The number of DCMs depends on the device size, as shown in Table 23. Table 23: DCM Organization Device XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 Columns 2 2 4 4 4 4 4 6 6 6 6 DCMs 4 4 8 8 8 8 8 12 12 12 12
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Active Interconnect Technology

Local and global Virtex-II routing resources are optimized for speed and timing predictability, as well as to facilitate IP cores implementation. Virtex-II Active Interconnect Technology is a fully buffered programmable routing matrix. All routing resources are segmented to offer the advantages of a hierarchical solution. Virtex-II logic features like CLBs, IOBs, block RAM, multipliers, and DCMs are all connected to an identical switch matrix for access to global routing resources, as shown in Figure 47.
Switch Matrix
CLB
Switch Matrix
Switch Matrix Switch Matrix
IOB
Switch Matrix
18Kb BRAM
MULT 18 x 18
Switch Matrix
DCM
Switch Matrix
DS031_55_101000
Figure 47: Active Interconnect Technology Each Virtex-II device can be represented as an array of switch matrixes with logic blocks attached, as illustrated in Figure 48.
Switch Matrix
IOB
Switch Matrix
IOB
Switch Matrix
IOB
Switch Matrix
DCM
Switch Matrix
Switch Matrix
IOB
Switch Matrix
CLB
Switch Matrix
CLB
Switch Matrix
Switch Matrix
SelectRAM
Switch Matrix
IOB
Switch Matrix
CLB
Switch Matrix
CLB
Switch Matrix
Multiplier
Switch Matrix
IOB
Switch Matrix
CLB
Switch Matrix
CLB
Switch Matrix
Switch Matrix
Switch Matrix
Switch Matrix
IOB
Switch Matrix
CLB
Switch Matrix
CLB
Switch Matrix
Switch Matrix
DS031_34_110300
Figure 48: Routing Resources
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Virtex-II Platform FPGAs: Detailed Description incremental design flow that is based on modular implementations. Total design time is reduced due to fewer and shorter design iterations.
Place-and-route software takes advantage of this regular array to deliver optimum system performance and fast compile times. The segmented routing resources are essential to guarantee IP cores portability and to efficiently handle an
Hierarchical Routing Resources

Most Virtex-II signals are routed using the global routing resources, which are located in horizontal and vertical routing channels between each switch matrix. As shown in Figure 49, Virtex-II has fully buffered programmable interconnections, with a number of resources counted between any two adjacent switch matrix rows or columns. Fanout has minimal impact on the performance of each net.
24 Horizontal Long Lines 24 Vertical Long Lines 120 Horizontal Hex Lines 120 Vertical Hex Lines 40 Horizontal Double Lines 40 Vertical Double Lines
16 Direct Connections (total in all four directions)
8 Fast Connects
DS031_60_110200
Figure 49: Hierarchical Routing Resources The long lines are bidirectional wires that distribute signals across the device. Vertical and horizontal long lines span the full height and width of the device. The hex lines route signals to every third or sixth block away in all four directions. Organized in a staggered pattern, hex lines can only be driven from one end. Hex-line signals can be accessed either at the endpoints or at the midpoint (three blocks from the source). The double lines route signals to every first or second block away in all four directions. Organized in a staggered pattern, double lines can be driven only at their endpoints. Double-line signals can be accessed either at the endpoints or at the midpoint (one block from the source). The direct connect lines route signals to neighboring blocks: vertically, horizontally, and diagonally. The fast connect lines are the internal CLB local interconnections from LUT outputs to LUT inputs.
Dedicated Routing
In addition to the global and local routing resources, dedicated signals are available. There are eight global clock nets per quadrant (see Global Clock Multiplexer Buffers). Horizontal routing resources are provided for on-chip 3-state busses. Four partitionable bus lines are provided per CLB row, permitting multiple busses within a row. (See 3-State Buffers.) Two dedicated carry-chain resources per slice column (two per CLB column) propagate carry-chain MUXCY output signals vertically to the adjacent slice. (See CLB/Slice Configurations.)
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One dedicated SOP chain per slice row (two per CLB row) propagate ORCY output logic signals horizontally to the adjacent slice. (See Sum of Products.) One dedicated shift-chain per CLB connects the output of LUTs in shift-register mode to the input of the next LUT in shift-register mode (vertically) inside the CLB. (See Shift Registers, page 16.)
Design Entry
All Xilinx ISE development systems support the mainstream EDA design entry capabilities, ranging from schematic design to advanced HDL design methodologies. Given the high densities of the Virtex-II family, designs are created most efficiently using HDLs. To further improve their time to market, many Xilinx customers employ incremental, modular, and Intellectual Property (IP) design techniques. When properly used, these techniques further accelerate the logic design process. To enable designers to leverage existing investments in EDA tools, and to ensure high performance design flows, Xilinx jointly develops tools with leading EDA vendors, including: Aldec Cadence Exemplar Mentor Graphics Model Technology Synopsys Synplicity
Creating a Design
Creating Virtex-II designs is easy with Xilinx Integrated Synthesis Environment (ISE) development systems, which support advanced design capabilities, including ProActive Timing Closure, integrated logic analysis, and the fastest place and route runtimes in the industry. ISE solutions enable designers to get the performance they need, quickly and easily. As a result of the ongoing cooperative development efforts between Xilinx and EDA Alliance partners, designers can take advantage of the benefits provided by EDA technologies in the programmable logic design process. Xilinx development systems are available in a number of easy to use configurations, collectively known as the ISE Series.
ISE Alliance
The ISE Alliance solution is designed to plug and play within an existing design environment. Built using industry standard data formats and netlists, these stable, flexible products enable Alliance EDA partners to deliver their best design automation capabilities to Xilinx customers, along with the time to market benefits of ProActive Timing Closure.
Complete information on Alliance Series partners and their associated design flows is available at www.xilinx.com on the Xilinx Alliance Series web page. The ISE Foundation product offers schematic entry and HDL design capabilities as part of an integrated design solution - enabling one-stop shopping. These capabilities are powerful, easy to use, and they support the full portfolio of Xilinx programmable logic devices. HDL design capabilities include a color-coded HDL editor with integrated language templates, state diagram entry, and Core generation capabilities.
ISE Foundation
The ISE Foundation solution delivers the benefits of true HDL-based design in a seamlessly integrated design environment. An intuitive project navigator, as well as powerful HDL design and two HDL synthesis tools, ensure that high-quality results are achieved quickly and easily. The ISE Foundation product includes: State Diagram entry using Xilinx StateCAD Automatic HDL Testbench generation using Xilinx HDLBencher HDL Simulation using ModelSim XE
Synthesis
The ISE Alliance product is engineered to support advanced design flows with the industry's best synthesis tools. Advanced design methodologies include: Physical Synthesis Incremental synthesis RTL floorplanning Direct physical mapping
Design Flow
Virtex-II design flow proceeds as follows: Design Entry Synthesis Implementation Verification
The ISE Foundation product seamlessly integrates synthesis capabilities purchased directly from Exemplar, Synopsys, and Synplicity. In addition, it includes the capabilities of Xilinx Synthesis Technology. A benefit of having two seamlessly integrated synthesis engines within an ISE design flow is the ability to apply alternative sets of optimization techniques on designs, helping to ensure that designers can meet even the toughest timing requirements.
Most programmable logic designers iterate through these steps several times in the process of completing a design.
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Virtex-II Platform FPGAs: Detailed Description capability only available in the Xilinx design flow is Modular Design, part of the Xilinx suite of team design tools, which enables autonomous design, implementation, and verification of design modules.
Design Implementation
The ISE Series development systems include Xilinx timing-driven implementation tools, frequently called place and route or fitting software. This robust suite of tools enables the creation of an intuitive, flexible, tightly integrated design flow that efficiently bridges logical and physical design domains. This simplifies the task of defining a design, including its behavior, timing requirements, and optional layout (or floorplanning), as well as simplifying the task of analyzing reports generated during the implementation process. The Virtex-II implementation process is comprised of Synthesis, translation, mapping, place and route, and configuration file generation. While the tools can be run individually, many designers choose to run the entire implementation process with the click of a button. To assist those who prefer to script their design flows, Xilinx provides Xflow, an automated single command line process.
Incremental Synthesis
Xilinx unique hierarchical floorplanning capabilities enable designers to create a programmable logic design by isolating design changes within one hierarchical logic block, and perform synthesis, verification and implementation processes on that specific logic block. By preserving the logic in unchanged portions of a design, Xilinx incremental design makes the high-density design process more efficient. Xilinx hierarchical floorplanning capabilities can be specified using the high-level floorplanner or a preferred RTL floorplanner (see the Xilinx web site for a list of supported EDA partners). When used in conjunction with one of the EDA partners floorplanners, higher performance results can be achieved, as many synthesis tools use this more predictable detailed physical implementation information to establish more aggressive and accurate timing estimates when performing their logic optimizations.
Design Verification
In addition to conventional design verification using static timing analysis or simulation techniques, Xilinx offers powerful in-circuit debugging techniques using ChipScope ILA (Integrated Logic Analysis). The reconfigurable nature of Xilinx FPGAs means that designs can be verified in real time without the need for extensive sets of software simulation vectors. For simulation, the system extracts post-layout timing information from the design database, and back-annotates this information into the netlist for use by the simulator. The back annotation features a variety of patented Xilinx techniques, resulting in the industrys most powerful simulation flows. Alternatively, timing-critical portions of a design can be verified using the Xilinx static timing analyzer or a third party static timing analysis tool like Synopsys Prime Time, by exporting timing data in the STAMP data format. For in-circuit debugging, ChipScope ILA enables designers to analyze the real-time behavior of a device while operating at full system speeds. Logic analysis commands and captured data are transferred between the ChipScope software and ILA cores within the Virtex-II FPGA, using industry standard JTAG protocols. These JTAG transactions are driven over an optional download cable (MultiLINX or JTAG), connecting the Virtex device in the target system to a PC or workstation. ChipScope ILA was designed to look and feel like a logic analyzer, making it easy to begin debugging a design immediately. Modifications to the desired logic analysis can be downloaded directly into the system in a matter of minutes.
Modular Design
Xilinx innovative modular design capabilities take the incremental design process one step further by enabling the designer to delegate responsibility for completing the design, synthesis, verification, and implementation of a hierarchical logic block to an arbitrary number of designers assigning a specific region within the target FPGA for exclusive use by each of the team members. This team design capability enables an autonomous approach to design modules, changing the hand-off point to the lead designer or integrator from my module works in simulation to my module works in the FPGA. This unique design methodology also leverages the Xilinx hierarchical floorplanning capabilities and enables the Xilinx (or EDA partner) floorplanner to manage the efficient implementation of very high-density FPGAs.
Configuration
Virtex-II devices are configured by loading application specific configuration data into the internal configuration memory. Configuration is carried out using a subset of the device pins, some of which are dedicated, while others can be re-used as general purpose inputs and outputs once configuration is complete. Depending on the system design, several configuration modes are supported, selectable via mode pins. The mode pins M2, M1 and M0 are dedicated pins. An additional pin, HSWAP_EN is used in conjunction with the mode pins to select whether user I/O pins have pull-ups during configuration. By default, HSWAP_EN is tied High (internal pull-up) which shuts off the pull-ups on the user I/O pins during configuration. When HSWAP_EN is tied Low, user I/Os have
Other Unique Features of Virtex-II Design Flow

Xilinx design flows feature a number of unique capabilities. Among these are efficient incremental HDL design flows; a robust capability that is enabled by Xilinx exclusive hierarchical floorplanning capabilities. Another powerful design
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Virtex-II Platform FPGAs: Detailed Description loaded, the data for the next device in a daisy-chain is presented on the DOUT pin after the falling CCLK edge. The interface is identical to slave serial except that an internal oscillator is used to generate the configuration clock (CCLK). A wide range of frequencies can be selected for CCLK which always starts at a slow default frequency. Configuration bits then switch CCLK to a higher frequency for the remainder of the configuration.
pull-ups during configuration. Other dedicated pins are CCLK (the configuration clock pin), DONE, PROG_B, and the boundary-scan pins: TDI, TDO, TMS, and TCK. Depending on the configuration mode chosen, CCLK can be an output generated by the FPGA, or an input accepting an externally generated clock. The configuration pins and boundary scan pins are independent of the VCCO. The auxiliary power supply (VCCAUX) of 3.3V is used for these pins. All configuration pins are LVTTL 12 mA. (See Virtex-II DC Characteristics in Module 3.) A persist option is available which can be used to force the configuration pins to retain their configuration function even after device configuration is complete. If the persist option is not selected then the configuration pins with the exception of CCLK, PROG_B, and DONE can be used as user I/O in normal operation. The persist option does not apply to the boundary-scan related pins. The persist feature is valuable in applications which employ partial reconfiguration or reconfiguration on the fly.
Slave SelectMAP Mode

The SelectMAP mode is the fastest configuration option. Byte-wide data is written into the Virtex-II FPGA device with a BUSY flag controlling the flow of data. An external data source provides a byte stream, CCLK, an active Low Chip Select (CS_B) signal and a Write signal (RDWR_B). If BUSY is asserted (High) by the FPGA, the data must be held until BUSY goes Low. Data can also be read using the SelectMAP mode. If RDWR_B is asserted, configuration data is read out of the FPGA as part of a readback operation. After configuration, the pins of the SelectMAP port can be used as additional user I/O. Alternatively, the port can be retained to permit high-speed 8-bit readback using the persist option. Multiple Virtex-II FPGAs can be configured using the SelectMAP mode, and be made to start-up simultaneously. To configure multiple devices in this way, wire the individual CCLK, Data, RDWR_B, and BUSY pins of all the devices in parallel. The individual devices are loaded separately by deasserting the CS_B pin of each device in turn and writing the appropriate data.
Configuration Modes
Virtex-II supports the following five configuration modes: Slave-serial mode Master-serial mode Slave SelectMAP mode Master SelectMAP mode Boundary-Scan mode (IEEE 1532/IEEE 1149)
A detailed description of configuration modes is provided in the Virtex-II User Guide.
Slave-Serial Mode
In slave-serial mode, the FPGA receives configuration data in bit-serial form from a serial PROM or other serial source of configuration data. The CCLK pin on the FPGA is an input in this mode. The serial bitstream must be setup at the DIN input pin a short time before each rising edge of the externally generated CCLK. Multiple FPGAs can be daisy-chained for configuration from a single source. After a particular FPGA has been configured, the data for the next device is routed internally to the DOUT pin. The data on the DOUT pin changes on the falling edge of CCLK. Slave-serial mode is selected by applying <111> to the mode pins (M2, M1, M0). A weak pull-up on the mode pins makes slave serial the default mode if the pins are left unconnected.
Master SelectMAP Mode

This mode is a master version of the SelectMAP mode. The device is configured byte-wide on a CCLK supplied by the Virtex-II FPGA device. Timing is similar to the Slave SerialMAP mode except that CCLK is supplied by the Virtex-II FPGA.
Boundary-Scan (JTAG, IEEE 1532) Mode

In boundary-scan mode, dedicated pins are used for configuring the Virtex-II device. The configuration is done entirely through the IEEE 1149.1 Test Access Port (TAP). Virtex-II device configuration using Boundary scan is compliant with IEEE 1149.1-1993 standard and the new IEEE 1532 standard for In-System Configurable (ISC) devices. The IEEE 1532 standard is backward compliant with the IEEE 1149.1-1993 TAP and state machine. The IEEE Standard 1532 for In-System Configurable (ISC) devices is intended to be programmed, reprogrammed, or tested on the board via a physical and logical protocol. Configuration through the boundary-scan port is always available, independent of the mode selection. Selecting the boundary-scan mode simply turns off the other modes.
Master-Serial Mode
In master-serial mode, the CCLK pin is an output pin. It is the Virtex-II FPGA device that drives the configuration clock on the CCLK pin to a Xilinx Serial PROM which in turn feeds bit-serial data to the DIN input. The FPGA accepts this data on each rising CCLK edge. After the FPGA has been
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Table 24: Virtex-II Configuration Mode Pin Settings Configuration Mode (1) Master Serial Slave Serial Master SelectMAP Slave SelectMAP Boundary Scan M2 0 1 0 1 1 M1 0 1 1 1 0 M0 0 1 1 0 1 CCLK Direction Out In Out In N/A Data Width 1 1 8 8 1 Serial DOUT (2) Yes Yes No No No
Notes: 1. The HSWAP_EN pin controls the pullups. Setting M2, M1, and M0 selects the configuration mode, while the HSWAP_EN pin controls whether or not the pullups are used. 2. Daisy chaining is possible only in modes where Serial DOUT is used. For example, in SelectMAP modes, the first device does NOT support daisy chaining of downstream devices.
Table 25 lists the total number of bits required to configure each device. Table 25: Virtex-II Bitstream Lengths Device XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 # of Configuration Bits 360,096 635,296 1,697,184 2,761,888 4,082,592 5,659,296 7,492,000 10,494,368 15,659,936 21,849,504 29,063,072
being cleared. Extending the time that the pin is Low causes the configuration sequencer to wait. Thus, configuration is delayed by preventing entry into the phase where data is loaded. The configuration process can also be initiated by asserting the PROG_B pin. The end of the memory-clearing phase is signaled by the INIT_B pin going High, and the completion of the entire process is signaled by the DONE pin going High. The Global Set/Reset (GSR) signal is pulsed after the last frame of configuration data is written but before the start-up sequence. The GSR signal resets all flip-flops on the device. The default start-up sequence is that one CCLK cycle after DONE goes High, the global 3-state signal (GTS) is released. This permits device outputs to turn on as necessary. One CCLK cycle later, the Global Write Enable (GWE) signal is released. This permits the internal storage elements to begin changing state in response to the logic and the user clock. The relative timing of these events can be changed via configuration options in software. In addition, the GTS and GWE events can be made dependent on the DONE pins of multiple devices all going High, forcing the devices to start synchronously. The sequence can also be paused at any stage, until lock has been achieved on any or all DCMs, as well as the DCI.
Configuration Sequence
The configuration of Virtex-II devices is a three-phase process after Power On Reset or POR. POR occurs when VCCINT is greater than 1.2V, VCCAUX is greater than 2.5V, and VCCO (bank 4) is greater than 1.5V. Once the POR voltages have been reached, the three-phase process begins. First, the configuration memory is cleared. Next, configuration data is loaded into the memory, and finally, the logic is activated by a start-up process. Configuration is automatically initiated on power-up unless it is delayed by the user. The INIT_B pin can be held Low using an open-drain driver. An open-drain is required since INIT_B is a bidirectional open-drain pin that is held Low by a Virtex-II FPGA device while the configuration memory is
Readback
In this mode, configuration data from the Virtex-II FPGA device can be read back. Readback is supported only in the SelectMAP (master and slave) and Boundary Scan mode. Along with the configuration data, it is possible to read back the contents of all registers, distributed SelectRAM, and block RAM resources. This capability is used for real-time debugging. For more detailed configuration information, see the Virtex-II Platform FPGA User Guide.
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Bitstream Encryption
Virtex-II devices have an on-chip decryptor using one or two sets of three keys for triple-key Data Encryption Standard (DES) operation. Xilinx software tools offer an optional encryption of the configuration data (bitstream) with a triple-key DES determined by the designer. The keys are stored in the FPGA by JTAG instruction and retained by a battery connected to the VBATT pin, when the device is not powered. Virtex-II devices can be configured with the corresponding encrypted bitstream, using any of the configuration modes described previously. A detailed description of how to use bitstream encryption is provided in the Virtex-II Platform FPGA User Guide. For devices that support this feature, please contact your sales representative for specific ordering part number.
Partial Reconfiguration
Partial reconfiguration of Virtex-II devices can be accomplished in either Slave SelectMAP mode or Boundary-Scan mode. Instead of resetting the chip and doing a full configuration, new data is loaded into a specified area of the chip, while the rest of the chip remains in operation. Data is loaded on a column basis, with the smallest load unit being a configuration frame of the bitstream (device size dependent). Partial reconfiguration is useful for applications that require different designs to be loaded into the same area of a chip, or that require the ability to change portions of a design without having to reset or reconfigure the entire chip.
Revision History
This section records the change history for this module of the data sheet. Date 11/07/00 12/06/00 01/15/01 01/25/01 Version 1.0 1.1 1.2 1.3 Early access draft. Initial release. Added values to the tables in the Virtex-II Performance Characteristics and Virtex-II Switching Characteristics sections. The data sheet was divided into four modules (per the current style standard). A note was added to Table 1. 04/02/01 1.5 10/02/01 10/12/01 11/29/01 07/16/02 09/26/02 12/06/02 1.7 1.8 1.9 2.0 2.1 2.1.1 Under Input/Output Individual Options, the range of values for optional pull-up and pull-down resistors was changed to 10 - 60 K from 50 - 100 K. Skipped v1.4 to sync up modules. Reverted to traditional double-column format. Added Table 6. Changed definition of multiply and divide integer ranges under Digital Clock Manager (DCM). Made numerous minor edits throughout this module. Updated descriptions under Digitally Controlled Impedance (DCI), Global Clock Multiplexer Buffers, Digital Clock Manager (DCM), and Creating a Design. Made clarifying edits under Digital Clock Manager (DCM). Changed bitstream lengths for each device in Table 25. Updated compatible input standards listed in Table 6. Changed number of resources available to the XC2V40 device in Table 12. Clarified Power On Reset information under Configuration Sequence. Cosmetic edits. Added qualification note to Figure 13, page 11. Corrected sentence in section Input/Output Individual Options, page 4, to read The optional weak-keeper circuit is connected to each user I/O pad. Corrected typographical errors in Table 3 for names of HSTL_[x]_DCI_18 standards. Revision
07/30/01
1.6
05/07/03
2.1.2
Module 2 of 4 39
Date
Version
Revision Removed Compatible Output Standards and Compatible Input Standards tables. Added new Table 5, Summary of Voltage Supply Requirements for All Input and Output Standards. This table replaces deleted I/O standards tables. Added section Rules for Combining I/O Standards in the Same Bank, page 6.
06/19/03
2.2
08/01/03 10/14/03
3.0 3.1
All Virtex-II devices and speed grades now Production. See Table 13, Module 3. Added section Local Clocking, page 30. Table 1, page 1: - Added SSTL18_I and SSTL18_II. - Corrected names of 1.8V HSTL_I-IV standards to HSTL_I-IV_18. - Corrected Input VREF for HSTL_III-IV_18 from 1.08V to 1.1V. - Changed N/A to N/R (no requirement). Table 2, page 2: - Changed N/A to N/R (no requirement). Table 3, page 2: - Added SSTL18_I_DCI, SSTL18_II_DCI, LVDS_33_DCI, LVDSEXT_33_DCI, LVDS_25_DCI, and LVDSEXT_25_DCI. - Corrected Input VREF for HSTL_III-IV_18 from 1.08V to 1.1V. Sections Slave-Serial Mode and Master-Serial Mode, page 37: Changed "rising" to "falling" edge with respect to DOUT. Added verbiage to section Bitstream Encryption, page 39: For devices that support this feature, please contact your sales representative for specific ordering part number.

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38
Virtex-II Platform FPGAs: DC and Switching Characteristics

0 0
DS031-3 (v3.1) October 14, 2003
Virtex-II Electrical Characteristics

Virtex-II devices are provided in -6, -5, and -4 speed grades, with -6 having the highest performance. Virtex-II DC and AC characteristics are specified for both commercial and industrial grades. Except the operating temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -4 speed grade industrial device are the same as for a -4 speed grade commercial device). However, only selected speed grades and/or devices might be available in the industrial range. All supply voltage and junction temperature specifications are representative of worst-case conditions. The parameters included are common to popular designs and typical applications. Contact Xilinx for design considerations requiring more detailed information. All specifications are subject to change without notice.
Virtex-II DC Characteristics
Table 1: Absolute Maximum Ratings Symbol VCCINT VCCAUX VCCO VBATT VREF VIN (3) VTS TSTG TSOL TJ Description(1) Internal supply voltage relative to GND Auxiliary supply voltage relative to GND Output drivers supply voltage relative to GND Key memory battery backup supply Input reference voltage Input voltage relative to GND (user and dedicated I/Os) Voltage applied to 3-state output (user and dedicated I/Os) Storage temperature (ambient) Maximum soldering temperature (2) Maximum junction temperature (2)
0.5 to 1.65 0.5 to 4.0 0.5 to 4.0 0.5 to 4.0 0.5 to VCCO + 0.5 0.5 to VCCO + 0.5 0.5 to 4.0 65 to +150
Units V V V V V V V C C C
+220 +125
Notes: 1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability. 2. For soldering guidelines and thermal considerations, see the Device Packaging information on the Xilinx website. 3. Inputs configured as PCI are fully PCI compliant. This statement takes precedence over any specification that would imply that the device is not PCI compliant.
Module 3 of 4 1
Table 2: Recommended Operating Conditions Symbol VCCINT Description Internal supply voltage relative to GND, TJ = 0 C to +85C Internal supply voltage relative to GND, TJ = 40C to +100C Auxiliary supply voltage relative to GND, TJ = 0 C to +85C Auxiliary supply voltage relative to GND, TJ = 40C to +100C Supply voltage relative to GND, TJ = 0 C to +85C Supply voltage relative to GND, TJ = 40C to +100C Battery voltage relative to GND, TJ = 0 C to +85C Battery voltage relative to GND, TJ = 40C to +100C Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Min 1.425 1.425 3.135 3.135 1.2 1.2 1.0 1.0 Max 1.575 1.575 3.465 3.465 3.6 3.6 3.6 3.6 Units V V V V V V V V
VCCAUX
VCCO
VBATT
Notes: 1. If battery is not used, do not connect VBATT. 2. Recommended maximum voltage droop for VCCAUX is 10 mV/ms. 3. The thresholds for Power On Reset are VCCINT > 1.2V, VCCAUX > 2.5V, and VCCO (Bank 4) > 1.5 V. 4. Limit the noise at the power supply to be within 200 mV peak-to-peak. 5. For power bypassing guidelines, see XAPP623 at www.xilinx.com.
Table 3: DC Characteristics Over Recommended Operating Conditions Symbol VDRINT VDRI IREF IL CIN IRPU IRPD IBATT Description Data retention VCCINT voltage Data retention VCCAUX voltage VREF current per bank Input leakage current Input capacitance Pad pull-up (when selected) @ VIN = 0 V, VCCO = 3.3 V (sample tested) Pad pull-down (when selected) @ VIN = 3.6 V (sample tested) Battery supply current Device All All All All All All All All Note 1 Note 1 Min 1.2 2.5
10 10
Max
Units V V
+10 +10 10 250 250 100
A A pF A A nA
Notes: 1. Internal pull-up and pull-down resistors guarantee valid logic levels at unconnected input pins. These pull-up and pull-down resistors do not guarantee valid logic levels when input pins are connected to other circuits.
Module 3 of 4 2
Table 4: Quiescent Supply Current Symbol Description Quiescent VCCINT supply current Device
XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000
Min
Typical
50 50 65 80 100 125 150 200 225 250 300 1 1 1 1 1 2 2 2 2 2 2 10 10 10 10 10 15 15 20 20 25 25
Max
TBD 125 150 200 250 350 400 500 650 800 1100 TBD 2 2 2 2 4 4 4 4 4 4 TBD 25 25 25 25 50 50 75 75 100 100
Units
ICCINTQ
mA
Quiescent VCCO supply current(1,2)
ICCOQ
mA
Quiescent VCCAUX supply current(1,2)
ICCAUXQ
mA
Notes: 1. With no output current loads, no active input pull-up resistors, all I/O pins are 3-state and floating. 2. If DCI or differential signaling is used, more accurate values can be obtained by using the Power Estimator or XPOWER. 3. Data are retained even if VCCO drops to 0 V. 4. Values specified for quiescent supply current parameters are Commercial Grade. For Industrial Grade values, multiply Commercial Grade values by 1.25.
Power-On Power Supply Requirements

Xilinx FPGAs require a certain amount of supply current during power-on to insure proper device operation. The actual current consumed depends on the power-on ramp rate of the power supply. The VCCINT, VCCAUX, and VCCO power supplies shall each ramp on no faster than 200 s and no slower than 50 ms. Ramp on is defined as: 0 VDC to minimum supply voltages. Table 5 shows the minimum current required by Virtex-II devices for proper power on and configuration. Power supplies can be turned on in any sequence.
If any VCCO bank powers up before VCCAUX, then each bank draws up to 300 mA, worst case, until the VCCAUX powers on(1). This does not harm the device. If the current is limited to the minimum value above, or larger, the device powers on properly after all three supplies have passed through their power on reset threshold voltages. Once initialized and configured, use the power calculator to estimate current drain on these supplies.
Notes: 1. The 300 mA is transient current (peak); it eventually disappears even if VCCAUX does not power up.
Module 3 of 4 3
Table 5: Minimum Power On Current Required for Virtex-II Devices

Device (mA) XC2V40, XC2V80, XC2V250, XC2V500 ICCINTMIN ICCAUXMIN ICCOMIN 200 100 50 XC2V1000 250 100 50 XC2V1500 350 100 100 XC2V2000 400 100 100 XC2V3000 500 100 100 XC2V4000 650 100 100 XC2V6000 800 100 100 XC2V8000 1100 100 100
Notes: 1. Values specified for power on current parameters are Commercial Grade. For Industrial Grade values, multiply Commercial Grade values by 1.25. 2. ICCOMIN values listed here apply to the entire device (all banks).
General Power Supply Requirements

Proper decoupling of all FPGA power supplies is sessential. Consult Xilinx Application Note XAPP623 for detailed information on power distribution system design. VCCAUX powers critical resources in the FPGA. Thus, VCCAUX is especially susceptible to power supply noise. Changes in VCCAUX voltage outside of 200 mV peak to peak should take place at a rate no faster than 10 mV per millisecond. Techniques to help reduce jitter and period distortion are provided in Xilinx Answer Record 13756, available at www.support.xilinx.com. VCCAUX can share a power plane with 3.3V VCCO, but only if VCCO does not have excessive noise. Using simultaneously switching output (SSO) limits are essential for keeping power supply noise to a minimum. Refer to XAPP689, Managing Ground Bounce in Large FPGAs, to determine the number of simultaneously switching outputs allowed per bank at the package level.
DC Input and Output Levels

Values for VIL and VIH are recommended input voltages. Values for IOL and IOH are guaranteed over the recommended operating conditions at the VOL and VOH test points. Only selected standards are tested. These are choTable 6: DC Input and Output Levels Input/Output Standard
LVTTL(1) LVCMOS33 LVCMOS25 LVCMOS18 LVCMOS15 PCI33_3 PCI66_3 PCIX GTLP GTL HSTL I HSTL II HSTL III HSTL IV
sen to ensure that all standards meet their specifications. The selected standards are tested at minimum VCCO with the respective VOL and VOH voltage levels shown. Other standards are sample tested.
VIL V, Min
0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5
VIH V, Min
2.0 2.0 1.7 65% VCCO 65% VCCO 50% VCCO 50% VCCO Note 2 VREF + 0.1 VREF + 0.05 VREF + 0.1 VREF + 0.1 VREF + 0.1 VREF + 0.1
VOL V, Max
3.6 3.6 2.7 1.95 1.7 VCCO + 0.5 VCCO + 0.5 Note 2 VCCO + 0.5 VCCO + 0.5 VCCO + 0.5 VCCO + 0.5 VCCO + 0.5 VCCO + 0.5
VOH V, Min
2.4 VCCO 0.4 VCCO 0.4 VCCO 0.4 VCCO 0.4 90% VCCO 90% VCCO Note 2 n/a n/a VCCO 0.4 VCCO 0.4 VCCO 0.4 VCCO 0.4
IOL mA
24 24 24 16 16 Note 2 Note 2 Note 2 36 40 8 16 24 48
IOH mA
24 24 24 16 16 Note 2 Note 2 Note 2 n/a n/a 8 16 8 8
V, Max
0.8 0.8 0.7 35% VCCO 35% VCCO 30% VCCO 30% VCCO Note 2 VREF 0.1 VREF 0.05 VREF 0.1 VREF 0.1 VREF 0.1 VREF 0.1
V, Max
0.4 0.4 0.4 0.4 0.4 10% VCCO 10% VCCO Note 2 0.6 0.4 0.4 0.4 0.4 0.4
Module 3 of 4 4
Table 6: DC Input and Output Levels (Continued) Input/Output Standard

SSTL3 I SSTL3 II SSTL2 I SSTL2 II AGP
VIL V, Min
0.5 0.5 0.5 0.5 0.5
VIH V, Min
VREF + 0.2 VREF + 0.2 VREF + 0.15 VREF + 0.15 VREF + 0.2
VOL V, Max
VCCO + 0.5 VCCO + 0.5 VCCO + 0.5 VCCO + 0.5 VCCO + 0.5
VOH V, Min
VREF + 0.6 VREF + 0.8 VREF + 0.65 VREF + 0.80 90% VCCO
IOL mA
8 16 7.6 15.2 Note 2
IOH mA
8 16 7.6 15.2 Note 2
V, Max
VREF 0.2 VREF 0.2 VREF 0.15 VREF 0.15 VREF 0.2
V, Max
VREF 0.6 VREF 0.8 VREF 0.65 VREF 0.80 10% VCCO
Notes: 1. VOL and VOH for lower drive currents are sample tested. The DONE pin is always LVTTL 12 mA. 2. Tested according to the relevant specifications. 3. LVTTL and LVCMOS inputs have approximately 100 mV of hysteresis.
LDT Differential Signal DC Specifications (LDT_25)

Table 7: LDT DC Specifications DC Parameter Differential Output Voltage Change in VOD Magnitude Output Common Mode Voltage Change in VOS Magnitude Input Differential Voltage Change in VID Magnitude Input Common Mode Voltage Change in VICM Magnitude Symbol VOD VOD VOCM VOCM VID VID VICM VICM RT = 100 across Q and Q signals Conditions RT = 100 across Q and Q signals Min 500
15
Typ 600
Max 700 15
Units mV mV mV mV mV mV mV mV
560
15
600
640 15
200
15
600
1000 15
500
15
600
700 15
LVDS DC Specifications (LVDS_33 & LVDS_25)

Table 8: LVDS DC Specifications
DC Parameter Supply Voltage Output High Voltage for Q and Q Output Low Voltage for Q and Q Differential Output Voltage (Q Q), Q = High (Q Q), Q = High Output Common-Mode Voltage Differential Input Voltage (Q Q), Q = High (Q Q), Q = High Input Common-Mode Voltage Symbol VCCO VOH VOL VODIFF VOCM VIDIFF VICM RT = 100 across Q and Q signals RT = 100 across Q and Q signals RT = 100 across Q and Q signals RT = 100 across Q and Q signals Common-mode input voltage = 1.25 V Differential input voltage = 350 mV 0.925 250 1.125 100 0.2 350 1.2 350 1.25 400 1.375 N/A VCCO 0.5 Conditions Min Typ 3.3 or 2.5 1.575 Max Units V V V mV V mV V
Module 3 of 4 5
Extended LVDS DC Specifications (LVDSEXT_33 & LVDSEXT_25)

Table 9: Extended LVDS DC Specifications
DC Parameter Supply Voltage Output High voltage for Q and Q Output Low voltage for Q and Q Differential output voltage (Q Q), Q = High (Q Q), Q = High Output common-mode voltage Differential input voltage (Q Q), Q = High (Q Q), Q = High Input common-mode voltage Symbol VCCO VOH VOL VODIFF VOCM VIDIFF VICM RT = 100 across Q and Q signals RT = 100 across Q and Q signals RT = 100 across Q and Q signals RT = 100 across Q and Q signals Common-mode input voltage = 1.25 V Differential input voltage = 350 mV 0.705 440 1.125 100 0.2 1.200 350 1.25 820 1.375 N/A VCCO 0.5 Conditions Min Typ 3.3 or 2.5 1.785 Max Units V V V mV V mV V
LVPECL DC Specifications
These values are valid when driving a 100 differential load only, i.e., a 100 resistor between the two receiver pins. The VOH levels are 200 mV below standard LVPECL levels and are compatible with devices tolerant of lower Table 10: LVPECL DC Specifications DC Parameter VCCO VOH VOL VIH VIL Differential Input Voltage 1.8 0.96 1.49 0.86 0.3 Min 3.0 2.11 1.27 2.72 2.125
common-mode ranges. Table 10 summarizes the DC output specifications of LVPECL. For more information on using LVPECL, see the Virtex-II User Guide.
Max
Min 3.3 1.92 1.06 1.49 0.86 0.3
Max
Min 3.6
Max
Units V
2.28 1.43 2.72 2.125
2.13 1.30 1.49 0.86 0.3
2.41 1.57 2.72 2.125
V V V V V
Module 3 of 4 6
Virtex-II Performance Characteristics

This section provides the performance characteristics of some common functions and designs implemented in Virtex-II devices. The numbers reported here are worst-case values; they have all been fully characterized. Note that these values are subject to the same guidelines as Virtex-II Switching Characteristics, page 9 (speed files). Table 11: Pin-to-Pin Performance Description Basic Functions 16-bit Address Decoder 32-bit Address Decoder 64-bit Address Decoder 4:1 MUX 8:1 MUX 16:1 MUX 32:1 MUX Combinatorial (pad to LUT to pad) Memory
Block RAM
XC2V1000 -5 XC2V1000 -5 XC2V1000 -5 XC2V1000 -5 XC2V1000 -5 XC2V1000 -5 XC2V1000 -5 XC2V1000 -5 6.3 7.7 9.3 5.7 6.5 6.7 8.7 5.0 ns ns ns ns ns ns ns ns
Table 11 provides pin-to-pin values (in nanoseconds) including IOB delays; that is, delay through the device from input pin to output pin. In the case of multiple inputs and outputs, the worst delay is reported.
Device Used & Speed Grade
Pin-to-Pin (with I/O delays)
Units
Pad to setup Clock to Pad

Distributed RAM
1.6 9.5
ns ns
Pad to setup Clock to Pad
XC2V1000 -5 XC2V1000 -5
2.7 5.1 (no clk skew)
ns ns
Table 12 shows internal (register-to-register) performance. Values are reported in MHz. Table 12: Register-to-Register Performance Description Basic Functions 16-bit Address Decoder 32-bit Address Decoder 64-bit Address Decoder 4:1 MUX 8:1 MUX 16:1 MUX 32:1 MUX Register to LUT to Register
XC2V1000 -5 XC2V1000 -5 XC2V1000 -5 XC2V1000 -5 XC2V1000 -5 XC2V1000 -5 XC2V1000 -5 XC2V1000 -5 398 291 274 563 454 414 323 613 MHz MHz MHz MHz MHz MHz MHz MHz
Register-to-Register Performance
Units
Module 3 of 4 7
Table 12: Register-to-Register Performance (Continued) Description 8-bit Adder 16-bit Adder 64-bit Adder 64-bit Counter 64-bit Accumulator Multiplier 18x18 (with Block RAM inputs) Multiplier 18x18 (with Register inputs) Memory
Block RAM

XC2V1000 -5 XC2V1000 -5 XC2V1000 -5 XC2V1000 -5 XC2V1000 -5 XC2V1000 -5 XC2V1000 -5
Register-to-Register Performance
292 239 114 114 110 88 105
Units
MHz MHz MHz MHz MHz MHz MHz
Single-Port 4096 x 4 bits Single-Port 2048 x 9 bits Single-Port 1024 x 18 bits Single-Port 512 x 36 bits Dual-Port A:4096 x 4 bits & B:1024 x 18 bits Dual-Port A:1024 x 18 bits & B:1024 x 18 bits Dual-Port A:2048 x 9 bits & B: 512 x 36 bits
Distributed RAM
278 277 270 253 257 259 250
MHz MHz MHz MHz MHz MHz MHz
Single-Port 32 x 8-bit Single-Port 64 x 8-bit Single-Port 128 x 8-bit Dual-Port 16 x 8 Dual-Port 32 x 8 Dual-Port 64 x 8
Shift Registers
XC2V1000 -5 XC2V1000 -5 XC2V1000 -5 XC2V1000 -5 XC2V1000 -5 XC2V1000 -5
387 335 266 409 311 294
MHz MHz MHz MHz MHz MHz
128-bit SRL 256-bit SRL

FIFOs (Async. in Block RAM)
N/A N/A
MHz MHz
1024 x 18-bit Read 1024 x 18-bit Write

FIFOs (Sync. in SRL)
279 172
MHz MHz
128 x 8-bit 128 x 16-bit
N/A N/A
MHz MHz
Module 3 of 4 8
Virtex-II Switching Characteristics

Switching characteristics in this document are specified on a per-speed-grade basis and can be designated as Advance, Preliminary, or Production. Note that Virtex-II Performance Characteristics, page 7 are subject to these guidelines as well. Each designation is defined as follows: Advance: These speed files are based on simulations only and are typically available soon after device design specifications are frozen. Although speed grades with this designation are considered relatively stable and conservative, some under-reporting might still occur. Preliminary: These speed files are based on complete ES (engineering sample) silicon characterization. Devices and speed grades with this designation are intended to give a better indication of the expected performance of production silicon. The probability of under-reporting delays is greatly reduced as compared to Advance data. Production: These speed files are released once enough production silicon of a particular device family member has been characterized to provide full correlation between speed files and devices over numerous production lots. There is no under-reporting of delays, and customers receive formal notification of any subsequent changes. Typically, the slowest speed grades transition to Production before faster speed grades. Since individual family members are produced at different times, the migration from one category to another depends completely on the status of the fabrication process for each device. Table 13 correlates the current status of each Virtex-II device with a corresponding speed grade designation. All specifications are always representative of worst-case supply voltage and junction temperature conditions. Table 14: IOB Input Switching Characteristics Speed Grade Description Propagation Delays Pad to I output, no delay Pad to I output, with delay
TIOPI TIOPID All XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 0.69 1.92 1.92 1.92 1.92 1.92 1.92 1.92 1.97 1.97 2.10 0.76 2.11 2.11 2.11 2.11 2.11 2.11 2.11 2.16 2.16 2.31 2.31 0.88 2.43 2.43 2.43 2.43 2.43 2.43 2.43 2.49 2.49 2.66 2.66 ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max
Testing of Switching Characteristics

All devices are 100% functionally tested. Internal timing parameters are derived from measuring internal test patterns. Listed below are representative values. For more specific, more precise, and worst-case guaranteed data, use the values reported by the Xilinx static timing analyzer and back-annotate to the simulation net list. Unless otherwise noted, values apply to all Virtex-II devices.
IOB Input Switching Characteristics

Input delays associated with the pad are specified for LVTTL levels. For other standards, adjust the delays with the values shown in IOB Input Switching Characteristics Standard Adjustments, page 11. Table 13: Virtex-II Device Speed Grade Designations Speed Grade Designations Device
XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000
Advance
Preliminary
Production
-6, -5, -4 -6, -5, -4 -6, -5, -4 -6, -5, -4 -6, -5, -4 -6, -5, -4 -6, -5, -4 -6, -5, -4 -6, -5, -4 -6, -5, -4 -5, -4
Symbol
Device
-6
-5
-4
Units
Module 3 of 4 9
Table 14: IOB Input Switching Characteristics (Continued) Speed Grade Description Propagation Delays Pad to output IQ via transparent latch, no delay Pad to output IQ via transparent latch, with delay
TIOPLI TIOPLID All XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 0.83 3.23 3.23 3.23 3.23 3.23 3.23 3.23 3.32 3.32 3.60 0.91 3.55 3.55 3.55 3.55 3.55 3.55 3.55 3.65 3.65 3.95 3.95 0.67 1.05 4.09 4.09 4.09 4.09 4.09 4.09 4.09 4.20 4.20 4.55 4.55 0.77 ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max
Symbol
Device
-6
-5
-4
Units
Clock CLK to output IQ
TIOCKIQ
All
Setup and Hold Times With Respect to Clock at IOB Input Register Pad, no delay Pad, with delay
TIOPICK/TIOICKP TIOPICKD/TIOICKPD All XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 0.84/0.36 3.24/2.04 3.24/2.04 3.24/2.04 3.24/2.04 3.24/2.04 3.24/2.04 3.24/2.04 3.33/2.10 3.33/2.10 3.61/2.29 0.92/0.39 3.57/2.24 3.57/2.24 3.57/2.24 3.57/2.24 3.57/2.24 3.57/2.24 3.57/2.24 3.67/2.31 3.67/2.31 3.97/2.52 3.97/2.52 0.21/ 0.04 0.27 0.30 1.06/0.45 4.10/2.58 4.10/2.58 4.10/2.58 4.10/2.58 4.10/2.58 4.10/2.58 4.10/2.58 4.22/2.66 4.22/2.66 4.56/2.90 4.56/2.90 0.24/ 0.04 0.34 ns, Min ns, Min ns, Min ns, Min ns, Min ns, Min ns, Min ns, Min ns, Min ns, Min ns, Min ns, Min ns, Min ns, Min
ICE input SR input (IFF, synchronous) Set/Reset Delays SR input to IQ (asynchronous) GSR to output IQ
TIOICECK/TIOCKICE TIOSRCKI TIOSRIQ TGSRQ
All All
All All
1.11 5.44
1.22 5.98
1.40 6.88
ns, Max ns, Max
Notes: 1. Input timing for LVTTL is measured at 1.4 V. For other I/O standards, see Table 18.
Module 3 of 4 10
IOB Input Switching Characteristics Standard Adjustments

Table 15: IOB Input Switching Characteristics Standard Adjustments Speed Grade Description Data Input Delay Adjustments Standard-specific data input delay adjustments TILVTTL TILVCMOS33 TILVCMOS25 TILVCMOS18 TILVCMOS15 TILVDS_25 TILVDS_33 TILVPECL_33 TIPCI33_3 TIPCI66_3 TIPCIX TIGTL TIGTLP TIHSTL_I TIHSTL_II TIHSTL_III TIHSTL_IV TIHSTL_I_18 TIHSTL_II_18 TIHSTL_III_18 TIHSTL_IV_18 TISSTL2_I TISSTL2_II TISSTL3_I TISSTL3_II TIAGP TILVDCI_33 TILVDCI_25 TILVDCI_18 LVTTL LVCMOS33 LVCMOS25 LVCMOS18 LVCMOS15 LVDS_25 LVDS_33 LVPECL PCI, 33 MHz, 3.3 V PCI, 66 MHz, 3.3 V PCIX, 133 MHz, 3.3 V GTL GTLP HSTL I HSTL II HSTL III HSTL IV HSTL I_18 HSTL II_18 HSTL III_18 HSTL IV_18 SSTL2 I SSTL2 II SSTL3 I SSTL3 II AGP LVDCI_33 LVDCI_25 LVDCI_18
0.00 0.00 0.11 0.42 0.98 0.60 0.60 0.60 0.00 0.00 0.00 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.35 0.35 0.35 0.00 0.11 0.42 0.00 0.00 0.11 0.43 1.00 0.60 0.60 0.60 0.00 0.00 0.00 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.35 0.35 0.35 0.00 0.11 0.43 0.00 0.00 0.12 0.49 1.15 0.69 0.69 0.69 0.00 0.00 0.00 0.48 0.48 0.48 0.48 0.48 0.48 0.48 0.48 0.48 0.48 0.48 0.48 0.40 0.40 0.40 0.00 0.12 0.49
Symbol
Standard
-6
-5
-4
Units
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Module 3 of 4 11
Table 15: IOB Input Switching Characteristics Standard Adjustments (Continued) Speed Grade Description Symbol TILVDCI_15 TILVDCI_DV2_33 TILVDCI_DV2_25 TILVDCI_DV2_18 TILVDCI_DV2_15 TIGTL_DCI TIGTLP_DCI TIHSTL_I_DCI TIHSTL_II_DCI TIHSTL_III_DCI TIHSTL_IV_DCI TIHSTL_I_DCI_18 TIHSTL_II_DCI_18 TIHSTL_III_DCI_18 TIHSTL_IV_DCI_18 TISSTL2_I_DCI TISSTL2_II_DCI TISSTL3_I_DCI TISSTL3_II_DCI TILDT_25 TIULVDS_25 Standard LVDCI_15 LVDCI_DV2_33 LVDCI_DV2_25 LVDCI_DV2_18 LVDCI_DV2_15 GTL_DCI GTLP_DCI HSTL_I_DCI HSTL_II_DCI HSTL_III_DCI HSTL_IV_DCI HSTL_I_DCI_18 HSTL_II_DCI_18 HSTL_III_DCI_18 HSTL_IV_DCI_18 SSTL2_I_DCI SSTL2_II_DCI SSTL3_I_DCI SSTL3_II_DCI LDT_25 ULVDS_25
-6 0.98 0.00 0.11 0.42 0.98 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.35 0.35 0.48 0.48 -5 1.00 0.00 0.11 0.43 1.00 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.42 0.35 0.35 0.49 0.49 -4 1.14 0.00 0.12 0.49 1.14 0.48 0.48 0.48 0.48 0.48 0.48 0.48 0.48 0.48 0.48 0.48 0.48 0.40 0.40 0.56 0.56
Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Notes: 1. Input timing for LVTTL is measured at 1.4 V. For other I/O standards, see Table 18.
Module 3 of 4 12
IOB Output Switching Characteristics

Output delays terminating at a pad are specified for LVTTL with 12 mA drive and fast slew rate. For other standards, adjust the delays with the values shown in IOB Output Switching Characteristics Standard Adjustments, page 14. Table 16: IOB Output Switching Characteristics Speed Grade Description Propagation Delays O input to Pad O input to Pad via transparent latch 3-State Delays T input to Pad high-impedance(1) T input to valid data on Pad T input to Pad high-impedance via transparent latch(1) T input to valid data on Pad via transparent latch GTS to Pad high impedance(1) Sequential Delays Clock CLK to Pad Clock CLK to Pad high-impedance (synchronous)(1) Clock CLK to valid data on Pad (synchronous) Setup and Hold Times Before/After Clock CLK O input OCE input SR input (OFF) 3State Setup Times, T input 3State Setup Times, TCE input 3State Setup Times, SR input (TFF) Set/Reset Delays SR input to Pad (asynchronous) SR input to Pad high-impedance (asynchronous)(1) SR input to valid data on Pad (asynchronous) GSR to Pad
Notes: 1. The 3-state turn-off delays should not be adjusted.
Symbol
-6
-5
-4
Units
TIOOP TIOOLP
1.43 1.72
1.51 1.83
1.74 2.11
ns, Max ns, Max
TIOTHZ TIOTP TIOTLPHZ TIOTLPON TGTS
0.51 1.38 0.80 1.67 4.73
0.56 1.45 0.88 1.77 5.20
0.64 1.67 1.01 2.04 5.98
ns, Max ns, Max ns, Max ns, Max ns, Max
TIOCKP TIOCKHZ TIOCKON
1.76 0.95
1.87 1.04
2.15 1.20
ns, Max ns, Max ns, Max
1.82
1.94
2.22
TIOOCK/TIOCKO TIOOCECK/TIOCKOCE TIOSRCKO/TIOCKOSR TIOTCK/TIOCKT TIOTCECK/TIOCKTCE TIOSRCKT/TIOCKTSR
0.31/0.08 0.19/0.06 0.27/0.05 0.28/0.06 0.19/0.06 0.27/0.05
0.34/0.09 0.21/0.07 0.30/0.06 0.31/0.07 0.21/0.07 0.30/0.06
0.39/0.11 0.24/0.08 0.34/0.07 0.35/0.08 0.24/0.08 0.34/0.07
ns, Min ns, Min ns, Min ns, Min ns, Min ns, Min
TIOSRP TIOSRHZ TIOSRON TIOGSRQ
2.41 1.52 2.39 5.44
2.59 1.67 2.56 5.98
2.98 1.92 2.95 6.88
ns, Max ns, Max ns, Max ns, Max
Module 3 of 4 13
IOB Output Switching Characteristics Standard Adjustments

Output delays terminating at a pad are specified for LVTTL with 12 mA drive and fast slew rate. For other standards, adjust the delays by the values shown. Table 17: IOB Output Switching Characteristics Standard Adjustments
Speed Grade Description Output Delay Adjustments Standard-specific adjustments for output delays terminating at pads (based on standard capacitive load, Csl) TOLVTTL_S2 TOLVTTL_S4 TOLVTTL_S6 TOLVTTL_S8 TOLVTTL_S12 TOLVTTL_S16 TOLVTTL_S24 TOLVTTL_F2 TOLVTTL_F4 TOLVTTL_F6 TOLVTTL_F8 TOLVTTL_F12 TOLVTTL_F16 TOLVTTL_F24 TOLVDS_25 TOLVDS_33 TOLVDSEXT_25 TOLVDSEXT_33 TOLDT_25 TOBLVDS_25 TOULVDS_25 TOLVPECL_33 TOPCI33_3 TOPCI66_3 TOPCIX TOGTL TOGTLP TOHSTL_I TOHSTL_II TOHSTL_III TOHSTL_IV TOHSTL_I_18 TOHSTL_II_18 TOHSTL_III_18 TOHSTL_IV_18 LVTTL, Slow, 2 mA 4 mA 6 mA 8 mA 12 mA 16 mA 24 mA LVTTL, Fast, 2 mA 4 mA 6 mA 8 mA 12 mA 16 mA 24 mA LVDS LVDS LVDS LVDS LDT BLVDS ULVDS LVPECL PCI, 33 MHz, 3.3 V PCI, 66 MHz, 3.3 V PCIX, 133 MHz, 3.3 V GTL GTLP HSTL I HSTL II HSTL III HSTL IV HSTL I_18 HSTL II_18 HSTL III_18 HSTL IV_18 9.42 5.77 4.11 2.87 2.32 1.70 1.26 6.52 2.80 1.57 0.46 0.00 0.13 0.22 0.31 0.25 0.18 0.17 0.20 0.67 0.20 0.29 1.15 0.01 0.01 0.31 0.17 0.26 0.15 0.17 0.40 0.03 0.17 0.16 0.39 9.71 5.95 4.24 2.96 2.39 1.75 1.30 6.72 2.88 1.62 0.48 0.00 0.14 0.23 0.32 0.26 0.19 0.18 0.21 0.69 0.21 0.30 1.19 0.01 0.01 0.32 0.18 0.27 0.16 0.17 0.41 0.03 0.18 0.16 0.40 10.68 6.55 4.66 3.26 2.63 1.93 1.43 7.39 3.17 1.78 0.52 0.00 0.15 0.26 0.36 0.29 0.21 0.19 0.23 0.76 0.23 0.33 1.31 0.01 0.01 0.36 0.20 0.29 0.17 0.19 0.45 0.04 0.20 0.18 0.44 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Symbol Standard -6 -5 -4 Units
Module 3 of 4 14
Table 17: IOB Output Switching Characteristics Standard Adjustments (Continued)

Speed Grade Description Symbol TOSSTL2_I TOSSTL2_II TOSSTL3_I TOSSTL3_II TOAGP TOLVCMOS33_S2 TOLVCMOS33_S4 TOLVCMOS33_S6 TOLVCMOS33_S8 TOLVCMOS33_S12 TOLVCMOS33_S16 TOLVCMOS33_S24 TOLVCMOS33_F2 TOLVCMOS33_F4 TOLVCMOS33_F6 TOLVCMOS33_F8 TOLVCMOS33_F12 TOLVCMOS33_F16 TOLVCMOS33_F24 TOLVCMOS25_S2 TOLVCMOS25_S4 TOLVCMOS25_S6 TOLVCMOS25_S8 TOLVCMOS25_S12 TOLVCMOS25_S16 TOLVCMOS25_S24 TOLVCMOS25_F2 TOLVCMOS25_F4 TOLVCMOS25_F6 TOLVCMOS25_F8 TOLVCMOS25_F12 TOLVCMOS25_F16 TOLVCMOS25_F24 TOLVCMOS18_S2 TOLVCMOS18_S4 TOLVCMOS18_S6 TOLVCMOS18_S8 TOLVCMOS18_S12 TOLVCMOS18_S16 TOLVCMOS18_F2 DS031-3 (v3.1) October 14, 2003 Product Specification Standard SSTL2 I SSTL2 II SSTL3 I SSTL3 II AGP LVCMOS33, Slow, 2 mA 4 mA 6 mA 8 mA 12 mA 16 mA 24 mA LVCMOS33, Fast, 2 mA 4 mA 6 mA 8 mA 12 mA 16 mA 24 mA LVCMOS25, Slow, 2 mA 4 mA 6 mA 8 mA 12 mA 16 mA 24 mA LVCMOS25, Fast, 2 mA 4 mA 6 mA 8 mA 12 mA 16 mA 24 mA LVCMOS18, Slow, 2 mA 4 mA 6 mA 8 mA 12 mA 16 mA LVCMOS18, Fast, 2 mA -6 0.21 0.15 0.29 0.05 0.27 7.67 4.37 3.34 2.29 1.91 1.24 1.18 5.82 2.48 1.28 0.48 0.27 0.14 0.21 9.11 5.00 4.53 3.86 2.84 2.36 2.00 4.06 1.15 0.72 0.33 0.02 0.18 0.35 15.62 10.20 7.52 6.87 5.54 5.31 5.55 -5 0.22 0.16 0.30 0.05 0.28 7.91 4.50 3.44 2.36 1.97 1.27 1.22 6.00 2.55 1.31 0.49 0.28 0.14 0.21 9.39 5.16 4.67 3.98 2.93 2.43 2.06 4.18 1.18 0.74 0.34 0.02 0.19 0.36 16.10 10.51 7.75 7.08 5.71 5.47 5.72 -4 0.24 0.18 0.33 0.05 0.31 8.70 4.95 3.78 2.60 2.16 1.40 1.34 6.60 2.81 1.45 0.54 0.31 0.15 0.23 10.33 5.67 5.13 4.38 3.22 2.67 2.27 4.60 1.30 0.81 0.37 0.03 0.21 0.40 17.71 11.57 8.53 7.78 6.28 6.02 6.30 Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Module 3 of 4 15
Table 17: IOB Output Switching Characteristics Standard Adjustments (Continued)

Speed Grade Description Symbol TOLVCMOS18_F4 TOLVCMOS18_F6 TOLVCMOS18_F8 TOLVCMOS18_F12 TOLVCMOS18_F16 TOLVCMOS15_S2 TOLVCMOS15_S4 TOLVCMOS15_S6 TOLVCMOS15_S8 TOLVCMOS15_S12 TOLVCMOS15_S16 TOLVCMOS15_F2 TOLVCMOS15_F4 TOLVCMOS15_F6 TOLVCMOS15_F8 TOLVCMOS15_F12 TOLVCMOS15_F16 TOLVDCI_33 TOLVDCI_25 TOLVDCI_18 TOLVDCI_15 TOLVDCI_DV2_33 TOLVDCI_DV2_25 TOLVDCI_DV2_18 TOLVDCI_DV2_15 TOGTL_DCI TOGTLP_DCI TOHSTL_I_DCI TOHSTL_II_DCI TOHSTL_III_DCI TOHSTL_IV_DCI TOHSTL_I_DCI_18 TOHSTL_II_DCI_18 TOHSTL_III_DCI_18 TOHSTL_IV_DCI_18 TOSSTL2_I_DCI TOSSTL2_II_DCI TOSSTL3_I_DCI TOSSTL3_II_DCI Standard 4 mA 6 mA 8 mA 12 mA 16 mA LVCMOS15, Slow, 2 mA 4 mA 6 mA 8 mA 12 mA 16 mA LVCMOS15, Fast, 2 mA 4 mA 6 mA 8 mA 12 mA 16 mA LVDCI_33 LVDCI_25 LVDCI_18 LVDCI_15 LVDCI_DV2_33 LVDCI_DV2_25 LVDCI_DV2_18 LVDCI_DV2_15 GTL_DCI GTLP_DCI HSTL_I_DCI HSTL_II_DCI HSTL_III_DCI HSTL_IV_DCI HSTL_I_DCI_18 HSTL_II_DCI_18 HSTL_III_DCI_18 HSTL_IV_DCI_18 SSTL2_I_DCI SSTL2_II_DCI SSTL3_I_DCI SSTL3_II_DCI -6 1.89 0.83 0.70 0.26 0.23 18.96 12.77 12.05 9.75 9.04 8.21 5.09 2.01 1.46 0.93 0.74 0.67 0.74 0.78 0.84 1.82 0.12 0.03 0.42 1.20 0.31 0.15 0.23 0.06 0.17 0.46 0.05 0.03 0.14 0.41 0.12 0.10 0.15 0.08 -5 1.95 0.85 0.72 0.27 0.23 19.55 13.17 12.42 10.06 9.32 8.46 5.25 2.07 1.51 0.96 0.77 0.69 0.77 0.80 0.87 1.88 0.12 0.03 0.43 1.23 0.32 0.16 0.23 0.06 0.18 0.47 0.05 0.03 0.14 0.42 0.13 0.10 0.16 0.08 -4 2.15 0.94 0.80 0.30 0.26 21.50 14.48 13.66 11.06 10.25 9.31 5.78 2.27 1.66 1.05 0.84 0.75 0.84 0.88 0.95 2.06 0.13 0.03 0.48 1.36 0.35 0.17 0.26 0.07 0.20 0.52 0.06 0.03 0.16 0.47 0.14 0.11 0.17 0.09 Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Module 3 of 4 16
I/O Standard Adjustment Measurement Methodology Input Delay Measurements

Table 18 shows the test setup parameters used for measuring Input standard adjustments (see Table 15, page 11). Table 18: Input Delay Measurement Methodology
Standard LVTTL LVCMOS33 LVCMOS25 LVCMOS18 LVCMOS15 PCI33_3 PCI66_3 PCI-X GTL GTLP HSTL Class I HSTL Class II HSTL Class III HSTL Class IV SSTL3 Class I & II SSTL2 Class I & II AGP-2X LVDS25 LVDS33 LVDSEXT25 LVDSEXT33 ULVDS25 LDT25 LVPECL VL (1) 0 0 0 0 0 VH (1) 3.0 3.3 2.5 1.8 1.5 Per PCI Specification Per PCI Specification Per PCI-X Specification VREF 0.2 VREF 0.2 VREF 0.5 VREF 0.5 VREF 0.5 VREF 0.5 VREF 1.00 VREF 0.75 VREF (0.2 x VCCO) 1.2 0.125 1.2 0.125 1.2 0.125 1.2 0.125 0.6 0.125 0.6 0.125 1.6 0.3 VREF + 0.2 VREF + 0.2 VREF + 0.5 VREF + 0.5 VREF + 0.5 VREF + 0.5 VREF + 1.00 VREF + 0.75 VREF + (0.2 x VCCO) 1.2 + 0.125 1.2 + 0.125 1.2 + 0.125 1.2 + 0.125 0.6 + 0.125 0.6 + 0.125 1.6 + 0.3 VREF VREF VREF VREF VREF VREF VREF VREF
VMEAS
(3,4)
Output Delay Measurements

Output delays are measured using a Tektronix P6245 TDS500/600 probe (< 1 pf) across approximately 4" of FR4 microstrip trace. Standard termination was used for all testing. (See Virtex-II Platform FPGA User Guide for details.) The propagation delay of the 4" trace is characterized separately and subtracted from the final measurement, and is therefore not included in the generalized test setup shown in Figure 1. Measurements and test conditions are reflected in the IBIS models except where the IBIS format precludes it. (IBIS models can be found on the web at http://support.xilinx.com/support/sw_ibis.htm.) Parameters VREF, RREF, CREF, and VMEAS fully describe the test conditions for each I/O standard. The most accurate prediction of propagation delay in any given application can be obtained through IBIS simulation, using the following method: 1. Simulate the output driver of choice into the generalized test setup, using values from Table 19. 2. Record the time to VMEAS . 3. Simulate the output driver of choice into the actual PCB trace and load, using the appropriate IBIS model or capacitance value to represent the load. 4. Record the time to VMEAS . 5. Compare the results of steps 2 and 4. The increase or decrease in delay should be added to or subtracted from the I/O Output Standard Adjustment value (Table 17) to yield the actual worst-case propagation delay (clock-to-input) of the PCB trace.
VREF
(2,4)
1.4 1.65 1.25 0.9 0.75
0.80 1.0 0.75 0.75 0.90 0.90 1.5 1.25 Per AGP Spec
VREF FPGA Output
VREF 1.2 1.2 1.2 1.2 0.6 0.6 1.6
RREF
VMEAS (voltage level at which delay measurement is taken) CREF

(probe capacitance)
ds083-3_06a_092503
Notes: 1. Input waveform switches between VLand VH. 2. Measurements are made at typical, minimum, and maximum VREF values. Reported delays reflect worst case of these measurements. VREF values listed are typical. See Virtex-II Platform FPGA User Guide for min/max specifications. 3. Input voltage level from which measurement starts. 4. Note that this is an input voltage reference that bears no relation to the VREF / VMEAS parameters found in IBIS models and/or noted in Figure 1.
Figure 1: Generalized Test Setup
Module 3 of 4 17
Virtex-II Platform FPGAs: DC and Switching Characteristics Table 19: Output Delay Measurement Methodology
Standard LVDS25 LVDSEXT25 LVDS33 LVDSEXT33 BLVDS LDT_25 LVPECL25 LVDCI33 LVDCI25 LVDCI18 3.3 1.2 1.5 0.75 0.75 1.5 1.5 0.9 0.9 1.8 1.8 1.5 1.5 1.25 1.25 0.9 0.9 0 3.3 LVDCI15 HSTL DCI Class I HSTL DCI C0lass II HSTL DCI Class III HSTL DCI Class IV HSTL18 DCI Class I HSTL18 DCI Class II HSTL18 DCI Class III HSTL18 DCI Class IV SSTL3 DCI Class I SSTL3 DCI Class II SSTL2 DCI Class I SSTL2 DCI Class II SSTL18 DCI Class I SSTL18 DCI Class II GTL DCI GTLP DCI RREF (ohms) 50 50 50 50 1M 50 1M 1M 1M 1M 1M 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 CREF(1) (pF) 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 VMEAS (V) VREF VREF VREF VREF 1.2 VREF 1.23 1.65 1.25 0.9 0.75 VREF VREF 0.9 0.9 VREF VREF 1.1 1.1 VREF VREF VREF VREF VREF VREF 0.8 1.0 VREF (V) 1.2 1.2 1.2 1.2 0 0.6 0 0 0 0 0 0.75 0.75 1.5 1.5 0.9 0.9 1.8 1.8 1.5 1.5 1.25 1.25 0.9 0.9 1.2 1.5
Table 19: Output Delay Measurement Methodology

Standard LVTTL (all) LVCMOS33 LVCMOS25 LVCMOS18 LVCMOS15 PCI33_3 - rising edge PCI33_3 - falling edge PCI66_3 - rising edge PCI66_3 - falling edge PCI-X - rising edge PCI-X - falling edge GTL GTLP HSTL Class I HSTL Class II HSTL Class III HSTL Class IV HSTL18 Class I HSTL18 Class II HSTL18 Class III HSTL18 Class IV SSTL3 Class I SSTL3 Class II SSTL2 Class I SSTL2 Class II SSTL18 Class I SSTL18 Class II AGP-2X - rising edge AGP-2X - falling edge RREF (ohms) 1M 1M 1M 1M 1M 25 25 25 25 25 25 25 25 50 25 50 25 50 25 50 25 50 25 50 25 50 25 50 50 CREF(1) (pF) 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 VMEAS (V) 1.4 1.65 1.25 0.9 0.75 0.94 2.03 0.94 2.03 0.94 2.03 0.8 1.0 VREF VREF 0.9 0.9 VREF VREF 1.1 1.1 VREF VREF VREF VREF VREF VREF 0.94 2.03 VREF (V) 0 0 0 0 0 0 3.3 0 3.3
Notes: 1. CREF is the capacitance of the probe, nominally 0 pF.
Module 3 of 4 18
Clock Distribution Switching Characteristics

Table 20: Clock Distribution Switching Characteristics Speed Grade Description Global Clock Buffer I input to O output Symbol TGIO
-6 0.47 -5 0.52 -4 0.59
Units ns, Max
CLB Switching Characteristics

Delays originating at F/G inputs vary slightly according to the input used (see Figure 16 in Module 2). The values listed below are worst-case. Precise values are provided by the timing analyzer. Table 21: CLB Switching Characteristics Speed Grade Description Combinatorial Delays 4-input function: F/G inputs to X/Y outputs 5-input function: F/G inputs to F5 output 5-input function: F/G inputs to X output FXINA or FXINB inputs to Y output via MUXFX FXINA input to FX output via MUXFX FXINB input to FX output via MUXFX SOPIN input to SOPOUT output via ORCY Incremental delay routing through transparent latch to XQ/YQ outputs Sequential Delays FF Clock CLK to XQ/YQ outputs Latch Clock CLK to XQ/YQ outputs Setup and Hold Times Before/After Clock CLK BX/BY inputs DY inputs DX inputs CE input SR/BY inputs (synchronous) Clock CLK Minimum Pulse Width, High Minimum Pulse Width, Low Set/Reset Minimum Pulse Width, SR/BY inputs Delay from SR/BY inputs to XQ/YQ outputs (asynchronous) Toggle Frequency (MHz) (for export control) TRPW TRQ FTOG
0.61 1.06 820 0.67 1.17 750 0.77 1.34 650
Symbol
-6
-5
-4
Units
TILO TIF5 TIF5X TIFXY TINAFX TINBFX TSOPSOP TIFNCTL
0.35 0.57 0.76 0.36 0.26 0.26 0.35 0.41
0.39 0.63 0.83 0.39 0.28 0.28 0.38 0.45
0.44 0.72 0.95 0.45 0.32 0.32 0.44 0.51
ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max
TCKO TCKLO TDICK/TCKDI TDYCK/TCKDY TDXCK/TCKDX TCECK/TCKCE TSRCK/TSCKR TCH TCL
0.45 0.54
0.50 0.59
0.57 0.68
ns, Max ns, Max
0.30/0.07 0.30/0.07 0.30/0.07 0.19/0.06 0.21/0.02
0.33/0.08 0.33/0.08 0.33/0.08 0.21/0.07 0.23/0.03
0.37/0.09 0.37/0.09 0.37/0.09 0.24/0.08 0.26/0.03
ns, Min ns, Min ns, Min ns, Min ns, Min
0.61 0.61
0.67 0.67
0.77 0.77
ns, Min ns, Min
ns, Min ns, Max MHz
Module 3 of 4 19
CLB Distributed RAM Switching Characteristics

Table 22: CLB Distributed RAM Switching Characteristics Speed Grade Description Sequential Delays Clock CLK to X/Y outputs (WE active) in 16 x 1 mode Clock CLK to X/Y outputs (WE active) in 32 x 1 mode Clock CLK to F5 output Setup and Hold Times Before/After Clock CLK BX/BY data inputs (DIN) F/G address inputs SR input (WS) Clock CLK Minimum Pulse Width, High Minimum Pulse Width, Low Minimum clock period to meet address write cycle time TWPH TWPL TWC
0.57 0.57 1.14 0.63 0.63 1.25 0.72 0.72 1.44
Symbol
-6
-5
-4
Units
TSHCKO16 TSHCKO32 TSHCKOF5
1.63 1.97 1.77
1.79 2.17 1.94
2.05 2.49 2.23
TDS/TDH TAS/TAH TWES/TWEH
0.53/0.09 0.40/ 0.00 0.42/0.01
0.58/0.10 0.44/ 0.00 0.46/0.01
0.67/0.11 0.50/ 0.00 0.53/0.01
ns, Min ns, Min ns, Min
ns, Min ns, Min ns, Min
CLB Shift Register Switching Characteristics

Table 23: CLB Shift Register Switching Characteristics Speed Grade Description Sequential Delays Clock CLK to X/Y outputs Clock CLK to X/Y outputs Clock CLK to XB output via MC15 LUT output Clock CLK to YB output via MC15 LUT output Clock CLK to Shiftout Clock CLK to F5 output Setup and Hold Times Before/After Clock CLK BX/BY data inputs (DIN) SR input (WS) Clock CLK Minimum Pulse Width, High Minimum Pulse Width, Low TSRPH TSRPL
0.57 0.57 0.63 0.63 0.72 0.72
Symbol
-6
-5
-4
Units
TREG TREG32 TREGXB TREGYB TCKSH TREGF5
2.31 2.65 2.23 2.18 1.92 2.45
2.54 2.92 2.46 2.40 2.11 2.69
2.92 3.35 2.82 2.75 2.43 3.09
ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max
TSRLDS/TSRLDH TWSS/TWSH
0.53/0.07 0.19/0.06
0.58/0.08 0.21/0.07
0.67/0.09 0.24/0.08
ns, Min ns, Min
ns, Min ns, Min
Module 3 of 4 20
Multiplier Switching Characteristics

Table 24: Multiplier Switching Characteristics Speed Grade Description Propagation Delay to Output Pin Input to Pin 35 Input to Pin 34 Input to Pin 33 Input to Pin 32 Input to Pin 31 Input to Pin 30 Input to Pin 29 Input to Pin 28 Input to Pin 27 Input to Pin 26 Input to Pin 25 Input to Pin 24 Input to Pin 23 Input to Pin 22 Input to Pin 21 Input to Pin 20 Input to Pin 19 Input to Pin 18 Input to Pin 17 Input to Pin 16 Input to Pin 15 Input to Pin 14 Input to Pin 13 Input to Pin 12 Input to Pin 11 Input to Pin 10 Input to Pin 9 Input to Pin 8 Input to Pin 7 Input to Pin 6 Input to Pin 5 Input to Pin 4 Input to Pin 3 Input to Pin 2 Input to Pin 1 Input to Pin 0
DS031-3 (v3.1) October 14, 2003 Product Specification www.xilinx.com 1-800-255-7778
Symbol TMULT_P35 TMULT_P34 TMULT_P33 TMULT_P32 TMULT_P31 TMULT_P30 TMULT_P29 TMULT_P28 TMULT_P27 TMULT_P26 TMULT_P25 TMULT_P24 TMULT_P23 TMULT_P22 TMULT_P21 TMULT_P20 TMULT_P19 TMULT_P18 TMULT_P17 TMULT_P16 TMULT_P15 TMULT_P14 TMULT_P13 TMULT_P12 TMULT_P11 TMULT_P10 TMULT_P9 TMULT_P8 TMULT_P7 TMULT_P6 TMULT_P5 TMULT_P4 TMULT_P3 TMULT_P2 TMULT_P1 TMULT_P0
-6
-5
-4
Units ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max
Module 3 of 4 21
4.66 4.57 4.47 4.37 4.28 4.18 4.08 3.99 3.89 3.79 3.69 3.60 3.50 3.40 3.31 3.21 3.11 3.02 2.92 2.82 2.72 2.63 2.53 2.43 2.34 2.24 2.14 2.05 1.95 1.85 1.75 1.66 1.56 1.46 1.37 1.27
8.50 8.33 8.16 7.99 7.82 7.65 7.48 7.31 7.14 6.97 6.80 6.63 6.46 6.29 6.12 5.95 5.78 5.61 5.44 5.27 5.10 4.93 4.76 4.59 4.42 4.25 4.08 3.91 3.74 3.57 3.40 3.23 3.06 2.89 2.72 2.55
10.36 10.15 9.95 9.74 9.53 9.33 9.12 8.91 8.70 8.50 8.29 8.08 7.88 7.67 7.46 7.26 7.05 6.84 6.63 6.43 6.22 6.01 5.81 5.60 5.39 5.19 4.98 4.77 4.56 4.36 4.15 3.94 3.74 3.53 3.32 3.12
Table 25: Pipelined Multiplier Switching Characteristics

Speed Grade Description Setup and Hold Times Before/After Clock Data Inputs Clock Enable Reset Clock to Output Pin Clock to Pin 35 Clock to Pin 34 Clock to Pin 33 Clock to Pin 32 Clock to Pin 31 Clock to Pin 30 Clock to Pin 29 Clock to Pin 28 Clock to Pin 27 Clock to Pin 26 Clock to Pin 25 Clock to Pin 24 Clock to Pin 23 Clock to Pin 22 Clock to Pin 21 Clock to Pin 20 Clock to Pin 19 Clock to Pin 18 Clock to Pin 17 Clock to Pin 16 Clock to Pin 15 Clock to Pin 14 Clock to Pin 13 Clock to Pin 12 Clock to Pin 11 Clock to Pin 10 Clock to Pin 9 Clock to Pin 8 Clock to Pin 7 Clock to Pin 6 Clock to Pin 5 Clock to Pin 4 Clock to Pin 3 Clock to Pin 2 Clock to Pin 1 Clock to Pin 0 TMULTCK_P35 TMULTCK_P34 TMULTCK_P33 TMULTCK_P32 TMULTCK_P31 TMULTCK_P30 TMULTCK_P29 TMULTCK_P28 TMULTCK_P27 TMULTCK_P26 TMULTCK_P25 TMULTCK_P24 TMULTCK_P23 TMULTCK_P22 TMULTCK_P21 TMULTCK_P20 TMULTCK_P19 TMULTCK_P18 TMULTCK_P17 TMULTCK_P16 TMULTCK_P15 TMULTCK_P14 TMULTCK_P13 TMULTCK_P12 TMULTCK_P11 TMULTCK_P10 TMULTCK_P9 TMULTCK_P8 TMULTCK_P7 TMULTCK_P6 TMULTCK_P5 TMULTCK_P4 TMULTCK_P3 TMULTCK_P2 TMULTCK_P1 TMULTCK_P0 3.05 2.95 2.85 2.76 2.66 2.56 2.47 2.37 2.27 2.17 2.08 1.98 1.88 1.79 1.69 1.59 1.50 1.40 1.30 1.20 1.11 1.01 0.91 0.91 0.91 0.91 0.91 0.91 0.91 0.91 0.91 0.91 0.91 0.91 0.91 0.91 6.91 6.75 6.59 6.43 6.27 6.11 5.95 5.79 5.63 5.47 5.31 5.15 4.99 4.83 4.67 4.51 4.35 4.19 4.03 3.87 3.71 3.55 3.39 3.23 3.07 2.91 2.75 2.59 2.43 2.27 2.11 1.95 1.79 1.63 1.47 1.31 8.12 7.93 7.74 7.56 7.37 7.19 7.00 6.81 6.63 6.44 6.26 6.07 5.88 5.70 5.51 5.33 5.14 4.95 4.77 4.58 4.40 4.21 4.02 3.84 3.65 3.47 3.28 3.09 2.91 2.72 2.54 2.35 2.16 1.98 1.79 1.61 ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max TMULIDCK/TMULCKID TMULIDCK_CE/TMULCKID_CE TMULIDCK_RST/TMULCKID_RST 3.00/ 0.00 0.72/ 0.00 0.72/ 0.00 3.45/ 0.00 0.80/ 0.00 0.80/ 0.00 3.89/ 0.00 0.86/ 0.00 0.86/ 0.00 ns, Max ns, Max ns, Max Symbol -6 -5 -4 Units
Module 3 of 4 22
Enhanced Multiplier Switching Characteristics

Table 26 and Table 27 provide timing information for enhanced Virtex-II multiplier blocks, available in stepping revisions of Virtex-II devices. For more information on stepping revisions, availability, and ordering instructions, see your local sales representative. Table 26: Enhanced Multiplier Switching Characteristics
Speed Grade Description Propagation Delay to Output Pin Input to Pin 35 Input to Pin 34 Input to Pin 33 Input to Pin 32 Input to Pin 31 Input to Pin 30 Input to Pin 29 Input to Pin 28 Input to Pin 27 Input to Pin 26 Input to Pin 25 Input to Pin 24 Input to Pin 23 Input to Pin 22 Input to Pin 21 Input to Pin 20 Input to Pin 19 Input to Pin 18 Input to Pin 17 Input to Pin 16 Input to Pin 15 Input to Pin 14 Input to Pin 13 Input to Pin 12 Input to Pin 11 Input to Pin 10 Input to Pin 9 Input to Pin 8 Input to Pin 7 Input to Pin 6 Input to Pin 5 Input to Pin 4 Input to Pin 3 Input to Pin 2 Input to Pin 1 Input to Pin 0 TMULT1_P35 TMULT1_P34 TMULT1_P33 TMULT1_P32 TMULT1_P31 TMULT1_P30 TMULT1_P29 TMULT1_P28 TMULT1_P27 TMULT1_P26 TMULT1_P25 TMULT1_P24 TMULT1_P23 TMULT1_P22 TMULT1_P21 TMULT1_P20 TMULT1_P19 TMULT1_P18 TMULT1_P17 TMULT1_P16 TMULT1_P15 TMULT1_P14 TMULT1_P13 TMULT1_P12 TMULT1_P11 TMULT1_P10 TMULT1_P9 TMULT1_P8 TMULT1_P7 TMULT1_P6 TMULT1_P5 TMULT1_P4 TMULT1_P3 TMULT1_P2 TMULT1_P1 TMULT1_P0 4.66 4.57 4.47 4.37 4.28 4.18 4.08 3.99 3.89 3.79 3.69 3.60 3.50 3.40 3.31 3.21 3.11 3.02 2.92 2.82 2.72 2.63 2.53 2.43 2.34 2.24 2.14 2.05 1.95 1.85 1.75 1.66 1.56 1.46 1.37 1.27 5.14 5.03 4.93 4.82 4.71 4.61 4.50 4.39 4.28 4.18 4.07 3.96 3.86 3.75 3.64 3.54 3.43 3.32 3.21 3.11 3.00 2.89 2.79 2.68 2.57 2.47 2.36 2.25 2.14 2.04 1.93 1.82 1.72 1.61 1.50 1.40 5.91 5.79 5.66 5.54 5.42 5.29 5.17 5.05 4.92 4.80 4.68 4.56 4.43 4.31 4.19 4.06 3.94 3.82 3.69 3.57 3.45 3.33 3.20 3.08 2.96 2.83 2.71 2.59 2.46 2.34 2.22 2.10 1.97 1.85 1.73 1.60 ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max Symbol -6 -5 -4 Units
Module 3 of 4 23
Table 27: Enhanced Pipelined Multiplier Switching Characteristics

Speed Grade Description Setup and Hold Times Before/After Clock Data Inputs Clock Enable Reset Clock to Output Pin Clock to Pin 35 Clock to Pin 34 Clock to Pin 33 Clock to Pin 32 Clock to Pin 31 Clock to Pin 30 Clock to Pin 29 Clock to Pin 28 Clock to Pin 27 Clock to Pin 26 Clock to Pin 25 Clock to Pin 24 Clock to Pin 23 Clock to Pin 22 Clock to Pin 21 Clock to Pin 20 Clock to Pin 19 Clock to Pin 18 Clock to Pin 17 Clock to Pin 16 Clock to Pin 15 Clock to Pin 14 Clock to Pin 13 Clock to Pin 12 Clock to Pin 11 Clock to Pin 10 Clock to Pin 9 Clock to Pin 8 Clock to Pin 7 Clock to Pin 6 Clock to Pin 5 Clock to Pin 4 Clock to Pin 3 Clock to Pin 2 Clock to Pin 1 Clock to Pin 0 TMULTCK1_P35 TMULTCK1_P34 TMULTCK1_P33 TMULTCK1_P32 TMULTCK1_P31 TMULTCK1_P30 TMULTCK1_P29 TMULTCK1_P28 TMULTCK1_P27 TMULTCK1_P26 TMULTCK1_P25 TMULTCK1_P24 TMULTCK1_P23 TMULTCK1_P22 TMULTCK1_P21 TMULTCK1_P20 TMULTCK1_P19 TMULTCK1_P18 TMULTCK1_P17 TMULTCK1_P16 TMULTCK1_P15 TMULTCK1_P14 TMULTCK1_P13 TMULTCK1_P12 TMULTCK1_P11 TMULTCK1_P10 TMULTCK1_P9 TMULTCK1_P8 TMULTCK1_P7 TMULTCK1_P6 TMULTCK1_P5 TMULTCK1_P4 TMULTCK1_P3 TMULTCK1_P2 TMULTCK1_P1 TMULTCK1_P0 3.05 2.95 2.85 2.76 2.66 2.56 2.47 2.37 2.27 2.17 2.08 1.98 1.88 1.79 1.69 1.59 1.50 1.40 1.30 1.20 1.11 1.01 0.91 0.91 0.91 0.91 0.91 0.91 0.91 0.91 0.91 0.91 0.91 0.91 0.91 0.91 3.25 3.14 3.04 2.93 2.82 2.72 2.61 2.50 2.40 2.29 2.18 2.07 1.97 1.86 1.75 1.65 1.54 1.43 1.33 1.22 1.11 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 3.74 3.61 3.49 3.37 3.25 3.12 3.00 2.88 2.75 2.63 2.51 2.38 2.26 2.14 2.02 1.89 1.77 1.65 1.52 1.40 1.28 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 1.15 ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max ns, Max TMULIDCK/TMULCKID TMULIDCK_CE/TMULCKID_CE TMULIDCK_RST/TMULCKID_RST 3.00/0.00 0.72/0.00 0.72/0.00 3.45/0.00 0.80/0.00 0.80/0.00 3.89/0.00 0.86/0.00 0.86/0.00 ns, Max ns, Max ns, Max Symbol -6 -5 -4 Units
Module 3 of 4 24
Block SelectRAM Switching Characteristics

Table 28: Block SelectRAM Switching Characteristics Speed Grade Description Sequential Delays Clock CLK to DOUT output Setup and Hold Times Before Clock CLK ADDR inputs DIN inputs EN input RST input WEN input Clock CLK Minimum Pulse Width, High Minimum Pulse Width, Low TBPWH TBPWL
1.17 1.17 1.29 1.29 1.48 1.48
Symbol
-6
-5
-4
Units
TBCKO
2.10
2.31
2.65
ns, Max
TBACK/TBCKA TBDCK/TBCKD TBECK/TBCKE TBRCK/TBCKR TBWCK/TBCKW
0.29/ 0.00 0.29/ 0.00 0.95/0.46 1.31/0.71 0.57/0.19
0.32/ 0.00 0.32/ 0.00 1.04/0.50 1.44/0.78 0.63/0.21
0.36/ 0.00 0.36/ 0.00 1.20/0.58 1.65/0.90 0.72/0.25
ns, Min ns, Min ns, Min ns, Min ns, Min
ns, Min ns, Min
TBUF Switching Characteristics

Table 29: TBUF Switching Characteristics Speed Grade Description Combinatorial Delays IN input to OUT output TRI input to OUT output high-impedance TRI input to valid data on OUT output TIO TOFF TON
0.45 0.44 0.44 0.50 0.48 0.48 0.58 0.55 0.55
Symbol
-6
-5
-4
Units
JTAG Test Access Port Switching Characteristics

Table 30: JTAG Test Access Port Switching Characteristics Description TMS and TDI Setup times before TCK TMS and TDI Hold times after TCK Output delay from clock TCK to output TDO Maximum TCK clock frequency Symbol TTAPTK TTCKTAP TTCKTDO FTCK 5.5 0.0 10.0 33 Units ns, Min ns, Min ns, Max MHz, Max
Module 3 of 4 25
Virtex-II Pin-to-Pin Output Parameter Guidelines

All devices are 100% functionally tested. Listed below are representative values for typical pin locations and normal clock loading. Values are expressed in nanoseconds unless otherwise noted.
Global Clock Input to Output Delay for LVTTL, 12 mA, Fast Slew Rate, With DCM
Table 31: Global Clock Input to Output Delay for LVTTL, 12 mA, Fast Slew Rate, With DCM Speed Grade Description LVTTL Global Clock Input to Output delay using Output flip-flop, 12 mA, Fast Slew Rate, with DCM. For data output with different standards, adjust the delays with the values shown in IOB Output Switching Characteristics Standard Adjustments, page 14. Global Clock and OFF with DCM
TICKOFDCM XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 1.10 1.10 1.10 1.10 1.10 1.10 1.10 1.19 1.19 1.64 1.28 1.28 1.28 1.28 1.28 1.28 1.28 1.38 1.38 1.88 1.88 1.48 1.48 1.48 1.48 1.48 1.48 1.48 1.59 1.59 2.17 2.17 ns ns ns ns ns ns ns ns ns ns ns
Symbol
Device
-6
-5
-4
Units
Notes: 1. Listed above are representative values where one global clock input drives one vertical clock line in each accessible column, and where all accessible IOB and CLB flip-flops are clocked by the global clock net. 2. Output timing is measured at 50% VCC threshold with test setup shown in Figure 1. For other I/O standards, see Table 19.
Module 3 of 4 26
Global Clock Input to Output Delay for LVTTL, 12 mA, Fast Slew Rate, Without DCM
Table 32: Global Clock Input to Output Delay for LVTTL, 12 mA, Fast Slew Rate, Without DCM Speed Grade Description LVTTL Global Clock Input to Output Delay using Output flip-flop, 12 mA, Fast Slew Rate, without DCM. For data output with different standards, adjust the delays with the values shown in IOB Output Switching Characteristics Standard Adjustments, page 14. Global Clock and OFF without DCM
TICKOF XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 3.46 3.62 3.79 3.85 4.02 4.16 4.30 4.49 4.82 5.19 3.58 3.58 3.88 3.88 4.28 4.28 4.43 4.64 4.99 5.38 6.09 3.69 3.69 4.47 4.47 4.62 4.62 5.10 5.34 5.74 5.93 7.00 ns ns ns ns ns ns ns ns ns ns ns
Symbol
Device
-6
-5
-4
Units
Notes: 1. Listed above are representative values where one global clock input drives one vertical clock line in each accessible column, and where all accessible IOB and CLB flip-flops are clocked by the global clock net. 2. Output timing is measured at 50% VCC threshold with test setup shown in Figure 1. For other I/O standards, see Table 19.
Module 3 of 4 27
Virtex-II Pin-to-Pin Input Parameter Guidelines

All devices are 100% functionally tested. Listed below are representative values for typical pin locations and normal clock loading. Values are expressed in nanoseconds unless otherwise noted.
Global Clock Setup and Hold for LVTTL Standard, With DCM
Table 33: Global Clock Setup and Hold for LVTTL Standard, With DCM Speed Grade Description Input Setup and Hold Time Relative to Global Clock Input Signal for LVTTL Standard. For data input with different standards, adjust the setup time delay by the values shown in IOB Input Switching Characteristics Standard Adjustments, page 11.
No Delay Global Clock and IFF with DCM TPSDCM/TPHDCM XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 1.60/0.90 1.60/0.90 1.60/0.90 1.60/0.90 1.60/0.90 1.60/0.90 1.70/0.90 1.70/0.90 1.70/0.90 1.70/0.90 1.60/0.90 1.60/0.90 1.60/0.90 1.60/0.90 1.60/0.90 1.60/0.90 1.70/0.90 1.70/0.90 1.70/0.90 1.70/0.90 1.70/0.90 1.84/0.76 1.84/0.76 1.84/0.76 1.84/0.76 1.84/0.76 1.84/0.76 1.96/0.76 1.96/0.76 1.96/0.76 1.96/0.76 1.96/0.76 ns ns ns ns ns ns ns ns ns ns ns
Symbol
Device
-6
-5
-4
Units
Notes: 1. IFF = Input Flip-Flop or Latch 2. Setup time is measured relative to the Global Clock input signal with the fastest route and the lightest load. Hold time is measured relative to the Global Clock input signal with the slowest route and heaviest load.
Module 3 of 4 28
Global Clock Setup and Hold for LVTTL Standard, Without DCM
,
Table 34: Global Clock Setup and Hold for LVTTL Standard, Without DCM Speed Grade Description Input Setup and Hold Time Relative to Global Clock Input Signal for LVTTL Standard.(2) For data input with different standards, adjust the setup time delay by the values shown in IOB Input Switching Characteristics Standard Adjustments, page 11. Full Delay Global Clock and IFF(1) without DCM
TPSFD/TPHFD XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 1.92/ 0.00 2.10/ 0.00 1.92/ 0.00 1.92/ 0.00 1.92/ 0.00 1.92/ 0.00 1.92/ 0.00 1.92/ 0.00 2.00/ 0.00 1.92/ 0.50 1.92/ 0.00 2.10/ 0.00 1.92/ 0.00 1.92/ 0.00 1.92/ 0.00 1.92/ 0.00 1.92/ 0.00 1.92/ 0.00 2.00/ 0.00 1.92/ 0.50 2.38/ 0.00 2.21/ 0.00 2.21/ 0.00 2.21/ 0.00 2.21/ 0.00 2.21/ 0.00 2.21/ 0.00 2.21/ 0.00 2.21/ 0.00 2.30/ 0.00 2.21/ 0.50 2.60/ 0.00 ns ns ns ns ns ns ns ns ns ns ns
Symbol
Device
-6
-5
-4
Units
Notes: 1. IFF = Input Flip-Flop or Latch 2. Setup time is measured relative to the Global Clock input signal with the fastest route and the lightest load. Hold time is measured relative to the Global Clock input signal with the slowest route and heaviest load. 3. These values are parametrically measured.
Module 3 of 4 29
DCM Timing Parameters

All devices are 100% functionally tested. Because of the difficulty in directly measuring many internal timing parameters, those parameters are derived from benchmark timing patterns. The following guidelines reflect worst-case values across the recommended operating conditions. All output jitter and phase specifications are determined through statistical measurement at the package pins.
Operating Frequency Ranges

e
Table 35: Operating Frequency Ranges Description

Output Clocks (Low Frequency Mode)
CLK0, CLK90, CLK180, CLK270 CLKOUT_FREQ_1X_LF_Min CLKOUT_FREQ_1X_LF_Max CLK2X, CLK2X180 CLKOUT_FREQ_2X_LF_Min CLKOUT_FREQ_2X_LF_Max CLKDV CLKOUT_FREQ_DV_LF_Min CLKOUT_FREQ_DV_LF_Max CLKFX, CLKFX180 CLKOUT_FREQ_FX_LF_Min CLKOUT_FREQ_FX_LF_Max 24.00 230.00 48.00 450.00 1.50 150.00 24.00 260.00 24.00 210.00 48.00 420.00 1.50 140.00 24.00 240.00 24.00 180.00 48.00 360.00 1.50 120.00 24.00 210.00 MHz MHz MHz MHz MHz MHz MHz MHz
Symbol
Constraint s
Speed Grade -6 -5 -4
Unit s
Input Clocks (Low Frequency Mode)

CLKIN (using DLL outputs) (1,3) CLKIN (using CLKFX outputs) (2,3) CLKIN_FREQ_DLL_LF_Min CLKIN_FREQ_DLL_LF_Max CLKIN_FREQ_FX_LF_Min CLKIN_FREQ_FX_LF_Max PSCLK PSCLK_FREQ_LF_Min PSCLK_FREQ_LF_Max 24.00 230.00 1.00 260.00 0.01 450.00 24.00 210.00 1.00 240.00 0.01 420.00 24.00 180.00 1.00 210.00 0.01 360.00 MHz MHz MHz MHz MHz MHz
Output Clocks (High Frequency Mode)

CLK0, CLK180 CLKOUT_FREQ_1X_HF_Min CLKOUT_FREQ_1X_HF_Max CLKDV CLKOUT_FREQ_DV_HF_Min CLKOUT_FREQ_DV_HF_Max CLKFX, CLKFX180 CLKOUT_FREQ_FX_HF_Min CLKOUT_FREQ_FX_HF_Max 48.00 450.00 3.00 300.00 210.00 350.00 48.00 420.00 3.00 280.00 210.00 320.00 48.00 360.00 3.00 240.00 210.00 270.00 MHz MHz MHz MHz MHz MHz
Input Clocks (High Frequency Mode)

CLKIN (using DLL outputs) (1,3) CLKIN (using CLKFX outputs) (2,3) CLKIN_FREQ_DLL_HF_Min CLKIN_FREQ_DLL_HF_Max CLKIN_FRQ_FX_HF_Min CLKIN_FRQ_FX_HF_Max PSCLK PSCLK_FREQ_HF_Min PSCLK_FREQ_HF_Max 48.00 450.00 50.00 350.00 0.01 450.00 48.00 420.00 50.00 320.00 0.01 420.00 48.00 360.00 50.00 270.00 0.01 360.00 MHz MHz MHz MHz MHz MHz
Notes: 1. DLL outputs is used here to describe the outputs: CLK0, CLK90, CLK180, CLK270, CLK2X, CLK2X180, and CLKDV. 2. If both DLL and CLKFX outputs are used, follow the more restrictive specification. 3. If the CLKIN_DIVIDE_BY_2 attribute of the DCM is used, then double these values.
Module 3 of 4 30
Input Clock Tolerances

Table 36: Input Clock Tolerances
Speed Grade Constraints Description Input Clock Low/High Pulse Width PSCLK PSCLK_PULSE < 1MHz 1 10 MHz 10 25 MHz 25 50 MHz 50 100 MHz 100 150 MHz PSCLK and CLKIN(3) PSCLK_PULSE and CLKIN_PULSE 150 200 MHz 200 250 MHz 250 300 MHz 300 350 MHz 350 400 MHz > 400 MHz Input Clock Cycle-Cycle Jitter (Low Frequency Mode) CLKIN (using DLL outputs)(1) CLKIN (using CLKFX outputs)(2) CLKIN_CYC_JITT_DLL_LF CLKIN_CYC_JITT_FX_LF 300 300 300 300 300 300 ps ps 25.00 25.00 10.00 5.00 3.00 2.40 2.00 1.80 1.50 1.30 1.15 1.05 25.00 25.00 10.00 5.00 3.00 2.40 2.00 1.80 1.50 1.30 1.15 1.05 25.00 25.00 10.00 5.00 3.00 2.40 2.00 1.80 1.50 1.30 1.15 1.05 ns ns ns ns ns ns ns ns ns ns ns ns Symbol FCLKIN Min -6 Max Min -5 Max Min -4 Max Units
Input Clock Cycle-Cycle Jitter (High Frequency Mode) CLKIN (using DLL outputs)(1) CLKIN (using CLKFX outputs)(2) CLKIN_CYC_JITT_DLL_HF CLKIN_CYC_JITT_FX_HF 150 150 150 150 150 150 ps ps
Input Clock Period Jitter (Low Frequency Mode) CLKIN (using DLL outputs)(1) CLKIN (using CLKFX outputs)(2) CLKIN_PER_JITT_DLL_LF CLKIN_PER_JITT_FX_LF 1 1 1 1 1 1 ns ns
Input Clock Period Jitter (High Frequency Mode) CLKIN (using DLL outputs)(1) CLKIN (using CLKFX outputs)(2) CLKIN_PER_JITT_DLL_HF CLKIN_PER_JITT_FX_HF 1 1 1 1 1 1 ns ns
Feedback Clock Path Delay Variation CLKFB off-chip feedback CLKFB_DELAY_VAR_EXT 1 1 1 ns
Notes: 1. DLL outputs is used here to describe the outputs: CLK0, CLK90, CLK180, CLK270, CLK2X, CLK2X180, and CLKDV. 2. If both DLL and CLKFX outputs are used, follow the more restrictive specification.
3.
If DCM phase shift feature is used and CLKIN frequency > 200 Mhz, CLKIN duty cycle must be within 5% (45/55 to 55/45).
Module 3 of 4 31
Output Clock Jitter

Table 37: Output Clock Jitter
Speed Grade Description Clock Synthesis Period Jitter CLK0 CLK90 CLK180 CLK270 CLK2X, CLK2X180 CLKDV (integer division) CLKDV (non-integer division) CLKFX, CLKFX180 CLKOUT_PER_JITT_0 CLKOUT_PER_JITT_90 CLKOUT_PER_JITT_180 CLKOUT_PER_JITT_270 CLKOUT_PER_JITT_2X CLKOUT_PER_JITT_DV1 CLKOUT_PER_JITT_DV2 CLKOUT_PER_JITT_FX 100 150 150 150 200 150 300 Note 1 100 150 150 150 200 150 300 Note 1 100 150 150 150 200 150 300 Note 1 ps ps ps ps ps ps ps ps Symbol Constraints -6 -5 -4 Units
Notes: 1. Values for this parameter are available at www.xilinx.com.
Output Clock Phase Alignment

Table 38: Output Clock Phase Alignment
Speed Grade Description Phase Offset Between CLKIN and CLKFB CLKIN/CLKFB CLKIN_CLKFB_PHASE 50 50 50 ps Symbol Constraints -6 -5 -4 Units
Phase Offset Between Any DCM Outputs All CLK outputs Duty Cycle Precision DLL outputs(1) CLKFX outputs CLKOUT_DUTY_CYCLE_DLL(2) CLKOUT_DUTY_CYCLE_FX 150 100 150 100 150 100 ps ps CLKOUT_PHASE 140 140 140 ps
Notes: 1. "DLL outputs" is used here to describe the outputs: CLK0, CLK90, CLK180, CLK270, CLK2X, CLK2X180, and CLKDV. 2. CLKOUT_DUTY_CYCLE_DLL applies to the 1X clock outputs (CLK0, CLK90, CLK180, and CLK270) only if DUTY_CYCLE_CORRECTION = TRUE. 3. Specification also applies to PSCLK.
Module 3 of 4 32
Miscellaneous Timing Parameters

Table 39: Miscellaneous Timing Parameters
Constraints Description Symbol FCLKIN -6 Time Required to Achieve LOCK Using DLL outputs(1) LOCK_DLL LOCK_DLL_60 LOCK_DLL_50_60 LOCK_DLL_40_50 LOCK_DLL_30_40 LOCK_DLL_24_30 Using CLKFX outputs LOCK_FX_MIN LOCK_FX_MAX Additional lock time with fine-phase shifting Fine-Phase Shifting Absolute shifting range Delay Lines Tap delay resolution DCM_TAP_MIN DCM_TAP_MAX 30.0 60.0 30.0 60.0 30.0 60.0 ps ps FINE_SHIFT_RANGE 10.0 10.0 10.0 ns LOCK_DLL_FINE_SHIFT > 60MHz 50 - 60 MHz 40 - 50 MHz 30 - 40 MHz 24 - 30 MHz 20.0 25.0 50.0 90.0 120.0 10.0 10.0 50.0 20.0 25.0 50.0 90.0 120.0 10.0 10.0 50.0 20.0 25.0 50.0 90.0 120.0 10.0 10.0 50.0 s s s s s ms ms s Speed Grade -5 -4 Units
Notes: 1. "DLL outputs" is used here to describe the outputs: CLK0, CLK90, CLK180, CLK270, CLK2X, CLK2X180, and CLKDV. 2. Specification also applies to PSCLK.
Frequency Synthesis
Table 40: Frequency Synthesis Attribute CLKFX_MULTIPLY CLKFX_DIVIDE Min 2 1 Max 32 32
Parameter Cross Reference

Table 41: Parameter Cross Reference Libraries Guide DLL_CLKOUT_{MIN|MAX}_LF DFS_CLKOUT_{MIN|MAX}_LF DLL_CLKIN_{MIN|MAX}_LF DFS_CLKIN_{MIN|MAX}_LF DLL_CLKOUT_{MIN|MAX}_HF DFS_CLKOUT_{MIN|MAX}_HF DLL_CLKIN_{MIN|MAX}_HF DFS_CLKIN_{MIN|MAX}_HF Data Sheet CLKOUT_FREQ_{1X|2X|DV}_LF CLKOUT_FREQ_FX_LF CLKIN_FREQ_DLL_LF CLKIN_FREQ_FX_LF CLKOUT_FREQ_{1X|DV}_HF CLKOUT_FREQ_FX_HF CLKIN_FREQ_DLL_HF CLKIN_FREQ_FX_HF
Module 3 of 4 33
Source-Synchronous Switching Characteristics

The parameters in this section provide the necessary values for calculating timing budgets for Virtex-II source-synchronous transmitter and receiver data-valid windows. Table 42: Duty Cycle Distortion and Clock-Tree Skew Speed Grade Description
Duty Cycle Distortion(1)
Symbol
TDCD_CLK0 TDCD_CLK180
Device
All All XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000
-6 140 50 50 50 50 50 80 80 100 100 400 500
-5 140 50 50 50 50 50 80 80 100 100 400 500 600
-4 140 50 60 60 60 60 90 90 110 110 450 550 650
Units
ps ps ps ps ps ps ps ps ps ps ps ps ps
Clock Tree Skew(2)
TCKSKEW
Notes: 1. These parameters represent the worst-case duty cycle distortion observable at the pins of the device using LVDS output buffers. For cases where other I/O standards are used, IBIS can be used to calculate any additional duty cycle distortion that might be caused by asymmetrical rise/fall times. TDCD_CLK0 applies to cases where local (IOB) inversion is used to provide the negative-edge clock to the DDR element in the I/O. TDCD_CLK180 applies to cases where the CLK180 output of the DCM is used to provide the negative-edge clock to the DDR element in the I/O. 2. This value represents the worst-case clock-tree skew observable between sequential I/O elements. Significantly less clock-tree skew exists for I/O registers that are close to each other and fed by the same or adjacent clock-tree branches. Use the Xilinx FPGA_Editor and Timing Analyzer tools to evaluate clock skew specific to your application.
Table 43: Package Skew Description

Package Skew(1)
Symbol
TPKGSKEW
Device/Package
XC2V1000 / FF896 XC2V3000 / FF1152 XC2V3000 / BF957 XC2V4000 / FF1152 XC2V4000 / FF1517 XC2V4000 / BF957 XC2V6000 / FF1152 XC2V6000 / FF1517 XC2V6000 / BF957
Value
130 115 130 130 200 140 90 105 105
Units
ps ps ps ps ps ps ps ps ps
Notes: 1. These values represent the worst-case skew between any two balls of the package: shortest flight time to longest flight time from Pad to Ball (7.1ps per mm). 2. Package trace length information is available for these device/package combinations. This information can be used to deskew the package.
Module 3 of 4 34
Table 44: Sample Window Speed Grade Description

Sampling Error at Receiver Pins(1)
Symbol
TSAMP
Device
XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000
-6 500 500 500 500 500 500 500 500 500 500
-5 500 500 500 500 500 500 500 500 500 500 500
-4 550 550 550 550 550 550 550 550 550 550 550
Units
ps ps ps ps ps ps ps ps ps ps ps
Notes: 1. This parameter indicates the total sampling error of Virtex-II DDR input registers across voltage, temperature, and process. The characterization methodology uses the DCM to capture the DDR input registers edges of operation. These measurements include: - CLK0 and CLK180 DCM jitter - Worst-case Duty-Cycle Distortion - TDCD_CLK180 - DCM accuracy (phase offset) - DCM phase shift resolution. These measurements do not include package or clock tree skew.
Table 45: Pin-to-Pin Setup/Hold: Source-Synchronous Configuration Speed Grade Description

Data Input Set-Up and Hold Times Relative to a Forwarded Clock Input Pin, Using DCM and Global Clock Buffer. For situations where clock and data inputs conform to different standards, adjust the setup and hold values accordingly using the values shown in IOB Input Switching Characteristics Standard Adjustments, page 11. No Delay Global Clock and IFF with DCM TPSDCM/ TPHDCM XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.6 0.2/0.6 0.2/0.6 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.5 0.2/0.6 0.2/0.6 0.2/0.6 0.2/0.7 ns ns ns ns ns ns ns ns ns ns ns
Symbol
Device
-6
-5
-4
Units
Notes: 1. IFF = Input Flip-Flop 2. The timing values were measured using the fine-phase adjustment feature of the DCM. 3. The worst-case duty-cycle distortion and DCM jitter on CLK0 and CLK180 is included in these measurements.
Module 3 of 4 35
Source Synchronous Timing Budgets

This section describes how to use the parameters provided in the Source-Synchronous Switching Characteristics section to develop system-specific timing budgets. The following analysis provides information necessary for determining Virtex-II contributions to an overall system timing analysis; no assumptions are made about the effects of Inter-Symbol Interference or PCB skew.
Virtex-II Transmitter Data-Valid Window (TX)

TX is the minimum aggregate valid data period for a source-synchronous data bus at the pins of the device and is calculated as follows: TX = Data Period - [Jitter(1) + Duty Cycle Distortion(2) + TCKSKEW(3) + TPKGSKEW(4)]
Notes: 1. Jitter values and accumulation methodology to be provided in a future release of this document. The absolute period jitter values found in the DCM Timing Parameters section of the particular DCM output clock used to clock the IOB FF can be used for a best case analysis. 2. This value depends on the clocking methodology used. See Note1 for Table 42. 3. This value represents the worst-case clock-tree skew observable between sequential I/O elements. Significantly less clock-tree skew exists for I/O registers that are close to each other and fed by the same or adjacent clock-tree branches. Use the Xilinx FPGA_Editor and Timing Analyzer tools to evaluate clock skew specific to your application. 4. These values represent the worst-case skew between any two balls of the package: shortest flight time to longest flight time from Pad to Ball.
Virtex-II Receiver Data-Valid Window (RX)

RX is the required minimum aggregate valid data period for a source-synchronous data bus at the pins of the device and is calculated as follows: RX = [TSAMP(1) + TCKSKEW(2) + TPKGSKEW(3) ]
Notes: 1. This parameter indicates the total sampling error of Virtex-II DDR input registers across voltage, temperature, and process. The characterization methodology uses the DCM to capture the DDR input registers edges of operation. These measurements include: CLK0 and CLK180 DCM jitter in a quiet system Worst-case duty-cycle distortion DCM accuracy (phase offset) DCM phase shift resolution. These measurements do not include package or clock tree skew. 2. This value represents the worst-case clock-tree skew observable between sequential I/O elements. Significantly less clock-tree skew exists for I/O registers that are close to each other and fed by the same or adjacent clock-tree branches. Use the Xilinx FPGA_Editor and Timing Analyzer tools to evaluate clock skew specific to your application. These values represent the worst-case skew between any two balls of the package: shortest flight time to longest flight time from Pad to Ball.
3.
Revision History
This section records the change history for this module of the data sheet. Date 11/07/00 12/06/00 01/15/01 01/25/01 Version 1.0 1.1 1.2 1.3 Early access draft. Initial release. Added values to the tables in the Virtex-II Performance Characteristics and Virtex-II Switching Characteristics sections. 04/23/01 1.5 The data sheet was divided into four modules (per the current style standard). Updated values in the Virtex-II Performance Characteristics and Virtex-II Switching Characteristics tables. Table 18, Delay Measurement Methodology Updated values in the Virtex-II Performance Characteristics and Virtex-II Switching Characteristics tables. Added TREG32 symbol to Table 23. Skipped v1.4 to sync with other modules. Reverted to traditional double-column format. Revision
Module 3 of 4 36
Date 07/30/01
Version 1.6
Revision Updated values in the Virtex-II Performance Characteristics and Virtex-II Switching Characteristics tables. Added values to the Virtex-II Pin-to-Pin Output Parameter Guidelines and Virtex-II Pin-to-Pin Input Parameter Guidelines tables. Added Frequency Synthesis table. Updated values in the Virtex-II Performance Characteristics and Virtex-II Switching Characteristics tables. Updated the speed grade designations used in data sheets, and added Table 13, which shows the current speed grade designation for each device. Corrected the speed grade designation for the XC2V1000 device in Table 13. Updated values in the Virtex-II Performance Characteristics and Virtex-II Switching Characteristics tables. Updated values in Table 3, Table 4, Table 5, Virtex-II Performance Characteristics, and Virtex-II Switching Characteristics tables. Updated values in Virtex-II Performance Characteristics and Virtex-II Switching Characteristics tables, based on values extracted from speedsfile version 1.96. Changed the speed grade designation for the XC2V6000 device in Table 13. Updated values in Table 4, "Quiescent Supply Current." Updated values in Virtex-II Performance Characteristics and Virtex-II Switching Characteristics tables, based on values extracted from speedsfile version 1.111. Added Enhanced Multiplier Switching Characteristics section. Added footnote to Table 34, "Global Clock Setup and Hold for LVTTL Standard, Without DCM." Added Source-Synchronous Switching Characteristics section. Removed mention of MIL-M-38510/605 specification. Added footnotes to Table 2 and Table 6. Revised SSTL2 values in Table 6 to match the latest JEDEC specification. Added footnote regarding VIN PCI compliance to Table 1. Added footnote regarding CLKOUT_DUTY_CYCLE_DLL to Table 38. Updated values in Virtex-II Performance Characteristics and Virtex-II Switching Characteristics tables, based on values extracted from speedsfile version 1.114. Table 4, Quiescent Supply Current, and Table 5, Minimum Power On Current Required for Virtex-II Devices: Added parameters for XC2V8000 device. Table 16, IOB Output Switching Characteristics: Changed parameter designator TIOTON to TIOTP. Table 26, Enhanced Multiplier Switching Characteristics: Corrected all parameter designators from TMULT_P[nn] to TMULT1_P[nn] in order to correspond with designators used in speedsfile. Table 27, Enhanced Pipelined Multiplier Switching Characteristics: Corrected all parameter designators from TMULTCK_P[nn] to TMULTCK1_P[nn] in order to correspond with designators used in speedsfile. Removed old Table 19, Standard Capacitive Loads. Added Figure 1, page 17, showing test configuration for measuring I/O standard adjustments. Removed footnotes in Table 31 and Table 33 that stated DCM jitter was included in the measurements.
10/02/01
1.7
10/05/01 10/12/01 11/28/01 01/03/02
1.8 1.9 2.0 2.1
07/16/02
2.2
09/26/02 12/06/02
2.3 2.4
05/07/03
2.5
06/19/03 2.5.1
Module 3 of 4 37
Date 08/01/03
Version 3.0
Revision Table 13: All Virtex-II devices and speed grades now Production. Updated values in Virtex-II Performance Characteristics and Virtex-II Switching Characteristics tables, based on values extracted from speedsfile version 1.116. Table 31 and Table 32: Revised test setup footnote to refer to Figure 1. Previously specified a capacitive load parameter. Figure 1: Added note to figure regarding termination resistors. Table 1: Changed TJ description from Operating junction temperature to Maximum junction temperature. In section General Power Supply Requirements, replaced reference to Answer Record 11713 with reference to XAPP689 regarding handling of simultaneously switching outputs (SSO). In section I/O Standard Adjustment Measurement Methodology: - Table 18 renamed Input Delay Measurement Methodology. Added footnotes. - Added new Table 19, Output Delay Measurement Methodology. - Replaced Figure 1, Generalized Test Setup, with new drawing. - Revised and extended text describing output delay measurement procedure. Table 42, Table 44, and Table 45: All Source-Synchronous parameters for all devices now available in these tables. XC2V8000 is no longer offered in the -6 speed grade. The following tables containing parameters or other references to this device/grade combination were corrected accordingly: Table 13, Table 14, Table 31, Table 32, Table 33, Table 34, Table 42, Table 44, and Table 45. Table 36: For Input Clock Low/High Pulse Width, PSCLK and CLKIN, changed existing Footnote (2) to new Footnote (3).
10/14/03
3.1

Module 3 of 4 38
225
Virtex-II Platform FPGAs: Pinout Information

0 0
DS031-4 (v2.0) August 1, 2003
Product Specification BG728 Standard BGA Package FF896 Flip-Chip Fine-Pitch BGA Package FF1152 Flip-Chip Fine-Pitch BGA Package FF1517 Flip-Chip Fine-Pitch BGA Package BF957 Flip-Chip BGA Package
This document provides Virtex-II Device/Package Combinations and Maximum I/Os Available and Virtex-II Pin Definitions, followed by pinout tables for the following packages: CS144 Chip-Scale BGA Package FG256 Fine-Pitch BGA Package FG456 Fine-Pitch BGA Package FG676 Fine-Pitch BGA Package BG575 Standard BGA Package
For device pinout diagrams and layout guidelines, refer to the Virtex-II Platform FPGA User Guide. ASCII package pinout files are also available for download from the Xilinx website (www.xilinx.com).
Virtex-II Device/Package Combinations and Maximum I/Os Available

Wire-bond and flip-chip packages are available. Table 1 and Table 2 show the maximum number of user I/Os possible in wire-bond and flip-chip packages, respectively. Table 3 shows the number of user I/Os available for all device/package combinations.
CS denotes wire-bond chip-scale ball grid array (BGA) (0.80 mm pitch). FG denotes wire-bond fine-pitch BGA (1.00 mm pitch). FF denotes flip-chip fine-pitch BGA (1.00 mm pitch). BG denotes standard BGA (1.27 mm pitch). BF denotes flip-chip BGA (1.27 mm pitch).
The number of I/Os per package include all user I/Os except the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, AND RSVD).
Table 1: Wire-Bond Packages Information Package Pitch (mm) Size (mm) I/Os CS144 0.80 12 x 12 92 FG256 1.00 17 x 17 172 FG456 1.00 23 x 23 324 FG676 1.00 27 x 27 484 BG575 1.27 31 x 31 408 BG728 1.27 35 x 35 516
Table 2: Flip-Chip Packages Information Package Pitch (mm) Size (mm) I/Os FF896 1.00 31 x 31 624 FF1152 1.00 35 x 35 824 FF1517 1.00 40 x 40 1,108 BF957 1.27 40 x 40 684
Module 4 of 4 1
Table 3: Virtex-II Device/Package Combinations and Maximum Number of Available I/Os Available I/Os Package CS144 FG256 FG456 FG676 FF896 FF1152 FF1517 BG575 BG728 BF957 XC2V 40 88 88 XC2V 80 92 120 XC2V 250 92 172 200 XC2V 500 172 264 XC2V 1000 172 324 432 328 XC2V 1500 392 528 392 XC2V 2000 456 624 408 624 XC2V 3000 484 720 516 684 XC2V 4000 824 912 684 XC2V 6000 824 1,104 684 XC2V 8000 824 1,108 -
Virtex-II Pin Definitions

This section describes the pinouts for Virtex-II devices in the following packages: CS144: wire-bond chip-scale ball grid array (BGA) of 0.80 mm pitch FG256, FG456, and FG676: wire-bond fine-pitch BGA of 1.00 mm pitch FF896, FF1152, FF1517: flip-chip fine-pitch BGA of 1.00 mm pitch BG575 and BG728: wire-bond BGA of 1.27 mm pitch BF957: flip-chip BGA of 1.27 mm pitch
All of the devices supported in a particular package are pinout compatible and are listed in the same table (one table per package). In addition, the FG456 and FG676 packages are compatible, as are the FF896 and FF1152 packages. Pins that are not available for the smallest devices are listed in right-hand columns. Each device is split into eight I/O banks to allow for flexibility in the choice of I/O standards (see the Virtex-II Data Sheet). Global pins, including JTAG, configuration, and power/ground pins, are listed at the end of each table. Table 4 provides definitions for all pin types. The FG256 pinouts (Table 6) is included as an example. All Virtex-II pinout tables are available on the distribution CD-ROM, or on the web (at http://www.xilinx.com).
Module 4 of 4 2
Pin Definitions
Table 4 provides a description of each pin type listed in Virtex-II pinout tables. Table 4: Virtex-II Pin Definitions Pin Name
User I/O Pins
Direction
Description
IO_LXXY_#
Input/Output
All user I/O pins are capable of differential signalling and can implement LVDS, ULVDS, BLVDS, LVPECL, or LDT pairs. Each user I/O is labeled IO_LXXY_#, where: IO indicates a user I/O pin. LXXY indicates a differential pair, with XX a unique pair in the bank and Y = P/N for the positive and negative sides of the differential pair. # indicates the bank number (0 through 7)
Dual-Function Pins
IO_LXXY_#/ZZZ
The dual-function pins are labelled IO_LXXY_#/ZZZ, where ZZZ can be one of the following pins: Per Bank - VRP, VRN, or VREF Globally - GCLKX(S/P), BUSY/DOUT, INIT_B, D0/DIN D7, RDWR_B, or CS_B
With /ZZZ:
D0/DIN, D1, D2, D3, D4, D5, D6, D7 CS_B RDWR_B BUSY/DOUT
Input/Output
In SelectMAP mode, D0 through D7 are configuration data pins. These pins become user I/Os after configuration, unless the SelectMAP port is retained. In bit-serial modes, DIN (D0) is the single-data input. This pin becomes a user I/O after configuration.
Input Input Output
In SelectMAP mode, this is the active-low Chip Select signal. The pin becomes a user I/O after configuration, unless the SelectMAP port is retained. In SelectMAP mode, this is the active-low Write Enable signal. The pin becomes a user I/O after configuration, unless the SelectMAP port is retained. In SelectMAP mode, BUSY controls the rate at which configuration data is loaded. The pin becomes a user I/O after configuration, unless the SelectMAP port is retained. In bit-serial modes, DOUT provides preamble and configuration data to downstream devices in a daisy-chain. The pin becomes a user I/O after configuration.
INIT_B
Bidirectional (open-drain)
When Low, this pin indicates that the configuration memory is being cleared. When held Low, the start of configuration is delayed. During configuration, a Low on this output indicates that a configuration data error has occurred. The pin becomes a user I/O after configuration. These are clock input pins that connect to Global Clock Buffers. These pins become regular user I/Os when not needed for clocks. This pin is for the DCI voltage reference resistor of P transistor (per bank). This pin is for the DCI voltage reference resistor of N transistor (per bank). This is the alternative pin for the DCI voltage reference resistor of P transistor. This is the alternative pin for the DCI voltage reference resistor of N transistor. These are input threshold voltage pins. They become user I/Os when an external threshold voltage is not needed (per bank).
GCLKx (S/P) VRP VRN ALT_VRP ALT_VRN VREF

Dedicated Pins(1)
Input/Output Input Input Input Input Input
Module 4 of 4 3
Table 4: Virtex-II Pin Definitions (Continued) Pin Name CCLK PROG_B DONE Direction Input/Output Input Input/Output Description Configuration clock. Output in Master mode or Input in Slave mode. Active Low asynchronous reset to configuration logic. This pin has a permanent weak pull-up resistor. DONE is a bidirectional signal with an optional internal pull-up resistor. As an output, this pin indicates completion of the configuration process. As an input, a Low level on DONE can be configured to delay the start-up sequence. Configuration mode selection. Enable I/O pullups during configuration. Boundary Scan Clock. Boundary Scan Data Input. Boundary Scan Data Output. Boundary Scan Mode Select. Active Low power-down pin (unsupported). Driving this pin Low can adversely affect device operation and configuration. PWRDWN_B is internally pulled High, which is its default state. It does not require an external pull-up.
M2, M1, M0 HSWAP_EN TCK TDI TDO TMS PWRDWN_B
Input Input Input Input Output Input Input

(unsupported)
Other Pins
DXN, DXP VBATT RSVD VCCO VCCAUX VCCINT GND
N/A Input N/A Input Input Input Input
Temperature-sensing diode pins (Anode: DXP, Cathode: DXN). Decryptor key memory backup supply. (Do not connect if battery is not used.) Reserved pin - do not connect. Power-supply pins for the output drivers (per bank). Power-supply pins for auxiliary circuits. Power-supply pins for the internal core logic. Ground.
Notes: 1. All dedicated pins (JTAG and configuration) are powered by VCCAUX (independent of the bank VCCO voltage).
Module 4 of 4 4
CS144 Chip-Scale BGA Package

As shown in Table 5, XC2V40, XC2V80, and XC2V250 Virtex-II devices are available in the CS144 package. Pins in the XC2V40, XC2V80, and XC2V250 devices are the same except for pin differences in the XC2V40 device, shown in the No Connect column. Following this table are the CS144 Chip-Scale BGA Package Specifications (0.80mm pitch). Table 5: CS144 XC2V40, XC2V80, and XC2V250 Bank 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 2 2 2 2 2 2 Pin Description IO_L01N_0 IO_L01P_0 IO_L02N_0 IO_L02P_0 IO_L03N_0/VRP_0 IO_L03P_0/VRN_0 IO_L94N_0/VREF_0 IO_L94P_0 IO_L95N_0/GCLK7P IO_L95P_0/GCLK6S IO_L96N_0/GCLK5P IO_L96P_0/GCLK4S IO_L96N_1/GCLK3P IO_L96P_1/GCLK2S IO_L95N_1/GCLK1P IO_L95P_1/GCLK0S IO_L94N_1 IO_L94P_1/VREF_1 IO_L03N_1/VRP_1 IO_L03P_1/VRN_1 IO_L02N_1 IO_L02P_1 IO_L01N_1 IO_L01P_1 IO_L01N_2 IO_L01P_2 IO_L02N_2/VRP_2 IO_L02P_2/VRN_2 IO_L03N_2 IO_L03P_2/VREF_2 IO_L93N_2 IO_L93P_2/VREF_2 IO_L94N_2 IO_L94P_2 Pin Number B3 A3 C4 B4 A4 D5 A5 D6 C6 B6 A6 D7 A7 B7 A8 B8 C8 D8 C9 D9 A10 B10 C10 D10 C13 D11 D12 D13 E10 E11 E13 F11 F12 G10 NC NC No Connect in the XC2V40
Module 4 of 4 5
Table 5: CS144 XC2V40, XC2V80, and XC2V250 Bank 2 2 3 3 3 3 3 3 3 3 3 3 4 4 4 4 4 4 4 4 4 4 4 4 5 5 5 5 5 5 5 5 5 5 5 5 Pin Description IO_L96N_2 IO_L96P_2 IO_L96N_3 IO_L96P_3 IO_L94N_3 IO_L94P_3 IO_L03N_3/VREF_3 IO_L03P_3 IO_L02N_3/VRP_3 IO_L02P_3/VRN_3 IO_L01N_3 IO_L01P_3 IO_L01N_4/BUSY/DOUT (1) IO_L01P_4/INIT_B IO_L02N_4/D0/DIN (1) IO_L02P_4/D1 IO_L03N_4/D2/ALT_VRP_4 IO_L03P_4/D3/ALT_VRN_4 IO_L94N_4/VREF_4 IO_L94P_4 IO_L95N_4/GCLK3S IO_L95P_4/GCLK2P IO_L96N_4/GCLK1S IO_L96P_4/GCLK0P IO_L96N_5/GCLK7S IO_L96P_5/GCLK6P IO_L95N_5/GCLK5S IO_L95P_5/GCLK4P IO_L94N_5 IO_L94P_5/VREF_5 IO_L03N_5/D4/ALT_VRP_5 IO_L03P_5/D5/ALT_VRN_5 IO_L02N_5/D6 IO_L02P_5/D7 IO_L01N_5/RDWR_B IO_L01P_5/CS_B Pin Number G11 G13 G12 H12 H11 J13 J10 K13 K12 K11 K10 L13 M11 N11 L10 M10 N10 K9 N9 K8 L8 M8 N8 K7 N7 M7 N6 M6 L6 K6 L5 K5 N4 M4 L4 K4 No Connect in the XC2V40
Module 4 of 4 6
Table 5: CS144 XC2V40, XC2V80, and XC2V250 Bank 6 6 6 6 6 6 6 6 6 6 7 7 7 7 7 7 7 7 7 7 7 7 0 0 1 1 2 2 3 3 4 4 5 5 6 6 7 7 Pin Description IO_L01P_6 IO_L01N_6 IO_L02P_6/VRN_6 IO_L02N_6/VRP_6 IO_L03P_6 IO_L03N_6/VREF_6 IO_L94P_6 IO_L94N_6 IO_L96P_6 IO_L96N_6 IO_L96P_7 IO_L96N_7 IO_L94P_7 IO_L94N_7 IO_L93P_7/VREF_7 IO_L93N_7 IO_L03P_7/VREF_7 IO_L03N_7 IO_L02P_7/VRN_7 IO_L02N_7/VRP_7 IO_L01P_7 IO_L01N_7 VCCO_0 VCCO_0 VCCO_1 VCCO_1 VCCO_2 VCCO_2 VCCO_3 VCCO_3 VCCO_4 VCCO_4 VCCO_5 VCCO_5 VCCO_6 VCCO_6 VCCO_7 VCCO_7 Pin Number L3 L2 L1 K3 K2 K1 J2 H4 H3 H1 G4 G3 G1 F1 F2 F4 E2 E3 E4 D1 D2 D3 B5 C3 A11 A9 F10 C12 L12 J12 M9 L11 N3 N5 J3 M1 D4 F3 NC NC No Connect in the XC2V40
Module 4 of 4 7
Table 5: CS144 XC2V40, XC2V80, and XC2V250 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description CCLK PROG_B DONE M0 M1 M2 TCK TDI TDO TMS PWRDWN_B HSWAP_EN RSVD RSVD VBATT RSVD VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT GND GND GND GND GND GND GND GND GND GND GND GND Pin Number M13 B1 N12 N2 M2 M3 B12 C1 C11 A13 M12 A1 A2 B2 A12 B11 C2 N1 N13 B13 H2 L7 H13 C7 E1 G2 J1 J4 M5 L9 J11 H10 F13 E12 B9 C5 No Connect in the XC2V40
Notes: 1. See Table 4 for an explanation of the signals available on this pin.
Module 4 of 4 8
CS144 Chip-Scale BGA Package Specifications (0.80mm pitch)
Figure 1: CS144 Chip-Scale BGA Package Specifications
Module 4 of 4 9
FG256 Fine-Pitch BGA Package

As shown in Table 6, XC2V40, XC2V80, XC2V250, XC2V500, and XC2V1000 Virtex-II devices are available in the FG256 fine-pitch BGA package. The pins in the XC2V250, XC2V500, and XC2V1000 devices are same. The No Connect columns show pin differences for the XC2V40 and XC2V80 devices. Following this table are the FG256 Fine-Pitch BGA Package Specifications (1.00mm pitch). Table 6: FG256 BGA XC2V40, XC2V80, XC2V250, XC2V500, and XC2V1000 Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Pin Description IO_L01N_0 IO_L01P_0 IO_L02N_0 IO_L02P_0 IO_L03N_0/VRP_0 IO_L03P_0/VRN_0 IO_L04N_0/VREF_0 IO_L04P_0 IO_L05N_0 IO_L05P_0 IO_L92N_0 IO_L92P_0 IO_L93N_0 IO_L93P_0 IO_L94N_0/VREF_0 IO_L94P_0 IO_L95N_0/GCLK7P IO_L95P_0/GCLK6S IO_L96N_0/GCLK5P IO_L96P_0/GCLK4S Pin Number C4 B4 D5 C5 B5 A5 D6 C6 B6 A6 E6 E7 D7 C7 B7 A7 D8 C8 B8 A8 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC No Connect in XC2V40 No Connect in XC2V80
1 1 1 1 1 1 1 1 1
IO_L96N_1/GCLK3P IO_L96P_1/GCLK2S IO_L95N_1/GCLK1P IO_L95P_1/GCLK0S IO_L94N_1 IO_L94P_1/VREF_1 IO_L93N_1 IO_L93P_1 IO_L92N_1
A9 B9 C9 D9 A10 B10 C10 D10 E10 NC NC NC NC NC NC
Module 4 of 4 10
Table 6: FG256 BGA XC2V40, XC2V80, XC2V250, XC2V500, and XC2V1000 Bank 1 1 1 1 1 1 1 1 1 1 1 Pin Description IO_L92P_1 IO_L05N_1 IO_L05P_1 IO_L04N_1 IO_L04P_1/VREF_1 IO_L03N_1/VRP_1 IO_L03P_1/VRN_1 IO_L02N_1 IO_L02P_1 IO_L01N_1 IO_L01P_1 Pin Number E11 A11 B11 C11 D11 A12 B12 C12 D12 B13 C13 No Connect in XC2V40 NC NC NC NC NC No Connect in XC2V80 NC NC NC NC NC
2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2
IO_L01N_2 IO_L01P_2 IO_L02N_2/VRP_2 IO_L02P_2/VRN_2 IO_L03N_2 IO_L03P_2/VREF_2 IO_L04N_2 IO_L04P_2 IO_L06N_2 IO_L06P_2 IO_L43N_2 IO_L43P_2 IO_L45N_2 IO_L45P_2/VREF_2 IO_L91N_2 IO_L91P_2 IO_L93N_2 IO_L93P_2/VREF_2 IO_L94N_2 IO_L94P_2 IO_L96N_2 IO_L96P_2
C16 D16 D14 D15 E13 E14 E15 E16 F13 F14 F15 F16 F12 G12 G13 G14 G15 G16 H13 H14 H15 H16 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC
Module 4 of 4 11
Table 6: FG256 BGA XC2V40, XC2V80, XC2V250, XC2V500, and XC2V1000 Bank Pin Description Pin Number No Connect in XC2V40 No Connect in XC2V80
3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3
IO_L96N_3 IO_L96P_3 IO_L94N_3 IO_L94P_3 IO_L93N_3/VREF_3 IO_L93P_3 IO_L91N_3 IO_L91P_3 IO_L45N_3/VREF_3 IO_L45P_3 IO_L43N_3 IO_L43P_3 IO_L06N_3 IO_L06P_3 IO_L04N_3 IO_L04P_3 IO_L03N_3/VREF_3 IO_L03P_3 IO_L02N_3/VRP_3 IO_L02P_3/VRN_3 IO_L01N_3 IO_L01P_3
J16 J15 J14 J13 K16 K15 K14 K13 K12 L12 L16 L15 L14 L13 M16 M15 M14 M13 N15 N14 N16 P16 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC
4 4 4 4 4 4 4 4 4 4
IO_L01N_4/BUSY/DOUT (1) IO_L01P_4/INIT_B IO_L02N_4/D0/DIN (1) IO_L02P_4/D1 IO_L03N_4/D2/ALT_VRP_4 IO_L03P_4/D3/ALT_VRN_4 IO_L04N_4/VREF_4 IO_L04P_4 IO_L05N_4/VRP_4 IO_L05P_4/VRN_4
T14 T13 P13 R13 N12 P12 R12 T12 N11 P11 NC NC NC NC NC NC NC NC
Module 4 of 4 12
Table 6: FG256 BGA XC2V40, XC2V80, XC2V250, XC2V500, and XC2V1000 Bank 4 4 4 4 4 4 4 4 4 4 4 4 Pin Description IO_L91N_4/VREF_4 IO_L91P_4 IO_L92N_4 IO_L92P_4 IO_L93N_4 IO_L93P_4 IO_L94N_4/VREF_4 IO_L94P_4 IO_L95N_4/GCLK3S IO_L95P_4/GCLK2P IO_L96N_4/GCLK1S IO_L96P_4/GCLK0P Pin Number R11 T11 M11 M10 N10 P10 R10 T10 N9 P9 R9 T9 No Connect in XC2V40 NC NC NC NC NC NC No Connect in XC2V80 NC NC NC NC NC NC
5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5
IO_L96N_5/GCLK7S IO_L96P_5/GCLK6P IO_L95N_5/GCLK5S IO_L95P_5/GCLK4P IO_L94N_5 IO_L94P_5/VREF_5 IO_L93N_5 IO_L93P_5 IO_L92N_5 IO_L92P_5 IO_L91N_5 IO_L91P_5/VREF_5 IO_L05N_5/VRP_5 IO_L05P_5/VRN_5 IO_L04N_5 IO_L04P_5/VREF_5 IO_L03N_5/D4/ALT_VRP_5 IO_L03P_5/D5/ALT_VRN_5 IO_L02N_5/D6 IO_L02P_5/D7 IO_L01N_5/RDWR_B
T8 R8 P8 N8 T7 R7 P7 N7 M7 M6 T6 R6 P6 N6 T5 R5 P5 N5 R4 P4 T4 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC
Module 4 of 4 13
Table 6: FG256 BGA XC2V40, XC2V80, XC2V250, XC2V500, and XC2V1000 Bank 5 Pin Description IO_L01P_5/CS_B Pin Number T3 No Connect in XC2V40 No Connect in XC2V80
6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
IO_L01P_6 IO_L01N_6 IO_L02P_6/VRN_6 IO_L02N_6/VRP_6 IO_L03P_6 IO_L03N_6/VREF_6 IO_L04P_6 IO_L04N_6 IO_L06P_6 IO_L06N_6 IO_L43P_6 IO_L43N_6 IO_L45P_6 IO_L45N_6/VREF_6 IO_L91P_6 IO_L91N_6 IO_L93P_6 IO_L93N_6/VREF_6 IO_L94P_6 IO_L94N_6 IO_L96P_6 IO_L96N_6
P1 N1 N3 N2 M4 M3 M2 M1 L4 L3 L2 L1 L5 K5 K4 K3 K2 K1 J4 J3 J2 J1 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC
7 7 7 7 7 7 7 7 7
IO_L96P_7 IO_L96N_7 IO_L94P_7 IO_L94N_7 IO_L93P_7/VREF_7 IO_L93N_7 IO_L91P_7 IO_L91N_7 IO_L45P_7/VREF_7
H1 H2 H3 H4 G1 G2 G3 G4 G5 NC NC NC NC NC NC
Module 4 of 4 14
Table 6: FG256 BGA XC2V40, XC2V80, XC2V250, XC2V500, and XC2V1000 Bank 7 7 7 7 7 7 7 7 7 7 7 7 7 Pin Description IO_L45N_7 IO_L43P_7 IO_L43N_7 IO_L06P_7 IO_L06N_7 IO_L04P_7 IO_L04N_7 IO_L03P_7/VREF_7 IO_L03N_7 IO_L02P_7/VRN_7 IO_L02N_7/VRP_7 IO_L01P_7 IO_L01N_7 Pin Number F5 F1 F2 F3 F4 E1 E2 E3 E4 D2 D3 D1 C1 No Connect in XC2V40 NC NC NC NC NC NC NC No Connect in XC2V80 NC NC NC
0 0 0 1 1 1 2 2 2 3 3 3 4 4 4 5 5 5 6 6
VCCO_0 VCCO_0 VCCO_0 VCCO_1 VCCO_1 VCCO_1 VCCO_2 VCCO_2 VCCO_2 VCCO_3 VCCO_3 VCCO_3 VCCO_4 VCCO_4 VCCO_4 VCCO_5 VCCO_5 VCCO_5 VCCO_6 VCCO_6
F8 F7 E8 F10 F9 E9 H12 H11 G11 K11 J12 J11 M9 L10 L9 M8 L8 L7 K6 J6
Module 4 of 4 15
Table 6: FG256 BGA XC2V40, XC2V80, XC2V250, XC2V500, and XC2V1000 Bank 6 7 7 7 Pin Description VCCO_6 VCCO_7 VCCO_7 VCCO_7 Pin Number J5 H6 H5 G6 No Connect in XC2V40 No Connect in XC2V80
NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA
CCLK PROG_B DONE M0 M1 M2 HSWAP_EN TCK TDI TDO TMS PWRDWN_B RSVD RSVD VBATT RSVD
P15 A2 R14 T2 P2 R3 B3 A15 C2 C15 B14 T15 A4 A3 A14 A13
NA NA NA NA NA NA NA NA NA NA NA NA
VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT
R16 R1 B16 B1 N13 N4 M12 M5 E12 E5 D13 D4
Module 4 of 4 16
Table 6: FG256 BGA XC2V40, XC2V80, XC2V250, XC2V500, and XC2V1000 Bank Pin Description Pin Number No Connect in XC2V40 No Connect in XC2V80
NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA
GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND
T16 T1 R15 R2 P14 P3 L11 L6 K10 K9 K8 K7 J10 J9 J8 J7 H10 H9 H8 H7 G10 G9 G8 G7 F11 F6 C14 C3 B15 B2 A16 A1
Module 4 of 4 17
FG256 Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 2: FG256 Fine-Pitch BGA Package Specifications

DS031-4 (v2.0) August 1, 2003 Product Specification www.xilinx.com 1-800-255-7778 Module 4 of 4 18

As shown in Table 7, XC2V250, XC2V500, and XC2V1000 Virtex-II devices are available in the FG456 fine-pitch BGA package. Pins in the XC2V250, XC2V500, and XC2V1000 devices are the same, except for the pin differences in the XC2V250 and XC2V500 devices shown in the No Connect columns. Following this table are the FG456 Fine-Pitch BGA Package Specifications (1.00mm pitch). Table 7: FG456 BGA XC2V250, XC2V500, and XC2V1000 Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Pin Description IO_L01N_0 IO_L01P_0 IO_L02N_0 IO_L02P_0 IO_L03N_0/VRP_0 IO_L03P_0/VRN_0 IO_L04N_0/VREF_0 IO_L04P_0 IO_L05N_0 IO_L05P_0 IO_L06N_0 IO_L06P_0 IO_L21N_0 IO_L21P_0/VREF_0 IO_L22N_0 IO_L22P_0 IO_L24N_0 IO_L24P_0 IO_L49N_0 IO_L49P_0 IO_L51N_0 IO_L51P_0/VREF_0 IO_L52N_0 IO_L52P_0 IO_L54N_0 IO_L54P_0 IO_L91N_0/VREF_0 IO_L91P_0 IO_L92N_0 IO_L92P_0 Pin Number B4 A4 C4 C5 B5 A5 D6 C6 B6 A6 E7 E8 D7 C7 B7 A7 D8 C8 B8 A8 E9 F9 D9 C9 B9 A9 E10 F10 D10 C10 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC No Connect in XC2V250 No Connect in XC2V500
Module 4 of 4 19
Table 7: FG456 BGA XC2V250, XC2V500, and XC2V1000 Bank 0 0 0 0 0 0 0 0 Pin Description IO_L93N_0 IO_L93P_0 IO_L94N_0/VREF_0 IO_L94P_0 IO_L95N_0/GCLK7P IO_L95P_0/GCLK6S IO_L96N_0/GCLK5P IO_L96P_0/GCLK4S Pin Number B10 A10 E11 F11 D11 C11 B11 A11 No Connect in XC2V250 No Connect in XC2V500
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
IO_L96N_1/GCLK3P IO_L96P_1/GCLK2S IO_L95N_1/GCLK1P IO_L95P_1/GCLK0S IO_L94N_1 IO_L94P_1/VREF_1 IO_L93N_1 IO_L93P_1 IO_L92N_1 IO_L92P_1 IO_L91N_1 IO_L91P_1/VREF_1 IO_L54N_1 IO_L54P_1 IO_L52N_1 IO_L52P_1 IO_L51N_1/VREF_1 IO_L51P_1 IO_L49N_1 IO_L49P_1 IO_L24N_1 IO_L24P_1 IO_L22N_1 IO_L22P_1 IO_L21N_1/VREF_1
F12 F13 E12 D12 C12 B12 A13 B13 C13 D13 E13 E14 A14 B14 C14 D14 A15 B15 C15 D15 F14 E15 A16 B16 C16 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC
Module 4 of 4 20
Table 7: FG456 BGA XC2V250, XC2V500, and XC2V1000 Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 Pin Description IO_L21P_1 IO_L06N_1 IO_L06P_1 IO_L05N_1 IO_L05P_1 IO_L04N_1 IO_L04P_1/VREF_1 IO_L03N_1/VRP_1 IO_L03P_1/VRN_1 IO_L02N_1 IO_L02P_1 IO_L01N_1 IO_L01P_1 Pin Number D16 E16 E17 A17 B17 C17 D17 A18 B18 C18 D18 A19 B19 No Connect in XC2V250 NC No Connect in XC2V500 NC
2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2
IO_L01N_2 IO_L01P_2 IO_L02N_2/VRP_2 IO_L02P_2/VRN_2 IO_L03N_2 IO_L03P_2/VREF_2 IO_L04N_2 IO_L04P_2 IO_L06N_2 IO_L06P_2 IO_L19N_2 IO_L19P_2 IO_L21N_2 IO_L21P_2/VREF_2 IO_L22N_2 IO_L22P_2 IO_L24N_2 IO_L24P_2 IO_L43N_2 IO_L43P_2
C21 C22 E18 F18 D21 D22 E19 E20 E21 E22 F19 F20 F21 F22 G18 H18 G19 G20 G21 G22 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC
Module 4 of 4 21
Table 7: FG456 BGA XC2V250, XC2V500, and XC2V1000 Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Pin Description IO_L45N_2 IO_L45P_2/VREF_2 IO_L46N_2 IO_L46P_2 IO_L48N_2 IO_L48P_2 IO_L49N_2 IO_L49P_2 IO_L51N_2 IO_L51P_2/VREF_2 IO_L52N_2 IO_L52P_2 IO_L54N_2 IO_L54P_2 IO_L91N_2 IO_L91P_2 IO_L93N_2 IO_L93P_2/VREF_2 IO_L94N_2 IO_L94P_2 IO_L96N_2 IO_L96P_2 Pin Number H19 H20 H21 H22 J17 J18 J19 J20 J21 J22 K17 K18 K19 K20 K21 K22 L17 L18 L19 L20 L21 L22 NC NC NC NC NC NC NC NC No Connect in XC2V250 No Connect in XC2V500
3 3 3 3 3 3 3 3 3 3 3
IO_L96N_3 IO_L96P_3 IO_L94N_3 IO_L94P_3 IO_L93N_3/VREF_3 IO_L93P_3 IO_L91N_3 IO_L91P_3 IO_L54N_3 IO_L54P_3 IO_L52N_3
M21 M20 M19 M18 M17 N17 N22 N21 N20 N19 N18 NC NC NC
Module 4 of 4 22
Table 7: FG456 BGA XC2V250, XC2V500, and XC2V1000 Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Pin Description IO_L52P_3 IO_L51N_3/VREF_3 IO_L51P_3 IO_L49N_3 IO_L49P_3 IO_L48N_3 IO_L48P_3 IO_L46N_3 IO_L46P_3 IO_L45N_3/VREF_3 IO_L45P_3 IO_L43N_3 IO_L43P_3 IO_L24N_3 IO_L24P_3 IO_L22N_3 IO_L22P_3 IO_L21N_3/VREF_3 IO_L21P_3 IO_L19N_3 IO_L19P_3 IO_L06N_3 IO_L06P_3 IO_L04N_3 IO_L04P_3 IO_L03N_3/VREF_3 IO_L03P_3 IO_L02N_3/VRP_3 IO_L02P_3/VRN_3 IO_L01N_3 IO_L01P_3 Pin Number P18 P22 P21 P20 P19 R22 R21 R20 R19 R18 P17 T22 T21 T20 T19 U22 U21 U20 U19 T18 U18 V22 V21 V20 V19 W22 W21 Y22 Y21 W20 AA20 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC No Connect in XC2V250 NC NC NC NC NC No Connect in XC2V500
4 4
IO_L01N_4/BUSY/DOUT (1) IO_L01P_4/INIT_B
AB19 AA19
Module 4 of 4 23
Table 7: FG456 BGA XC2V250, XC2V500, and XC2V1000 Bank 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Pin Description IO_L02N_4/D0/DIN (1) IO_L02P_4/D1 IO_L03N_4/D2/ALT_VRP_4 IO_L03P_4/D3/ALT_VRN_4 IO_L04N_4/VREF_4 IO_L04P_4 IO_L05N_4/VRP_4 IO_L05P_4/VRN_4 IO_L06N_4 IO_L06P_4 IO_L19N_4 IO_L19P_4 IO_L21N_4 IO_L21P_4/VREF_4 IO_L22N_4 IO_L22P_4 IO_L24N_4 IO_L24P_4 IO_L49N_4 IO_L49P_4 IO_L51N_4 IO_L51P_4/VREF_4 IO_L52N_4 IO_L52P_4 IO_L54N_4 IO_L54P_4 IO_L91N_4/VREF_4 IO_L91P_4 IO_L92N_4 IO_L92P_4 IO_L93N_4 IO_L93P_4 IO_L94N_4/VREF_4 IO_L94P_4 Pin Number V18 V17 W18 Y18 AA18 AB18 W17 Y17 AA17 AB17 V16 V15 W16 Y16 AA16 AB16 W15 Y15 AA15 AB15 U14 V14 W14 Y14 AA14 AB14 U13 V13 W13 Y13 AA13 AB13 U12 V12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC No Connect in XC2V250 No Connect in XC2V500
Module 4 of 4 24
Table 7: FG456 BGA XC2V250, XC2V500, and XC2V1000 Bank 4 4 4 4 Pin Description IO_L95N_4/GCLK3S IO_L95P_4/GCLK2P IO_L96N_4/GCLK1S IO_L96P_4/GCLK0P Pin Number W12 Y12 AA12 AB12 No Connect in XC2V250 No Connect in XC2V500
5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5
IO_L96N_5/GCLK7S IO_L96P_5/GCLK6P IO_L95N_5/GCLK5S IO_L95P_5/GCLK4P IO_L94N_5 IO_L94P_5/VREF_5 IO_L93N_5 IO_L93P_5 IO_L92N_5 IO_L92P_5 IO_L91N_5 IO_L91P_5/VREF_5 IO_L54N_5 IO_L54P_5 IO_L52N_5 IO_L52P_5 IO_L51N_5/VREF_5 IO_L51P_5 IO_L49N_5 IO_L49P_5 IO_L24N_5 IO_L24P_5 IO_L22N_5 IO_L22P_5 IO_L21N_5/VREF_5 IO_L21P_5 IO_L19N_5 IO_L19P_5 IO_L06N_5
AA11 Y11 W11 V11 U11 U10 AB10 AA10 Y10 W10 V10 V9 AB9 AA9 Y9 W9 AB8 AA8 Y8 W8 U9 V8 AB7 AA7 Y7 W7 AB6 AA6 Y6 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC
Module 4 of 4 25
Table 7: FG456 BGA XC2V250, XC2V500, and XC2V1000 Bank 5 5 5 5 5 5 5 5 5 5 5 Pin Description IO_L06P_5 IO_L05N_5/VRP_5 IO_L05P_5/VRN_5 IO_L04N_5 IO_L04P_5/VREF_5 IO_L03N_5/D4/ALT_VRP_5 IO_L03P_5/D5/ALT_VRN_5 IO_L02N_5/D6 IO_L02P_5/D7 IO_L01N_5/RDWR_B IO_L01P_5/CS_B Pin Number W6 V7 V6 AB5 AA5 Y5 W5 AB4 AA4 Y4 AA3 No Connect in XC2V250 No Connect in XC2V500
6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
IO_L01P_6 IO_L01N_6 IO_L02P_6/VRN_6 IO_L02N_6/VRP_6 IO_L03P_6 IO_L03N_6/VREF_6 IO_L04P_6 IO_L04N_6 IO_L06P_6 IO_L06N_6 IO_L19P_6 IO_L19N_6 IO_L21P_6 IO_L21N_6/VREF_6 IO_L22P_6 IO_L22N_6 IO_L24P_6 IO_L24N_6 IO_L43P_6 IO_L43N_6 IO_L45P_6 IO_L45N_6/VREF_6
V5 U5 Y2 Y1 V4 V3 W2 W1 U4 U3 V2 V1 U2 U1 T5 R5 T4 T3 T2 T1 R4 R3 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC
Module 4 of 4 26
Table 7: FG456 BGA XC2V250, XC2V500, and XC2V1000 Bank 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Pin Description IO_L46P_6 IO_L46N_6 IO_L48P_6 IO_L48N_6 IO_L49P_6 IO_L49N_6 IO_L51P_6 IO_L51N_6/VREF_6 IO_L52P_6 IO_L52N_6 IO_L54P_6 IO_L54N_6 IO_L91P_6 IO_L91N_6 IO_L93P_6 IO_L93N_6/VREF_6 IO_L94P_6 IO_L94N_6 IO_L96P_6 IO_L96N_6 Pin Number R2 R1 P6 P5 P4 P3 P2 P1 N6 N5 N4 N3 N2 N1 M6 M5 M4 M3 M2 M1 NC NC NC NC NC NC NC NC No Connect in XC2V250 No Connect in XC2V500
7 7 7 7 7 7 7 7 7 7 7 7 7
IO_L96P_7 IO_L96N_7 IO_L94P_7 IO_L94N_7 IO_L93P_7/VREF_7 IO_L93N_7 IO_L91P_7 IO_L91N_7 IO_L54P_7 IO_L54N_7 IO_L52P_7 IO_L52N_7 IO_L51P_7/VREF_7
L2 L3 L4 L5 K1 K2 K3 K4 L6 K6 K5 J5 J1 NC NC NC NC NC
Module 4 of 4 27
Table 7: FG456 BGA XC2V250, XC2V500, and XC2V1000 Bank 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 Pin Description IO_L51N_7 IO_L49P_7 IO_L49N_7 IO_L48P_7 IO_L48N_7 IO_L46P_7 IO_L46N_7 IO_L45P_7/VREF_7 IO_L45N_7 IO_L43P_7 IO_L43N_7 IO_L24P_7 IO_L24N_7 IO_L22P_7 IO_L22N_7 IO_L21P_7/VREF_7 IO_L21N_7 IO_L19P_7 IO_L19N_7 IO_L06P_7 IO_L06N_7 IO_L04P_7 IO_L04N_7 IO_L03P_7/VREF_7 IO_L03N_7 IO_L02P_7/VRN_7 IO_L02N_7/VRP_7 IO_L01P_7 IO_L01N_7 Pin Number J2 J3 J4 H1 H2 H3 H4 J6 H5 G1 G2 G3 G4 F1 F2 F3 F4 G5 F5 E1 E2 E3 E4 D1 D2 C1 C2 E5 E6 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC No Connect in XC2V250 NC NC NC No Connect in XC2V500
0 0 0 0
VCCO_0 VCCO_0 VCCO_0 VCCO_0
G11 G10 G9 F8
Module 4 of 4 28
Table 7: FG456 BGA XC2V250, XC2V500, and XC2V1000 Bank 0 1 1 1 1 1 2 2 2 2 2 3 3 3 3 3 4 4 4 4 4 5 5 5 5 5 6 6 6 6 6 7 7 7 Pin Description VCCO_0 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_7 VCCO_7 VCCO_7 Pin Number F7 G14 G13 G12 F16 F15 L16 K16 J16 H17 G17 T17 R17 P16 N16 M16 U16 U15 T14 T13 T12 U8 U7 T11 T10 T9 T6 R6 P7 N7 M7 L7 K7 J7 No Connect in XC2V250 No Connect in XC2V500
Module 4 of 4 29
Table 7: FG456 BGA XC2V250, XC2V500, and XC2V1000 Bank 7 7 Pin Description VCCO_7 VCCO_7 Pin Number H6 G6 No Connect in XC2V250 No Connect in XC2V500
CCLK PROG_B DONE M0 M1 M2 HSWAP_EN TCK TDI TDO TMS PWRDWN_B DXN DXP VBATT RSVD
Y19 A2 AB20 AB2 W3 AB3 B3 C19 D3 D20 B20 AB21 D5 A3 A21 A20
NA NA NA NA NA NA NA NA NA NA NA NA NA NA
VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT
AB11 AA22 AA1 M22 L1 B22 B1 A12 U17 U6 T16 T15 T8 T7
Module 4 of 4 30
Table 7: FG456 BGA XC2V250, XC2V500, and XC2V1000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number R16 R7 H16 H7 G16 G15 G8 G7 F17 F6 AB22 AB1 AA21 AA2 Y20 Y3 W19 W4 P14 P13 P12 P11 P10 P9 N14 N13 N12 N11 N10 N9 M14 M13 M12 M11 No Connect in XC2V250 No Connect in XC2V500
Module 4 of 4 31
Table 7: FG456 BGA XC2V250, XC2V500, and XC2V1000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number M10 M9 L14 L13 L12 L11 L10 L9 K14 K13 K12 K11 K10 K9 J14 J13 J12 J11 J10 J9 D19 D4 C20 C3 B21 B2 A22 A1 No Connect in XC2V250 No Connect in XC2V500
Module 4 of 4 32
Module 4 of 4 33

As shown in Table 8, XC2V1500, XC2V2000, and XC2V3000 Virtex-II devices are available in the FG676 fine-pitch BGA package. Pins in the XC2V1500, XC2V2000, and XC2V3000 devices are the same, except for the pin differences in the XC2V1500 and XC2V2000 devices shown in the No Connect columns. Following this table are the FG676 Fine-Pitch BGA Package Specifications (1.00mm pitch). Table 8: FG676 BGA XC2V1500, XC2V2000, and XC2V3000 Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Pin Description IO_L01N_0 IO_L01P_0 IO_L02N_0 IO_L02P_0 IO_L03N_0/VRP_0 IO_L03P_0/VRN_0 IO_L04N_0/VREF_0 IO_L04P_0 IO_L05N_0 IO_L05P_0 IO_L06N_0 IO_L06P_0 IO_L19N_0 IO_L19P_0 IO_L21N_0 IO_L21P_0/VREF_0 IO_L22N_0 IO_L22P_0 IO_L24N_0 IO_L24P_0 IO_L25N_0 IO_L25P_0 IO_L27N_0 IO_L27P_0/VREF_0 IO_L49N_0 IO_L49P_0 IO_L51N_0 IO_L51P_0/VREF_0 IO_L52N_0 IO_L52P_0 IO_L54N_0 IO_L54P_0 IO_L67N_0 Pin Number D6 C6 B1 A2 D7 C7 B3 A3 G6 G7 E6 E7 B4 A4 B5 A5 B6 A6 A7 A8 E8 D8 G8 F8 C8 B8 D9 E9 F9 G9 B9 A9 C9 NC NC NC NC NC NC NC NC No Connect in XC2V1500 No Connect in XC2V2000
Module 4 of 4 34
Table 8: FG676 BGA XC2V1500, XC2V2000, and XC2V3000 Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Pin Description IO_L67P_0 IO_L69N_0 IO_L69P_0/VREF_0 IO_L70N_0 IO_L70P_0 IO_L72N_0 IO_L72P_0 IO_L73N_0 IO_L73P_0 IO_L75N_0 IO_L75P_0/VREF_0 IO_L76N_0 IO_L76P_0 IO_L78N_0 IO_L78P_0 IO_L91N_0/VREF_0 IO_L91P_0 IO_L92N_0 IO_L92P_0 IO_L93N_0 IO_L93P_0 IO_L94N_0/VREF_0 IO_L94P_0 IO_L95N_0/GCLK7P IO_L95P_0/GCLK6S IO_L96N_0/GCLK5P IO_L96P_0/GCLK4S Pin Number C10 F10 G10 E10 D10 A10 A11 F11 E11 G11 H11 D11 C11 B11 B12 G12 H12 F12 E12 D12 C12 G13 H13 F13 E13 D13 C13 NC NC NC NC NC NC NC NC No Connect in XC2V1500 No Connect in XC2V2000
1 1 1 1 1 1 1 1 1
IO_L96N_1/GCLK3P IO_L96P_1/GCLK2S IO_L95N_1/GCLK1P IO_L95P_1/GCLK0S IO_L94N_1 IO_L94P_1/VREF_1 IO_L93N_1 IO_L93P_1 IO_L92N_1
H14 H15 G14 F14 E14 D14 A12 A13 A14
Module 4 of 4 35
Table 8: FG676 BGA XC2V1500, XC2V2000, and XC2V3000 Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Pin Description IO_L92P_1 IO_L91N_1 IO_L91P_1/VREF_1 IO_L78N_1 IO_L78P_1 IO_L76N_1 IO_L76P_1 IO_L75N_1/VREF_1 IO_L75P_1 IO_L73N_1 IO_L73P_1 IO_L72N_1 IO_L72P_1 IO_L70N_1 IO_L70P_1 IO_L69N_1/VREF_1 IO_L69P_1 IO_L67N_1 IO_L67P_1 IO_L54N_1 IO_L54P_1 IO_L52N_1 IO_L52P_1 IO_L51N_1/VREF_1 IO_L51P_1 IO_L49N_1 IO_L49P_1 IO_L27N_1/VREF_1 IO_L27P_1 IO_L25N_1 IO_L25P_1 IO_L24N_1 IO_L24P_1 IO_L22N_1 IO_L22P_1 IO_L21N_1/VREF_1 IO_L21P_1 Pin Number A15 B15 C15 D15 E15 F15 G15 G16 F16 A16 A17 B16 C16 D16 E16 C17 D17 H16 G17 E17 F17 A18 A19 E18 D18 B18 C18 F19 F18 G18 G19 B19 C19 D19 E19 A20 A21 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC No Connect in XC2V1500 No Connect in XC2V2000
Module 4 of 4 36
Table 8: FG676 BGA XC2V1500, XC2V2000, and XC2V3000 Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Pin Description IO_L19N_1 IO_L19P_1 IO_L06N_1 IO_L06P_1 IO_L05N_1 IO_L05P_1 IO_L04N_1 IO_L04P_1/VREF_1 IO_L03N_1/VRP_1 IO_L03P_1/VRN_1 IO_L02N_1 IO_L02P_1 IO_L01N_1 IO_L01P_1 Pin Number E20 F20 B21 B22 A22 A23 C21 D21 C20 D20 A24 A25 B23 B24 No Connect in XC2V1500 No Connect in XC2V2000
2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2
IO_L01N_2 IO_L01P_2 IO_L02N_2/VRP_2 IO_L02P_2/VRN_2 IO_L03N_2 IO_L03P_2/VREF_2 IO_L04N_2 IO_L04P_2 IO_L06N_2 IO_L06P_2 IO_L19N_2 IO_L19P_2 IO_L21N_2 IO_L21P_2/VREF_2 IO_L22N_2 IO_L22P_2 IO_L24N_2 IO_L24P_2 IO_L25N_2 IO_L25P_2 IO_L43N_2 IO_L43P_2
B26 C26 G20 H20 C25 D25 E23 E24 G21 G22 D26 E26 F23 F24 E25 F25 H22 H21 G23 G24 F26 G26 NC NC NC NC
Module 4 of 4 37
Table 8: FG676 BGA XC2V1500, XC2V2000, and XC2V3000 Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Pin Description IO_L45N_2 IO_L45P_2/VREF_2 IO_L46N_2 IO_L46P_2 IO_L48N_2 IO_L48P_2 IO_L49N_2 IO_L49P_2 IO_L51N_2 IO_L51P_2/VREF_2 IO_L52N_2 IO_L52P_2 IO_L54N_2 IO_L54P_2 IO_L67N_2 IO_L67P_2 IO_L69N_2 IO_L69P_2/VREF_2 IO_L70N_2 IO_L70P_2 IO_L72N_2 IO_L72P_2 IO_L73N_2 IO_L73P_2 IO_L75N_2 IO_L75P_2/VREF_2 IO_L76N_2 IO_L76P_2 IO_L78N_2 IO_L78P_2 IO_L91N_2 IO_L91P_2 IO_L93N_2 IO_L93P_2/VREF_2 IO_L94N_2 IO_L94P_2 IO_L96N_2 Pin Number H23 H24 J21 J20 H25 H26 J22 J23 K21 K22 K20 L20 J24 J25 K23 K24 J26 K26 L22 L21 L25 L26 L19 M19 L23 L24 M22 M21 M23 M24 M25 M26 M20 N20 N22 N21 N24 NC NC NC NC NC NC NC NC No Connect in XC2V1500 No Connect in XC2V2000
Module 4 of 4 38
Table 8: FG676 BGA XC2V1500, XC2V2000, and XC2V3000 Bank 2 Pin Description IO_L96P_2 Pin Number N23 No Connect in XC2V1500 No Connect in XC2V2000
3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3
IO_L96N_3 IO_L96P_3 IO_L94N_3 IO_L94P_3 IO_L93N_3/VREF_3 IO_L93P_3 IO_L91N_3 IO_L91P_3 IO_L78N_3 IO_L78P_3 IO_L76N_3 IO_L76P_3 IO_L75N_3/VREF_3 IO_L75P_3 IO_L73N_3 IO_L73P_3 IO_L72N_3 IO_L72P_3 IO_L70N_3 IO_L70P_3 IO_L69N_3/VREF_3 IO_L69P_3 IO_L67N_3 IO_L67P_3 IO_L54N_3 IO_L54P_3 IO_L52N_3 IO_L52P_3 IO_L51N_3/VREF_3 IO_L51P_3 IO_L49N_3 IO_L49P_3 IO_L48N_3 IO_L48P_3 IO_L46N_3
N26 P26 P23 P22 P19 N19 P21 P20 R26 R25 R20 R19 R24 R23 R22 R21 T26 T25 T20 T19 T24 T23 T22 T21 U26 V26 U24 U23 U22 U21 V25 V24 V23 V22 W26 NC NC NC NC NC NC NC NC
Module 4 of 4 39
Table 8: FG676 BGA XC2V1500, XC2V2000, and XC2V3000 Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Pin Description IO_L46P_3 IO_L45N_3/VREF_3 IO_L45P_3 IO_L43N_3 IO_L43P_3 IO_L25N_3 IO_L25P_3 IO_L24N_3 IO_L24P_3 IO_L22N_3 IO_L22P_3 IO_L21N_3/VREF_3 IO_L21P_3 IO_L19N_3 IO_L19P_3 IO_L06N_3 IO_L06P_3 IO_L04N_3 IO_L04P_3 IO_L03N_3/VREF_3 IO_L03P_3 IO_L02N_3/VRP_3 IO_L02P_3/VRN_3 IO_L01N_3 IO_L01P_3 IO_L01N_4/BUSY/DOUT (1) IO_L01P_4/INIT_B IO_L02N_4/D0/DIN (1) IO_L02P_4/D1 IO_L03N_4/D2/ALT_VRP_4 IO_L03P_4/D3/ALT_VRN_4 IO_L04N_4/VREF_4 IO_L04P_4 IO_L05N_4/VRP_4 IO_L05P_4/VRN_4 IO_L06N_4 Pin Number Y26 U20 V20 W25 W24 V21 W21 AA26 AA25 Y24 Y23 W22 W23 AB26 AB25 AC26 AC25 AD26 AD25 AA24 AA23 AB24 AB23 Y22 AA22 NC NC NC NC No Connect in XC2V1500 No Connect in XC2V2000
4 4 4 4 4 4 4 4 4 4 4
AD21 AC21 Y20 Y19 AA20 AB20 AC22 AE21 AE26 AF25 W20
Module 4 of 4 40
Table 8: FG676 BGA XC2V1500, XC2V2000, and XC2V3000 Bank 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Pin Description IO_L06P_4 IO_L19N_4 IO_L19P_4 IO_L21N_4 IO_L21P_4/VREF_4 IO_L22N_4 IO_L22P_4 IO_L24N_4 IO_L24P_4 IO_L25N_4 IO_L25P_4 IO_L27N_4 IO_L27P_4/VREF_4 IO_L28N_4 IO_L28P_4 IO_L49N_4 IO_L49P_4 IO_L51N_4 IO_L51P_4/VREF_4 IO_L52N_4 IO_L52P_4 IO_L54N_4 IO_L54P_4 IO_L67N_4 IO_L67P_4 IO_L69N_4 IO_L69P_4/VREF_4 IO_L70N_4 IO_L70P_4 IO_L72N_4 IO_L72P_4 IO_L73N_4 IO_L73P_4 IO_L75N_4 IO_L75P_4/VREF_4 IO_L76N_4 IO_L76P_4 Pin Number Y21 AE24 AF24 AE23 AF23 AE22 AF22 AF21 AF20 AA19 AB19 AD20 AC20 AC19 AD19 AE19 AF19 AA18 AB18 Y18 Y17 AC18 AD18 AE18 AF18 AA17 AB17 AC17 AD17 AF17 AF16 AB16 AC16 AA16 Y16 AD16 AE16 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC No Connect in XC2V1500 No Connect in XC2V2000
Module 4 of 4 41
Table 8: FG676 BGA XC2V1500, XC2V2000, and XC2V3000 Bank 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Pin Description IO_L78N_4 IO_L78P_4 IO_L91N_4/VREF_4 IO_L91P_4 IO_L92N_4 IO_L92P_4 IO_L93N_4 IO_L93P_4 IO_L94N_4/VREF_4 IO_L94P_4 IO_L95N_4/GCLK3S IO_L95P_4/GCLK2P IO_L96N_4/GCLK1S IO_L96P_4/GCLK0P Pin Number Y15 AA15 W15 W16 AB15 AC15 AD15 AE15 W14 Y14 AA14 AB14 AC14 AD14 No Connect in XC2V1500 NC NC No Connect in XC2V2000
5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5
IO_L96N_5/GCLK7S IO_L96P_5/GCLK6P IO_L95N_5/GCLK5S IO_L95P_5/GCLK4P IO_L94N_5 IO_L94P_5/VREF_5 IO_L93N_5 IO_L93P_5 IO_L92N_5 IO_L92P_5 IO_L91N_5 IO_L91P_5/VREF_5 IO_L78N_5 IO_L78P_5 IO_L76N_5 IO_L76P_5 IO_L75N_5/VREF_5 IO_L75P_5 IO_L73N_5 IO_L73P_5 IO_L72N_5 IO_L72P_5
AC13 AB13 AA13 Y13 W13 W12 AF15 AF14 AF13 AF12 AE12 AD12 AC12 AB12 AA12 Y12 AF11 AF10 AE11 AD11 AC11 AB11 NC NC NC NC NC NC NC NC
Module 4 of 4 42
Table 8: FG676 BGA XC2V1500, XC2V2000, and XC2V3000 Bank 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 Pin Description IO_L70N_5 IO_L70P_5 IO_L69N_5/VREF_5 IO_L69P_5 IO_L67N_5 IO_L67P_5 IO_L54N_5 IO_L54P_5 IO_L52N_5 IO_L52P_5 IO_L51N_5/VREF_5 IO_L51P_5 IO_L49N_5 IO_L49P_5 IO_L28N_5 IO_L28P_5 IO_L27N_5/VREF_5 IO_L27P_5 IO_L25N_5 IO_L25P_5 IO_L24N_5 IO_L24P_5 IO_L22N_5 IO_L22P_5 IO_L21N_5/VREF_5 IO_L21P_5 IO_L19N_5 IO_L19P_5 IO_L06N_5 IO_L06P_5 IO_L05N_5/VRP_5 IO_L05P_5/VRN_5 IO_L04N_5 IO_L04P_5/VREF_5 IO_L03N_5/D4/ALT_VRP_5 IO_L03P_5/D5/ALT_VRN_5 IO_L02N_5/D6 Pin Number W11 Y10 Y11 AA11 AF9 AF8 AE9 AD9 AB10 AA10 AD10 AC10 AE8 AF7 AD8 AC8 AB9 AC9 AA9 Y9 AF6 AE6 AB8 AA8 AC7 AD7 AF5 AE5 AF4 AE4 AF3 AE3 Y8 Y7 AB7 AA7 AD6 NC NC NC NC NC NC NC NC NC NC NC NC No Connect in XC2V1500 No Connect in XC2V2000
Module 4 of 4 43
Table 8: FG676 BGA XC2V1500, XC2V2000, and XC2V3000 Bank 5 5 5 Pin Description IO_L02P_5/D7 IO_L01N_5/RDWR_B IO_L01P_5/CS_B Pin Number AC6 AB6 AC5 No Connect in XC2V1500 No Connect in XC2V2000
6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
IO_L01P_6 IO_L01N_6 IO_L02P_6/VRN_6 IO_L02N_6/VRP_6 IO_L03P_6 IO_L03N_6/VREF_6 IO_L04P_6 IO_L04N_6 IO_L06P_6 IO_L06N_6 IO_L19P_6 IO_L19N_6 IO_L21P_6 IO_L21N_6/VREF_6 IO_L22P_6 IO_L22N_6 IO_L24P_6 IO_L24N_6 IO_L25P_6 IO_L25N_6 IO_L43P_6 IO_L43N_6 IO_L45P_6 IO_L45N_6/VREF_6 IO_L46P_6 IO_L46N_6 IO_L48P_6 IO_L48N_6 IO_L49P_6 IO_L49N_6 IO_L51P_6 IO_L51N_6/VREF_6 IO_L52P_6
AF2 AE1 AB4 AB3 AD2 AD1 AC2 AC1 AB2 AB1 AA4 AA3 Y6 Y5 W6 W7 AA2 AA1 Y4 Y3 W5 W4 W2 W3 Y1 W1 V6 V7 V5 V4 V3 V2 V1 NC NC NC NC
Module 4 of 4 44
Table 8: FG676 BGA XC2V1500, XC2V2000, and XC2V3000 Bank 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Pin Description IO_L52N_6 IO_L54P_6 IO_L54N_6 IO_L67P_6 IO_L67N_6 IO_L69P_6 IO_L69N_6/VREF_6 IO_L70P_6 IO_L70N_6 IO_L72P_6 IO_L72N_6 IO_L73P_6 IO_L73N_6 IO_L75P_6 IO_L75N_6/VREF_6 IO_L76P_6 IO_L76N_6 IO_L78P_6 IO_L78N_6 IO_L91P_6 IO_L91N_6 IO_L93P_6 IO_L93N_6/VREF_6 IO_L94P_6 IO_L94N_6 IO_L96P_6 IO_L96N_6 Pin Number U1 U7 T7 U4 U3 U6 U5 T5 T6 T8 R8 T2 T1 T4 T3 R6 R5 R4 R3 R2 R1 R7 P7 P6 P5 P4 P3 NC NC NC NC NC NC NC NC No Connect in XC2V1500 No Connect in XC2V2000
7 7 7 7 7 7 7 7 7
IO_L96P_7 IO_L96N_7 IO_L94P_7 IO_L94N_7 IO_L93P_7/VREF_7 IO_L93N_7 IO_L91P_7 IO_L91N_7 IO_L78P_7
P1 N1 N4 N5 N6 N7 P8 N8 M1 NC
Module 4 of 4 45
Table 8: FG676 BGA XC2V1500, XC2V2000, and XC2V3000 Bank 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 Pin Description IO_L78N_7 IO_L76P_7 IO_L76N_7 IO_L75P_7/VREF_7 IO_L75N_7 IO_L73P_7 IO_L73N_7 IO_L72P_7 IO_L72N_7 IO_L70P_7 IO_L70N_7 IO_L69P_7/VREF_7 IO_L69N_7 IO_L67P_7 IO_L67N_7 IO_L54P_7 IO_L54N_7 IO_L52P_7 IO_L52N_7 IO_L51P_7/VREF_7 IO_L51N_7 IO_L49P_7 IO_L49N_7 IO_L48P_7 IO_L48N_7 IO_L46P_7 IO_L46N_7 IO_L45P_7/VREF_7 IO_L45N_7 IO_L43P_7 IO_L43N_7 IO_L25P_7 IO_L25N_7 IO_L24P_7 IO_L24N_7 IO_L22P_7 IO_L22N_7 Pin Number M2 M5 M6 M3 M4 M7 M8 L1 L2 L5 L6 L3 L4 K1 J1 K3 K4 K5 K6 L8 L7 J2 H1 J3 J4 J5 J6 H5 H4 K7 J7 H2 H3 G1 F1 G3 G4 NC NC NC NC No Connect in XC2V1500 NC NC NC NC NC NC NC No Connect in XC2V2000
Module 4 of 4 46
Table 8: FG676 BGA XC2V1500, XC2V2000, and XC2V3000 Bank 7 7 7 7 7 7 7 7 7 7 7 7 7 7 Pin Description IO_L21P_7/VREF_7 IO_L21N_7 IO_L19P_7 IO_L19N_7 IO_L06P_7 IO_L06N_7 IO_L04P_7 IO_L04N_7 IO_L03P_7/VREF_7 IO_L03N_7 IO_L02P_7/VRN_7 IO_L02N_7/VRP_7 IO_L01P_7 IO_L01N_7 Pin Number F3 F2 H6 H7 E1 E2 D1 D2 C1 C2 E3 E4 G5 F4 No Connect in XC2V1500 No Connect in XC2V2000
0 0 0 0 0 0 0 1 1 1 1 1 1 1 2 2 2 2 2 2 2 3
VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_3
J13 J12 J11 H10 H9 B10 B7 B17 J16 J15 J14 H18 H17 B20 N18 M18 L18 K25 K19 J19 G25 Y25
Module 4 of 4 47
Table 8: FG676 BGA XC2V1500, XC2V2000, and XC2V3000 Bank 3 3 3 3 3 3 4 4 4 4 4 4 4 5 5 5 5 5 5 5 6 6 6 6 6 6 6 7 7 7 7 7 7 7 Pin Description VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 Pin Number V19 U25 U19 T18 R18 P18 AE20 AE17 W18 W17 V16 V15 V14 AE10 AE7 W10 W9 V13 V12 V11 Y2 V8 U8 U2 T9 R9 P9 N9 M9 L9 K8 K2 J8 G2 No Connect in XC2V1500 No Connect in XC2V2000
NA NA
CCLK PROG_B
AB21 C4
Module 4 of 4 48
Table 8: FG676 BGA XC2V1500, XC2V2000, and XC2V3000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description DONE M0 M1 M2 HSWAP_EN TCK TDI TDO TMS PWRDWN_B DXN DXP VBATT RSVD Pin Number AD22 AD4 AA5 AD5 D5 E21 F5 F22 D22 AD23 F7 C5 C23 C22 No Connect in XC2V1500 No Connect in XC2V2000
NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA
VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT
AD13 AC24 AC3 P24 N3 D24 D3 C14 W19 W8 V18 V17 V10 V9 U18 U9 K18 K9 J18 J17 J10 J9
Module 4 of 4 49
Table 8: FG676 BGA XC2V1500, XC2V2000, and XC2V3000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description VCCINT VCCINT GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number H19 H8 AF26 AF1 AE25 AE14 AE13 AE2 AD24 AD3 AC23 AC4 AB22 AB5 AA21 AA6 U17 U16 U15 U14 U13 U12 U11 U10 T17 T16 T15 T14 T13 T12 T11 T10 R17 R16 R15 R14 R13 No Connect in XC2V1500 No Connect in XC2V2000
Module 4 of 4 50
Table 8: FG676 BGA XC2V1500, XC2V2000, and XC2V3000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number R12 R11 R10 P25 P17 P16 P15 P14 P13 P12 P11 P10 P2 N25 N17 N16 N15 N14 N13 N12 N11 N10 N2 M17 M16 M15 M14 M13 M12 M11 M10 L17 L16 L15 L14 L13 L12 No Connect in XC2V1500 No Connect in XC2V2000
Module 4 of 4 51
Table 8: FG676 BGA XC2V1500, XC2V2000, and XC2V3000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number L11 L10 K17 K16 K15 K14 K13 K12 K11 K10 F21 F6 E22 E5 D23 D4 C24 C3 B25 B14 B13 B2 A26 A1 No Connect in XC2V1500 No Connect in XC2V2000
Module 4 of 4 52
Module 4 of 4 53
BG575 Standard BGA Package

As shown in Table 9, XC2V1000, XC2V1500, and XC2V2000 Virtex-II devices are available in the BG575 BGA package. Pins in the XC2V1000, XC2V1500, and XC2V2000 devices are the same, except for the pin differences in the XC2V1000 and XC2V1500 devices shown in the No Connect columns. Following this table are the BG575 Standard BGA Package Specifications (1.27mm pitch). Table 9: BG575 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Pin Description IO_L01N_0 IO_L01P_0 IO_L02N_0 IO_L02P_0 IO_L03N_0/VRP_0 IO_L03P_0/VRN_0 IO_L04N_0/VREF_0 IO_L04P_0 IO_L05N_0 IO_L05P_0 IO_L06N_0 IO_L06P_0 IO_L19N_0 IO_L19P_0 IO_L21N_0 IO_L21P_0/VREF_0 IO_L22N_0 IO_L22P_0 IO_L24N_0 IO_L24P_0 IO_L49N_0 IO_L49P_0 IO_L51N_0 IO_L51P_0/VREF_0 IO_L52N_0 IO_L52P_0 IO_L54N_0 IO_L54P_0 IO_L67N_0 IO_L67P_0 IO_L69N_0 Pin Number A3 A4 D5 C5 E6 D6 F7 E7 G8 H9 A5 A6 B5 B6 D7 C7 F8 E8 G9 F9 G10 H10 B7 B8 D8 C8 E9 D9 A8 A9 C9 NC NC NC No Connect in XC2V1000 No Connect in XC2V1500
Module 4 of 4 54
Table 9: BG575 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Pin Description IO_L69P_0/VREF_0 IO_L70N_0 IO_L70P_0 IO_L72N_0 IO_L72P_0 IO_L73N_0 IO_L73P_0 IO_L91N_0/VREF_0 IO_L91P_0 IO_L92N_0 IO_L92P_0 IO_L93N_0 IO_L93P_0 IO_L94N_0/VREF_0 IO_L94P_0 IO_L95N_0/GCLK7P IO_L95P_0/GCLK6S IO_L96N_0/GCLK5P IO_L96P_0/GCLK4S Pin Number B9 F10 E10 A10 A11 C10 B10 D11 C11 G11 E11 C12 B12 E12 D12 G12 F12 H11 H12 No Connect in XC2V1000 NC NC NC NC NC NC NC NC NC No Connect in XC2V1500
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
IO_L96N_1/GCLK3P IO_L96P_1/GCLK2S IO_L95N_1/GCLK1P IO_L95P_1/GCLK0S IO_L94N_1 IO_L94P_1/VREF_1 IO_L93N_1 IO_L93P_1 IO_L92N_1 IO_L92P_1 IO_L91N_1 IO_L91P_1/VREF_1 IO_L73N_1 IO_L73P_1 IO_L72N_1 IO_L72P_1
A13 A14 B13 C13 D13 E13 F13 G13 H13 H14 C14 D14 E14 G14 A15 A16 NC NC NC NC NC NC
Module 4 of 4 55
Table 9: BG575 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Pin Description IO_L70N_1 IO_L70P_1 IO_L69N_1/VREF_1 IO_L69P_1 IO_L67N_1 IO_L67P_1 IO_L54N_1 IO_L54P_1 IO_L52N_1 IO_L52P_1 IO_L51N_1/VREF_1 IO_L51P_1 IO_L49N_1 IO_L49P_1 IO_L24N_1 IO_L24P_1 IO_L22N_1 IO_L22P_1 IO_L21N_1/VREF_1 IO_L21P_1 IO_L19N_1 IO_L19P_1 IO_L06N_1 IO_L06P_1 IO_L05N_1 IO_L05P_1 IO_L04N_1 IO_L04P_1/VREF_1 IO_L03N_1/VRP_1 IO_L03P_1/VRN_1 IO_L02N_1 IO_L02P_1 IO_L01N_1 IO_L01P_1 Pin Number B15 C15 E15 F15 G15 H15 B16 C16 D16 E16 F16 G16 A17 A19 B17 B18 C17 D17 F17 E17 A20 A21 B19 B20 C18 D18 C20 D20 D19 E19 E18 F18 H16 G17 No Connect in XC2V1000 NC NC NC NC NC NC No Connect in XC2V1500
IO_L01N_2
D22
Module 4 of 4 56
Table 9: BG575 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Pin Description IO_L01P_2 IO_L02N_2/VRP_2 IO_L02P_2/VRN_2 IO_L03N_2 IO_L03P_2/VREF_2 IO_L04N_2 IO_L04P_2 IO_L06N_2 IO_L06P_2 IO_L19N_2 IO_L19P_2 IO_L21N_2 IO_L21P_2/VREF_2 IO_L22N_2 IO_L22P_2 IO_L24N_2 IO_L24P_2 IO_L43N_2 IO_L43P_2 IO_L45N_2 IO_L45P_2/VREF_2 IO_L46N_2 IO_L46P_2 IO_L48N_2 IO_L48P_2 IO_L49N_2 IO_L49P_2 IO_L51N_2 IO_L51P_2/VREF_2 IO_L52N_2 IO_L52P_2 IO_L54N_2 IO_L54P_2 IO_L67N_2 IO_L67P_2 IO_L69N_2 Pin Number D23 E21 E22 F21 F20 G20 G19 H18 J17 D24 E23 E24 F24 F23 G23 G21 G22 H19 H20 J18 J19 K17 K18 H23 H24 H21 H22 J24 K24 J22 J23 J20 J21 K19 K20 L17 NC NC NC No Connect in XC2V1000 No Connect in XC2V1500
Module 4 of 4 57
Table 9: BG575 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Pin Description IO_L69P_2/VREF_2 IO_L70N_2 IO_L70P_2 IO_L72N_2 IO_L72P_2 IO_L73N_2 IO_L73P_2 IO_L91N_2 IO_L91P_2 IO_L93N_2 IO_L93P_2/VREF_2 IO_L94N_2 IO_L94P_2 IO_L96N_2 IO_L96P_2 Pin Number L18 K23 L24 K22 L22 L21 L20 M23 N24 M21 M22 M19 M20 M17 M18 No Connect in XC2V1000 NC NC NC NC NC NC NC NC NC No Connect in XC2V1500
3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3
IO_L96N_3 IO_L96P_3 IO_L94N_3 IO_L94P_3 IO_L93N_3/VREF_3 IO_L93P_3 IO_L91N_3 IO_L91P_3 IO_L73N_3 IO_L73P_3 IO_L72N_3 IO_L72P_3 IO_L70N_3 IO_L70P_3 IO_L69N_3/VREF_3 IO_L69P_3 IO_L67N_3 IO_L67P_3 IO_L54N_3 IO_L54P_3
N23 N22 N20 N21 N19 N18 N17 P17 P24 R24 R23 R22 P22 P21 P20 P18 T24 U24 T23 T22 NC NC NC NC NC NC NC NC NC NC NC NC
Module 4 of 4 58
Table 9: BG575 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Pin Description IO_L52N_3 IO_L52P_3 IO_L51N_3/VREF_3 IO_L51P_3 IO_L49N_3 IO_L49P_3 IO_L48N_3 IO_L48P_3 IO_L46N_3 IO_L46P_3 IO_L45N_3/VREF_3 IO_L45P_3 IO_L43N_3 IO_L43P_3 IO_L24N_3 IO_L24P_3 IO_L22N_3 IO_L22P_3 IO_L21N_3/VREF_3 IO_L21P_3 IO_L19N_3 IO_L19P_3 IO_L06N_3 IO_L06P_3 IO_L04N_3 IO_L04P_3 IO_L03N_3/VREF_3 IO_L03P_3 IO_L02N_3/VRP_3 IO_L02P_3/VRN_3 IO_L01N_3 IO_L01P_3 Pin Number T21 T20 R20 R19 W24 W23 U23 V23 U22 U21 V22 V21 U19 U20 T19 T18 R18 R17 Y24 Y23 AA24 AB24 AA23 AA22 Y22 Y21 W21 W20 V20 V19 U18 T17 No Connect in XC2V1000 No Connect in XC2V1500
4 4 4
IO_L01N_4/BUSY/DOUT (1) IO_L01P_4/INIT_B IO_L02N_4/D0/DIN (1)
AD22 AD21 AA20
Module 4 of 4 59
Table 9: BG575 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Pin Description IO_L02P_4/D1 IO_L03N_4/D2/ALT_VRP_4 IO_L03P_4/D3/ALT_VRN_4 IO_L04N_4/VREF_4 IO_L04P_4 IO_L05N_4/VRP_4 IO_L05P_4/VRN_4 IO_L06N_4 IO_L06P_4 IO_L19N_4 IO_L19P_4 IO_L21N_4 IO_L21P_4/VREF_4 IO_L22N_4 IO_L22P_4 IO_L24N_4 IO_L24P_4 IO_L49N_4 IO_L49P_4 IO_L51N_4 IO_L51P_4/VREF_4 IO_L52N_4 IO_L52P_4 IO_L54N_4 IO_L54P_4 IO_L67N_4 IO_L67P_4 IO_L69N_4 IO_L69P_4/VREF_4 IO_L70N_4 IO_L70P_4 IO_L72N_4 IO_L72P_4 IO_L73N_4 IO_L73P_4 IO_L91N_4/VREF_4 Pin Number AB20 Y19 AA19 W18 Y18 U16 V17 AD20 AD19 AC20 AC19 AA18 AB18 AC18 AC17 AA17 AB17 Y17 W17 V16 W16 AD17 AD16 AB16 AC16 Y16 AA16 W15 Y15 U15 V15 AD15 AD14 AB15 AC15 AA14 NC NC NC NC NC NC NC NC NC NC NC NC No Connect in XC2V1000 No Connect in XC2V1500
Module 4 of 4 60
Table 9: BG575 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 4 4 4 4 4 4 4 4 4 4 4 Pin Description IO_L91P_4 IO_L92N_4 IO_L92P_4 IO_L93N_4 IO_L93P_4 IO_L94N_4/VREF_4 IO_L94P_4 IO_L95N_4/GCLK3S IO_L95P_4/GCLK2P IO_L96N_4/GCLK1S IO_L96P_4/GCLK0P Pin Number AB14 V14 Y14 AB13 AC13 Y13 AA13 V13 W13 U14 U13 No Connect in XC2V1000 No Connect in XC2V1500
5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5
IO_L96N_5/GCLK7S IO_L96P_5/GCLK6P IO_L95N_5/GCLK5S IO_L95P_5/GCLK4P IO_L94N_5 IO_L94P_5/VREF_5 IO_L93N_5 IO_L93P_5 IO_L92N_5 IO_L92P_5 IO_L91N_5 IO_L91P_5/VREF_5 IO_L73N_5 IO_L73P_5 IO_L72N_5 IO_L72P_5 IO_L70N_5 IO_L70P_5 IO_L69N_5/VREF_5 IO_L69P_5 IO_L67N_5 IO_L67P_5 IO_L54N_5 IO_L54P_5
AD12 AD11 AC12 AB12 AA12 Y12 W12 V12 U12 U11 AB11 AA11 Y11 V11 AD10 AD9 AC10 AB10 Y10 W10 V10 U10 AC9 AB9 NC NC NC NC NC NC NC NC NC NC NC NC
Module 4 of 4 61
Table 9: BG575 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 Pin Description IO_L52N_5 IO_L52P_5 IO_L51N_5/VREF_5 IO_L51P_5 IO_L49N_5 IO_L49P_5 IO_L24N_5 IO_L24P_5 IO_L22N_5 IO_L22P_5 IO_L21N_5/VREF_5 IO_L21P_5 IO_L19N_5 IO_L19P_5 IO_L06N_5 IO_L06P_5 IO_L05N_5/VRP_5 IO_L05P_5/VRN_5 IO_L04N_5 IO_L04P_5/VREF_5 IO_L03N_5/D4/ALT_VRP_5 IO_L03P_5/D5/ALT_VRN_5 IO_L02N_5/D6 IO_L02P_5/D7 IO_L01N_5/RDWR_B IO_L01P_5/CS_B Pin Number AA9 Y9 W9 V9 AD8 AD6 AC8 AC7 AB8 AA8 W8 Y8 AD5 AD4 AC6 AC5 AB7 AA7 AB5 AA5 AA6 Y6 Y7 W7 V8 U9 No Connect in XC2V1000 No Connect in XC2V1500
6 6 6 6 6 6 6 6 6
IO_L01P_6 IO_L01N_6 IO_L02P_6/VRN_6 IO_L02N_6/VRP_6 IO_L03P_6 IO_L03N_6/VREF_6 IO_L04P_6 IO_L04N_6 IO_L06P_6
AB2 AB1 AA3 AA2 Y4 Y3 W4 W5 V5
Module 4 of 4 62
Table 9: BG575 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Pin Description IO_L06N_6 IO_L19P_6 IO_L19N_6 IO_L21P_6 IO_L21N_6/VREF_6 IO_L22P_6 IO_L22N_6 IO_L24P_6 IO_L24N_6 IO_L43P_6 IO_L43N_6 IO_L45P_6 IO_L45N_6/VREF_6 IO_L46P_6 IO_L46N_6 IO_L48P_6 IO_L48N_6 IO_L49P_6 IO_L49N_6 IO_L51P_6 IO_L51N_6/VREF_6 IO_L52P_6 IO_L52N_6 IO_L54P_6 IO_L54N_6 IO_L67P_6 IO_L67N_6 IO_L69P_6 IO_L69N_6/VREF_6 IO_L70P_6 IO_L70N_6 IO_L72P_6 IO_L72N_6 IO_L73P_6 IO_L73N_6 IO_L91P_6 Pin Number V6 U7 T8 AA1 Y2 Y1 W1 W2 V2 V4 V3 U6 U5 T7 T6 R8 R7 U2 U1 U4 U3 T1 R1 T3 T2 T5 T4 R6 R5 P8 P7 R2 P1 R3 P3 P5 NC NC NC NC NC NC NC NC NC NC NC NC No Connect in XC2V1000 No Connect in XC2V1500
Module 4 of 4 63
Table 9: BG575 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 6 6 6 6 6 6 6 Pin Description IO_L91N_6 IO_L93P_6 IO_L93N_6/VREF_6 IO_L94P_6 IO_L94N_6 IO_L96P_6 IO_L96N_6 Pin Number P4 N4 N3 N6 N5 N8 N7 No Connect in XC2V1000 No Connect in XC2V1500
7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7
IO_L96P_7 IO_L96N_7 IO_L94P_7 IO_L94N_7 IO_L93P_7/VREF_7 IO_L93N_7 IO_L91P_7 IO_L91N_7 IO_L73P_7 IO_L73N_7 IO_L72P_7 IO_L72N_7 IO_L70P_7 IO_L70N_7 IO_L69P_7/VREF_7 IO_L69N_7 IO_L67P_7 IO_L67N_7 IO_L54P_7 IO_L54N_7 IO_L52P_7 IO_L52N_7 IO_L51P_7/VREF_7 IO_L51N_7 IO_L49P_7 IO_L49N_7 IO_L48P_7 IO_L48N_7
N2 M1 M2 M3 M4 M5 M6 M7 M8 L8 L1 K1 K2 K3 L3 L4 L5 L7 J1 H1 J2 J3 J4 J5 K5 K6 F1 F2 NC NC NC NC NC NC NC NC NC NC NC NC
Module 4 of 4 64
Table 9: BG575 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 Pin Description IO_L46P_7 IO_L46N_7 IO_L45P_7/VREF_7 IO_L45N_7 IO_L43P_7 IO_L43N_7 IO_L24P_7 IO_L24N_7 IO_L22P_7 IO_L22N_7 IO_L21P_7/VREF_7 IO_L21N_7 IO_L19P_7 IO_L19N_7 IO_L06P_7 IO_L06N_7 IO_L04P_7 IO_L04N_7 IO_L03P_7/VREF_7 IO_L03N_7 IO_L02P_7/VRN_7 IO_L02N_7/VRP_7 IO_L01P_7 IO_L01N_7 Pin Number H2 G2 H3 H4 G3 G4 H5 H6 J6 J7 K7 K8 E1 E2 D2 D3 E3 E4 F4 F5 G5 G6 H7 J8 No Connect in XC2V1000 No Connect in XC2V1500
0 0 0 0 0 0 1 1 1 1 1
VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1
J12 J11 J10 F11 C6 B11 J15 J14 J13 F14 C19
Module 4 of 4 65
Table 9: BG575 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 1 2 2 2 2 2 2 3 3 3 3 3 3 4 4 4 4 4 4 5 5 5 5 5 5 6 6 6 6 6 6 7 7 7 7 7 Pin Description VCCO_1 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 Pin Number B14 M16 L23 L19 L16 K16 F22 W22 R16 P23 P19 P16 N16 AC14 AB19 W14 T15 T14 T13 AC11 AB6 W11 T12 T11 T10 W3 R9 P9 P6 P2 N9 M9 L9 L6 L2 K9 No Connect in XC2V1000 No Connect in XC2V1500
Module 4 of 4 66
Table 9: BG575 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 7 Pin Description VCCO_7 Pin Number F3 No Connect in XC2V1000 No Connect in XC2V1500
AB23 C1 AB21 AC4 AB4 AD3 C2 C23 D1 C24 C21 AC21 B4 C4 B21 A22
NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA
VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT
AD13 AC22 AC3 N1 M24 B22 B3 A12 U17 U8 T16 T9 R15 R14 R13 R12 R11
Module 4 of 4 67
Table 9: BG575 BGA XC2V1000, XC2V1500, and XC2V2000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number R10 P15 P10 N15 N10 M15 M10 L15 L10 K15 K14 K13 K12 K11 K10 J16 J9 H17 H8 AD24 AD23 AD18 AD7 AD2 AD1 AC24 AC23 AC2 AC1 AB22 AB3 AA21 AA15 AA10 AA4 Y20 No Connect in XC2V1000 No Connect in XC2V1500
Module 4 of 4 68
Table 9: BG575 BGA XC2V1000, XC2V1500, and XC2V2000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number Y5 W19 W6 V24 V18 V7 V1 R21 R4 P14 P13 P12 P11 N14 N13 N12 N11 M14 M13 M12 M11 L14 L13 L12 L11 K21 K4 G24 G18 G7 G1 F19 F6 E20 E5 D21 No Connect in XC2V1000 No Connect in XC2V1500
Module 4 of 4 69
Table 9: BG575 BGA XC2V1000, XC2V1500, and XC2V2000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number D15 D10 D4 C22 C3 B24 B23 B2 B1 A24 A23 A18 A7 A2 No Connect in XC2V1000 No Connect in XC2V1500
Module 4 of 4 70
BG575 Standard BGA Package Specifications (1.27mm pitch)
Figure 5: BG575 Standard BGA Package Specifications
Module 4 of 4 71
BG728 Standard BGA Package

As shown in Table 10, XC2V3000 Virtex-II devices are available in the BG728 BGA package. Following this table are the BG728 Standard BGA Package Specifications (1.27mm pitch). Table 10: BG728 BGA XC2V3000 Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Pin Description IO_L01N_0 IO_L01P_0 IO_L02N_0 IO_L02P_0 IO_L03N_0/VRP_0 IO_L03P_0/VRN_0 IO_L04N_0/VREF_0 IO_L04P_0 IO_L05N_0 IO_L05P_0 IO_L06N_0 IO_L06P_0 IO_L19N_0 IO_L19P_0 IO_L21N_0 IO_L21P_0/VREF_0 IO_L22N_0 IO_L22P_0 IO_L24N_0 IO_L24P_0 IO_L25N_0 IO_L25P_0 IO_L27N_0 IO_L27P_0/VREF_0 IO_L28N_0 IO_L28P_0 IO_L30N_0 IO_L30P_0 IO_L49N_0 IO_L49P_0 IO_L51N_0 IO_L51P_0/VREF_0 IO_L52N_0 Pin Number B3 A3 B4 A4 C5 C6 B5 A5 E6 D6 B6 A6 E7 D8 F8 E8 C7 C8 B7 A7 H9 J9 F9 G9 E9 D9 C9 B9 A8 A9 G10 H10 F10
Module 4 of 4 72
Table 10: BG728 BGA XC2V3000 Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Pin Description IO_L52P_0 IO_L54N_0 IO_L54P_0 IO_L67N_0 IO_L67P_0 IO_L69N_0 IO_L69P_0/VREF_0 IO_L70N_0 IO_L70P_0 IO_L72N_0 IO_L72P_0 IO_L73N_0 IO_L73P_0 IO_L75N_0 IO_L75P_0/VREF_0 IO_L76N_0 IO_L76P_0 IO_L78N_0 IO_L78P_0 IO_L91N_0/VREF_0 IO_L91P_0 IO_L92N_0 IO_L92P_0 IO_L93N_0 IO_L93P_0 IO_L94N_0/VREF_0 IO_L94P_0 IO_L95N_0/GCLK7P IO_L95P_0/GCLK6S IO_L96N_0/GCLK5P IO_L96P_0/GCLK4S Pin Number E10 D10 C10 B10 A10 G11 H11 F11 F12 D11 C11 B11 A11 H12 J12 E12 D12 B12 A12 J13 H13 G13 F13 E13 D13 B13 A13 C13 C14 F14 E14
1 1 1 1
IO_L96N_1/GCLK3P IO_L96P_1/GCLK2S IO_L95N_1/GCLK1P IO_L95P_1/GCLK0S
G14 H14 A15 B15
Module 4 of 4 73
Table 10: BG728 BGA XC2V3000 Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Pin Description IO_L94N_1 IO_L94P_1/VREF_1 IO_L93N_1 IO_L93P_1 IO_L92N_1 IO_L92P_1 IO_L91N_1 IO_L91P_1/VREF_1 IO_L78N_1 IO_L78P_1 IO_L76N_1 IO_L76P_1 IO_L75N_1/VREF_1 IO_L75P_1 IO_L73N_1 IO_L73P_1 IO_L72N_1 IO_L72P_1 IO_L70N_1 IO_L70P_1 IO_L69N_1/VREF_1 IO_L69P_1 IO_L67N_1 IO_L67P_1 IO_L54N_1 IO_L54P_1 IO_L52N_1 IO_L52P_1 IO_L51N_1/VREF_1 IO_L51P_1 IO_L49N_1 IO_L49P_1 IO_L30N_1 IO_L30P_1 IO_L28N_1 IO_L28P_1 Pin Number C15 D15 E15 F15 G15 H15 J15 J16 A16 B16 D16 E16 F16 F17 H16 H17 A17 B17 C17 D17 G18 G17 A18 B18 C18 D18 E18 F18 H19 H18 A19 A20 B19 C19 D19 E19
Module 4 of 4 74
Table 10: BG728 BGA XC2V3000 Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Pin Description IO_L27N_1/VREF_1 IO_L27P_1 IO_L25N_1 IO_L25P_1 IO_L24N_1 IO_L24P_1 IO_L22N_1 IO_L22P_1 IO_L21N_1/VREF_1 IO_L21P_1 IO_L19N_1 IO_L19P_1 IO_L06N_1 IO_L06P_1 IO_L05N_1 IO_L05P_1 IO_L04N_1 IO_L04P_1/VREF_1 IO_L03N_1/VRP_1 IO_L03P_1/VRN_1 IO_L02N_1 IO_L02P_1 IO_L01N_1 IO_L01P_1 Pin Number F19 G19 J19 J20 C20 C21 D20 E21 E20 F20 A21 B21 A22 B22 C22 C23 D22 E22 A23 B23 A24 B24 A25 B25
2 2 2 2 2 2 2 2 2 2 2
IO_L01N_2 IO_L01P_2 IO_L02N_2/VRP_2 IO_L02P_2/VRN_2 IO_L03N_2 IO_L03P_2/VREF_2 IO_L04N_2 IO_L04P_2 IO_L06N_2 IO_L06P_2 IO_L19N_2
C27 D27 D25 D26 E24 E25 E26 E27 F23 F24 F25
Module 4 of 4 75
Table 10: BG728 BGA XC2V3000 Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Pin Description IO_L19P_2 IO_L21N_2 IO_L21P_2/VREF_2 IO_L22N_2 IO_L22P_2 IO_L24N_2 IO_L24P_2 IO_L25N_2 IO_L25P_2 IO_L27N_2 IO_L27P_2/VREF_2 IO_L28N_2 IO_L28P_2 IO_L30N_2 IO_L30P_2 IO_L43N_2 IO_L43P_2 IO_L45N_2 IO_L45P_2/VREF_2 IO_L46N_2 IO_L46P_2 IO_L48N_2 IO_L48P_2 IO_L49N_2 IO_L49P_2 IO_L51N_2 IO_L51P_2/VREF_2 IO_L52N_2 IO_L52P_2 IO_L54N_2 IO_L54P_2 IO_L67N_2 IO_L67P_2 IO_L69N_2 IO_L69P_2/VREF_2 IO_L70N_2 Pin Number F26 F27 G27 G23 H23 G25 G26 H21 J21 H22 J22 H24 H25 H27 J27 J23 J24 J25 J26 K20 K21 K22 K23 K24 K25 K26 K27 L20 M20 L21 L22 L24 L25 L26 L27 M19
Module 4 of 4 76
Table 10: BG728 BGA XC2V3000 Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Pin Description IO_L70P_2 IO_L72N_2 IO_L72P_2 IO_L73N_2 IO_L73P_2 IO_L75N_2 IO_L75P_2/VREF_2 IO_L76N_2 IO_L76P_2 IO_L78N_2 IO_L78P_2 IO_L91N_2 IO_L91P_2 IO_L93N_2 IO_L93P_2/VREF_2 IO_L94N_2 IO_L94P_2 IO_L96N_2 IO_L96P_2 Pin Number N19 M22 M23 M24 N24 M26 M27 N20 N21 N22 N23 N25 P25 N26 N27 P20 P21 P22 P23
3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3
IO_L96N_3 IO_L96P_3 IO_L94N_3 IO_L94P_3 IO_L93N_3/VREF_3 IO_L93P_3 IO_L91N_3 IO_L91P_3 IO_L78N_3 IO_L78P_3 IO_L76N_3 IO_L76P_3 IO_L75N_3/VREF_3 IO_L75P_3 IO_L73N_3 IO_L73P_3
R27 R26 R25 R24 R23 T23 R22 R21 R20 R19 T27 T26 T24 U24 T22 U22
Module 4 of 4 77
Table 10: BG728 BGA XC2V3000 Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Pin Description IO_L72N_3 IO_L72P_3 IO_L70N_3 IO_L70P_3 IO_L69N_3/VREF_3 IO_L69P_3 IO_L67N_3 IO_L67P_3 IO_L54N_3 IO_L54P_3 IO_L52N_3 IO_L52P_3 IO_L51N_3/VREF_3 IO_L51P_3 IO_L49N_3 IO_L49P_3 IO_L48N_3 IO_L48P_3 IO_L46N_3 IO_L46P_3 IO_L45N_3/VREF_3 IO_L45P_3 IO_L43N_3 IO_L43P_3 IO_L28N_3 IO_L28P_3 IO_L27N_3/VREF_3 IO_L27P_3 IO_L25N_3 IO_L25P_3 IO_L24N_3 IO_L24P_3 IO_L22N_3 IO_L22P_3 IO_L21N_3/VREF_3 IO_L21P_3 Pin Number T20 T19 U27 U26 U25 V25 U21 U20 V27 V26 V24 V23 V22 W22 V21 V20 W27 Y27 W26 W25 W24 W23 W21 W20 W19 Y19 Y25 Y24 Y23 AA23 Y22 Y21 AA27 AB27 AA26 AA25
Module 4 of 4 78
Table 10: BG728 BGA XC2V3000 Bank 3 3 3 3 3 3 3 3 3 3 3 3 Pin Description IO_L19N_3 IO_L19P_3 IO_L06N_3 IO_L06P_3 IO_L04N_3 IO_L04P_3 IO_L03N_3/VREF_3 IO_L03P_3 IO_L02N_3/VRP_3 IO_L02P_3/VRN_3 IO_L01N_3 IO_L01P_3 Pin Number AB26 AB25 AB24 AB23 AC27 AC26 AC25 AC24 AD27 AE27 AD26 AD25
4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4
IO_L01N_4/BUSY/DOUT (1) IO_L01P_4/INIT_B IO_L02N_4/D0/DIN (1) IO_L02P_4/D1 IO_L03N_4/D2/ALT_VRP_4 IO_L03P_4/D3/ALT_VRN_4 IO_L04N_4/VREF_4 IO_L04P_4 IO_L05N_4/VRP_4 IO_L05P_4/VRN_4 IO_L06N_4 IO_L06P_4 IO_L19N_4 IO_L19P_4 IO_L21N_4 IO_L21P_4/VREF_4 IO_L22N_4 IO_L22P_4 IO_L24N_4 IO_L24P_4 IO_L25N_4 IO_L25P_4 IO_L27N_4
AF25 AG25 AF24 AG24 AD23 AE23 AF23 AG23 AD22 AE22 AF22 AG22 AC21 AB21 AE21 AE20 AF21 AG21 AB20 AA20 AC20 AD20 AG20
Module 4 of 4 79
Table 10: BG728 BGA XC2V3000 Bank 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Pin Description IO_L27P_4/VREF_4 IO_L28N_4 IO_L28P_4 IO_L30N_4 IO_L30P_4 IO_L49N_4 IO_L49P_4 IO_L51N_4 IO_L51P_4/VREF_4 IO_L52N_4 IO_L52P_4 IO_L54N_4 IO_L54P_4 IO_L67N_4 IO_L67P_4 IO_L69N_4 IO_L69P_4/VREF_4 IO_L70N_4 IO_L70P_4 IO_L72N_4 IO_L72P_4 IO_L73N_4 IO_L73P_4 IO_L75N_4 IO_L75P_4/VREF_4 IO_L76N_4 IO_L76P_4 IO_L78N_4 IO_L78P_4 IO_L91N_4/VREF_4 IO_L91P_4 IO_L92N_4 IO_L92P_4 IO_L93N_4 IO_L93P_4 IO_L94N_4/VREF_4 Pin Number AG19 AB19 AA19 AC19 AD19 AE19 AF19 AA18 Y18 AB18 AC18 AD18 AE18 AF18 AG18 AA17 Y17 AB17 AB16 AD17 AE17 AF17 AG17 Y16 W16 AC16 AD16 AF16 AG16 W15 Y15 AB15 AA15 AC15 AD15 AE15
Module 4 of 4 80
Table 10: BG728 BGA XC2V3000 Bank 4 4 4 4 4 Pin Description IO_L94P_4 IO_L95N_4/GCLK3S IO_L95P_4/GCLK2P IO_L96N_4/GCLK1S IO_L96P_4/GCLK0P Pin Number AE14 AF15 AG15 Y14 AA14
5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5
IO_L96N_5/GCLK7S IO_L96P_5/GCLK6P IO_L95N_5/GCLK5S IO_L95P_5/GCLK4P IO_L94N_5 IO_L94P_5/VREF_5 IO_L93N_5 IO_L93P_5 IO_L92N_5 IO_L92P_5 IO_L91N_5 IO_L91P_5/VREF_5 IO_L78N_5 IO_L78P_5 IO_L76N_5 IO_L76P_5 IO_L75N_5/VREF_5 IO_L75P_5 IO_L73N_5 IO_L73P_5 IO_L72N_5 IO_L72P_5 IO_L70N_5 IO_L70P_5 IO_L69N_5/VREF_5 IO_L69P_5 IO_L67N_5 IO_L67P_5 IO_L54N_5 IO_L54P_5
AC14 AB14 AG13 AF13 AE13 AD13 AC13 AB13 AA13 Y13 W13 W12 AG12 AF12 AD12 AC12 AB12 AB11 Y12 Y11 AG11 AF11 AE11 AD11 AA10 AA11 AG10 AF10 AE10 AD10
Module 4 of 4 81
Table 10: BG728 BGA XC2V3000 Bank 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 Pin Description IO_L52N_5 IO_L52P_5 IO_L51N_5/VREF_5 IO_L51P_5 IO_L49N_5 IO_L49P_5 IO_L30N_5 IO_L30P_5 IO_L28N_5 IO_L28P_5 IO_L27N_5/VREF_5 IO_L27P_5 IO_L25N_5 IO_L25P_5 IO_L24N_5 IO_L24P_5 IO_L22N_5 IO_L22P_5 IO_L21N_5/VREF_5 IO_L21P_5 IO_L19N_5 IO_L19P_5 IO_L06N_5 IO_L06P_5 IO_L05N_5/VRP_5 IO_L05P_5/VRN_5 IO_L04N_5 IO_L04P_5/VREF_5 IO_L03N_5/D4/ALT_VRP_5 IO_L03P_5/D5/ALT_VRN_5 IO_L02N_5/D6 IO_L02P_5/D7 IO_L01N_5/RDWR_B IO_L01P_5/CS_B Pin Number AC10 AB10 Y9 Y10 AG9 AG8 AF9 AE9 AD9 AC9 AB9 AA9 AE8 AE7 AD8 AC8 AB8 AA8 AG7 AF7 AC7 AB7 AG6 AF6 AE6 AD6 AG5 AF5 AE5 AD5 AG4 AF4 AG3 AF3
IO_L01P_6
AE1
Module 4 of 4 82
Table 10: BG728 BGA XC2V3000 Bank 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Pin Description IO_L01N_6 IO_L02P_6/VRN_6 IO_L02N_6/VRP_6 IO_L03P_6 IO_L03N_6/VREF_6 IO_L04P_6 IO_L04N_6 IO_L06P_6 IO_L06N_6 IO_L19P_6 IO_L19N_6 IO_L21P_6 IO_L21N_6/VREF_6 IO_L22P_6 IO_L22N_6 IO_L24P_6 IO_L24N_6 IO_L25P_6 IO_L25N_6 IO_L27P_6 IO_L27N_6/VREF_6 IO_L28P_6 IO_L28N_6 IO_L43P_6 IO_L43N_6 IO_L45P_6 IO_L45N_6/VREF_6 IO_L46P_6 IO_L46N_6 IO_L48P_6 IO_L48N_6 IO_L49P_6 IO_L49N_6 IO_L51P_6 IO_L51N_6/VREF_6 IO_L52P_6 Pin Number AD1 AD3 AD2 AC4 AC3 AC2 AC1 AB5 AB4 AB3 AB2 AB1 AA1 AA5 AA6 AA3 AA2 Y5 Y6 Y4 Y3 Y1 W1 W8 W9 W6 W7 W5 W4 W3 W2 V7 V8 V5 V6 V4
Module 4 of 4 83
Table 10: BG728 BGA XC2V3000 Bank 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Pin Description IO_L52N_6 IO_L54P_6 IO_L54N_6 IO_L67P_6 IO_L67N_6 IO_L69P_6 IO_L69N_6/VREF_6 IO_L70P_6 IO_L70N_6 IO_L72P_6 IO_L72N_6 IO_L73P_6 IO_L73N_6 IO_L75P_6 IO_L75N_6/VREF_6 IO_L76P_6 IO_L76N_6 IO_L78P_6 IO_L78N_6 IO_L91P_6 IO_L91N_6 IO_L93P_6 IO_L93N_6/VREF_6 IO_L94P_6 IO_L94N_6 IO_L96P_6 IO_L96N_6 Pin Number V3 V2 V1 U8 T8 U6 U7 U4 U3 U2 U1 T9 R9 T5 T6 T4 R4 T2 T1 R7 R8 R5 R6 R3 P3 R2 R1
7 7 7 7 7 7 7 7
IO_L96P_7 IO_L96N_7 IO_L94P_7 IO_L94N_7 IO_L93P_7/VREF_7 IO_L93N_7 IO_L91P_7 IO_L91N_7
P5 P6 P7 P8 N1 N2 N3 N4
Module 4 of 4 84
Table 10: BG728 BGA XC2V3000 Bank 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 Pin Description IO_L78P_7 IO_L78N_7 IO_L76P_7 IO_L76N_7 IO_L75P_7/VREF_7 IO_L75N_7 IO_L73P_7 IO_L73N_7 IO_L72P_7 IO_L72N_7 IO_L70P_7 IO_L70N_7 IO_L69P_7/VREF_7 IO_L69N_7 IO_L67P_7 IO_L67N_7 IO_L54P_7 IO_L54N_7 IO_L52P_7 IO_L52N_7 IO_L51P_7/VREF_7 IO_L51N_7 IO_L49P_7 IO_L49N_7 IO_L48P_7 IO_L48N_7 IO_L46P_7 IO_L46N_7 IO_L45P_7/VREF_7 IO_L45N_7 IO_L43P_7 IO_L43N_7 IO_L30P_7 IO_L30N_7 IO_L28P_7 IO_L28N_7 Pin Number N6 N7 N9 N8 N5 M6 M1 M2 M4 M5 M8 M9 L1 L2 L3 L4 K1 K2 K4 K5 L6 L7 K6 K7 L8 K8 J1 H1 J2 J3 K3 J4 H3 H4 J5 J6
Module 4 of 4 85
Table 10: BG728 BGA XC2V3000 Bank 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 Pin Description IO_L27P_7/VREF_7 IO_L27N_7 IO_L25P_7 IO_L25N_7 IO_L24P_7 IO_L24N_7 IO_L22P_7 IO_L22N_7 IO_L21P_7/VREF_7 IO_L21N_7 IO_L19P_7 IO_L19N_7 IO_L06P_7 IO_L06N_7 IO_L04P_7 IO_L04N_7 IO_L03P_7/VREF_7 IO_L03N_7 IO_L02P_7/VRN_7 IO_L02N_7/VRP_7 IO_L01P_7 IO_L01N_7 Pin Number H5 H6 J7 J8 G1 F1 G2 G3 F2 F3 G5 G6 F4 F5 E1 E2 D1 C1 E3 E4 D2 D3
0 0 0 0 0 0 0 0 1 1 1 1 1
VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1
K13 K12 K11 J11 J10 G12 D7 C12 K17 K16 K15 J18 J17
Module 4 of 4 86
Table 10: BG728 BGA XC2V3000 Bank 1 1 1 2 2 2 2 2 2 2 2 3 3 3 3 3 3 3 3 4 4 4 4 4 4 4 4 5 5 5 5 5 5 5 5 6 Pin Description VCCO_1 VCCO_1 VCCO_1 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_6 Pin Number G16 D21 C16 N18 M25 M21 M18 L19 L18 K19 G24 AA24 V19 U19 U18 T25 T21 T18 R18 AE16 AD21 AA16 W18 W17 V17 V16 V15 AE12 AD7 AA12 W11 W10 V13 V12 V11 AA4
Module 4 of 4 87
Table 10: BG728 BGA XC2V3000 Bank 6 6 6 6 6 6 6 7 7 7 7 7 7 7 7 Pin Description VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 Pin Number V9 U10 U9 T10 T7 T3 R10 M10 M7 M3 L10 L9 K9 G4 N10
AA22 C4 AC22 AC6 Y7 AE4 D5 G20 H7 G22 F21 AE24 G8 F7 D23 C24
NA NA NA
VCCAUX VCCAUX VCCAUX
AF14 AE26 AE2
Module 4 of 4 88
Table 10: BG728 BGA XC2V3000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT Pin Number P26 P2 C26 C2 B14 V18 V14 V10 U17 U16 U15 U14 U13 U12 U11 T17 T11 R17 R11 P18 P17 P11 P10 N17 N11 M17 M11 L17 L16 L15 L14 L13 L12 L11 K18 K14
Module 4 of 4 89
Table 10: BG728 BGA XC2V3000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description VCCINT GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number K10 AG27 AG26 AG14 AG2 AG1 AF27 AF26 AF20 AF8 AF2 AF1 AE25 AE3 AD24 AD14 AD4 AC23 AC17 AC11 AC5 AB22 AB6 AA21 AA7 Y26 Y20 Y8 Y2 W14 U23 U5 T16 T15 T14 T13
Module 4 of 4 90
Table 10: BG728 BGA XC2V3000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number T12 R16 R15 R14 R13 R12 P27 P24 P19 P16 P15 P14 P13 P12 P9 P4 P1 N16 N15 N14 N13 N12 M16 M15 M14 M13 M12 L23 L5 J14 H26 H20 H8 H2 G21 G7
Module 4 of 4 91
Table 10: BG728 BGA XC2V3000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number F22 F6 E23 E17 E11 E5 D24 D14 D4 C25 C3 B27 B26 B20 B8 B2 B1 A27 A26 A14 A2
Module 4 of 4 92
BG728 Standard BGA Package Specifications (1.27mm pitch)
Figure 6: BG728 Standard BGA Package Specifications
Module 4 of 4 93
FF896 Flip-Chip Fine-Pitch BGA Package

As shown in Table 11, XC2V1000, XC2V1500, and XC2V2000 Virtex-II devices are available in the FF896 flip-chip fine-pitch BGA package. Pins in the XC2V1000, XC2V1500, and XC2V2000 devices are the same, except for the pin differences in the XC2V1000 and XC2V1500 devices shown in the No Connect columns. Following this table are the FF896 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch). Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Pin Description IO_L01N_0 IO_L01P_0 IO_L02N_0 IO_L02P_0 IO_L03N_0/VRP_0 IO_L03P_0/VRN_0 IO_L04N_0/VREF_0 IO_L04P_0 IO_L05N_0 IO_L05P_0 IO_L06N_0 IO_L06P_0 IO_L19N_0 IO_L19P_0 IO_L20N_0 IO_L20P_0 IO_L21N_0 IO_L21P_0/VREF_0 IO_L22N_0 IO_L22P_0 IO_L23N_0 IO_L23P_0 IO_L24N_0 IO_L24P_0 IO_L49N_0 IO_L49P_0 IO_L50N_0 IO_L50P_0 IO_L51N_0 IO_L51P_0/VREF_0 IO_L52N_0 IO_L52P_0 Pin Number B27 A27 F24 E24 C26 C25 A26 A25 F23 F22 C24 D25 A24 B25 G22 G21 D24 D23 B23 B24 H21 H20 E22 E23 A22 B22 F21 F20 C23 C22 B20 B21 No Connect in the XC2V1000 No Connect in the XC2V1500
Module 4 of 4 94
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Pin Description IO_L53N_0 IO_L53P_0 IO_L54N_0 IO_L54P_0 IO_L67N_0 IO_L67P_0 IO_L68N_0 IO_L68P_0 IO_L69N_0 IO_L69P_0/VREF_0 IO_L70N_0 IO_L70P_0 IO_L71N_0 IO_L71P_0 IO_L72N_0 IO_L72P_0 IO_L73N_0 IO_L73P_0 IO_L74N_0 IO_L74P_0 IO_L75N_0 IO_L75P_0/VREF_0 IO_L76N_0 IO_L76P_0 IO_L77N_0 IO_L77P_0 IO_L78N_0 IO_L78P_0 IO_L91N_0/VREF_0 IO_L91P_0 IO_L92N_0 IO_L92P_0 IO_L93N_0 IO_L93P_0 IO_L94N_0/VREF_0 IO_L94P_0 IO_L95N_0/GCLK7P Pin Number G20 G19 D21 D22 E20 E21 H19 H18 D20 D19 A20 A21 F19 F18 C19 C20 B18 B19 G18 H17 E18 D18 A18 A19 J17 J16 E16 E17 B17 B16 F17 F16 D16 D17 A17 A16 H16
No Connect in the XC2V1000
NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 0 0 0 Pin Description IO_L95P_0/GCLK6S IO_L96N_0/GCLK5P IO_L96P_0/GCLK4S Pin Number G16 C17 C16 No Connect in the XC2V1000 No Connect in the XC2V1500
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
IO_L96N_1/GCLK3P IO_L96P_1/GCLK2S IO_L95N_1/GCLK1P IO_L95P_1/GCLK0S IO_L94N_1 IO_L94P_1/VREF_1 IO_L93N_1 IO_L93P_1 IO_L92N_1 IO_L92P_1 IO_L91N_1 IO_L91P_1/VREF_1 IO_L78N_1 IO_L78P_1 IO_L77N_1 IO_L77P_1 IO_L76N_1 IO_L76P_1 IO_L75N_1/VREF_1 IO_L75P_1 IO_L74N_1 IO_L74P_1 IO_L73N_1 IO_L73P_1 IO_L72N_1 IO_L72P_1 IO_L71N_1 IO_L71P_1 IO_L70N_1 IO_L70P_1 IO_L69N_1/VREF_1 IO_L69P_1 IO_L68N_1
C15 C14 F15 F14 B15 B14 D14 D15 G15 H15 A14 A13 E14 E15 J15 J14 B12 B13 D13 E13 H14 H13 A11 A12 C11 C12 F13 F12 B10 B11 D12 D11 G13
NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC
NC NC NC NC NC NC NC NC NC NC NC NC
Module 4 of 4 96
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Pin Description IO_L68P_1 IO_L67N_1 IO_L67P_1 IO_L54N_1 IO_L54P_1 IO_L53N_1 IO_L53P_1 IO_L52N_1 IO_L52P_1 IO_L51N_1/VREF_1 IO_L51P_1 IO_L50N_1 IO_L50P_1 IO_L49N_1 IO_L49P_1 IO_L24N_1 IO_L24P_1 IO_L23N_1 IO_L23P_1 IO_L22N_1 IO_L22P_1 IO_L21N_1/VREF_1 IO_L21P_1 IO_L20N_1 IO_L20P_1 IO_L19N_1 IO_L19P_1 IO_L06N_1 IO_L06P_1 IO_L05N_1 IO_L05P_1 IO_L04N_1 IO_L04P_1/VREF_1 IO_L03N_1/VRP_1 IO_L03P_1/VRN_1 IO_L02N_1 IO_L02P_1 Pin Number G12 A9 A10 E10 E11 H12 H11 D9 D10 C9 C8 F11 F10 B8 B9 E8 E9 G11 H10 B7 A7 D8 E7 G10 G9 A5 A6 C6 C7 F9 G8 B6 C5 D7 D6 F8 F7
No Connect in the XC2V1000 NC NC NC
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 1 1 Pin Description IO_L01N_1 IO_L01P_1 Pin Number B4 A4 No Connect in the XC2V1000 No Connect in the XC2V1500
2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2
IO_L01N_2 IO_L01P_2 IO_L02N_2/VRP_2 IO_L02P_2/VRN_2 IO_L03N_2 IO_L03P_2/VREF_2 IO_L04N_2 IO_L04P_2 IO_L05N_2 IO_L05P_2 IO_L06N_2 IO_L06P_2 IO_L19N_2 IO_L19P_2 IO_L20N_2 IO_L20P_2 IO_L21N_2 IO_L21P_2/VREF_2 IO_L22N_2 IO_L22P_2 IO_L23N_2 IO_L23P_2 IO_L24N_2 IO_L24P_2 IO_L43N_2 IO_L43P_2 IO_L44N_2 IO_L44P_2 IO_L45N_2 IO_L45P_2/VREF_2 IO_L46N_2 IO_L46P_2 IO_L47N_2 IO_L47P_2
C1 B1 H9 H8 D3 E3 D2 C2 G7 H7 F4 E4 E1 D1 G6 H6 F5 G5 G2 F2 J8 J7 G3 F3 G1 F1 K8 L8 G4 H4 J2 H2 J6 K6
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Pin Description IO_L48N_2 IO_L48P_2 IO_L49N_2 IO_L49P_2 IO_L50N_2 IO_L50P_2 IO_L51N_2 IO_L51P_2/VREF_2 IO_L52N_2 IO_L52P_2 IO_L53N_2 IO_L53P_2 IO_L54N_2 IO_L54P_2 IO_L67N_2 IO_L67P_2 IO_L68N_2 IO_L68P_2 IO_L69N_2 IO_L69P_2/VREF_2 IO_L70N_2 IO_L70P_2 IO_L71N_2 IO_L71P_2 IO_L72N_2 IO_L72P_2 IO_L73N_2 IO_L73P_2 IO_L74N_2 IO_L74P_2 IO_L75N_2 IO_L75P_2/VREF_2 IO_L76N_2 IO_L76P_2 IO_L77N_2 IO_L77P_2 IO_L78N_2 Pin Number J5 H5 J3 H3 K7 L7 J4 K4 K1 J1 L6 M6 L5 K5 L2 K2 M8 N8 L4 M4 M1 L1 M7 N7 M3 L3 N2 M2 N6 P6 N5 N4 P1 N1 P9 R9 R5
NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC
Module 4 of 4 99
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 Pin Description IO_L78P_2 IO_L91N_2 IO_L91P_2 IO_L92N_2 IO_L92P_2 IO_L93N_2 IO_L93P_2/VREF_2 IO_L94N_2 IO_L94P_2 IO_L95N_2 IO_L95P_2 IO_L96N_2 IO_L96P_2 Pin Number P5 R2 P2 P8 R8 P4 R4 R1 T2 R7 R6 R3 P3 No Connect in the XC2V1000 NC No Connect in the XC2V1500 NC
3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3
IO_L96N_3 IO_L96P_3 IO_L95N_3 IO_L95P_3 IO_L94N_3 IO_L94P_3 IO_L93N_3/VREF_3 IO_L93P_3 IO_L92N_3 IO_L92P_3 IO_L91N_3 IO_L91P_3 IO_L78N_3 IO_L78P_3 IO_L77N_3 IO_L77P_3 IO_L76N_3 IO_L76P_3 IO_L75N_3/VREF_3 IO_L75P_3 IO_L74N_3 IO_L74P_3 IO_L73N_3
T7 T6 U1 V1 T3 U3 T8 U8 U2 V2 T4 U4 U9 T9 W1 Y1 T5 U5 U6 V6 W2 Y2 V4
NC NC NC NC NC NC NC NC NC NC NC
NC NC NC NC NC NC NC NC NC NC NC
Module 4 of 4 100
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Pin Description IO_L73P_3 IO_L72N_3 IO_L72P_3 IO_L71N_3 IO_L71P_3 IO_L70N_3 IO_L70P_3 IO_L69N_3/VREF_3 IO_L69P_3 IO_L68N_3 IO_L68P_3 IO_L67N_3 IO_L67P_3 IO_L54N_3 IO_L54P_3 IO_L53N_3 IO_L53P_3 IO_L52N_3 IO_L52P_3 IO_L51N_3/VREF_3 IO_L51P_3 IO_L50N_3 IO_L50P_3 IO_L49N_3 IO_L49P_3 IO_L48N_3 IO_L48P_3 IO_L47N_3 IO_L47P_3 IO_L46N_3 IO_L46P_3 IO_L45N_3/VREF_3 IO_L45P_3 IO_L44N_3 IO_L44P_3 IO_L43N_3 IO_L43P_3 Pin Number W4 W7 V7 V5 W6 W3 Y3 V8 W8 AA1 AB1 Y4 AA4 AA6 Y6 AA2 AB2 Y5 AA5 Y8 AA8 AC2 AD2 Y7 AA7 AC6 AB6 AD1 AE1 AB3 AC3 AB7 AC7 AB4 AC4 AB5 AC5
No Connect in the XC2V1000 NC NC NC NC NC NC NC NC NC NC NC NC NC
No Connect in the XC2V1500 NC
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Pin Description IO_L24N_3 IO_L24P_3 IO_L23N_3 IO_L23P_3 IO_L22N_3 IO_L22P_3 IO_L21N_3/VREF_3 IO_L21P_3 IO_L20N_3 IO_L20P_3 IO_L19N_3 IO_L19P_3 IO_L06N_3 IO_L06P_3 IO_L05N_3 IO_L05P_3 IO_L04N_3 IO_L04P_3 IO_L03N_3/VREF_3 IO_L03P_3 IO_L02N_3/VRP_3 IO_L02P_3/VRN_3 IO_L01N_3 IO_L01P_3 IO_L01N_4/BUSY/DOUT (1) IO_L01P_4/INIT_B IO_L02N_4/D0/DIN (1) IO_L02P_4/D1 IO_L03N_4/D2/ALT_VRP_4 IO_L03P_4/D3/ALT_VRN_4 IO_L04N_4/VREF_4 IO_L04P_4 IO_L05N_4/VRP_4 IO_L05P_4/VRN_4 IO_L06N_4 IO_L06P_4 Pin Number AC8 AB8 AE2 AF3 AD3 AE3 AD6 AD7 AF1 AG1 AD4 AE4 AD8 AE7 AG2 AH2 AD5 AE5 AC9 AD9 AH1 AJ1 AF4 AG3 No Connect in the XC2V1000 No Connect in the XC2V1500
4 4 4 4 4 4 4 4 4 4 4 4
AK2 AJ3 AE8 AF9 AH5 AH6 AJ4 AK4 AC10 AC11 AH7 AG6
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Pin Description IO_L19N_4 IO_L19P_4 IO_L20N_4 IO_L20P_4 IO_L21N_4 IO_L21P_4/VREF_4 IO_L22N_4 IO_L22P_4 IO_L23N_4 IO_L23P_4 IO_L24N_4 IO_L24P_4 IO_L49N_4 IO_L49P_4 IO_L50N_4 IO_L50P_4 IO_L51N_4 IO_L51P_4/VREF_4 IO_L52N_4 IO_L52P_4 IO_L53N_4 IO_L53P_4 IO_L54N_4 IO_L54P_4 IO_L67N_4 IO_L67P_4 IO_L68N_4 IO_L68P_4 IO_L69N_4 IO_L69P_4/VREF_4 IO_L70N_4 IO_L70P_4 IO_L71N_4 IO_L71P_4 IO_L72N_4 IO_L72P_4 IO_L73N_4 Pin Number AK6 AK5 AE9 AE10 AF7 AF8 AK7 AJ6 AD10 AD11 AG8 AG7 AJ8 AJ7 AE11 AE12 AG9 AG10 AK9 AJ9 AH8 AH9 AF11 AF10 AJ11 AJ10 AC12 AC13 AG11 AG12 AK11 AK10 AD12 AD13 AH12 AH11 AJ13
NC NC NC NC NC NC NC NC NC NC NC NC NC NC
Module 4 of 4 103
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Pin Description IO_L73P_4 IO_L74N_4 IO_L74P_4 IO_L75N_4 IO_L75P_4/VREF_4 IO_L76N_4 IO_L76P_4 IO_L77N_4 IO_L77P_4 IO_L78N_4 IO_L78P_4 IO_L91N_4/VREF_4 IO_L91P_4 IO_L92N_4 IO_L92P_4 IO_L93N_4 IO_L93P_4 IO_L94N_4/VREF_4 IO_L94P_4 IO_L95N_4/GCLK3S IO_L95P_4/GCLK2P IO_L96N_4/GCLK1S IO_L96P_4/GCLK0P Pin Number AJ12 AE13 AE14 AF13 AG13 AK13 AK12 AB14 AB15 AF15 AF14 AJ14 AJ15 AC14 AC15 AG15 AG14 AK14 AK15 AD15 AE15 AH14 AH15 No Connect in the XC2V1000 NC NC NC NC NC NC NC NC NC NC NC No Connect in the XC2V1500 NC NC NC NC NC NC NC NC NC NC NC
5 5 5 5 5 5 5 5 5 5 5 5 5
IO_L96N_5/GCLK7S IO_L96P_5/GCLK6P IO_L95N_5/GCLK5S IO_L95P_5/GCLK4P IO_L94N_5 IO_L94P_5/VREF_5 IO_L93N_5 IO_L93P_5 IO_L92N_5 IO_L92P_5 IO_L91N_5 IO_L91P_5/VREF_5 IO_L78N_5
AH16 AH17 AE16 AD16 AJ16 AJ17 AG17 AG16 AC16 AC17 AK17 AK18 AF17
NC
NC
Module 4 of 4 104
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 Pin Description IO_L78P_5 IO_L77N_5 IO_L77P_5 IO_L76N_5 IO_L76P_5 IO_L75N_5/VREF_5 IO_L75P_5 IO_L74N_5 IO_L74P_5 IO_L73N_5 IO_L73P_5 IO_L72N_5 IO_L72P_5 IO_L71N_5 IO_L71P_5 IO_L70N_5 IO_L70P_5 IO_L69N_5/VREF_5 IO_L69P_5 IO_L68N_5 IO_L68P_5 IO_L67N_5 IO_L67P_5 IO_L54N_5 IO_L54P_5 IO_L53N_5 IO_L53P_5 IO_L52N_5 IO_L52P_5 IO_L51N_5/VREF_5 IO_L51P_5 IO_L50N_5 IO_L50P_5 IO_L49N_5 IO_L49P_5 IO_L24N_5 IO_L24P_5 Pin Number AF16 AB16 AB17 AJ19 AJ18 AG18 AF18 AE17 AE18 AK20 AK19 AH20 AH19 AD18 AD19 AJ21 AJ20 AG19 AG20 AC18 AC19 AK22 AK21 AF21 AF20 AH22 AH23 AG22 AG21 AF22 AF23 AE19 AE20 AJ23 AJ22 AF24 AG23
No Connect in the XC2V1000 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC
No Connect in the XC2V1500 NC NC NC NC NC NC NC NC NC NC NC
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 Pin Description IO_L23N_5 IO_L23P_5 IO_L22N_5 IO_L22P_5 IO_L21N_5/VREF_5 IO_L21P_5 IO_L20N_5 IO_L20P_5 IO_L19N_5 IO_L19P_5 IO_L06N_5 IO_L06P_5 IO_L05N_5/VRP_5 IO_L05P_5/VRN_5 IO_L04N_5 IO_L04P_5/VREF_5 IO_L03N_5/D4/ALT_VRP_5 IO_L03P_5/D5/ALT_VRN_5 IO_L02N_5/D6 IO_L02P_5/D7 IO_L01N_5/RDWR_B IO_L01P_5/CS_B Pin Number AD20 AD21 AK25 AK24 AH24 AH25 AE21 AD22 AJ25 AJ24 AG25 AG24 AC20 AC21 AK26 AK27 AH26 AJ27 AE22 AE23 AJ28 AK29 No Connect in the XC2V1000 No Connect in the XC2V1500
6 6 6 6 6 6 6 6 6 6 6 6 6 6
IO_L01P_6 IO_L01N_6 IO_L02P_6/VRN_6 IO_L02N_6/VRP_6 IO_L03P_6 IO_L03N_6/VREF_6 IO_L04P_6 IO_L04N_6 IO_L05P_6 IO_L05N_6 IO_L06P_6 IO_L06N_6 IO_L19P_6 IO_L19N_6
AC22 AB23 AG28 AF28 AJ30 AH30 AD23 AC23 AF27 AE27 AG29 AH29 AE24 AD24
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Pin Description IO_L20P_6 IO_L20N_6 IO_L21P_6 IO_L21N_6/VREF_6 IO_L22P_6 IO_L22N_6 IO_L23P_6 IO_L23N_6 IO_L24P_6 IO_L24N_6 IO_L43P_6 IO_L43N_6 IO_L44P_6 IO_L44N_6 IO_L45P_6 IO_L45N_6/VREF_6 IO_L46P_6 IO_L46N_6 IO_L47P_6 IO_L47N_6 IO_L48P_6 IO_L48N_6 IO_L49P_6 IO_L49N_6 IO_L50P_6 IO_L50N_6 IO_L51P_6 IO_L51N_6/VREF_6 IO_L52P_6 IO_L52N_6 IO_L53P_6 IO_L53N_6 IO_L54P_6 IO_L54N_6 IO_L67P_6 IO_L67N_6 IO_L68P_6 Pin Number AE26 AD26 AG30 AF30 AD25 AC25 AE28 AD28 AD29 AE29 AC24 AB24 AD27 AC27 AC26 AB26 AA23 Y23 AC28 AB28 AD30 AE30 AB25 AA25 AA24 Y24 AC29 AB30 Y25 W25 AB27 AA27 AA29 AB29 W23 V23 AA26
NC NC NC
Module 4 of 4 107
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Pin Description IO_L68N_6 IO_L69P_6 IO_L69N_6/VREF_6 IO_L70P_6 IO_L70N_6 IO_L71P_6 IO_L71N_6 IO_L72P_6 IO_L72N_6 IO_L73P_6 IO_L73N_6 IO_L74P_6 IO_L74N_6 IO_L75P_6 IO_L75N_6/VREF_6 IO_L76P_6 IO_L76N_6 IO_L77P_6 IO_L77N_6 IO_L78P_6 IO_L78N_6 IO_L91P_6 IO_L91N_6 IO_L92P_6 IO_L92N_6 IO_L93P_6 IO_L93N_6/VREF_6 IO_L94P_6 IO_L94N_6 IO_L95P_6 IO_L95N_6 IO_L96P_6 IO_L96N_6 Pin Number Y26 AA30 Y30 W24 V24 Y27 W27 W28 Y28 V25 U25 V26 V27 Y29 W29 U22 T22 U26 T26 V30 W30 U23 T23 U27 T27 V29 U29 T24 T25 U28 T28 T30 U30 No Connect in the XC2V1000 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC No Connect in the XC2V1500
7 7 7
IO_L96P_7 IO_L96N_7 IO_L95P_7
P28 R28 R25

Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 Pin Description IO_L95N_7 IO_L94P_7 IO_L94N_7 IO_L93P_7/VREF_7 IO_L93N_7 IO_L92P_7 IO_L92N_7 IO_L91P_7 IO_L91N_7 IO_L78P_7 IO_L78N_7 IO_L77P_7 IO_L77N_7 IO_L76P_7 IO_L76N_7 IO_L75P_7/VREF_7 IO_L75N_7 IO_L74P_7 IO_L74N_7 IO_L73P_7 IO_L73N_7 IO_L72P_7 IO_L72N_7 IO_L71P_7 IO_L71N_7 IO_L70P_7 IO_L70N_7 IO_L69P_7/VREF_7 IO_L69N_7 IO_L68P_7 IO_L68N_7 IO_L67P_7 IO_L67N_7 IO_L54P_7 IO_L54N_7 IO_L53P_7 IO_L53N_7 Pin Number R24 R29 T29 R27 P27 R23 P23 N30 P30 P26 R26 R22 P22 N29 P29 N27 N26 P25 N25 L30 M30 L28 M28 N24 M24 L29 M29 M27 L27 N23 M23 J30 K30 K26 L26 M25 L25
NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC
NC NC NC NC NC NC NC NC NC NC NC NC
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 Pin Description IO_L52P_7 IO_L52N_7 IO_L51P_7/VREF_7 IO_L51N_7 IO_L50P_7 IO_L50N_7 IO_L49P_7 IO_L49N_7 IO_L48P_7 IO_L48N_7 IO_L47P_7 IO_L47N_7 IO_L46P_7 IO_L46N_7 IO_L45P_7/VREF_7 IO_L45N_7 IO_L44P_7 IO_L44N_7 IO_L43P_7 IO_L43N_7 IO_L24P_7 IO_L24N_7 IO_L23P_7 IO_L23N_7 IO_L22P_7 IO_L22N_7 IO_L21P_7/VREF_7 IO_L21N_7 IO_L20P_7 IO_L20N_7 IO_L19P_7 IO_L19N_7 IO_L06P_7 IO_L06N_7 IO_L05P_7 IO_L05N_7 IO_L04P_7 Pin Number J29 K29 K27 J27 L24 K24 H27 J28 H26 J26 K25 J25 H28 H29 G28 F28 L23 K23 F30 G30 F26 G27 J24 H24 F29 G29 G26 G25 H25 G24 D30 E30 E27 F27 J23 H22 C29
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 7 7 7 7 7 7 7 Pin Description IO_L04N_7 IO_L03P_7/VREF_7 IO_L03N_7 IO_L02P_7/VRN_7 IO_L02N_7/VRP_7 IO_L01P_7 IO_L01N_7 Pin Number D29 E28 D28 H23 G23 B30 C30 No Connect in the XC2V1000 No Connect in the XC2V1500
0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 2 2 2
VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2
K20 K19 K18 K17 K16 J21 J20 J19 J18 C18 B26 K15 K14 K13 K12 K11 J13 J12 J11 J10 C13 B5 R10 P10 N10 N9 N3 M10 M9
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 2 2 2 2 3 3 3 3 3 3 3 3 3 3 3 4 4 4 4 4 4 4 4 4 4 4 5 5 5 5 5 5 5 5 5 5 5 Pin Description VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 Pin Number L10 L9 K9 E2 AF2 AA9 Y10 Y9 W10 W9 V10 V9 V3 U10 T10 AJ5 AH13 AB13 AB12 AB11 AB10 AA15 AA14 AA13 AA12 AA11 AJ26 AH18 AB21 AB20 AB19 AB18 AA20 AA19 AA18 AA17 AA16
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank 6 6 6 6 6 6 6 6 6 6 6 7 7 7 7 7 7 7 7 7 7 7 Pin Description VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 Pin Number AF29 AA22 Y22 Y21 W22 W21 V28 V22 V21 U21 T21 R21 P21 N28 N22 N21 M22 M21 L22 L21 K22 E29 No Connect in the XC2V1000 No Connect in the XC2V1500
NA NA NA NA NA NA NA NA NA NA NA NA NA NA
CCLK PROG_B DONE M0 M1 M2 HSWAP_EN TCK TDI TDO TMS PWRDWN_B DXN DXP
AF6 B28 AG5 AF25 AG26 AH27 C27 D5 A29 B3 C4 AH4 D26 E25
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank NA NA Pin Description VBATT RSVD Pin Number A2 E6 No Connect in the XC2V1000 No Connect in the XC2V1500
NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA
VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT
AK28 AK16 AK3 T1 R30 A28 A15 A3 AB22 AB9 AA21 AA10 Y20 Y19 Y18 Y17 Y16 Y15 Y14 Y13 Y12 Y11 W20 W11 V20 V11 U20 U11 T20 T11 R20 R11 P20 P11
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number N20 N11 M20 M11 L20 L19 L18 L17 L16 L15 L14 L13 L12 L11 K21 K10 J22 J9 AK23 AK8 AJ29 AJ2 AH28 AH21 AH10 AH3 AG27 AG4 AF26 AF19 AF12 AF5 AE25 AE6 AD17 AD14 AC30
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number AC1 AA28 AA3 W26 W19 W18 W17 W16 W15 W14 W13 W12 W5 V19 V18 V17 V16 V15 V14 V13 V12 U24 U19 U18 U17 U16 U15 U14 U13 U12 U7 T19 T18 T17 T16 T15 T14
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number T13 T12 R19 R18 R17 R16 R15 R14 R13 R12 P24 P19 P18 P17 P16 P15 P14 P13 P12 P7 N19 N18 N17 N16 N15 N14 N13 N12 M26 M19 M18 M17 M16 M15 M14 M13 M12
Table 11: FF896 BGA XC2V1000, XC2V1500, and XC2V2000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number M5 K28 K3 H30 H1 G17 G14 F25 F6 E26 E19 E12 E5 D27 D4 C28 C21 C10 C3 B29 B2 A23 A8 No Connect in the XC2V1000 No Connect in the XC2V1500
Module 4 of 4 118
FF896 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 7: FF896 Flip-Chip Fine-Pitch BGA Package Specifications
Module 4 of 4 119

As shown in Table 12, XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Virtex-II devices are available in the FF1152 flip-chip fine-pitch BGA package. Pins in each of these devices are the same, except for the pin differences in the XC2V3000 device shown in the No Connect column. Following this table are the FF1152 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch). Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Pin Description IO_L01N_0 IO_L01P_0 IO_L02N_0 IO_L02P_0 IO_L03N_0/VRP_0 IO_L03P_0/VRN_0 IO_L04N_0/VREF_0 IO_L04P_0 IO_L05N_0 IO_L05P_0 IO_L06N_0 IO_L06P_0 IO_L19N_0 IO_L19P_0 IO_L20N_0 IO_L20P_0 IO_L21N_0 IO_L21P_0/VREF_0 IO_L22N_0 IO_L22P_0 IO_L23N_0 IO_L23P_0 IO_L24N_0 IO_L24P_0 IO_L25N_0 IO_L25P_0 IO_L26N_0 IO_L26P_0 IO_L27N_0 IO_L27P_0/VREF_0 IO_L28N_0 Pin Number D29 C29 H26 G26 E28 E27 F25 F26 H25 H24 E26 F27 B32 C33 J24 J23 C27 C28 B30 B31 K23 K22 C26 D27 A30 A31 G24 G25 E25 E24 D25 No Connect in the XC2V3000
Module 4 of 4 120
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Pin Description IO_L28P_0 IO_L29N_0 IO_L29P_0 IO_L30N_0 IO_L30P_0 IO_L49N_0 IO_L49P_0 IO_L50N_0 IO_L50P_0 IO_L51N_0 IO_L51P_0/VREF_0 IO_L52N_0 IO_L52P_0 IO_L53N_0 IO_L53P_0 IO_L54N_0 IO_L54P_0 IO_L60N_0 IO_L60P_0 IO_L67N_0 IO_L67P_0 IO_L68N_0 IO_L68P_0 IO_L69N_0 IO_L69P_0/VREF_0 IO_L70N_0 IO_L70P_0 IO_L71N_0 IO_L71P_0 IO_L72N_0 IO_L72P_0 IO_L73N_0 IO_L73P_0 IO_L74N_0 IO_L74P_0 IO_L75N_0 Pin Number D26 H23 H22 F23 F24 B28 B29 J22 J21 A28 A29 A26 B27 C24 D24 D22 D23 B25 B26 B23 B24 G22 G23 F22 F21 A23 A24 K21 K20 C22 C23 E21 E22 H21 H20 G20 NC NC No Connect in the XC2V3000
Module 4 of 4 121
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Pin Description IO_L75P_0/VREF_0 IO_L76N_0 IO_L76P_0 IO_L77N_0 IO_L77P_0 IO_L78N_0 IO_L78P_0 IO_L79N_0 IO_L79P_0 IO_L80N_0 IO_L80P_0 IO_L81N_0 IO_L81P_0/VREF_0 IO_L82N_0 IO_L82P_0 IO_L83N_0 IO_L83P_0 IO_L84N_0 IO_L84P_0 IO_L91N_0/VREF_0 IO_L91P_0 IO_L92N_0 IO_L92P_0 IO_L93N_0 IO_L93P_0 IO_L94N_0/VREF_0 IO_L94P_0 IO_L95N_0/GCLK7P IO_L95P_0/GCLK6S IO_L96N_0/GCLK5P IO_L96P_0/GCLK4S Pin Number F20 B21 B22 J20 K19 D20 D21 A21 A22 L19 L18 B19 A20 A18 B18 H19 H18 C20 C21 D19 D18 G18 G19 F18 F19 C19 C18 K18 J18 E19 E18 NC NC NC NC NC NC NC NC NC NC NC NC No Connect in the XC2V3000
1 1 1 1
IO_L96N_1/GCLK3P IO_L96P_1/GCLK2S IO_L95N_1/GCLK1P IO_L95P_1/GCLK0S
E17 E16 H17 H16
Module 4 of 4 122
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Pin Description IO_L94N_1 IO_L94P_1/VREF_1 IO_L93N_1 IO_L93P_1 IO_L92N_1 IO_L92P_1 IO_L91N_1 IO_L91P_1/VREF_1 IO_L84N_1 IO_L84P_1 IO_L83N_1 IO_L83P_1 IO_L82N_1 IO_L82P_1 IO_L81N_1/VREF_1 IO_L81P_1 IO_L80N_1 IO_L80P_1 IO_L79N_1 IO_L79P_1 IO_L78N_1 IO_L78P_1 IO_L77N_1 IO_L77P_1 IO_L76N_1 IO_L76P_1 IO_L75N_1/VREF_1 IO_L75P_1 IO_L74N_1 IO_L74P_1 IO_L73N_1 IO_L73P_1 IO_L72N_1 IO_L72P_1 IO_L71N_1 IO_L71P_1 Pin Number D17 D16 F16 F17 G16 G17 C16 C15 D14 D15 J17 K17 B17 A17 A15 B16 L17 L16 A13 A14 C13 C14 K16 K15 B13 B14 F15 G15 H15 H14 A11 A12 E13 E14 J15 J14 NC NC NC NC NC NC NC NC NC NC NC NC No Connect in the XC2V3000
Module 4 of 4 123
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Pin Description IO_L70N_1 IO_L70P_1 IO_L69N_1/VREF_1 IO_L69P_1 IO_L68N_1 IO_L68P_1 IO_L67N_1 IO_L67P_1 IO_L60N_1 IO_L60P_1 IO_L54N_1 IO_L54P_1 IO_L53N_1 IO_L53P_1 IO_L52N_1 IO_L52P_1 IO_L51N_1/VREF_1 IO_L51P_1 IO_L50N_1 IO_L50P_1 IO_L49N_1 IO_L49P_1 IO_L30N_1 IO_L30P_1 IO_L29N_1 IO_L29P_1 IO_L28N_1 IO_L28P_1 IO_L27N_1/VREF_1 IO_L27P_1 IO_L26N_1 IO_L26P_1 IO_L25N_1 IO_L25P_1 IO_L24N_1 IO_L24P_1 Pin Number D12 D13 F14 F13 C11 C12 B11 B12 F11 F12 D10 D11 G12 G13 B9 B10 B8 A9 K14 K13 A6 A7 D9 C9 H13 H12 C7 C8 E11 E10 J13 K12 B6 B7 E8 E9 NC NC No Connect in the XC2V3000
Module 4 of 4 124
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Pin Description IO_L23N_1 IO_L23P_1 IO_L22N_1 IO_L22P_1 IO_L21N_1/VREF_1 IO_L21P_1 IO_L20N_1 IO_L20P_1 IO_L19N_1 IO_L19P_1 IO_L06N_1 IO_L06P_1 IO_L05N_1 IO_L05P_1 IO_L04N_1 IO_L04P_1/VREF_1 IO_L03N_1/VRP_1 IO_L03P_1/VRN_1 IO_L02N_1 IO_L02P_1 IO_L01N_1 IO_L01P_1 Pin Number G10 G11 A4 A5 F10 G9 J12 J11 B4 B5 D6 C6 H11 J10 D8 E7 F9 F8 H10 H9 C2 B3 No Connect in the XC2V3000
2 2 2 2 2 2 2 2 2 2 2 2 2
IO_L01N_2 IO_L01P_2 IO_L02N_2/VRP_2 IO_L02P_2/VRN_2 IO_L03N_2 IO_L03P_2/VREF_2 IO_L04N_2 IO_L04P_2 IO_L05N_2 IO_L05P_2 IO_L06N_2 IO_L06P_2 IO_L19N_2
E2 D2 K11 K10 F5 G5 E3 D3 J9 K9 F4 E4 E1
Module 4 of 4 125
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Pin Description IO_L19P_2 IO_L20N_2 IO_L20P_2 IO_L21N_2 IO_L21P_2/VREF_2 IO_L22N_2 IO_L22P_2 IO_L23N_2 IO_L23P_2 IO_L24N_2 IO_L24P_2 IO_L25N_2 IO_L25P_2 IO_L26N_2 IO_L26P_2 IO_L27N_2 IO_L27P_2/VREF_2 IO_L28N_2 IO_L28P_2 IO_L29N_2 IO_L29P_2 IO_L30N_2 IO_L30P_2 IO_L43N_2 IO_L43P_2 IO_L44N_2 IO_L44P_2 IO_L45N_2 IO_L45P_2/VREF_2 IO_L46N_2 IO_L46P_2 IO_L47N_2 IO_L47P_2 IO_L48N_2 IO_L48P_2 IO_L49N_2 Pin Number D1 J8 K8 H7 J7 H6 G6 L10 L9 G3 F3 G2 F2 M10 N10 J6 K6 J5 H5 L7 K7 J4 H4 G1 F1 L8 M8 J1 H2 J3 H3 M9 N9 L5 K5 K2 No Connect in the XC2V3000
Module 4 of 4 126
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Pin Description IO_L49P_2 IO_L50N_2 IO_L50P_2 IO_L51N_2 IO_L51P_2/VREF_2 IO_L52N_2 IO_L52P_2 IO_L53N_2 IO_L53P_2 IO_L54N_2 IO_L54P_2 IO_L67N_2 IO_L67P_2 IO_L68N_2 IO_L68P_2 IO_L69N_2 IO_L69P_2/VREF_2 IO_L70N_2 IO_L70P_2 IO_L71N_2 IO_L71P_2 IO_L72N_2 IO_L72P_2 IO_L73N_2 IO_L73P_2 IO_L74N_2 IO_L74P_2 IO_L75N_2 IO_L75P_2/VREF_2 IO_L76N_2 IO_L76P_2 IO_L77N_2 IO_L77P_2 IO_L78N_2 IO_L78P_2 IO_L79N_2 Pin Number J2 N7 M7 L6 M6 M3 L3 L4 K4 N4 M4 M2 L2 N8 P8 N6 P6 P5 N5 P10 R10 P3 N3 M1 L1 P9 R9 P2 N2 R4 P4 R8 T8 T3 R3 P1 NC No Connect in the XC2V3000
Module 4 of 4 127
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Pin Description IO_L79P_2 IO_L80N_2 IO_L80P_2 IO_L81N_2 IO_L81P_2/VREF_2 IO_L82N_2 IO_L82P_2 IO_L83N_2 IO_L83P_2 IO_L84N_2 IO_L84P_2 IO_L91N_2 IO_L91P_2 IO_L92N_2 IO_L92P_2 IO_L93N_2 IO_L93P_2/VREF_2 IO_L94N_2 IO_L94P_2 IO_L95N_2 IO_L95P_2 IO_L96N_2 IO_L96P_2 Pin Number N1 T11 U11 R7 R6 U5 T5 T10 U10 U4 T4 T2 R1 U7 T7 T6 U6 U1 U2 U9 U8 U3 V4 No Connect in the XC2V3000 NC NC NC NC NC NC NC NC NC NC NC
3 3 3 3 3 3 3 3 3 3 3 3
IO_L96N_3 IO_L96P_3 IO_L95N_3 IO_L95P_3 IO_L94N_3 IO_L94P_3 IO_L93N_3/VREF_3 IO_L93P_3 IO_L92N_3 IO_L92P_3 IO_L91N_3 IO_L91P_3
V6 W6 V5 W5 V7 W7 V10 W10 V1 V2 W3 Y3
Module 4 of 4 128
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Pin Description IO_L84N_3 IO_L84P_3 IO_L83N_3 IO_L83P_3 IO_L82N_3 IO_L82P_3 IO_L81N_3/VREF_3 IO_L81P_3 IO_L80N_3 IO_L80P_3 IO_L79N_3 IO_L79P_3 IO_L78N_3 IO_L78P_3 IO_L77N_3 IO_L77P_3 IO_L76N_3 IO_L76P_3 IO_L75N_3/VREF_3 IO_L75P_3 IO_L74N_3 IO_L74P_3 IO_L73N_3 IO_L73P_3 IO_L72N_3 IO_L72P_3 IO_L71N_3 IO_L71P_3 IO_L70N_3 IO_L70P_3 IO_L69N_3/VREF_3 IO_L69P_3 IO_L68N_3 IO_L68P_3 IO_L67N_3 IO_L67P_3 Pin Number V9 V8 W4 Y4 W11 V11 W8 Y8 W2 Y1 AA3 AB3 Y6 AA6 AA4 AB4 Y7 AA8 Y10 AA10 AA1 AB1 AA5 AB5 AA9 Y9 AA2 AB2 AB6 AC6 AD1 AC1 AC3 AD3 AC4 AD4 No Connect in the XC2V3000 NC NC NC NC NC NC NC NC NC NC NC NC
Module 4 of 4 129
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Pin Description IO_L54N_3 IO_L54P_3 IO_L53N_3 IO_L53P_3 IO_L52N_3 IO_L52P_3 IO_L51N_3/VREF_3 IO_L51P_3 IO_L50N_3 IO_L50P_3 IO_L49N_3 IO_L49P_3 IO_L48N_3 IO_L48P_3 IO_L47N_3 IO_L47P_3 IO_L46N_3 IO_L46P_3 IO_L45N_3/VREF_3 IO_L45P_3 IO_L44N_3 IO_L44P_3 IO_L43N_3 IO_L43P_3 IO_L30N_3 IO_L30P_3 IO_L29N_3 IO_L29P_3 IO_L28N_3 IO_L28P_3 IO_L27N_3/VREF_3 IO_L27P_3 IO_L26N_3 IO_L26P_3 IO_L25N_3 IO_L25P_3 Pin Number AB7 AC7 AC2 AD2 AC8 AB8 AB10 AC10 AD5 AE5 AE4 AF4 AB9 AC9 AE2 AF1 AD6 AE6 AD9 AE9 AF2 AG2 AF3 AG3 AD7 AE7 AF5 AG5 AE8 AD8 AF8 AF9 AH1 AJ1 AG4 AH5 No Connect in the XC2V3000
Module 4 of 4 130
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Pin Description IO_L24N_3 IO_L24P_3 IO_L23N_3 IO_L23P_3 IO_L22N_3 IO_L22P_3 IO_L21N_3/VREF_3 IO_L21P_3 IO_L20N_3 IO_L20P_3 IO_L19N_3 IO_L19P_3 IO_L06N_3 IO_L06P_3 IO_L05N_3 IO_L05P_3 IO_L04N_3 IO_L04P_3 IO_L03N_3/VREF_3 IO_L03P_3 IO_L02N_3/VRP_3 IO_L02P_3/VRN_3 IO_L01N_3 IO_L01P_3 Pin Number AF6 AG6 AH3 AJ3 AF7 AG7 AL1 AK1 AH2 AJ2 AJ4 AK4 AE10 AD10 AK2 AL2 AH6 AJ5 AE11 AF11 AK3 AL3 AF10 AG9 No Connect in the XC2V3000
4 4 4 4 4 4 4 4 4 4 4
IO_L01N_4/BUSY/DOUT (1) IO_L01P_4/INIT_B IO_L02N_4/D0/DIN (1) IO_L02P_4/D1 IO_L03N_4/D2/ALT_VRP_4 IO_L03P_4/D3/ALT_VRN_4 IO_L04N_4/VREF_4 IO_L04P_4 IO_L05N_4/VRP_4 IO_L05P_4/VRN_4 IO_L06N_4
AM4 AL5 AG10 AH11 AK7 AK8 AL6 AM6 AK9 AJ8 AM8
Module 4 of 4 131
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Pin Description IO_L06P_4 IO_L19N_4 IO_L19P_4 IO_L20N_4 IO_L20P_4 IO_L21N_4 IO_L21P_4/VREF_4 IO_L22N_4 IO_L22P_4 IO_L23N_4 IO_L23P_4 IO_L24N_4 IO_L24P_4 IO_L25N_4 IO_L25P_4 IO_L26N_4 IO_L26P_4 IO_L27N_4 IO_L27P_4/VREF_4 IO_L28N_4 IO_L28P_4 IO_L29N_4 IO_L29P_4 IO_L30N_4 IO_L30P_4 IO_L49N_4 IO_L49P_4 IO_L50N_4 IO_L50P_4 IO_L51N_4 IO_L51P_4/VREF_4 IO_L52N_4 IO_L52P_4 IO_L53N_4 IO_L53P_4 IO_L54N_4 Pin Number AM7 AN3 AM2 AJ10 AJ9 AH9 AH10 AN5 AN4 AE12 AE13 AM9 AL8 AP5 AP4 AG11 AG12 AN7 AN6 AL10 AL9 AF12 AF13 AK10 AK11 AP7 AP6 AH13 AH12 AJ11 AJ12 AP9 AN8 AG13 AG14 AM11 No Connect in the XC2V3000
Module 4 of 4 132
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Pin Description IO_L54P_4 IO_L60N_4 IO_L60P_4 IO_L67N_4 IO_L67P_4 IO_L68N_4 IO_L68P_4 IO_L69N_4 IO_L69P_4/VREF_4 IO_L70N_4 IO_L70P_4 IO_L71N_4 IO_L71P_4 IO_L72N_4 IO_L72P_4 IO_L73N_4 IO_L73P_4 IO_L74N_4 IO_L74P_4 IO_L75N_4 IO_L75P_4/VREF_4 IO_L76N_4 IO_L76P_4 IO_L77N_4 IO_L77P_4 IO_L78N_4 IO_L78P_4 IO_L79N_4 IO_L79P_4 IO_L80N_4 IO_L80P_4 IO_L81N_4 IO_L81P_4/VREF_4 IO_L82N_4 IO_L82P_4 IO_L83N_4 Pin Number AL11 AN10 AN9 AN12 AN11 AE14 AE15 AJ13 AJ14 AL13 AL12 AF14 AF15 AM13 AM12 AP12 AP11 AG15 AG16 AN14 AN13 AP14 AP13 AD16 AD17 AK14 AK13 AN16 AP15 AE16 AE17 AH15 AJ15 AP17 AN17 AH17 NC NC NC NC NC NC NC NC NC NC NC No Connect in the XC2V3000
Module 4 of 4 133
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Pin Description IO_L83P_4 IO_L84N_4 IO_L84P_4 IO_L91N_4/VREF_4 IO_L91P_4 IO_L92N_4 IO_L92P_4 IO_L93N_4 IO_L93P_4 IO_L94N_4/VREF_4 IO_L94P_4 IO_L95N_4/GCLK3S IO_L95P_4/GCLK2P IO_L96N_4/GCLK1S IO_L96P_4/GCLK0P Pin Number AH16 AL15 AL14 AL16 AL17 AJ17 AJ16 AM15 AM14 AM16 AM17 AF17 AG17 AK16 AK17 No Connect in the XC2V3000 NC NC NC
5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5
IO_L96N_5/GCLK7S IO_L96P_5/GCLK6P IO_L95N_5/GCLK5S IO_L95P_5/GCLK4P IO_L94N_5 IO_L94P_5/VREF_5 IO_L93N_5 IO_L93P_5 IO_L92N_5 IO_L92P_5 IO_L91N_5 IO_L91P_5/VREF_5 IO_L84N_5 IO_L84P_5 IO_L83N_5 IO_L83P_5 IO_L82N_5 IO_L82P_5 IO_L81N_5/VREF_5 IO_L81P_5
AK18 AK19 AG18 AF18 AL18 AL19 AJ19 AJ18 AH19 AH18 AM19 AM20 AL21 AL20 AM22 AM21 AN18 AP18 AP20 AN19 NC NC NC NC NC NC NC NC
Module 4 of 4 134
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 Pin Description IO_L80N_5 IO_L80P_5 IO_L79N_5 IO_L79P_5 IO_L78N_5 IO_L78P_5 IO_L77N_5 IO_L77P_5 IO_L76N_5 IO_L76P_5 IO_L75N_5/VREF_5 IO_L75P_5 IO_L74N_5 IO_L74P_5 IO_L73N_5 IO_L73P_5 IO_L72N_5 IO_L72P_5 IO_L71N_5 IO_L71P_5 IO_L70N_5 IO_L70P_5 IO_L69N_5/VREF_5 IO_L69P_5 IO_L68N_5 IO_L68P_5 IO_L67N_5 IO_L67P_5 IO_L60N_5 IO_L60P_5 IO_L54N_5 IO_L54P_5 IO_L53N_5 IO_L53P_5 IO_L52N_5 IO_L52P_5 Pin Number AE18 AE19 AP22 AP21 AK22 AK21 AD18 AD19 AN22 AN21 AJ20 AH20 AG19 AG20 AP24 AP23 AL23 AL22 AF20 AF21 AM24 AM23 AJ21 AJ22 AJ24 AJ23 AN24 AN23 AN26 AN25 AL25 AL24 AE20 AE21 AN27 AP26 NC NC No Connect in the XC2V3000 NC NC NC NC
Module 4 of 4 135
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 Pin Description IO_L51N_5/VREF_5 IO_L51P_5 IO_L50N_5 IO_L50P_5 IO_L49N_5 IO_L49P_5 IO_L30N_5 IO_L30P_5 IO_L29N_5 IO_L29P_5 IO_L28N_5 IO_L28P_5 IO_L27N_5/VREF_5 IO_L27P_5 IO_L26N_5 IO_L26P_5 IO_L25N_5 IO_L25P_5 IO_L24N_5 IO_L24P_5 IO_L23N_5 IO_L23P_5 IO_L22N_5 IO_L22P_5 IO_L21N_5/VREF_5 IO_L21P_5 IO_L20N_5 IO_L20P_5 IO_L19N_5 IO_L19P_5 IO_L06N_5 IO_L06P_5 IO_L05N_5/VRP_5 IO_L05P_5/VRN_5 IO_L04N_5 IO_L04P_5/VREF_5 Pin Number AP29 AP28 AG21 AG22 AN29 AN28 AK24 AK25 AH23 AH22 AP31 AP30 AH24 AH25 AF22 AF23 AM27 AM26 AL27 AL26 AH26 AJ25 AN31 AN30 AK26 AK27 AG23 AF24 AM33 AN32 AJ27 AJ26 AE22 AE23 AM28 AM29 No Connect in the XC2V3000
Module 4 of 4 136
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 5 5 5 5 5 5 Pin Description IO_L03N_5/D4/ALT_VRP_5 IO_L03P_5/D5/ALT_VRN_5 IO_L02N_5/D6 IO_L02P_5/D7 IO_L01N_5/RDWR_B IO_L01P_5/CS_B Pin Number AK28 AL29 AG24 AG25 AL30 AM31 No Connect in the XC2V3000
6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
IO_L01P_6 IO_L01N_6 IO_L02P_6/VRN_6 IO_L02N_6/VRP_6 IO_L03P_6 IO_L03N_6/VREF_6 IO_L04P_6 IO_L04N_6 IO_L05P_6 IO_L05N_6 IO_L06P_6 IO_L06N_6 IO_L19P_6 IO_L19N_6 IO_L20P_6 IO_L20N_6 IO_L21P_6 IO_L21N_6/VREF_6 IO_L22P_6 IO_L22N_6 IO_L23P_6 IO_L23N_6 IO_L24P_6 IO_L24N_6 IO_L25P_6 IO_L25N_6 IO_L26P_6 IO_L26N_6 IO_L27P_6
AE24 AD25 AJ30 AH30 AL32 AK32 AF25 AE25 AJ31 AK31 AH29 AG29 AG26 AF26 AL33 AK33 AJ32 AH32 AG28 AF28 AG30 AF30 AF29 AE29 AF27 AE27 AL34 AK34 AE28
Module 4 of 4 137
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Pin Description IO_L27N_6/VREF_6 IO_L28P_6 IO_L28N_6 IO_L29P_6 IO_L29N_6 IO_L30P_6 IO_L30N_6 IO_L43P_6 IO_L43N_6 IO_L44P_6 IO_L44N_6 IO_L45P_6 IO_L45N_6/VREF_6 IO_L46P_6 IO_L46N_6 IO_L47P_6 IO_L47N_6 IO_L48P_6 IO_L48N_6 IO_L49P_6 IO_L49N_6 IO_L50P_6 IO_L50N_6 IO_L51P_6 IO_L51N_6/VREF_6 IO_L52P_6 IO_L52N_6 IO_L53P_6 IO_L53N_6 IO_L54P_6 IO_L54N_6 IO_L67P_6 IO_L67N_6 IO_L68P_6 IO_L68N_6 IO_L69P_6 Pin Number AD28 AE26 AD26 AF31 AG31 AF32 AG32 AC25 AB25 AJ33 AH33 AE31 AD32 AD27 AC27 AJ34 AH34 AE30 AD30 AC26 AB26 AD29 AC29 AF33 AG33 AC28 AB28 AF34 AE33 AB27 AA27 AA25 Y25 AD33 AC33 AC32 No Connect in the XC2V3000
Module 4 of 4 138
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Pin Description IO_L69N_6/VREF_6 IO_L70P_6 IO_L70N_6 IO_L71P_6 IO_L71N_6 IO_L72P_6 IO_L72N_6 IO_L73P_6 IO_L73N_6 IO_L74P_6 IO_L74N_6 IO_L75P_6 IO_L75N_6/VREF_6 IO_L76P_6 IO_L76N_6 IO_L77P_6 IO_L77N_6 IO_L78P_6 IO_L78N_6 IO_L79P_6 IO_L79N_6 IO_L80P_6 IO_L80N_6 IO_L81P_6 IO_L81N_6/VREF_6 IO_L82P_6 IO_L82N_6 IO_L83P_6 IO_L83N_6 IO_L84P_6 IO_L84N_6 IO_L91P_6 IO_L91N_6 IO_L92P_6 IO_L92N_6 IO_L93P_6 Pin Number AB32 AA26 Y26 AD34 AC34 AC31 AD31 Y27 W27 AB29 AA29 AB31 AA31 Y28 Y29 AB33 AA33 AA30 AB30 W24 V24 AB34 AA34 W33 Y34 W25 V25 Y32 AA32 W29 V29 W28 V28 V33 V34 Y31 NC NC NC NC NC NC NC NC NC NC NC NC No Connect in the XC2V3000
Module 4 of 4 139
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 6 6 6 6 6 6 6 Pin Description IO_L93N_6/VREF_6 IO_L94P_6 IO_L94N_6 IO_L95P_6 IO_L95N_6 IO_L96P_6 IO_L96N_6 Pin Number W31 V26 V27 W30 V30 V32 W32 No Connect in the XC2V3000
7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7
IO_L96P_7 IO_L96N_7 IO_L95P_7 IO_L95N_7 IO_L94P_7 IO_L94N_7 IO_L93P_7/VREF_7 IO_L93N_7 IO_L92P_7 IO_L92N_7 IO_L91P_7 IO_L91N_7 IO_L84P_7 IO_L84N_7 IO_L83P_7 IO_L83N_7 IO_L82P_7 IO_L82N_7 IO_L81P_7/VREF_7 IO_L81N_7 IO_L80P_7 IO_L80N_7 IO_L79P_7 IO_L79N_7 IO_L78P_7 IO_L78N_7 IO_L77P_7 IO_L77N_7
U31 V31 T28 U28 U33 U34 U29 T29 U27 U26 T30 U30 R32 T32 U25 T25 R34 T33 N34 P34 U24 T24 R31 T31 N32 P32 T27 R27 NC NC NC NC NC NC NC NC NC NC NC NC
Module 4 of 4 140
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 Pin Description IO_L76P_7 IO_L76N_7 IO_L75P_7/VREF_7 IO_L75N_7 IO_L74P_7 IO_L74N_7 IO_L73P_7 IO_L73N_7 IO_L72P_7 IO_L72N_7 IO_L71P_7 IO_L71N_7 IO_L70P_7 IO_L70N_7 IO_L69P_7/VREF_7 IO_L69N_7 IO_L68P_7 IO_L68N_7 IO_L67P_7 IO_L67N_7 IO_L54P_7 IO_L54N_7 IO_L53P_7 IO_L53N_7 IO_L52P_7 IO_L52N_7 IO_L51P_7/VREF_7 IO_L51N_7 IO_L50P_7 IO_L50N_7 IO_L49P_7 IO_L49N_7 IO_L48P_7 IO_L48N_7 IO_L47P_7 IO_L47N_7 Pin Number N33 P33 R29 R28 R26 P26 N31 P31 N30 P30 R25 P25 L34 M34 P29 N29 P27 N27 L32 M32 L31 M31 K29 L30 L33 M33 M29 L29 M28 N28 K30 K31 H32 J32 N26 M26 No Connect in the XC2V3000
Module 4 of 4 141
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 Pin Description IO_L46P_7 IO_L46N_7 IO_L45P_7/VREF_7 IO_L45N_7 IO_L44P_7 IO_L44N_7 IO_L43P_7 IO_L43N_7 IO_L30P_7 IO_L30N_7 IO_L29P_7 IO_L29N_7 IO_L28P_7 IO_L28N_7 IO_L27P_7/VREF_7 IO_L27N_7 IO_L26P_7 IO_L26N_7 IO_L25P_7 IO_L25N_7 IO_L24P_7 IO_L24N_7 IO_L23P_7 IO_L23N_7 IO_L22P_7 IO_L22N_7 IO_L21P_7/VREF_7 IO_L21N_7 IO_L20P_7 IO_L20N_7 IO_L19P_7 IO_L19N_7 IO_L06P_7 IO_L06N_7 IO_L05P_7 IO_L05N_7 Pin Number J33 K33 H33 J34 M27 L27 H31 J31 F32 G32 N25 M25 F34 G34 J30 H30 K28 L28 H28 J29 G29 H29 L26 K26 F33 G33 J28 J27 K27 J26 E31 F31 D32 E32 L25 K24 No Connect in the XC2V3000
Module 4 of 4 142
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 7 7 7 7 7 7 7 7 Pin Description IO_L04P_7 IO_L04N_7 IO_L03P_7/VREF_7 IO_L03N_7 IO_L02P_7/VRN_7 IO_L02N_7/VRP_7 IO_L01P_7 IO_L01N_7 Pin Number D34 E34 G30 F30 K25 J25 D33 E33 No Connect in the XC2V3000
0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 2
VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_2
M22 M21 M20 M19 M18 L23 L22 L21 L20 E20 D28 A25 A19 M17 M16 M15 M14 M13 L15 L14 L13 L12 E15 D7 A16 A10 U12
Module 4 of 4 143
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 2 2 2 2 2 2 2 2 2 2 2 2 3 3 3 3 3 3 3 3 3 3 3 3 3 4 4 4 4 4 4 4 4 4 4 4 Pin Description VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 Pin Number T12 T1 R12 R11 R5 P12 P11 N12 N11 M11 K1 G4 AH4 AE1 AC11 AB12 AB11 AA12 AA11 Y12 Y11 Y5 W12 W1 V12 AP16 AP10 AL7 AK15 AD15 AD14 AD13 AD12 AC17 AC16 AC15 No Connect in the XC2V3000
Module 4 of 4 144
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 4 4 5 5 5 5 5 5 5 5 5 5 5 5 5 6 6 6 6 6 6 6 6 6 6 6 6 6 7 7 7 7 7 7 7 7 Pin Description VCCO_4 VCCO_4 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 Pin Number AC14 AC13 AP25 AP19 AL28 AK20 AD23 AD22 AD21 AD20 AC22 AC21 AC20 AC19 AC18 AH31 AE34 AC24 AB24 AB23 AA24 AA23 Y30 Y24 Y23 W34 W23 V23 U23 T34 T23 R30 R24 R23 P24 P23 No Connect in the XC2V3000
Module 4 of 4 145
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank 7 7 7 7 7 Pin Description VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 Pin Number N24 N23 M24 K34 G31 No Connect in the XC2V3000
NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA
CCLK PROG_B DONE M0 M1 M2 HSWAP_EN TCK TDI TDO TMS PWRDWN_B DXN DXP VBATT RSVD VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT
AH8 D30 AJ7 AH27 AJ28 AK29 E29 F7 C31 D5 E6 AK6 F28 G27 C4 G8 AM30 AM18 AM5 V3 U32 C30 C17 C5 AD24 AD11 AC23 AC12 AB22 AB21
Module 4 of 4 146
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT Pin Number AB20 AB19 AB18 AB17 AB16 AB15 AB14 AB13 AA22 AA13 Y22 Y13 W22 W13 V22 V13 U22 U13 T22 T13 R22 R13 P22 P13 N22 N21 N20 N19 N18 N17 N16 N15 N14 N13 M23 M12 No Connect in the XC2V3000
Module 4 of 4 147
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank NA NA Pin Description VCCINT VCCINT Pin Number L24 L11 No Connect in the XC2V3000
NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA
GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND
AP33 AP32 AP27 AP8 AP3 AP2 AN34 AN33 AN20 AN15 AN2 AN1 AM34 AM32 AM25 AM10 AM3 AM1 AL31 AL4 AK30 AK23 AK12 AK5 AJ29 AJ6 AH28 AH21 AH14 AH7 AG34 AG27 AG8
Module 4 of 4 148
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number AG1 AF19 AF16 AE32 AE3 AC30 AC5 AA28 AA21 AA20 AA19 AA18 AA17 AA16 AA15 AA14 AA7 Y33 Y21 Y20 Y19 Y18 Y17 Y16 Y15 Y14 Y2 W26 W21 W20 W19 W18 W17 W16 W15 W14 No Connect in the XC2V3000
Module 4 of 4 149
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number W9 V21 V20 V19 V18 V17 V16 V15 V14 U21 U20 U19 U18 U17 U16 U15 U14 T26 T21 T20 T19 T18 T17 T16 T15 T14 T9 R33 R21 R20 R19 R18 R17 R16 R15 R14 No Connect in the XC2V3000
Module 4 of 4 150
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number R2 P28 P21 P20 P19 P18 P17 P16 P15 P14 P7 M30 M5 K32 K3 J19 J16 H34 H27 H8 H1 G28 G21 G14 G7 F29 F6 E30 E23 E12 E5 D31 D4 C34 C32 C25 No Connect in the XC2V3000
Module 4 of 4 151
Table 12: FF1152 BGA XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number C10 C3 C1 B34 B33 B20 B15 B2 B1 A33 A32 A27 A8 A3 A2 No Connect in the XC2V3000
Module 4 of 4 152
Module 4 of 4 153

As shown in Table 13, XC2V4000, XC2V6000, and XC2V8000 Virtex-II devices are available in the FF1517 flip-chip fine-pitch BGA package. Pins in each of these devices are the same, except for the pin differences in the XC2V4000 and XC2V6000 devices shown in the No Connect columns. Following this table are the FF1517 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch). Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Pin Description IO_L01N_0 IO_L01P_0 IO_L02N_0 IO_L02P_0 IO_L03N_0/VRP_0 IO_L03P_0/VRN_0 IO_L04N_0/VREF_0 IO_L04P_0 IO_L05N_0 IO_L05P_0 IO_L06N_0 IO_L06P_0 IO_L07N_0 IO_L07P_0 IO_L08N_0 IO_L08P_0 IO_L09N_0 IO_L09P_0/VREF_0 IO_L10N_0 IO_L10P_0 IO_L11N_0 IO_L11P_0 IO_L12N_0 IO_L12P_0 IO_L19N_0 IO_L19P_0 IO_L20N_0 IO_L20P_0 IO_L21N_0 IO_L21P_0/VREF_0 IO_L22N_0 Pin Number B36 C36 J30 J29 D33 D34 C34 C35 H30 G30 D32 E33 A35 A36 K28 J28 E32 F32 B34 B35 H29 H28 F31 G31 C32 C33 M26 M25 E30 E31 A33 NC NC NC NC NC NC NC NC NC NC NC NC No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 154
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Pin Description IO_L22P_0 IO_L23N_0 IO_L23P_0 IO_L24N_0 IO_L24P_0 IO_L25N_0 IO_L25P_0 IO_L26N_0 IO_L26P_0 IO_L27N_0 IO_L27P_0/VREF_0 IO_L28N_0 IO_L28P_0 IO_L29N_0 IO_L29P_0 IO_L30N_0 IO_L30P_0 IO_L31N_0 IO_L31P_0 IO_L32N_0 IO_L32P_0 IO_L33N_0 IO_L33P_0/VREF_0 IO_L34N_0 IO_L34P_0 IO_L35N_0 IO_L35P_0 IO_L36N_0 IO_L36P_0 IO_L49N_0 IO_L49P_0 IO_L50N_0 IO_L50P_0 IO_L51N_0 IO_L51P_0/VREF_0 IO_L52N_0 Pin Number A34 K27 K26 F29 F30 B32 B33 L26 L25 G28 G29 C30 C31 J27 J26 D30 D31 A31 A32 H27 H26 F27 F28 B30 B31 M24 M23 D28 D29 C28 C29 K25 L24 E27 E28 A29 NC NC NC NC NC NC NC NC NC NC NC NC No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 155
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Pin Description IO_L52P_0 IO_L53N_0 IO_L53P_0 IO_L54N_0 IO_L54P_0 IO_L55N_0 IO_L55P_0 IO_L56N_0 IO_L56P_0 IO_L57N_0 IO_L57P_0/VREF_0 IO_L58N_0 IO_L58P_0 IO_L59N_0 IO_L59P_0 IO_L60N_0 IO_L60P_0 IO_L67N_0 IO_L67P_0 IO_L68N_0 IO_L68P_0 IO_L69N_0 IO_L69P_0/VREF_0 IO_L70N_0 IO_L70P_0 IO_L71N_0 IO_L71P_0 IO_L72N_0 IO_L72P_0 IO_L73N_0 IO_L73P_0 IO_L74N_0 IO_L74P_0 IO_L75N_0 IO_L75P_0/VREF_0 IO_L76N_0 Pin Number A30 G26 G25 D26 D27 B27 B28 H25 H24 F25 F26 A27 A28 K24 K23 E24 E25 C26 C27 J24 J23 D24 D25 A25 A26 M22 M21 G23 G24 B25 C25 L22 L21 F23 F24 C23 No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 156
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Pin Description IO_L76P_0 IO_L77N_0 IO_L77P_0 IO_L78N_0 IO_L78P_0 IO_L79N_0 IO_L79P_0 IO_L80N_0 IO_L80P_0 IO_L81N_0 IO_L81P_0/VREF_0 IO_L82N_0 IO_L82P_0 IO_L83N_0 IO_L83P_0 IO_L84N_0 IO_L84P_0 IO_L91N_0/VREF_0 IO_L91P_0 IO_L92N_0 IO_L92P_0 IO_L93N_0 IO_L93P_0 IO_L94N_0/VREF_0 IO_L94P_0 IO_L95N_0/GCLK7P IO_L95P_0/GCLK6S IO_L96N_0/GCLK5P IO_L96P_0/GCLK4S Pin Number C24 K22 K21 E22 E23 B23 B24 J22 J21 G21 G22 A23 A24 H22 H21 F21 F22 B21 B22 L20 M20 E21 D22 A21 A22 H20 J20 C21 D21 No Connect in the XC2V4000 No Connect in the XC2V6000
1 1 1 1 1 1
IO_L96N_1/GCLK3P IO_L96P_1/GCLK2S IO_L95N_1/GCLK1P IO_L95P_1/GCLK0S IO_L94N_1 IO_L94P_1/VREF_1
F19 F20 H19 H18 C19 C20
Module 4 of 4 157
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Pin Description IO_L93N_1 IO_L93P_1 IO_L92N_1 IO_L92P_1 IO_L91N_1 IO_L91P_1/VREF_1 IO_L84N_1 IO_L84P_1 IO_L83N_1 IO_L83P_1 IO_L82N_1 IO_L82P_1 IO_L81N_1/VREF_1 IO_L81P_1 IO_L80N_1 IO_L80P_1 IO_L79N_1 IO_L79P_1 IO_L78N_1 IO_L78P_1 IO_L77N_1 IO_L77P_1 IO_L76N_1 IO_L76P_1 IO_L75N_1/VREF_1 IO_L75P_1 IO_L74N_1 IO_L74P_1 IO_L73N_1 IO_L73P_1 IO_L72N_1 IO_L72P_1 IO_L71N_1 IO_L71P_1 IO_L70N_1 IO_L70P_1 Pin Number E19 E20 J19 J18 A18 A19 D18 D19 K19 K18 B18 B19 G18 G19 E18 E17 A16 A17 F17 F18 L19 L18 B16 B17 G16 G17 M19 M18 C16 C17 D15 D16 J17 J16 A14 A15 No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 158
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Pin Description IO_L69N_1/VREF_1 IO_L69P_1 IO_L68N_1 IO_L68P_1 IO_L67N_1 IO_L67P_1 IO_L60N_1 IO_L60P_1 IO_L59N_1 IO_L59P_1 IO_L58N_1 IO_L58P_1 IO_L57N_1/VREF_1 IO_L57P_1 IO_L56N_1 IO_L56P_1 IO_L55N_1 IO_L55P_1 IO_L54N_1 IO_L54P_1 IO_L53N_1 IO_L53P_1 IO_L52N_1 IO_L52P_1 IO_L51N_1/VREF_1 IO_L51P_1 IO_L50N_1 IO_L50P_1 IO_L49N_1 IO_L49P_1 IO_L36N_1 IO_L36P_1 IO_L35N_1 IO_L35P_1 IO_L34N_1 IO_L34P_1 Pin Number E15 E16 K17 K16 C15 B15 F15 F16 H16 H15 C13 C14 D13 D14 M17 M16 A12 A13 B12 B13 G15 G14 C11 C12 F13 F14 L16 L15 A10 A11 E12 E13 K15 J14 B9 B10 NC NC NC NC NC NC No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 159
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Pin Description IO_L33N_1/VREF_1 IO_L33P_1 IO_L32N_1 IO_L32P_1 IO_L31N_1 IO_L31P_1 IO_L30N_1 IO_L30P_1 IO_L29N_1 IO_L29P_1 IO_L28N_1 IO_L28P_1 IO_L27N_1/VREF_1 IO_L27P_1 IO_L26N_1 IO_L26P_1 IO_L25N_1 IO_L25P_1 IO_L24N_1 IO_L24P_1 IO_L23N_1 IO_L23P_1 IO_L22N_1 IO_L22P_1 IO_L21N_1/VREF_1 IO_L21P_1 IO_L20N_1 IO_L20P_1 IO_L19N_1 IO_L19P_1 IO_L12N_1 IO_L12P_1 IO_L11N_1 IO_L11P_1 IO_L10N_1 IO_L10P_1 Pin Number D11 D12 H14 H13 A8 A9 F11 F12 K14 L14 C9 C10 G11 G12 M15 M14 B7 B8 D9 D10 J13 J12 A6 A7 E9 E10 D8 E7 C7 C8 F9 F10 H12 H11 B5 B6 NC NC NC NC NC NC No Connect in the XC2V4000 NC NC NC NC NC NC No Connect in the XC2V6000
Module 4 of 4 160
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Pin Description IO_L09N_1/VREF_1 IO_L09P_1 IO_L08N_1 IO_L08P_1 IO_L07N_1 IO_L07P_1 IO_L06N_1 IO_L06P_1 IO_L05N_1 IO_L05P_1 IO_L04N_1 IO_L04P_1/VREF_1 IO_L03N_1/VRP_1 IO_L03P_1/VRN_1 IO_L02N_1 IO_L02P_1 IO_L01N_1 IO_L01P_1 Pin Number G9 G10 K13 K12 A4 A5 F8 E8 J11 K11 C5 C6 D6 D7 H10 J10 C4 B4 No Connect in the XC2V4000 NC NC NC NC NC NC No Connect in the XC2V6000
2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2
IO_L01N_2 IO_L01P_2 IO_L02N_2/VRP_2 IO_L02P_2/VRN_2 IO_L03N_2 IO_L03P_2/VREF_2 IO_L04N_2 IO_L04P_2 IO_L05N_2 IO_L05P_2 IO_L06N_2 IO_L06P_2 IO_L07N_2 IO_L07P_2 IO_L08N_2 IO_L08P_2 IO_L09N_2
E3 D2 L13 M13 F4 E4 E1 D1 L12 M11 G6 F5 F2 E2 M12 N12 H6 NC NC NC NC NC
Module 4 of 4 161
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Pin Description IO_L09P_2/VREF_2 IO_L10N_2 IO_L10P_2 IO_L11N_2 IO_L11P_2 IO_L12N_2 IO_L12P_2 IO_L19N_2 IO_L19P_2 IO_L20N_2 IO_L20P_2 IO_L21N_2 IO_L21P_2/VREF_2 IO_L22N_2 IO_L22P_2 IO_L23N_2 IO_L23P_2 IO_L24N_2 IO_L24P_2 IO_L25N_2 IO_L25P_2 IO_L26N_2 IO_L26P_2 IO_L27N_2 IO_L27P_2/VREF_2 IO_L28N_2 IO_L28P_2 IO_L29N_2 IO_L29P_2 IO_L30N_2 IO_L30P_2 IO_L31N_2 IO_L31P_2 IO_L32N_2 IO_L32P_2 IO_L33N_2 Pin Number H7 G3 F3 J8 K8 H5 G5 G1 F1 K9 L10 K7 J7 H2 G2 L9 M9 H4 G4 J3 H3 M10 N10 K6 J6 K5 J5 N11 P11 M7 L7 J1 H1 L8 M8 K4 NC NC NC NC NC No Connect in the XC2V4000 NC NC NC NC NC NC NC No Connect in the XC2V6000
Module 4 of 4 162
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Pin Description IO_L33P_2/VREF_2 IO_L34N_2 IO_L34P_2 IO_L35N_2 IO_L35P_2 IO_L36N_2 IO_L36P_2 IO_L43N_2 IO_L43P_2 IO_L44N_2 IO_L44P_2 IO_L45N_2 IO_L45P_2/VREF_2 IO_L46N_2 IO_L46P_2 IO_L47N_2 IO_L47P_2 IO_L48N_2 IO_L48P_2 IO_L49N_2 IO_L49P_2 IO_L50N_2 IO_L50P_2 IO_L51N_2 IO_L51P_2/VREF_2 IO_L52N_2 IO_L52P_2 IO_L53N_2 IO_L53P_2 IO_L54N_2 IO_L54P_2 IO_L55N_2 IO_L55P_2 IO_L56N_2 IO_L56P_2 IO_L57N_2 Pin Number J4 K2 J2 P12 R12 M6 L6 L3 K3 N9 P9 M4 L4 L1 K1 P10 R10 N5 M5 N3 M3 N8 P8 T11 R11 N2 M2 T12 U12 P6 N6 N1 M1 R8 T8 R7 No Connect in the XC2V4000 NC NC NC NC NC NC NC No Connect in the XC2V6000
Module 4 of 4 163
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Pin Description IO_L57P_2/VREF_2 IO_L58N_2 IO_L58P_2 IO_L59N_2 IO_L59P_2 IO_L60N_2 IO_L60P_2 IO_L67N_2 IO_L67P_2 IO_L68N_2 IO_L68P_2 IO_L69N_2 IO_L69P_2/VREF_2 IO_L70N_2 IO_L70P_2 IO_L71N_2 IO_L71P_2 IO_L72N_2 IO_L72P_2 IO_L73N_2 IO_L73P_2 IO_L74N_2 IO_L74P_2 IO_L75N_2 IO_L75P_2/VREF_2 IO_L76N_2 IO_L76P_2 IO_L77N_2 IO_L77P_2 IO_L78N_2 IO_L78P_2 IO_L79N_2 IO_L79P_2 IO_L80N_2 IO_L80P_2 IO_L81N_2 Pin Number P7 R3 P3 T10 U10 P4 N4 T6 R6 T9 U9 T5 R5 R1 P1 V12 W12 T4 R4 T2 R2 V11 W11 U7 T7 U3 T3 V10 W10 V6 U6 U1 T1 V9 W9 V5 No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 164
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Pin Description IO_L81P_2/VREF_2 IO_L82N_2 IO_L82P_2 IO_L83N_2 IO_L83P_2 IO_L84N_2 IO_L84P_2 IO_L91N_2 IO_L91P_2 IO_L92N_2 IO_L92P_2 IO_L93N_2 IO_L93P_2/VREF_2 IO_L94N_2 IO_L94P_2 IO_L95N_2 IO_L95P_2 IO_L96N_2 IO_L96P_2 Pin Number U5 V2 U2 V8 W8 W7 V7 W1 V1 Y11 Y12 W4 V4 W2 W3 Y8 Y9 W5 W6 No Connect in the XC2V4000 No Connect in the XC2V6000
3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3
IO_L96N_3 IO_L96P_3 IO_L95N_3 IO_L95P_3 IO_L94N_3 IO_L94P_3 IO_L93N_3/VREF_3 IO_L93P_3 IO_L92N_3 IO_L92P_3 IO_L91N_3 IO_L91P_3 IO_L84N_3 IO_L84P_3 IO_L83N_3 IO_L83P_3
AB8 AA8 Y3 AA3 Y6 AA6 AB9 AA9 AA1 AB1 Y5 AA5 AB10 AA10 AA2 AB2
Module 4 of 4 165
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Pin Description IO_L82N_3 IO_L82P_3 IO_L81N_3/VREF_3 IO_L81P_3 IO_L80N_3 IO_L80P_3 IO_L79N_3 IO_L79P_3 IO_L78N_3 IO_L78P_3 IO_L77N_3 IO_L77P_3 IO_L76N_3 IO_L76P_3 IO_L75N_3/VREF_3 IO_L75P_3 IO_L74N_3 IO_L74P_3 IO_L73N_3 IO_L73P_3 IO_L72N_3 IO_L72P_3 IO_L71N_3 IO_L71P_3 IO_L70N_3 IO_L70P_3 IO_L69N_3/VREF_3 IO_L69P_3 IO_L68N_3 IO_L68P_3 IO_L67N_3 IO_L67P_3 IO_L60N_3 IO_L60P_3 IO_L59N_3 IO_L59P_3 Pin Number AA4 AB4 AB11 AA11 AC1 AD1 AA7 AB7 AB12 AA12 AC2 AC3 AB5 AC5 AD9 AC9 AD2 AE2 AB6 AC6 AD10 AC10 AD3 AE3 AC7 AD7 AE8 AD8 AE1 AF1 AD4 AE4 AD12 AC12 AF3 AG3 No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 166
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Pin Description IO_L58N_3 IO_L58P_3 IO_L57N_3/VREF_3 IO_L57P_3 IO_L56N_3 IO_L56P_3 IO_L55N_3 IO_L55P_3 IO_L54N_3 IO_L54P_3 IO_L53N_3 IO_L53P_3 IO_L52N_3 IO_L52P_3 IO_L51N_3/VREF_3 IO_L51P_3 IO_L50N_3 IO_L50P_3 IO_L49N_3 IO_L49P_3 IO_L48N_3 IO_L48P_3 IO_L47N_3 IO_L47P_3 IO_L46N_3 IO_L46P_3 IO_L45N_3/VREF_3 IO_L45P_3 IO_L44N_3 IO_L44P_3 IO_L43N_3 IO_L43P_3 IO_L36N_3 IO_L36P_3 IO_L35N_3 IO_L35P_3 Pin Number AD5 AE5 AE11 AD11 AG1 AH1 AD6 AE6 AF10 AE10 AG2 AH2 AF4 AG4 AG8 AF8 AH3 AJ3 AE7 AF7 AG9 AF9 AF6 AG6 AG5 AH5 AF12 AE12 AJ1 AK1 AH4 AJ4 AG11 AF11 AK2 AL2 NC NC NC NC No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 167
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Pin Description IO_L34N_3 IO_L34P_3 IO_L33N_3/VREF_3 IO_L33P_3 IO_L32N_3 IO_L32P_3 IO_L31N_3 IO_L31P_3 IO_L30N_3 IO_L30P_3 IO_L29N_3 IO_L29P_3 IO_L28N_3 IO_L28P_3 IO_L27N_3/VREF_3 IO_L27P_3 IO_L26N_3 IO_L26P_3 IO_L25N_3 IO_L25P_3 IO_L24N_3 IO_L24P_3 IO_L23N_3 IO_L23P_3 IO_L22N_3 IO_L22P_3 IO_L21N_3/VREF_3 IO_L21P_3 IO_L20N_3 IO_L20P_3 IO_L19N_3 IO_L19P_3 IO_L12N_3 IO_L12P_3 IO_L11N_3 IO_L11P_3 Pin Number AH6 AJ6 AJ8 AH8 AL1 AM1 AH7 AJ7 AH10 AG10 AK3 AL3 AK4 AL4 AJ9 AH9 AM2 AN2 AK5 AL5 AK9 AK8 AN1 AP1 AK6 AL6 AH12 AG12 AM3 AN3 AM4 AN4 AJ12 AH11 AP2 AR2 NC NC NC NC No Connect in the XC2V4000 NC NC NC NC NC NC NC NC No Connect in the XC2V6000
Module 4 of 4 168
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Pin Description IO_L10N_3 IO_L10P_3 IO_L09N_3/VREF_3 IO_L09P_3 IO_L08N_3 IO_L08P_3 IO_L07N_3 IO_L07P_3 IO_L06N_3 IO_L06P_3 IO_L05N_3 IO_L05P_3 IO_L04N_3 IO_L04P_3 IO_L03N_3/VREF_3 IO_L03P_3 IO_L02N_3/VRP_3 IO_L02P_3/VRN_3 IO_L01N_3 IO_L01P_3 Pin Number AK7 AL7 AK11 AJ10 AR1 AT1 AM5 AN5 AM7 AL8 AP3 AP4 AM6 AN6 AJ13 AH13 AR3 AT2 AP5 AR4 No Connect in the XC2V4000 NC NC NC NC NC NC NC NC No Connect in the XC2V6000
4 4 4 4 4 4 4 4 4 4 4 4 4 4 4
IO_L01N_4/BUSY/DOUT (1) IO_L01P_4/INIT_B IO_L02N_4/D0/DIN (1) IO_L02P_4/D1 IO_L03N_4/D2/ALT_VRP_4 IO_L03P_4/D3/ALT_VRN_4 IO_L04N_4/VREF_4 IO_L04P_4 IO_L05N_4/VRP_4 IO_L05P_4/VRN_4 IO_L06N_4 IO_L06P_4 IO_L07N_4 IO_L07P_4 IO_L08N_4
AV4 AU4 AM9 AM10 AT6 AR6 AU6 AU5 AL10 AL11 AR8 AR7 AW5 AW4 AK12 NC NC NC
Module 4 of 4 169
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Pin Description IO_L08P_4 IO_L09N_4 IO_L09P_4/VREF_4 IO_L10N_4 IO_L10P_4 IO_L11N_4 IO_L11P_4 IO_L12N_4 IO_L12P_4 IO_L19N_4 IO_L19P_4 IO_L20N_4 IO_L20P_4 IO_L21N_4 IO_L21P_4/VREF_4 IO_L22N_4 IO_L22P_4 IO_L23N_4 IO_L23P_4 IO_L24N_4 IO_L24P_4 IO_L25N_4 IO_L25P_4 IO_L26N_4 IO_L26P_4 IO_L27N_4 IO_L27P_4/VREF_4 IO_L28N_4 IO_L28P_4 IO_L29N_4 IO_L29P_4 IO_L30N_4 IO_L30P_4 IO_L31N_4 IO_L31P_4 IO_L32N_4 Pin Number AL12 AP9 AP8 AV6 AV5 AM11 AM12 AN10 AN9 AU8 AU7 AH14 AH15 AT8 AT7 AW7 AW6 AK13 AK14 AR10 AR9 AV8 AV7 AJ14 AJ15 AP11 AP10 AU10 AU9 AL13 AL14 AN12 AN11 AW9 AW8 AM13 NC NC NC No Connect in the XC2V4000 NC NC NC NC NC NC NC NC NC No Connect in the XC2V6000
Module 4 of 4 170
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Pin Description IO_L32P_4 IO_L33N_4 IO_L33P_4/VREF_4 IO_L34N_4 IO_L34P_4 IO_L35N_4 IO_L35P_4 IO_L36N_4 IO_L36P_4 IO_L49N_4 IO_L49P_4 IO_L50N_4 IO_L50P_4 IO_L51N_4 IO_L51P_4/VREF_4 IO_L52N_4 IO_L52P_4 IO_L53N_4 IO_L53P_4 IO_L54N_4 IO_L54P_4 IO_L55N_4 IO_L55P_4 IO_L56N_4 IO_L56P_4 IO_L57N_4 IO_L57P_4/VREF_4 IO_L58N_4 IO_L58P_4 IO_L59N_4 IO_L59P_4 IO_L60N_4 IO_L60P_4 IO_L67N_4 IO_L67P_4 IO_L68N_4 Pin Number AM14 AT10 AT9 AV10 AV9 AH16 AH17 AP13 AP12 AU12 AU11 AK15 AJ16 AT12 AT11 AN15 AN14 AR12 AR13 AT14 AT13 AW11 AW10 AM15 AM16 AP15 AP14 AV13 AV12 AK16 AK17 AR16 AR15 AW13 AW12 AL16 No Connect in the XC2V4000 NC NC NC NC NC NC NC NC NC No Connect in the XC2V6000
Module 4 of 4 171
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Pin Description IO_L68P_4 IO_L69N_4 IO_L69P_4/VREF_4 IO_L70N_4 IO_L70P_4 IO_L71N_4 IO_L71P_4 IO_L72N_4 IO_L72P_4 IO_L73N_4 IO_L73P_4 IO_L74N_4 IO_L74P_4 IO_L75N_4 IO_L75P_4/VREF_4 IO_L76N_4 IO_L76P_4 IO_L77N_4 IO_L77P_4 IO_L78N_4 IO_L78P_4 IO_L79N_4 IO_L79P_4 IO_L80N_4 IO_L80P_4 IO_L81N_4 IO_L81P_4/VREF_4 IO_L82N_4 IO_L82P_4 IO_L83N_4 IO_L83P_4 IO_L84N_4 IO_L84P_4 IO_L85N_4 IO_L85P_4 IO_L91N_4/VREF_4 Pin Number AL17 AT16 AT15 AU14 AU13 AH18 AH19 AN17 AN16 AW15 AW14 AJ18 AJ19 AP17 AP16 AV15 AU15 AK18 AK19 AR18 AR17 AU17 AU16 AL18 AL19 AN19 AN18 AV17 AV16 AM18 AM19 AP19 AP18 AW17 AW16 AV19 NC NC NC NC No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 172
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 4 4 4 4 4 4 4 4 4 4 4 Pin Description IO_L91P_4 IO_L92N_4 IO_L92P_4 IO_L93N_4 IO_L93P_4 IO_L94N_4/VREF_4 IO_L94P_4 IO_L95N_4/GCLK3S IO_L95P_4/GCLK2P IO_L96N_4/GCLK1S IO_L96P_4/GCLK0P Pin Number AV18 AH20 AJ20 AR19 AT18 AW19 AW18 AL20 AM20 AU19 AT19 No Connect in the XC2V4000 No Connect in the XC2V6000
5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5
IO_L96N_5/GCLK7S IO_L96P_5/GCLK6P IO_L95N_5/GCLK5S IO_L95P_5/GCLK4P IO_L94N_5 IO_L94P_5/VREF_5 IO_L93N_5 IO_L93P_5 IO_L92N_5 IO_L92P_5 IO_L91N_5 IO_L91P_5/VREF_5 IO_L85N_5 IO_L85P_5 IO_L84N_5 IO_L84P_5 IO_L83N_5 IO_L83P_5 IO_L82N_5 IO_L82P_5 IO_L81N_5/VREF_5 IO_L81P_5 IO_L80N_5 IO_L80P_5
AP21 AP20 AN21 AN22 AU21 AU20 AR21 AR20 AM21 AM22 AW22 AW21 AV22 AV21 AT22 AT21 AL21 AL22 AW24 AW23 AR23 AR22 AK21 AK22 NC NC NC NC
Module 4 of 4 173
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 Pin Description IO_L79N_5 IO_L79P_5 IO_L78N_5 IO_L78P_5 IO_L77N_5 IO_L77P_5 IO_L76N_5 IO_L76P_5 IO_L75N_5/VREF_5 IO_L75P_5 IO_L74N_5 IO_L74P_5 IO_L73N_5 IO_L73P_5 IO_L72N_5 IO_L72P_5 IO_L71N_5 IO_L71P_5 IO_L70N_5 IO_L70P_5 IO_L69N_5/VREF_5 IO_L69P_5 IO_L68N_5 IO_L68P_5 IO_L67N_5 IO_L67P_5 IO_L60N_5 IO_L60P_5 IO_L59N_5 IO_L59P_5 IO_L58N_5 IO_L58P_5 IO_L57N_5/VREF_5 IO_L57P_5 IO_L56N_5 IO_L56P_5 Pin Number AV24 AV23 AP23 AP22 AJ21 AJ22 AU24 AU23 AT25 AT24 AH21 AH22 AW26 AW25 AR25 AR24 AN23 AN24 AU25 AV25 AL24 AL23 AK23 AK24 AU27 AU26 AP25 AP24 AM24 AM25 AW28 AW27 AT27 AT26 AH23 AH24 No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 174
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 Pin Description IO_L55N_5 IO_L55P_5 IO_L54N_5 IO_L54P_5 IO_L53N_5 IO_L53P_5 IO_L52N_5 IO_L52P_5 IO_L51N_5/VREF_5 IO_L51P_5 IO_L50N_5 IO_L50P_5 IO_L49N_5 IO_L49P_5 IO_L36N_5 IO_L36P_5 IO_L35N_5 IO_L35P_5 IO_L34N_5 IO_L34P_5 IO_L33N_5/VREF_5 IO_L33P_5 IO_L32N_5 IO_L32P_5 IO_L31N_5 IO_L31P_5 IO_L30N_5 IO_L30P_5 IO_L29N_5 IO_L29P_5 IO_L28N_5 IO_L28P_5 IO_L27N_5/VREF_5 IO_L27P_5 IO_L26N_5 IO_L26P_5 Pin Number AV28 AV27 AP27 AP26 AN25 AN26 AU29 AU28 AR28 AR27 AJ24 AJ25 AW30 AW29 AT29 AT28 AK25 AL26 AV31 AV30 AP29 AP28 AK26 AJ26 AW32 AW31 AM27 AM26 AN28 AN29 AU31 AU30 AT31 AT30 AH25 AH26 NC NC NC NC NC NC NC NC NC NC NC NC No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 175
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 Pin Description IO_L25N_5 IO_L25P_5 IO_L24N_5 IO_L24P_5 IO_L23N_5 IO_L23P_5 IO_L22N_5 IO_L22P_5 IO_L21N_5/VREF_5 IO_L21P_5 IO_L20N_5 IO_L20P_5 IO_L19N_5 IO_L19P_5 IO_L12N_5 IO_L12P_5 IO_L11N_5 IO_L11P_5 IO_L10N_5 IO_L10P_5 IO_L09N_5/VREF_5 IO_L09P_5 IO_L08N_5 IO_L08P_5 IO_L07N_5 IO_L07P_5 IO_L06N_5 IO_L06P_5 IO_L05N_5/VRP_5 IO_L05P_5/VRN_5 IO_L04N_5 IO_L04P_5/VREF_5 IO_L03N_5/D4/ALT_VRP_5 IO_L03P_5/D5/ALT_VRN_5 IO_L02N_5/D6 IO_L02P_5/D7 Pin Number AV33 AV32 AR31 AR30 AL27 AL28 AW34 AW33 AN30 AP30 AM28 AM29 AU33 AU32 AT33 AT32 AK27 AK28 AV35 AV34 AP32 AP31 AL29 AK29 AW36 AW35 AR33 AR32 AM30 AL30 AU35 AU34 AR34 AT34 AN31 AM31 NC NC NC NC NC NC NC NC NC NC NC NC No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 176
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 5 5 Pin Description IO_L01N_5/RDWR_B IO_L01P_5/CS_B Pin Number AU36 AV36 No Connect in the XC2V4000 No Connect in the XC2V6000
6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
IO_L01P_6 IO_L01N_6 IO_L02P_6/VRN_6 IO_L02N_6/VRP_6 IO_L03P_6 IO_L03N_6/VREF_6 IO_L04P_6 IO_L04N_6 IO_L05P_6 IO_L05N_6 IO_L06P_6 IO_L06N_6 IO_L07P_6 IO_L07N_6 IO_L08P_6 IO_L08N_6 IO_L09P_6 IO_L09N_6/VREF_6 IO_L10P_6 IO_L10N_6 IO_L11P_6 IO_L11N_6 IO_L12P_6 IO_L12N_6 IO_L19P_6 IO_L19N_6 IO_L20P_6 IO_L20N_6 IO_L21P_6 IO_L21N_6/VREF_6 IO_L22P_6 IO_L22N_6 IO_L23P_6
AJ27 AH27 AT38 AR37 AP36 AR36 AJ28 AH29 AT39 AR39 AN34 AP35 AH28 AG28 AR38 AP38 AM34 AM33 AL32 AK32 AP37 AN37 AM35 AN35 AK31 AJ30 AP39 AN39 AK33 AL33 AJ31 AH31 AN38 NC NC NC NC NC NC NC NC NC NC NC NC
Module 4 of 4 177
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Pin Description IO_L23N_6 IO_L24P_6 IO_L24N_6 IO_L25P_6 IO_L25N_6 IO_L26P_6 IO_L26N_6 IO_L27P_6 IO_L27N_6/VREF_6 IO_L28P_6 IO_L28N_6 IO_L29P_6 IO_L29N_6 IO_L30P_6 IO_L30N_6 IO_L31P_6 IO_L31N_6 IO_L32P_6 IO_L32N_6 IO_L33P_6 IO_L33N_6/VREF_6 IO_L34P_6 IO_L34N_6 IO_L35P_6 IO_L35N_6 IO_L36P_6 IO_L36N_6 IO_L43P_6 IO_L43N_6 IO_L44P_6 IO_L44N_6 IO_L45P_6 IO_L45N_6/VREF_6 IO_L46P_6 IO_L46N_6 IO_L47P_6 Pin Number AM38 AM36 AN36 AH30 AG30 AM37 AL37 AK34 AL34 AG29 AF29 AL35 AK35 AH33 AJ33 AJ32 AH32 AM39 AL39 AK36 AL36 AF28 AE28 AL38 AK38 AH34 AJ34 AG31 AF31 AK37 AJ37 AH36 AJ36 AF30 AE30 AK39 NC NC NC NC NC NC NC NC NC NC NC NC No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 178
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Pin Description IO_L47N_6 IO_L48P_6 IO_L48N_6 IO_L49P_6 IO_L49N_6 IO_L50P_6 IO_L50N_6 IO_L51P_6 IO_L51N_6/VREF_6 IO_L52P_6 IO_L52N_6 IO_L53P_6 IO_L53N_6 IO_L54P_6 IO_L54N_6 IO_L55P_6 IO_L55N_6 IO_L56P_6 IO_L56N_6 IO_L57P_6 IO_L57N_6/VREF_6 IO_L58P_6 IO_L58N_6 IO_L59P_6 IO_L59N_6 IO_L60P_6 IO_L60N_6 IO_L67P_6 IO_L67N_6 IO_L68P_6 IO_L68N_6 IO_L69P_6 IO_L69N_6/VREF_6 IO_L70P_6 IO_L70N_6 IO_L71P_6 Pin Number AJ39 AG35 AH35 AG32 AF32 AH37 AG37 AD29 AE29 AD28 AC28 AH38 AG38 AF34 AG34 AE32 AD32 AH39 AG39 AE33 AF33 AD30 AC30 AF37 AE37 AF36 AG36 AD31 AC31 AE34 AD34 AD35 AE35 AB28 AA28 AF39 No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 179
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Pin Description IO_L71N_6 IO_L72P_6 IO_L72N_6 IO_L73P_6 IO_L73N_6 IO_L74P_6 IO_L74N_6 IO_L75P_6 IO_L75N_6/VREF_6 IO_L76P_6 IO_L76N_6 IO_L77P_6 IO_L77N_6 IO_L78P_6 IO_L78N_6 IO_L79P_6 IO_L79N_6 IO_L80P_6 IO_L80N_6 IO_L81P_6 IO_L81N_6/VREF_6 IO_L82P_6 IO_L82N_6 IO_L83P_6 IO_L83N_6 IO_L84P_6 IO_L84N_6 IO_L91P_6 IO_L91N_6 IO_L92P_6 IO_L92N_6 IO_L93P_6 IO_L93N_6/VREF_6 IO_L94P_6 IO_L94N_6 IO_L95P_6 Pin Number AE39 AD36 AE36 AB29 AA29 AE38 AD38 AC33 AD33 AB30 AA30 AD37 AC37 AB34 AC34 AB31 AA31 AD39 AC39 AB35 AC35 AB32 AA32 AC38 AB38 AA33 AB33 Y28 Y29 AB39 AA39 AA36 AB36 Y31 Y32 AA37 No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 180
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 6 6 6 Pin Description IO_L95N_6 IO_L96P_6 IO_L96N_6 Pin Number AA38 AA35 AA34 No Connect in the XC2V4000 No Connect in the XC2V6000
7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7
IO_L96P_7 IO_L96N_7 IO_L95P_7 IO_L95N_7 IO_L94P_7 IO_L94N_7 IO_L93P_7/VREF_7 IO_L93N_7 IO_L92P_7 IO_L92N_7 IO_L91P_7 IO_L91N_7 IO_L84P_7 IO_L84N_7 IO_L83P_7 IO_L83N_7 IO_L82P_7 IO_L82N_7 IO_L81P_7/VREF_7 IO_L81N_7 IO_L80P_7 IO_L80N_7 IO_L79P_7 IO_L79N_7 IO_L78P_7 IO_L78N_7 IO_L77P_7 IO_L77N_7 IO_L76P_7 IO_L76N_7 IO_L75P_7/VREF_7 IO_L75N_7
W34 Y34 W32 V32 W37 Y37 W35 Y35 W31 V31 V39 W39 V36 W36 W30 V30 V38 W38 V33 W33 W29 V29 T39 U39 U35 V35 W28 V28 U37 U38 U34 V34
Module 4 of 4 181
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 Pin Description IO_L74P_7 IO_L74N_7 IO_L73P_7 IO_L73N_7 IO_L72P_7 IO_L72N_7 IO_L71P_7 IO_L71N_7 IO_L70P_7 IO_L70N_7 IO_L69P_7/VREF_7 IO_L69N_7 IO_L68P_7 IO_L68N_7 IO_L67P_7 IO_L67N_7 IO_L60P_7 IO_L60N_7 IO_L59P_7 IO_L59N_7 IO_L58P_7 IO_L58N_7 IO_L57P_7/VREF_7 IO_L57N_7 IO_L56P_7 IO_L56N_7 IO_L55P_7 IO_L55N_7 IO_L54P_7 IO_L54N_7 IO_L53P_7 IO_L53N_7 IO_L52P_7 IO_L52N_7 IO_L51P_7/VREF_7 IO_L51N_7 Pin Number U31 T31 R38 T38 T33 U33 U30 T30 R37 T37 R36 T36 T32 R32 P39 R39 R35 T35 U28 T28 N37 P37 R34 T34 T29 R29 M39 N39 N36 P36 R30 P30 M38 N38 P33 R33 No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 182
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 Pin Description IO_L50P_7 IO_L50N_7 IO_L49P_7 IO_L49N_7 IO_L48P_7 IO_L48N_7 IO_L47P_7 IO_L47N_7 IO_L46P_7 IO_L46N_7 IO_L45P_7/VREF_7 IO_L45N_7 IO_L44P_7 IO_L44N_7 IO_L43P_7 IO_L43N_7 IO_L36P_7 IO_L36N_7 IO_L35P_7 IO_L35N_7 IO_L34P_7 IO_L34N_7 IO_L33P_7/VREF_7 IO_L33N_7 IO_L32P_7 IO_L32N_7 IO_L31P_7 IO_L31N_7 IO_L30P_7 IO_L30N_7 IO_L29P_7 IO_L29N_7 IO_L28P_7 IO_L28N_7 IO_L27P_7/VREF_7 IO_L27N_7 Pin Number P32 N32 L37 M37 N34 P34 P31 N31 M35 N35 L36 M36 R28 P28 K39 L39 L34 M34 P29 N29 J38 K38 L33 M33 M32 L32 H39 J39 J36 K36 N30 M30 J37 K37 J35 K35 NC NC NC NC NC NC NC NC NC NC NC NC No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 183
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 Pin Description IO_L26P_7 IO_L26N_7 IO_L25P_7 IO_L25N_7 IO_L24P_7 IO_L24N_7 IO_L23P_7 IO_L23N_7 IO_L22P_7 IO_L22N_7 IO_L21P_7/VREF_7 IO_L21N_7 IO_L20P_7 IO_L20N_7 IO_L19P_7 IO_L19N_7 IO_L12P_7 IO_L12N_7 IO_L11P_7 IO_L11N_7 IO_L10P_7 IO_L10N_7 IO_L09P_7/VREF_7 IO_L09N_7 IO_L08P_7 IO_L08N_7 IO_L07P_7 IO_L07N_7 IO_L06P_7 IO_L06N_7 IO_L05P_7 IO_L05N_7 IO_L04P_7 IO_L04N_7 IO_L03P_7/VREF_7 IO_L03N_7 Pin Number M31 L31 G38 H38 J34 K34 K32 K31 F39 G39 G36 H36 N28 M28 G37 H37 J33 K33 M29 L28 E38 F38 G35 H35 L30 K29 D39 E39 G34 H34 J32 H33 F36 F37 E36 F35 NC NC NC NC NC NC NC NC NC NC NC NC No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 184
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 7 7 7 7 Pin Description IO_L02P_7/VRN_7 IO_L02N_7/VRP_7 IO_L01P_7 IO_L01N_7 Pin Number M27 L27 D38 E37 No Connect in the XC2V4000 No Connect in the XC2V6000
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1
VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1
P25 P24 P23 P22 P21 N26 N25 N24 N23 N22 N21 L23 J25 G27 E29 C22 B26 P19 P18 P17 P16 P15 N19 N18 N17 N16 N15 N14 L17 J15 G13
Module 4 of 4 185
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 1 1 1 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Pin Description VCCO_1 VCCO_1 VCCO_1 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 Pin Number E11 C18 B14 W14 W13 V14 V13 V3 U14 U13 U11 T14 T13 R14 R13 R9 P13 P2 N7 L5 AJ5 AG7 AF13 AF2 AE14 AE13 AE9 AD14 AD13 AC14 AC13 AC11 AB14 AB13 AB3 AA14 No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 186
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 3 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 6 Pin Description VCCO_3 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_6 Pin Number AA13 AV14 AU18 AR11 AN13 AL15 AJ17 AG19 AG18 AG17 AG16 AG15 AG14 AF19 AF18 AF17 AF16 AF15 AV26 AU22 AR29 AN27 AL25 AJ23 AG26 AG25 AG24 AG23 AG22 AG21 AF25 AF24 AF23 AF22 AF21 AJ35 No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 187
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 Pin Description VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 Pin Number AG33 AF38 AF27 AE31 AE27 AE26 AD27 AD26 AC29 AC27 AC26 AB37 AB27 AB26 AA27 AA26 W27 W26 V37 V27 V26 U29 U27 U26 T27 T26 R31 R27 R26 P38 P27 N33 L35 No Connect in the XC2V4000 No Connect in the XC2V6000
NA NA
CCLK PROG_B
AT5 H31
Module 4 of 4 188
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description DONE M0 M1 M2 HSWAP_EN TCK TDI TDO TMS PWRDWN_B DXN DXP VBATT RSVD Pin Number AP7 AN32 AP33 AT35 E34 G8 D35 E6 F7 AN8 G32 F33 D5 H9 No Connect in the XC2V4000 No Connect in the XC2V6000
NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA
VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT
AV20 AT37 AT3 Y38 Y2 D37 D3 B20 AG27 AG20 AG13 AF26 AF20 AF14 AE25 AE24 AE23 AE22 AE21 AE20 AE19
Module 4 of 4 189
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT Pin Number AE18 AE17 AE16 AE15 AD25 AD24 AD16 AD15 AC25 AC15 AB25 AB15 AA25 AA15 Y27 Y26 Y25 Y15 Y14 Y13 W25 W15 V25 V15 U25 U15 T25 T24 T16 T15 R25 R24 R23 R22 R21 R20 No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 190
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number R19 R18 R17 R16 R15 P26 P20 P14 N27 N20 N13 AW38 AW37 AW20 AW3 AW2 AV39 AV38 AV37 AV29 AV11 AV3 AV2 AV1 AU39 AU38 AU37 AU3 AU2 AU1 AT36 AT23 AT20 AT17 AT4 AR35 No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 191
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number AR26 AR14 AR5 AP34 AP6 AN33 AN20 AN7 AM32 AM23 AM17 AM8 AL31 AL9 AK30 AK20 AK10 AJ38 AJ29 AJ11 AJ2 AF35 AF5 AD23 AD22 AD21 AD20 AD19 AD18 AD17 AC36 AC32 AC24 AC23 AC22 AC21 No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 192
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number AC20 AC19 AC18 AC17 AC16 AC8 AC4 AB24 AB23 AB22 AB21 AB20 AB19 AB18 AB17 AB16 AA24 AA23 AA22 AA21 AA20 AA19 AA18 AA17 AA16 Y39 Y36 Y33 Y30 Y24 Y23 Y22 Y21 Y20 Y19 Y18 No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 193
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number Y17 Y16 Y10 Y7 Y4 Y1 W24 W23 W22 W21 W20 W19 W18 W17 W16 V24 V23 V22 V21 V20 V19 V18 V17 V16 U36 U32 U24 U23 U22 U21 U20 U19 U18 U17 U16 U8 No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 194
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number U4 T23 T22 T21 T20 T19 T18 T17 P35 P5 L38 L29 L11 L2 K30 K20 K10 J31 J9 H32 H23 H17 H8 G33 G20 G7 F34 F6 E35 E26 E14 E5 D36 D23 D20 D17 No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 195
Table 13: FF1517 BGA XC2V4000, XC2V6000, and XC2V8000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number D4 C39 C38 C37 C3 C2 C1 B39 B38 B37 B29 B11 B3 B2 B1 A38 A37 A20 A3 A2 No Connect in the XC2V4000 No Connect in the XC2V6000
Module 4 of 4 196
Module 4 of 4 197
BF957 Flip-Chip BGA Package

As shown in Table 14, XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Virtex-II devices are available in the BF957 package. Pins in each of these devices are the same, except for the pin differences in the XC2V2000 device shown in the No Connect column. Following this table are the BF957 Flip-Chip BGA Package Specifications (1.27mm pitch). Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Pin Description IO_L01N_0 IO_L01P_0 IO_L02N_0 IO_L02P_0 IO_L03N_0/VRP_0 IO_L03P_0/VRN_0 IO_L04N_0/VREF_0 IO_L04P_0 IO_L05N_0 IO_L05P_0 IO_L06N_0 IO_L06P_0 IO_L19N_0 IO_L19P_0 IO_L20N_0 IO_L20P_0 IO_L21N_0 IO_L21P_0/VREF_0 IO_L22N_0 IO_L22P_0 IO_L23N_0 IO_L23P_0 IO_L24N_0 IO_L24P_0 IO_L25N_0 IO_L25P_0 IO_L26N_0 IO_L26P_0 IO_L27N_0 IO_L27P_0/VREF_0 IO_L29N_0 IO_L29P_0 IO_L30N_0 IO_L30P_0 Pin Number H23 H22 G24 E25 B29 C27 F24 F23 D26 D25 A28 A27 J22 J21 G23 G22 B27 B26 K20 K19 C26 C24 D24 D23 E24 E23 G21 G20 A26 A25 H21 H20 B25 B23 NC NC NC NC NC NC NC NC NC NC No Connect in XC2V2000
Module 4 of 4 198
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Pin Description IO_L49N_0 IO_L49P_0 IO_L50N_0 IO_L50P_0 IO_L51N_0 IO_L51P_0/VREF_0 IO_L52N_0 IO_L52P_0 IO_L53N_0 IO_L53P_0 IO_L54N_0 IO_L54P_0 IO_L67N_0 IO_L67P_0 IO_L68N_0 IO_L68P_0 IO_L69N_0 IO_L69P_0/VREF_0 IO_L70N_0 IO_L70P_0 IO_L71N_0 IO_L71P_0 IO_L72N_0 IO_L72P_0 IO_L73N_0 IO_L73P_0 IO_L74N_0 IO_L74P_0 IO_L75N_0 IO_L75P_0/VREF_0 IO_L76N_0 IO_L76P_0 IO_L77N_0 IO_L77P_0 IO_L78N_0 IO_L78P_0 IO_L91N_0/VREF_0 IO_L91P_0 Pin Number C23 C22 E22 E21 F21 F20 A24 A23 E20 E19 B22 B21 D21 D20 J20 J19 F19 F18 A22 A21 H19 H17 C21 C20 B20 B19 G18 G17 E18 D17 A20 A19 D19 D18 C19 C17 K18 J18 No Connect in XC2V2000
Module 4 of 4 199
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Pin Description IO_L92N_0 IO_L92P_0 IO_L93N_0 IO_L93P_0 IO_L94N_0/VREF_0 IO_L94P_0 IO_L95N_0/GCLK7P IO_L95P_0/GCLK6S IO_L96N_0/GCLK5P IO_L96P_0/GCLK4S IO_L96N_1/GCLK3P IO_L96P_1/GCLK2S IO_L95N_1/GCLK1P IO_L95P_1/GCLK0S IO_L94N_1 IO_L94P_1/VREF_1 IO_L93N_1 IO_L93P_1 IO_L92N_1 IO_L92P_1 IO_L91N_1 IO_L91P_1/VREF_1 IO_L78N_1 IO_L78P_1 IO_L77N_1 IO_L77P_1 IO_L76N_1 IO_L76P_1 IO_L75N_1/VREF_1 IO_L75P_1 IO_L74N_1 IO_L74P_1 IO_L73N_1 IO_L73P_1 IO_L72N_1 IO_L72P_1 IO_L71N_1 Pin Number F17 F16 B18 B17 J17 J16 E17 E16 A18 A17 C16 C15 H16 H15 A15 A14 F15 F14 G15 G14 B15 B14 D15 E15 J15 K14 D14 D13 E14 E13 A13 A12 F13 F12 J14 J13 B13 No Connect in XC2V2000
Module 4 of 4 200
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Pin Description IO_L71P_1 IO_L70N_1 IO_L70P_1 IO_L69N_1/VREF_1 IO_L69P_1 IO_L68N_1 IO_L68P_1 IO_L67N_1 IO_L67P_1 IO_L54N_1 IO_L54P_1 IO_L53N_1 IO_L53P_1 IO_L52N_1 IO_L52P_1 IO_L51N_1/VREF_1 IO_L51P_1 IO_L50N_1 IO_L50P_1 IO_L49N_1 IO_L49P_1 IO_L30N_1 IO_L30P_1 IO_L29N_1 IO_L29P_1 IO_L27N_1/VREF_1 IO_L27P_1 IO_L26N_1 IO_L26P_1 IO_L25N_1 IO_L25P_1 IO_L24N_1 IO_L24P_1 IO_L23N_1 IO_L23P_1 IO_L22N_1 IO_L22P_1 IO_L21N_1/VREF_1 Pin Number B12 C13 C12 H13 H12 D12 D11 B11 B10 E12 E11 A11 A10 G12 G11 K13 K12 C11 C10 B9 B7 F11 F9 A9 A8 D9 D8 J12 J11 C9 C8 E10 E9 H11 H10 A7 A6 A5 NC NC NC NC NC NC NC NC NC NC No Connect in XC2V2000
Module 4 of 4 201
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Pin Description IO_L21P_1 IO_L20N_1 IO_L20P_1 IO_L19N_1 IO_L19P_1 IO_L06N_1 IO_L06P_1 IO_L05N_1 IO_L05P_1 IO_L04N_1 IO_L04P_1/VREF_1 IO_L03N_1/VRP_1 IO_L03P_1/VRN_1 IO_L02N_1 IO_L02P_1 IO_L01N_1 IO_L01P_1 IO_L01N_2 IO_L01P_2 IO_L02N_2/VRP_2 IO_L02P_2/VRN_2 IO_L03N_2 IO_L03P_2/VREF_2 IO_L04N_2 IO_L04P_2 IO_L05N_2 IO_L05P_2 IO_L06N_2 IO_L06P_2 IO_L19N_2 IO_L19P_2 IO_L20N_2 IO_L20P_2 IO_L21N_2 IO_L21P_2/VREF_2 IO_L22N_2 IO_L22P_2 Pin Number A4 G10 G9 B6 C5 C6 D6 H9 G8 D7 E6 E8 E7 F8 F7 B5 B3 F5 G4 G6 H6 D3 E4 K10 K9 D2 E3 F4 F3 L10 M10 H7 J8 D1 E1 G5 H5 No Connect in XC2V2000
Module 4 of 4 202
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Pin Description IO_L23N_2 IO_L23P_2 IO_L24N_2 IO_L24P_2 IO_L25N_2 IO_L25P_2 IO_L27N_2 IO_L27P_2/VREF_2 IO_L43N_2 IO_L43P_2 IO_L44N_2 IO_L44P_2 IO_L45N_2 IO_L45P_2/VREF_2 IO_L46N_2 IO_L46P_2 IO_L47N_2 IO_L47P_2 IO_L48N_2 IO_L48P_2 IO_L49N_2 IO_L49P_2 IO_L50N_2 IO_L50P_2 IO_L51N_2 IO_L51P_2/VREF_2 IO_L52N_2 IO_L52P_2 IO_L53N_2 IO_L53P_2 IO_L54N_2 IO_L54P_2 IO_L67N_2 IO_L67P_2 IO_L68N_2 IO_L68P_2 IO_L69N_2 IO_L69P_2/VREF_2 Pin Number E2 F2 H4 J4 K8 L8 J7 K7 F1 G1 L9 M9 G2 J2 H3 J3 J6 L6 J5 K5 H1 J1 N10 P10 L7 M7 K3 L3 M8 N8 L5 M5 K2 L2 M6 N6 L4 M4 NC NC NC NC No Connect in XC2V2000
Module 4 of 4 203
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 3 3 3 3 3 3 3 Pin Description IO_L70N_2 IO_L70P_2 IO_L71N_2 IO_L71P_2 IO_L72N_2 IO_L72P_2 IO_L73N_2 IO_L73P_2 IO_L74N_2 IO_L74P_2 IO_L75N_2 IO_L75P_2/VREF_2 IO_L76N_2 IO_L76P_2 IO_L77N_2 IO_L77P_2 IO_L78N_2 IO_L78P_2 IO_L91N_2 IO_L91P_2 IO_L92N_2 IO_L92P_2 IO_L93N_2 IO_L93P_2/VREF_2 IO_L94N_2 IO_L94P_2 IO_L95N_2 IO_L95P_2 IO_L96N_2 IO_L96P_2 IO_L96N_3 IO_L96P_3 IO_L95N_3 IO_L95P_3 IO_L94N_3 IO_L94P_3 IO_L93N_3/VREF_3 Pin Number K1 L1 N9 P9 N5 P5 M3 N3 R8 R9 M2 N2 M1 N1 P7 R7 N4 P4 T8 T9 P6 R6 P2 R2 R5 T5 P1 R1 R4 R3 T6 U5 U6 V6 T3 U3 U1 No Connect in XC2V2000
Module 4 of 4 204
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Pin Description IO_L93P_3 IO_L92N_3 IO_L92P_3 IO_L91N_3 IO_L91P_3 IO_L78N_3 IO_L78P_3 IO_L77N_3 IO_L77P_3 IO_L76N_3 IO_L76P_3 IO_L75N_3/VREF_3 IO_L75P_3 IO_L74N_3 IO_L74P_3 IO_L73N_3 IO_L73P_3 IO_L72N_3 IO_L72P_3 IO_L71N_3 IO_L71P_3 IO_L70N_3 IO_L70P_3 IO_L69N_3/VREF_3 IO_L69P_3 IO_L68N_3 IO_L68P_3 IO_L67N_3 IO_L67P_3 IO_L54N_3 IO_L54P_3 IO_L53N_3 IO_L53P_3 IO_L52N_3 IO_L52P_3 IO_L51N_3/VREF_3 IO_L51P_3 IO_L50N_3 Pin Number V1 U8 W8 U2 V2 U7 V7 U4 V4 W1 Y1 V5 W5 W2 Y2 W6 Y6 Y5 AA5 W3 Y3 W4 Y4 U9 V9 AA1 AB1 Y7 AA7 AA6 AC6 AA2 AB2 AA4 AC4 V10 W10 AA3 No Connect in XC2V2000
Module 4 of 4 205
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Pin Description IO_L50P_3 IO_L49N_3 IO_L49P_3 IO_L48N_3 IO_L48P_3 IO_L47N_3 IO_L47P_3 IO_L46N_3 IO_L46P_3 IO_L45N_3/VREF_3 IO_L45P_3 IO_L44N_3 IO_L44P_3 IO_L43N_3 IO_L43P_3 IO_L27N_3/VREF_3 IO_L27P_3 IO_L25N_3 IO_L25P_3 IO_L24N_3 IO_L24P_3 IO_L23N_3 IO_L23P_3 IO_L22N_3 IO_L22P_3 IO_L21N_3/VREF_3 IO_L21P_3 IO_L20N_3 IO_L20P_3 IO_L19N_3 IO_L19P_3 IO_L06N_3 IO_L06P_3 IO_L05N_3 IO_L05P_3 IO_L04N_3 IO_L04P_3 IO_L03N_3/VREF_3 Pin Number AB3 AB5 AC5 W9 Y9 AC1 AD1 AC3 AD3 Y8 AA8 AC2 AE2 AB7 AC7 Y10 AA10 AE1 AF1 AF2 AG2 AA9 AB9 AD4 AE4 AD5 AE5 AB8 AC8 AG1 AH1 AF4 AG4 AB10 AB11 AF3 AG3 AD6 NC NC NC NC No Connect in XC2V2000
Module 4 of 4 206
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 3 3 3 3 3 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Pin Description IO_L03P_3 IO_L02N_3/VRP_3 IO_L02P_3/VRN_3 IO_L01N_3 IO_L01P_3 IO_L01N_4/BUSY/DOUT (1) IO_L01P_4/INIT_B IO_L02N_4/D0/DIN (1) IO_L02P_4/D1 IO_L03N_4/D2/ALT_VRP_4 IO_L03P_4/D3/ALT_VRN_4 IO_L04N_4/VREF_4 IO_L04P_4 IO_L05N_4/VRP_4 IO_L05P_4/VRN_4 IO_L06N_4 IO_L06P_4 IO_L19N_4 IO_L19P_4 IO_L20N_4 IO_L20P_4 IO_L21N_4 IO_L21P_4/VREF_4 IO_L22N_4 IO_L22P_4 IO_L23N_4 IO_L23P_4 IO_L24N_4 IO_L24P_4 IO_L25N_4 IO_L25P_4 IO_L26N_4 IO_L26P_4 IO_L27N_4 IO_L27P_4/VREF_4 IO_L28N_4 IO_L28P_4 Pin Number AD7 AE6 AF5 AH2 AH3 AD9 AD10 AF7 AG7 AK3 AJ5 AE8 AF8 AK4 AK5 AH6 AH7 AC10 AC11 AE9 AE10 AL4 AL5 AB12 AB13 AJ6 AJ8 AK6 AK7 AG8 AG9 AF9 AF11 AH8 AH9 AD11 AD12 NC NC NC NC NC NC NC NC No Connect in XC2V2000
Module 4 of 4 207
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 Pin Description IO_L29N_4 IO_L29P_4 IO_L30N_4 IO_L30P_4 IO_L49N_4 IO_L49P_4 IO_L50N_4 IO_L50P_4 IO_L51N_4 IO_L51P_4/VREF_4 IO_L52N_4 IO_L52P_4 IO_L53N_4 IO_L53P_4 IO_L54N_4 IO_L54P_4 IO_L67N_4 IO_L67P_4 IO_L68N_4 IO_L68P_4 IO_L69N_4 IO_L69P_4/VREF_4 IO_L70N_4 IO_L70P_4 IO_L71N_4 IO_L71P_4 IO_L72N_4 IO_L72P_4 IO_L73N_4 IO_L73P_4 IO_L74N_4 IO_L74P_4 IO_L75N_4 IO_L75P_4/VREF_4 IO_L76N_4 IO_L76P_4 IO_L77N_4 IO_L77P_4 Pin Number AL6 AL7 AJ9 AJ10 AE11 AE12 AG10 AG11 AL8 AL9 AF12 AF13 AK9 AK10 AH11 AH12 AC12 AC13 AG12 AG13 AL10 AL11 AD13 AD15 AJ11 AJ12 AK11 AK12 AE14 AE15 AF14 AF15 AL12 AL13 AB14 AC14 AH13 AH14 No Connect in XC2V2000 NC NC NC NC
Module 4 of 4 208
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 4 4 4 4 4 4 4 4 4 4 4 4 4 4 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 Pin Description IO_L78N_4 IO_L78P_4 IO_L91N_4/VREF_4 IO_L91P_4 IO_L92N_4 IO_L92P_4 IO_L93N_4 IO_L93P_4 IO_L94N_4/VREF_4 IO_L94P_4 IO_L95N_4/GCLK3S IO_L95P_4/GCLK2P IO_L96N_4/GCLK1S IO_L96P_4/GCLK0P IO_L96N_5/GCLK7S IO_L96P_5/GCLK6P IO_L95N_5/GCLK5S IO_L95P_5/GCLK4P IO_L94N_5 IO_L94P_5/VREF_5 IO_L93N_5 IO_L93P_5 IO_L92N_5 IO_L92P_5 IO_L91N_5 IO_L91P_5/VREF_5 IO_L78N_5 IO_L78P_5 IO_L77N_5 IO_L77P_5 IO_L76N_5 IO_L76P_5 IO_L75N_5/VREF_5 IO_L75P_5 IO_L74N_5 IO_L74P_5 IO_L73N_5 Pin Number AJ13 AK13 AC15 AC16 AG14 AG15 AK14 AK15 AF16 AG16 AL14 AL15 AH15 AJ15 AJ16 AH17 AD16 AD17 AL17 AL18 AG17 AF17 AE17 AE18 AK17 AJ17 AK18 AK19 AC17 AB18 AH18 AH19 AL19 AL20 AC18 AC19 AJ19 No Connect in XC2V2000
Module 4 of 4 209
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 Pin Description IO_L73P_5 IO_L72N_5 IO_L72P_5 IO_L71N_5 IO_L71P_5 IO_L70N_5 IO_L70P_5 IO_L69N_5/VREF_5 IO_L69P_5 IO_L68N_5 IO_L68P_5 IO_L67N_5 IO_L67P_5 IO_L54N_5 IO_L54P_5 IO_L53N_5 IO_L53P_5 IO_L52N_5 IO_L52P_5 IO_L51N_5/VREF_5 IO_L51P_5 IO_L50N_5 IO_L50P_5 IO_L49N_5 IO_L49P_5 IO_L30N_5 IO_L30P_5 IO_L29N_5 IO_L29P_5 IO_L28N_5 IO_L28P_5 IO_L27N_5/VREF_5 IO_L27P_5 IO_L26N_5 IO_L26P_5 IO_L25N_5 IO_L25P_5 IO_L24N_5 Pin Number AJ20 AG18 AG19 AF18 AF19 AK20 AK21 AH20 AH21 AD19 AD20 AL21 AL22 AG20 AG21 AB19 AB20 AJ21 AJ22 AF20 AF21 AE20 AE21 AK22 AK23 AJ23 AJ24 AC20 AC21 AL23 AL24 AL25 AL26 AD21 AD22 AH23 AH24 AG22 NC NC NC NC NC NC NC NC NC NC NC NC No Connect in XC2V2000
Module 4 of 4 210
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Pin Description IO_L24P_5 IO_L23N_5 IO_L23P_5 IO_L22N_5 IO_L22P_5 IO_L21N_5/VREF_5 IO_L21P_5 IO_L20N_5 IO_L20P_5 IO_L19N_5 IO_L19P_5 IO_L06N_5 IO_L06P_5 IO_L05N_5/VRP_5 IO_L05P_5/VRN_5 IO_L04N_5 IO_L04P_5/VREF_5 IO_L03N_5/D4/ALT_VRP_5 IO_L03P_5/D5/ALT_VRN_5 IO_L02N_5/D6 IO_L02P_5/D7 IO_L01N_5/RDWR_B IO_L01P_5/CS_B IO_L01P_6 IO_L01N_6 IO_L02P_6/VRN_6 IO_L02N_6/VRP_6 IO_L03P_6 IO_L03N_6/VREF_6 IO_L04P_6 IO_L04N_6 IO_L05P_6 IO_L05N_6 IO_L06P_6 IO_L06N_6 IO_L19P_6 IO_L19N_6 Pin Number AG23 AE22 AE23 AK25 AK26 AH25 AG25 AB21 AC22 AL27 AL28 AK27 AJ27 AD23 AE24 AJ26 AH26 AF23 AF24 AG24 AF25 AK28 AK29 AF27 AF28 AE26 AE27 AH29 AH30 AB22 AB23 AG28 AG29 AH31 AG31 AA22 Y22 No Connect in XC2V2000
Module 4 of 4 211
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Pin Description IO_L20P_6 IO_L20N_6 IO_L21P_6 IO_L21N_6/VREF_6 IO_L22P_6 IO_L22N_6 IO_L23P_6 IO_L23N_6 IO_L24P_6 IO_L24N_6 IO_L25P_6 IO_L25N_6 IO_L27P_6 IO_L27N_6/VREF_6 IO_L43P_6 IO_L43N_6 IO_L44P_6 IO_L44N_6 IO_L45P_6 IO_L45N_6/VREF_6 IO_L46P_6 IO_L46N_6 IO_L47P_6 IO_L47N_6 IO_L48P_6 IO_L48N_6 IO_L49P_6 IO_L49N_6 IO_L50P_6 IO_L50N_6 IO_L51P_6 IO_L51N_6/VREF_6 IO_L52P_6 IO_L52N_6 IO_L53P_6 IO_L53N_6 IO_L54P_6 IO_L54N_6 Pin Number AD25 AC24 AG30 AF30 AD26 AC26 AF29 AD29 AE28 AD28 AB24 AA24 AC25 AB25 AF31 AE31 AA23 Y23 AE30 AC30 AC28 AA28 AD27 AC27 AA25 Y25 AC29 AB29 AB27 AA27 AA26 Y26 AD31 AC31 W22 V22 Y27 W27 NC NC NC NC No Connect in XC2V2000
Module 4 of 4 212
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 7 Pin Description IO_L67P_6 IO_L67N_6 IO_L68P_6 IO_L68N_6 IO_L69P_6 IO_L69N_6/VREF_6 IO_L70P_6 IO_L70N_6 IO_L71P_6 IO_L71N_6 IO_L72P_6 IO_L72N_6 IO_L73P_6 IO_L73N_6 IO_L74P_6 IO_L74N_6 IO_L75P_6 IO_L75N_6/VREF_6 IO_L76P_6 IO_L76N_6 IO_L77P_6 IO_L77N_6 IO_L78P_6 IO_L78N_6 IO_L91P_6 IO_L91N_6 IO_L92P_6 IO_L92N_6 IO_L93P_6 IO_L93N_6/VREF_6 IO_L94P_6 IO_L94N_6 IO_L95P_6 IO_L95N_6 IO_L96P_6 IO_L96N_6 IO_L96P_7 Pin Number AB30 AA30 W26 V26 AB31 AA31 AA29 Y29 Y24 W24 V25 U25 Y28 W28 W23 V23 Y30 W30 Y31 W31 V27 U27 W29 U29 U23 T23 U26 T26 V28 U28 U24 T24 V30 U30 V31 U31 T27 No Connect in XC2V2000
Module 4 of 4 213
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 Pin Description IO_L96N_7 IO_L95P_7 IO_L95N_7 IO_L94P_7 IO_L94N_7 IO_L93P_7/VREF_7 IO_L93N_7 IO_L92P_7 IO_L92N_7 IO_L91P_7 IO_L91N_7 IO_L78P_7 IO_L78N_7 IO_L77P_7 IO_L77N_7 IO_L76P_7 IO_L76N_7 IO_L75P_7/VREF_7 IO_L75N_7 IO_L74P_7 IO_L74N_7 IO_L73P_7 IO_L73N_7 IO_L72P_7 IO_L72N_7 IO_L71P_7 IO_L71N_7 IO_L70P_7 IO_L70N_7 IO_L69P_7/VREF_7 IO_L69N_7 IO_L68P_7 IO_L68N_7 IO_L67P_7 IO_L67N_7 IO_L54P_7 IO_L54N_7 IO_L53P_7 Pin Number R27 R24 N24 T29 R29 R31 P31 R26 P26 R30 P30 R25 P25 R28 P28 N31 M31 R23 P23 N30 M30 P27 N27 P22 N22 N29 M29 N28 M28 N26 M26 L31 K31 M27 L27 N23 M23 L30 No Connect in XC2V2000
Module 4 of 4 214
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 Pin Description IO_L53N_7 IO_L52P_7 IO_L52N_7 IO_L51P_7/VREF_7 IO_L51N_7 IO_L50P_7 IO_L50N_7 IO_L49P_7 IO_L49N_7 IO_L48P_7 IO_L48N_7 IO_L47P_7 IO_L47N_7 IO_L46P_7 IO_L46N_7 IO_L45P_7/VREF_7 IO_L45N_7 IO_L44P_7 IO_L44N_7 IO_L43P_7 IO_L43N_7 IO_L27P_7/VREF_7 IO_L27N_7 IO_L25P_7 IO_L25N_7 IO_L24P_7 IO_L24N_7 IO_L23P_7 IO_L23N_7 IO_L22P_7 IO_L22N_7 IO_L21P_7/VREF_7 IO_L21N_7 IO_L20P_7 IO_L20N_7 IO_L19P_7 IO_L19N_7 IO_L06P_7 Pin Number K30 L28 J28 M24 L24 L29 K29 M25 L25 L26 J26 J31 H31 J29 H29 M22 L22 J30 G30 K27 J27 L23 K23 G31 F31 F30 E30 K25 J25 H28 G28 H27 G27 K24 J24 E31 D31 F28 NC NC NC NC No Connect in XC2V2000
Module 4 of 4 215
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 7 7 7 7 7 7 7 7 7 7 7 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 Pin Description IO_L06N_7 IO_L05P_7 IO_L05N_7 IO_L04P_7 IO_L04N_7 IO_L03P_7/VREF_7 IO_L03N_7 IO_L02P_7/VRN_7 IO_L02N_7/VRP_7 IO_L01P_7 IO_L01N_7 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_0 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_1 VCCO_2 VCCO_2 VCCO_2 VCCO_2 Pin Number E28 K22 K21 F29 E29 H26 H25 G26 F27 D30 D29 C18 C25 F22 H18 L17 L18 L19 L20 M17 M18 M19 C7 C14 F10 H14 L12 L13 L14 L15 M13 M14 M15 G3 K6 M11 N11 No Connect in XC2V2000
Module 4 of 4 216
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 2 2 2 2 2 2 2 3 3 3 3 3 3 3 3 3 3 3 4 4 4 4 4 4 4 4 4 4 4 5 5 5 5 5 5 5 5 5 Pin Description VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_2 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_3 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_4 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 VCCO_5 Pin Number N12 P3 P8 P11 P12 R11 R12 U11 U12 V3 V8 V11 V12 W11 W12 Y11 AB6 AE3 Y13 Y14 Y15 AA12 AA13 AA14 AA15 AD14 AF10 AJ7 AJ14 Y17 Y18 Y19 AA17 AA18 AA19 AA20 AD18 AF22 No Connect in XC2V2000
Module 4 of 4 217
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank 5 5 6 6 6 6 6 6 6 6 6 6 6 7 7 7 7 7 7 7 7 7 7 7 NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description VCCO_5 VCCO_5 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_6 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 VCCO_7 CCLK PROG_B DONE M0 M1 M2 HSWAP_EN TCK TDI TDO TMS PWRDWN_B DXN Pin Number AJ18 AJ25 U20 U21 V20 V21 V24 V29 W20 W21 Y21 AB26 AE29 G29 K26 M21 N20 N21 P20 P21 P24 P29 R20 R21 AJ4 D27 AG6 AH27 AJ28 AG26 E26 K11 C28 C4 J10 AH5 F25 No Connect in XC2V2000
Module 4 of 4 218
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description DXP VBATT RSVD VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCAUX VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT Pin Number B28 D5 B4 B16 C2 C30 T2 T30 AJ2 AJ30 AK16 K15 K17 L11 L16 L21 M12 M16 M20 N13 N14 N15 N16 N17 N18 N19 P13 P19 R10 R13 R19 R22 T11 T12 T13 T19 T20 No Connect in XC2V2000
Module 4 of 4 219
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT VCCINT GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number T21 U10 U13 U19 U22 V13 V19 W13 W14 W15 W16 W17 W18 W19 Y12 Y16 Y20 AA11 AA16 AA21 AB15 AB17 A2 A3 A16 A29 A30 B1 B2 B8 B24 B30 B31 C1 C3 C29 C31 D4 No Connect in XC2V2000
Module 4 of 4 220
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number D10 D16 D22 D28 E5 E27 F6 F26 G7 G13 G16 G19 G25 H2 H8 H24 H30 J9 J23 K4 K16 K28 N7 N25 P14 P15 P16 P17 P18 R14 R15 R16 R17 R18 T1 T4 T7 T10 No Connect in XC2V2000
Module 4 of 4 221
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number T14 T15 T16 T17 T18 T22 T25 T28 T31 U14 U15 U16 U17 U18 V14 V15 V16 V17 V18 W7 W25 AB4 AB16 AB28 AC9 AC23 AD2 AD8 AD24 AD30 AE7 AE13 AE16 AE19 AE25 AF6 AF26 AG5 No Connect in XC2V2000
Module 4 of 4 222
Table 14: BF957 XC2V2000, XC2V3000, XC2V4000, and XC2V6000 Bank NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA NA Pin Description GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin Number AG27 AH4 AH10 AH16 AH22 AH28 AJ1 AJ3 AJ29 AJ31 AK1 AK2 AK8 AK24 AK30 AK31 AL2 AL3 AL16 AL29 AL30 No Connect in XC2V2000
Module 4 of 4 223
BF957 Flip-Chip BGA Package Specifications (1.27mm pitch)
Figure 10: BF957 Flip-Chip BGA Package Specifications
Module 4 of 4 224
Revision History
This section records the change history for this module of the data sheet. Date 11/07/00 11/22/00 Version 1.0 1.1 Early access draft. Initial Xilinx release. Made the following corrections: CS144 package - Table 5, page 5: Added missing pin D10 in Bank 1. Changed dedicated pins A2 and B2 to RSVD (from DXN and DXP). FG256 package - Table 6, page 10: Changed dedicated pins A3 and A4 to RSVD (from DXN and DXP). FG896 package - Table 11, page 94: Corrected pin AG1 in Bank 4 to be AG12. FF1152 package - Table 12, page 120: Corrected pin Y3 in Bank 6 to be Y32. Reverse designations were fixed for pins in every package. The data sheet was divided into four modules (per the current style standard). DXN and DXP pin information was added for the CS144 package (Table 5) and the FG256 package (Table 6). DXN and DXP pin information was changed back to RSVD for the CS144 package (Table 5) and the FG256 package (Table 6). 11/07/01 09/26/02 10/07/02 12/06/02 05/07/03 06/19/03 1.6 1.7 1.8 1.8.1 1.8.2 1.8.3 ALT_VRN and ALT_VRP pin information was added for each package. Table 8, page 34 added No Connect designations for the XC2V1500 device in the FG676 package. Reverted to traditional double-column format. Updated list of devices supported in the FF1152, FF1517, and BF957 packages. Updated Table 3 to reflect devices supported in the BG728 and BF957 packages. Added mention of LVPECL to pin definition in Table 4. Corrected Table 10 heading to reflect supported devices in the BG728 package. Enhanced the description of the PWRDWN_B pin in Table 4. Added clarification to Table 4 and all device pinout tables regarding the dual-use nature of pins D0/DIN and BUSY/DOUT during configuration. The final GND pin in each of five pinout tables was inadvertently deleted in v1.8.2. This revision restores the deleted GND pins as follows: - Pin C5, Table 5, page 5 (CS144) - Pin A1, Table 6, page 10 (FG256) - Pin A2, Table 10, page 72 (BG728) - Pin A2, Table 12, page 120 (FF1152) - Pin AL30, Table 14, page 198 (BF957) Revision
12/19/00 01/25/01
1.2 1.3
02/07/01 04/02/01
1.4 1.5
08/01/03
2.0
All Virtex-II devices and speed grades now Production. See Table 13, Module 3.

Module 4 of 4 225

Virtex 2 Data Sheet

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Virtex-II Platform FPGAs: Complete Data Sheet

DS031 October 14, 2003

Module 1: Introduction and Overview

Module 3: DC and Switching Characteristics

Module 2: Functional Description

Module 4: Pinout Information

DS031 October 14, 2003 Product Specification

Virtex-II Platform FPGAs: Introduction and Overview

DS031-1 (v2.0) August 1, 2003

Summary of Virtex-II Features

DS031-1 (v2.0) August 1, 2003 Product Specification

Virtex-II Platform FPGAs: Introduction and Overview

Notes: 1. See details in Table 2, Maximum Number of User I/O Pads.

DS031-1 (v2.0) August 1, 2003 Product Specification

Virtex-II Platform FPGAs: Introduction and Overview

DCM Global Clock Mux

Programmable I/Os CLB Block SelectRAM Multiplier

Input/Output Blocks (IOBs)

Configurable Logic Blocks (CLBs)

Block SelectRAM Memory

DS031-1 (v2.0) August 1, 2003 Product Specification

Virtex-II Platform FPGAs: Introduction and Overview

Readback and Integrated Logic Analyzer

Virtex-II Device/Package Combinations and Maximum I/O

DS031-1 (v2.0) August 1, 2003 Product Specification

Virtex-II Platform FPGAs: Introduction and Overview

Virtex-II Ordering Information

Speed Grade (-4, -5, -6)

Figure 2: Virtex-II Ordering Information

DS031-1 (v2.0) August 1, 2003 Product Specification

Virtex-II Platform FPGAs: Introduction and Overview

Virtex-II Data Sheet

DS031-1 (v2.0) August 1, 2003 Product Specification

Virtex-II Platform FPGAs: Detailed Description

DS031-2 (v3.1) October 14, 2003

Figure 1: Virtex-II Input/Output Tile

Supported I/O Standards

DS031-2 (v3.1) October 14, 2003 Product Specification

Virtex-II Platform FPGAs: Detailed Description

Table 2: Supported Differential Signal I/O Standards

Table 3: Supported DCI I/O Standards

Notes: 1. N/R = no requirement.

DS031-2 (v3.1) October 14, 2003 Product Specification

Virtex-II Platform FPGAs: Detailed Description

Figure 2: Virtex-II IOB Block

DCM 180 0 FDDR D1 Q1 CLOCK CLK1 D1 Q1 CLK1 FDDR

(50/50 duty cycle clock)

DS031-2 (v3.1) October 14, 2003 Product Specification

Virtex-II Platform FPGAs: Detailed Description

(O/T) 1 Attribute INIT1 INIT0 SRHIGH SRLOW

FF LATCH (O/T) CE (O/T) CLK1 SR Shared by all registers REV FF LATCH D2 Q2 D1 Q1

CE CK1 SR REV FF1 DDR MUX FF2 (OQ or TQ)

Attribute INIT1 INIT0 SRHIGH SRLOW

Reset Type SYNC ASYNC

Figure 4: Register / Latch Configuration in an IOB Block

Input/Output Individual Options

VCCO Program Current 10-60K

PAD VCCO 10-60K VCCAUX = 3.3V VCCINT = 1.5V IBUF

DS031-2 (v3.1) October 14, 2003 Product Specification

Rules for Combining I/O Standards in the Same Bank

The implementation tools will enforce these design rules.