Michel M.A. Francois 308 Hedgerow Lane Home: (215) 576-5279 Wyncote, PA, 19095 mf1293d4a@westpost.

net Cell: ( 215) 439-5409 ________________________________________________________________________________ __________________ SUMMARY Dedicated electrophysics / biosensor technologist specializing in the developmen t of multi-discipline IC technologies, biotechnologies, multi-level metallizatio n/no-wire bonds power semiconductor packaging, IC based high power-semiconductor device fabrication and high power-semiconductor switch module design. Backgrou nd includes over 22 years experience in research, development and fabrication of integrated circuits, power semiconductors, MEMS, multi-chip packaging (module) and nano-sensor devices. These devices span the integration of silicon, MEMS, m olecular nano, optical and piezoelectric technologies. Expertise are in scienti fic research, managing projects, developing products including: developing and i mproving processes, project management, defect minimization, yield improvement, metal voids, silicidation and salicidation, multi level metallization, flip-chip technology and multi-chip module fabrication for different applications. Well m otivated to achieve timeliness goals and capitalize on rapid market changes. Professional Experience Silicon Power Co. Malvern, PA 2008-Now Principal technologist IC based power-semiconductor device fabrication Process Development and Module p ackaging Design Engineer. * Develop and transfer new IC processes and Modules fabrication processes from R &D to outside manufacturing facilities * Lead teams in projects related to defect minimization, yield improvement, meta llization, flip-chip technology. Increased Fab. module fabrication yield from 15 96%. * Work with outside manufacturers on frontend and backend IC and Module sub-proc esses (covering the complete process from starting material to final module assembly) * Applied scientific and engineering principles to perform various R&D tasks suc h as design, theoretical analysis, review and approve specifications and drawings, as well as hands on experimentation. * Prepared requisitions for equipment and miscellaneous items as required. * Si and SiC based Super-GTO devices Drexel University, Philadelphia, PA 2006-2008 Research Scientist Responsible for developing multi-frequency biochip sensors. * Developed a biochip of an array of piezoelectric sensors for the detection or identification of target multi-measurands such as antigens, DNA, proteins, bioagents or other bio-chemical objects or b io-chemical reactions. This device can also be used for screening diseases, detecting gases. * Developed and fabricated micro-fluidic systems on the same biochips substrates to deliver bio-samples on the sensors. * Conducted and led Research and Development (R&D) teams in the development of b iosensors and medical devices.

* Led cross-functional teams from concept to production. * Facilitated communication and interaction amongst functional representatives a s delegated by the Principal Investigator for research projects. * Conducted and prepared individual, group and multi-group meetings. * Prepared and issue final reports for all projects. * Conducted and prepared individual, group and multi-group meetings. Allegro, Warminster, PA 1988-20 06 Principal Senior Engineer Worked in the Research and Technology Development Department delivering manucfac turable high yielding processes. * Integrated silicon sensors (Hall and Current sensors) into analog BiCMOS proce sses. * Developed new 1.25, 0.6 and 0.35 micron processes for BCD (Digital CMOS, Analo g Bipolar and High Power DMOS) and DABIC (Digital & Analog CMOS, Bipolar Devices). Decreased device size by 25 - 40 % as a consequence reduced inventory and increase company profit by approximately 25 %. * Participated in the design of new devices (Silicon, SiGe and GaAs Hall Sensors , Current Sensors with integrated current loop to create its own magnetic field, MEMS devices). * Assisted project groups in design of experiments to solve chronic process prob lems. Leaded teams in projects related to defect minimization, yield improvement, metal voids, silicidation, multi-leve l metallization, flip-chip technology. increased Fab. yield and probe yield by 50 %. * Transferred processes of other companies to Allegro production lines and viceversa. Used device reliability testing to modify and qualify processes. * Used DOE (design of experiments) techniques to solve chronic process problems. Developed high voltage processes up to 120 volts. Expertise in modular processes as well as BOE integration and Epi defects. TTL Techniques Inc., Hambler, PA 1985-1988 Principal Senior Scientist Wrote proposals and developed new technologies for a start-up company. * Involved in proposal writing to government and other agencies such as NSF, Nav y, Air Force, NIH. * Designed and built thin film plasma deposition systems such as PECVD, CVD, DC and RF sputters and evaporators. * Developed systems to deposit diamond-like films for protective coating on IR w indow (ZnS and ZnSe), AlN, Au, Cu Al alloys and superconductor materials. * Participated in the development of in-situ processing instruments such as opti cal emission/atomic absorption spectroscopy, Raman spectroscopy, glow discharge mass spectrometer/energy ana lyzer, spectroscopic ellipsometer and optical pirometer. * Functioned as senior scientist in Chip-on-board research program from the depa rtment of Navy, Crane Indiana, contract # N00164-87-C-004. Tasks included fabrication and tested the advanced hybrid pa ckaging system. Sprague Solid State Scientific, Willow-Grove, PA June-Nov. 1986

Process Sustaining Engineer Was responsible for improving processes that were already released to production * Worked in the process and equipment development groups; work included vacuum d eposited thin film development for MOS type devices. * Performed experiments for improving metallization step coverage. Designed and simulated the fabrication process. Qualified the manufacturing of CMOS and DMOS devices. Other Related Experience Drexel University, Philadelphia, PA 2008-Now Adjunct Professor * Teaching circuit analysis classes including Lab. Drexel University, Philadelphia, PA 1982-1987 Teaching/Research Assistant * Taught and graded Advanced Electronics Circuits, Computer Aided Designed of In tegrated Circuits, Design and Fabrication of Thick Film Hybrid Circuits Course Works. * Participated in proposal writing to government agencies such as NSF, SBIR, Nav y (Crane Indiana) * Developed liquid metal ion source for such application as etching, metal depos ition and mask repair. Participated in the design and fabrication of an intragastric pressure telemeter, an orthodontal biocompatible anode implant * Done studies on Ion Cluster Beams; including: Generation and Characterized of Ionized Cluster Beams from LMIS, Measurements of Charge, Mass and Energy, Measurements of Neutral Species Ener gy, Cluster Beam Focusing, Design of Source Structure, Characterization of the particles. * Designed and assembled an r-f Plasma Etching and deposition System. Establishe d a facility for making LMIS. Established a system for testing and studying LMIS. * Refurbished semiconductor processing equipments in the Microelectronics and ph otovoltaics Laboratories, Conducted tests on solar cells. Education PhD, Electrophysics/Biosensors, Drexel University, Philadelphia, PA 2008 MSEE, Electrophysics, Drexel University, Philadelphia, PA 1986 BSEE, Electronic/Micro-electronic/Control Systems, Drexel University, Philadelph ia, PA 1984

Addendum Presentations and Publications

Bahasadri, K. Pourrezaie, M. Franois, D. Nayak. Qualitative Description of Clust er emission from Liquid Metal Ion Source, presented at the 31st International Sy mposium of Electron Ion and Photon Beams. May 26-29, 1987, Woodland Hills, CA, a nd published in J. Vac. Sci. Technol. B (6) Jan-Feb 1988. Bahasadri, K. Pourrezaie, M. Franois, D. Nayak. Identification of Cluster Beam c onstituents and Qualitative Description of Cluster Emission from Liquid Gold Ion Source, Proc. Nat. Res. Soc. Vol. 93. M. Franois, K. Pourrezaie, D. Nayak, A. Bahasadri. Investigation of LMIS Cluster Beam Composition and the Effect of this Composition on Film Grown. Presented at the 30th International Symposium on Electron, Ion and Photon Beams, May 27-30, 1986, Boston, MA. M. Franois, K. Pourrezaie, D. Nayak, A. Bahasadri. Investigation of the LMIS Clu ster Beam Constituents and Their Role in the Properties of the Deposited Film, J . Vac. Sci. Technol. B (5) 1 (1987) 178. D. Nayak, K. Pourrezaie, M. Franois, A. Bahasadri. Measurement of charge to Mass Ratio (Q/M) Distribution of an Ionized Cluster Beam by a Special Type of Quadru pole Mass Analyzer, Review of Scientific Instruments, Dec. 1987. M. Francois, E. Ergezen, J Desa, K Pourrezaei, R Lec. Multi-Layer Interfacial Pr operty Analysis using a Multi-frequency Thickness Shear Mode Device builds on a Single Chip IEEE International Ultrasonics Symposium in New-York 28-31, 2007. M. Francois, E. Ergezen, J Desa, K Pourrezaei, R Lec. A Multi-Frequency Thicknes s Shear Mode Biochip for Monitoring Biological Interfacial Processes BMES Annual Fall Meeting 2007- Los Angeles.