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BCM970012 Datasheet
Aug 2007 Rev 1.1
www.usi.com.tw
Introduction
The BCM970012 is a single-lane Mini-card module that introduces the advantages of the next generation high-definition (HD) H.264 and VC-1 video compression algorithm and media security protection for PC applications such as playback from HD DVD or Blu-ray drives. The BCM970012 supports single-stream HD AVC/VC-1/MPEG-2 decoder capable of full high-definition real-time decoding. The high performance and low power consumption of the adapter enable reduced CPU utilization and support for mobile platform designs. The BCM970012 fully supports the MPEG-2 standard, so that compatibility with existing media can be maintained. The BCM970012 supports any compliant resolution from QCIF up to 1920 1080 for both interlaced as well as progressive content.
Features
Single-lane mini-card v1.1 compliant with Clock Request and ASPM support Memory-to-memory video decode Multi-standard HD video decoder - H.264/AVC HP at L4.1 1080i, 40 Mbps - SMPTE VC-1 AP at L3 1080i, 40 Mbps - H.264/AVC HP at L3.2 720p - H.264/AVC HP at L3.0 480i - MPEG-2 MP @ ML - MPEG-2 MP @ HL Uncompressed video output - YUV 4:2:0/4:2:2 - NV12/YUY2/UYVY YCbCr format support - SD, 720p, 1080i, 1080p support Strong media security - AES encryption and decryption engine - Encrypted elementary stream compressed input - Firmware verification via digital signature
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Pin assignment
No. Function 1 WAKE_L 3 Reserved 5 Reserved 7 CLKREQ_L 9 Ground 11 REFCLK_N 13 REFCLK_P 15 Ground 17 Reserved (UIM_C8) 19 Reserved (UIM_C4) 21 Ground 23 PERn0 25 PERp0 27 Ground 29 Ground 31 PETn0 33 PETp0 35 Ground 37 Reserved 39 Reserved 41 Reserved 43 Reserved 45 Reserved 47 Reserved 49 Reserved 51 Reserved No. Function 2 3.3V 4 Ground 6 1.5V 8 UIM_PWR 10 UIM_DATA 12 UIM_CLK 14 UIM_RESET 16 UIM_VPP 18 Ground 20 W_DISABLE_L 22 PERST_L 24 3.3VAUX 26 Ground 28 1.5V 30 SMB_CLK 32 SMB_DATA 34 Ground 36 USB_D_L 38 USB_D_P 40 Ground 42 LED_WWAN_L 44 LED_WLAN_L 46 LED_WPAN_L 48 1.5V 50 Ground 52 3.3V
Power Consumption
Power consumption for the BCM970012 module will be made available in subsequent updates of the data sheet.
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Thermal Information
Junction-to-Top Center thermal characterization parameter, JT JT = (TJ TT) / P where TJ= device junction temperature obtained under steady state test condition, C TA= ambient air temperature specified in thermal simulation, C TB= package lead footprint temperature specified in thermal simulation, C TC= package case top surface temperature specified in thermal simulation, C TT= package case top center temperature obtained under steady state test condition, C P= device power dissipation, W where TJ= device junction temperature in the steady state test condition, C
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Package
All the module will be placed in the tray and packed as presented by following picture.
25pcs / Tray
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For Additional information, please contact the following: Universal Scientific Industrial Co., Ltd. Headquarters 141, Lane 351, Taiping Road, Sec. 1 , Tsao-Tuen , Taiwan, Http://www.usi.com.tw Tel: + 886-49-2350876, 2325876 Fax: +886-49-3439561, 2337360,2351093 E-mail:usi@ms.usi.com.tw Shanghai Site Universal Scientific Industrial (Shanghai) Co., Ltd Tel. no. + 86-21-58966996 ext. 2174 Fax:86-21-58967666 ADD: 200, Jin Qiu Rd., Zhang Jiang High-Tech Park, Shanghai 201203, P. R. China
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