Desenho Electrotécnico - Apresentação

Desenho Electrotcnico -- Electrnica -Lus Simes lfcsimoes@estv.ipv.
pt Gabinete 15
Desenho Electrotcnico Lus Simes - DEE - ESTV
CONSTITUINTES DOS EQUIPAMENTOS ELECTRNICOS

Electrnica hoje
Circuito electrnico
Na base do funcionamento destes equipamentos est sempre um circuito electrnico De uma forma simplista, este circuito composto por:
Componentes electrnicos;
Placa de circuito impresso (PCB printed circuit board)
Tudo comea numa ideia
Como passar de um esquema para uma placa PCB?
Como desenhar o esquema do circuito (circuit schematic)? Como desenhar a placa de circuito impresso (PCB)?
Da electrnica ao produto final
Componentes mais comuns nos circuitos electrnicos
COMPONENTES ELECTRNICOS
Exemplo de esquema (schematic)
Elementos tpicos no esquema de um circuito

Num esquema, as ligaes entre componentes so representadas simplesmente por traos.

Fontes de alimentao (sources): todos os circuitos tero uma fonte de energia que faz mover os electres da rede elctrica.

Indutncias mtuas (mutual inductors): seguem o princpio das bobinas mas cumprem outros fins

Interruptores e comutadores (Switches)

Resistncias (resistors): ajudam a controlar as correntes e tenses presentes numa montagem

Um circuito (extremamente) simples:
Uma tenso aplicada a um circuito provocar a movimentao de electres corrente elctrica.

Condensadores (capacitors): componentes que armazenam energia na forma de campo elctrico
Bobinas (inductors): componentes que armazenam energia na forma de campo magntico

Rels (Relays)

Dodos (diodes): controlam o sentido em que flui a corrente.

Transstores (transistors): componente de 3 terminais em que actuando electricamente sobre um dos terminais se controla a corrente que flui entre os outros dois.

Outros transstores: JFET e MOSFET

Tiristores (Thyristors): controlo de correntes em circuitos de potncia

Circuitos digitais (digital circuits): circuitos que operam com base num sistema binrio (On,Off; 0V,5V; etc)
O mesmo componente pode ser comprado com diferentes apresentaes A aplicao determina o formato a escolher
ENCAPSULAMENTO DOS COMPONENTES

Mesmo componente, mesma funo, diferentes encapsulamentos!
SMD (surface mount device) Com terminais (Through Hole)
Os encapsulamentos podem ser de vidro, metal, cermicos ou plsticos O encapsulamento define a dissipao de potncia e as caractersticas de frequncia do componente. Cada encapsulamento designado por uma referncia diferente. Ao projectar uma placa PCB essa referncia que devemos utilizar ao adicionar o componente.
Encapsulamento de componentes discretos
TO 92
TO 18
TO 39
TO 220
TO 3
TO 126
DO 4
DO 5
DO 8
DO 9
HR 16
HR 23
HT 16
HT 23
HT 29
TO 65
TO 3
TO 5m
TO 48
TO 55
TO 83
TO 93
TO 94
TO 92
TO126
TO 127
TO 202
TO 218
TO 220 TO 220 2pin
Maior integrao Menor espao Mais funes desempenhadas Maior libertao de calor Maior velocidade (frequncia)
Tecnologias de montagem:
PTH (pin through hole)
SMT (surface mount technology)
BGA (ball grid array)
BGA socketing
S Single D Dual Q Quad
GA Grid Array P Package J J bended IP Inline Package IC Integrated Circuit FP Flat Pack S Small SO Small Outline TS Thin Small
P Plastic C Ceramic
Semiconductor Packages Single Chip
P Package IC Integrated Circuit
In-Line Dual In-Line (DIL/DIP) Single In-Line (SIL/SIP)
Single In-Line Memory Module (SIMM) Zig-Zag In-Line Package (ZIP)
Small Outline (SOP / SOIC)

Menor que o IL
Small Outline J-Bend Package (SOJ) Small Outline Gull-Wing Package (SOP) Thin Small Outline Package (TSOP)
Quad Surface Mount
Plastic Quad Flat Pack (PQFP) Ceramic Quad Flat Pack (CQFP) Chip Carrier (CC)
Grid Array Multi Chip

Semiconductor Packages Single Chip
In-Line Small Outline Quad Surface Mount Grid Array Pin Grid Array (PGA) (through hole; impossvel SMT)
Bolas de solda
Ball Grid Array (BGA)
Colocadas em cima de circuito impresso e fundidas por infravermelhos p.ex.
= BGA; mais pequeno
Chip Scale Package (CSP)
Multi Chip Module (MCM)
DIP (Dual Inline Package) / DIL (Dual In Line) CDIP (Ceramic DIP) PDIP (Plastic DIP) SDIP (Skinny DIP) QIP (Quad) QIP (Quad Inline Package) QFP (Quad Flat Pack) PQFP (Plastic QFP) CQFP (Ceramic QFP) TQFP (Thin QFP) LCC (Leadless Chip Carrier) CLCC (Ceramic LCC) PLCC (Plastic LCC) PLCC (Plastic Leadless Chip Carrier)
Maior afastamento das pistas maior corrente
QFP (Quad Flat Pack)
PGA (Pin Grid Array)
Evoluo do encapsulamento
Numerao dos pinos
SIP / SIL
DIP / SDIP / SOIC / SOJ / SOP / SSOP / TSOP / ...
ZIP
PGA / BGA
PLCC / QFP / PQFP
Correntes
Aquecimento
Todo o integrado sofrer um aquecimento quando em operao. H situaes em que no ser necessrio tomar medidas especiais dado que o encapsulamento suporta a temperatura em casua. Quando tal no acontecer ser necessrio recorrer a sistemas auxiliares de arrefecimento.
Uso de dissipadores
Cermico
Plstico
Outras formas de arrefecimento
Placa de circuito impresso
PCB PRINTED CIRCUIT BOARD
PCB
A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, or traces, etched from copper sheets laminated onto a non-conductive substrate. A PCB populated with electronic components is a printed circuit assembly (PCA), also known as a printed circuit board assembly (PCBA). Materials: Conducting layers are typically made of thin copper foil. Insulating layers are typically laminated together with epoxy resin. The board is typically green in color and made of materials like polytetrafluoroethylene, FR-4, FR-1, CEM-1 or CEM-3.
PCB (dupla face)
Folha de cobre
Resina epoxyca (extremamente fina e praticamente invisvel) Camada isolante (FR-4,FR-1,CEM-1,CEM-3,...)
Construo de placas PCB

The vast majority of printed circuit boards are made by bonding a layer of copper over the entire substrate, sometimes on both sides, (creating a "blank PCB") then removing unwanted copper after applying a temporary mask (eg. by etching), leaving only the desired copper traces. A few PCBs are made by adding traces to the bare substrate (or a substrate with a very thin layer of copper) usually by a complex process of multiple electroplating steps. There are three common "subtractive" methods (methods that remove copper) used for the production of printed circuit boards: silk screen printing, photoengraving and pcb milling.
Subtractive methods
Silk screen printing uses etch-resistant inks to protect the copper foil. Subsequent etching removes the unwanted copper. Alternatively, the ink may be conductive, printed on a blank (non-conductive) board. Photoengraving uses a photomask and chemical etching to remove the copper foil from the substrate. The photomask is usually prepared with a photoplotter from data produced by a technician using CAM, or computer-aided manufacturing software. PCB milling uses a two or three-axis mechanical milling system to mill away the copper foil from the substrate. A PCB milling machine (referred to as a 'PCB Prototyper') operates in a similar way to a plotter, receiving commands from the host software that control the position of the milling head in the x, y, and (if relevant) z axis. Data to drive the Prototyper is extracted from files generated in PCB design software and stored in HPGL or Gerber file format.
PCB (dupla face)
A PCB depois furada e maquinada para se obter uma placa rgida que liga os componentes de forma robusta.
Elementos de uma PCB

Trace Pad Hole Via: A plated through hole (PTH) in a Printed Circuit Board (PCB) that is used to provide electrical connection between a trace on one layer of the Printed Circuit Board to a trace on another layer. Since it is not used to mount component leads, it is generally a small hole and pad diameter. Blind via: A via hole that does not pass completely through the printed circuit board. A blind via starts from one side or another.
PCB Milling
Maquinao das PCBs.
Vdeos de maquinao de PCBs.
Furao das PCB

Drilling Holes, or vias, through a PCB are typically drilled with tiny drill bits made of solid tungsten carbide. The drilling is performed by automated drilling machines with placement controlled by a drill file. These computergenerated files are also called numerically controlled drill (NCD) files or "Excellon files". The drill file describes the location and size of each drilled hole. When very small vias are required, drilling with mechanical bits is costly because of high rates of wear and breakage. In this case, the vias may be evaporated by lasers. Laser-drilled vias typically have an inferior surface finish inside the hole. These holes are called micro vias. The walls of the holes, for boards with 2 or more layers, are plated with copper to form plated-through holes that electrically connect the conducting layers of the PCB.
Ficheiro de furao no Eagle
% M48 M72 T01C0.0240 T02C0.0320 T03C0.0360 T04C0.0400 T05C0.0440 T06C0.0520 T07C0.1300 % T01 X2351Y2075 X2351Y2637 X6038Y4700 X4913Y5825 X7726Y8450 X9601Y9512 X10726Y10387 X13038Y11700 X14163Y13012 X16413Y14637 X17851Y14200 X18288Y13012 X19913Y14450 X21788Y13887 X22038Y12575 X21726Y10950 X21288Y9825 X18413Y9200 X13726Y8075 X12413Y5887 X13726Y5137 X14351Y2325 X12226Y1450 X10601Y1075 X7413Y3075 X6476Y2887 X4476Y9575 X4663Y10325 X6038Y10575 X4163Y14012 X2163Y15825 X5913Y16575 X6788Y17200 X7476Y18012 X8288Y19262 X9351Y19075 X10351Y18137 X10913Y17887 X11976Y17012 X12913Y17887 X14413Y19137 X15413Y20700 X16351Y20262 X17538Y20950
Ficheiro de controlo da furao

X17601Y19575 X18851Y18137 X20163Y17012 X23851Y16450 X24351Y18137 X26413Y17887 X27913Y17012 X29351Y15887 X29851Y14762 X32101Y14762 X32101Y14200 X32163Y15512 X34413Y17012 X35351Y17575 X36038Y17450 X36101Y18512 X35976Y19762 X33851Y19200 X33163Y20137 X32038Y19637 X31163Y19575 X31351Y20387 X29788Y20137 X32726Y23512 X29351Y24075 X27788Y24762 X27601Y26450 X26663Y28700 X23601Y28387 X22851Y25200 X24976Y24075 X20976Y25200 X19788Y24325 X19351Y24762 X18351Y24762 X18976Y26637 X13351Y22887 X12351Y23825 X10226Y23825 X9351Y24262 X10476Y22012 X12351Y20450 X12351Y19575 X11351Y20012 X10663Y19700 X6788Y22137 X5976Y21325 X4538Y25387 X5038Y29512 X2476Y30700 X20351Y21887 X16163Y16450 X13288Y15012 X10788Y14512 X10726Y13387 X7476Y14887 X17913Y5200 X21226Y4012 X20163Y2575 X18976Y2575 X19788Y1200 X23351Y2575 X25226Y3012 X25851Y1762 X24226Y1075 X29913Y2887 X30351Y2325 X32851Y4200 X32101Y5325 X35288Y3637 X35288Y3075 X38663Y3512 X37788Y7450 X35351Y9950 X33913Y10450 X36851Y11700 X35163Y14200 X35601Y15825 X36476Y16075 X38101Y17700 X29788Y12512 X28726Y12012 X29351Y10950 X30476Y10012 X29788Y9575 X29851Y8950 X30663Y9262 X29913Y7950 X26976Y11012 X25976Y10950 X25351Y11075 X23351Y14450 X30913Y28387 X31913Y28575 T02 X30351Y26262 X30351Y24262 X29851Y18512 X28851Y18512 X27851Y18512 X26851Y18512 X25851Y18512 X24851Y18512 X23851Y18512 X22851Y18512 X21351Y18512 X20351Y18512 X19351Y18512 X18351Y18512 X17351Y18512 X16351Y18512 X15351Y18512 X14351Y18512 X12851Y18512 X11851Y18512 X10851Y18512 X9851Y18512 X8851Y18512 X7851Y18512 X6851Y18512 X5851Y18512 X5851Y15512 X6851Y15512 X7851Y15512 X8851Y15512 X9851Y15512 X10851Y15512 X11851Y15512 X12851Y15512 X14351Y15512 X15351Y15512 X16351Y15512 X17351Y15512 X18351Y15512 X19351Y15512 X20351Y15512 X21351Y15512 X22851Y15512 X23851Y15512 X24851Y15512 X25851Y15512 X26851Y15512 X27851Y15512 X28851Y15512 X29851Y15512 X31351Y13512 X31351Y12512 X31351Y11512 X31351Y10512 X31351Y9512 X31351Y8512 X31351Y7512 X31351Y6512 X28351Y6512 X28351Y7512 X28351Y8512 X28351Y9512 X28351Y10512 X27351Y10512 X27351Y9512 X27351Y8512 X27351Y7512 X27351Y6512 X24351Y6512 X23351Y6512 X23351Y7512 X24351Y7512 X24351Y8512 X23351Y8512 X23351Y9512 X24351Y9512 X24351Y10512 X23351Y10512 X23351Y11512 X24351Y11512 X24351Y12512 X23351Y12512 X23351Y13512 X24351Y13512 X27351Y13512 X28351Y13512 X28351Y12512 X28351Y11512 X27351Y11512 X27351Y12512 X33601Y14762 X33601Y15762 X31851Y17512 X31851Y18512 X20351Y13512 X19351Y13512 X19351Y12512 X20351Y12512 X20351Y11512 X19351Y11512 X19351Y10512 X20351Y10512 X20351Y9512 X19351Y9512 X19351Y8512 X20351Y8512 X20351Y7512 X19351Y7512 X19351Y6512 X20351Y6512 X16351Y6512 X15351Y6512 X15351Y7512 X16351Y7512 X16351Y8512 X15351Y8512 X15351Y9512 X16351Y9512 X16351Y10512 X15351Y10512 X15351Y11512 X16351Y11512 X16351Y12512 X15351Y12512 X15351Y13512 X16351Y13512 X12351Y13512 X12351Y12512 X12351Y11512 X11351Y11512 X11351Y12512 X11351Y13512 X8351Y13512 X8351Y12512 X8351Y11512 X8351Y10512 X8351Y9512 X8351Y8512 X8351Y7512 X8351Y6512 X5601Y6512 X5601Y7512 X11351Y7512 X12351Y7512 X12351Y6512 X11351Y6512 X11351Y8512 X12351Y8512 X12351Y9512 X12351Y10512 X11351Y10512 X11351Y9512 X5601Y12512 X5601Y13512 X34351Y5512 X35351Y5512 X36351Y5512 X37351Y5512 X38351Y5512 X38351Y1512 X37351Y1512 X36351Y1512 X35351Y1512 X34351Y1512 T03 X36351Y8262 X37351Y8262 X37351Y9262 X36351Y9262 X36351Y10262 X37351Y10262 X37351Y11262 X36351Y11262 X36351Y12262 X37351Y12262 X37351Y13262 X36351Y13262 X36351Y14262 X37351Y14262 X37351Y15262 X36351Y15262 X2851Y17012 X1851Y17012 X1851Y18012 X2851Y18012 X2851Y19012 X1851Y19012 X1851Y20012 X2851Y20012 X2851Y21012 X1851Y21012 X1851Y22012 X2851Y22012 X2851Y23012 X1851Y23012 X1851Y24012 X2851Y24012 X2851Y25012 X1851Y25012 X1851Y26012 X2851Y26012 X2851Y27012 X1851Y27012 X1851Y28012 X2851Y28012 X2851Y29012 X1851Y29012 X1851Y10012 X2851Y10012 X2851Y9012 X1851Y9012 X1851Y8012 X2851Y8012 X2851Y7012 X1851Y7012 X1851Y6012 X2851Y6012 X2851Y5012 X1851Y5012 X1851Y4012 X2851Y4012 X2851Y3012 X1851Y3012 T04 X7851Y3512 X8851Y3512 X9851Y3512 X10851Y3512 X11851Y3512 X12851Y3512 X13851Y3512 X14851Y3512 X15851Y3512 X16851Y3512 X17851Y3512 X18851Y3512 X19851Y3512 X20851Y3512 X21851Y3512 X22851Y3512 X23851Y3512 X24851Y3512 X25851Y3512 X26851Y3512 X27851Y3512 X28851Y3512 X29851Y3512 X30851Y3512 X31851Y3512 X31851Y4512 X30851Y4512 X29851Y4512 X28851Y4512 X27851Y4512 X26851Y4512 X25851Y4512 X24851Y4512 X23851Y4512 X22851Y4512 X21851Y4512 X20851Y4512 X19851Y4512 X18851Y4512 X17851Y4512 X16851Y4512 X15851Y4512 X14851Y4512 X13851Y4512 X12851Y4512 X11851Y4512 X10851Y4512 X9851Y4512 X8851Y4512 X7851Y4512 X7851Y21512 X8851Y21512 X9851Y21512 X10851Y21512 X11851Y21512 X12851Y21512 X13851Y21512 X14851Y21512 X15851Y21512 X16851Y21512 X17851Y21512 X18851Y21512 X19851Y21512 X20851Y21512 X21851Y21512 X22851Y21512 X23851Y21512 X24851Y21512 X25851Y21512 X26851Y21512 X27851Y21512 X28851Y21512 X29851Y21512
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Exemplos de PCBs
PCB glossary
Aperture A description of the shape and size of the tool used to create a pad or track. The term comes from the days of vector photo plotters, where film was exposed by shining light through apertures (shaped holes) arrayed around the edge of a disk (or "aperture wheel"). Each aperture corresponded to a different D code in the Gerber data. Today, photoplotters use lasers to expose the film but the term "aperture" persists. Aperture List / Aperture Table A list of the shapes and sizes for describing the pads and tracks used to create a layer of a circuit board. Pad The portion of the conductive pattern on printed circuits designated for the mounting or attachment of components. Via A plated through hole (PTH) in a Printed Circuit Board that is used to provide electrical connection between a trace on one layer of the Printed Circuit Board to a trace on another layer. Since it is not used to mount component leads, it is generally a small hole and pad diameter. Blind via A via hole that does not pass completely through the printed circuit board. A blind via starts from one side or another. Buried via A via connects two or more inner layers but no outer layer, and cannot be seen from either side of the board. Component Side The side of a printed circuit board on which most of the components will be mounted. Internal Layer A conductive pattern which is contained entirely within a multilayer printed board. Single Side PCB The pads and traces are on the one side of the board only. Double Side PCB The pads & traces are on both sides of the board. Multilayer PCB The pads and traces are on both sides and also there are traces embedded within the board. Speedy PCB is able to provide 3-20 multi layer boards.
NPTH NPTH: Non-plated Through Hole.
PCB Design Software/Tools Software that helps designer to do schematic, layout design, routing and optimizations, etc. There are many desing software and tools in the market. Some of them are free PCB design software. Here is a short list: ExpressPCB, EAGLE, PROTEL, CADSTAR, ORCAD, CIRCUIT MAKER, P-CAD 2000, PCB ELEGANCE, EDWIN, VISUALPC, BPECS32, AUTOENGINEER, EXPERT PCB, CIRCAD, LAYOUT, CIRCUIT LAYOUT, MCCAD, DREAM CAD, E-CAD, POWERPCB, PCB ASSISTANT, PCB DESIGNER, QCAD, QUICK ROUTE, TARGET 3001, WIN CIRCUIT 98, BOARD EDITOR, PCB, VUTRAX, CIRCUIT CREATOR, PADSPCB, DESIGN WORKS, OSMOND PPC, LAY01, SCORE, GElectronic, PRO-Board, PRO-Net , CSIEDA, VISUALPCB, WINBOARD, ULTIBOARD, EASY PC, RANGER, PROTEUS, EPD - Electronics Packaging Designer , AutoTrax Eda, SprintLayout, CADINT, KICAD, Merlin PCB Designer, FREE-PCB, TinyCAD, WINQCAD, Pulsonix, DIPTRACE. PCB Fabrication Process A general process can be simplified as: Copper laminate -> Drill board -> Deposit Cu -> Photolithography -> Tin lead plate or finishing > Etch -> Hot air level -> Solder mask -> E-Testing -> Routing/V-scoring -> Product inspection -> Final cleanning -> Packaging . PTH Plated Through Hole, a hole with the plated copper on its sides to provide electrical connections between conductive patterns at the levels of a printed circuit board. There are two types of PTH. One is for mounting components and the other is not used to mount component. RoHS Restriction of Hazardous Substances, is one of a handful of European legislation intended to eliminate or severely curtail the use of cadmium, hexavalent chromium, and lead in all products from automobiles to consumer electronics. Silkscreen Colored marks (usually white) on the PCB board to identify components for later assembly and trouble shooting processes. They can be put on either or both sides of the board.
O interior das PCBs
Regras na definio das PCB

Quando definindo traces sempre boa prtica faz-los to curtos e directos quanto possvel uma boa estratgia utilizar traces verticais numa das faces e horizontais na outra.
Unidades
Usar unidades imperiais A maioria dos componentes produzida com distncias entre terminais baseadas nestas unidades 1mil = 1/1000 inch (poleagadas) Usar unidades SI (mm): Dimenses da placa Dimetro das furaes Ateno diferena entre mm e mil!!!!
Regras para traces

Como regra geral a largura da pista deve ser to grande quanto possvel. Pistas mais largas tero menor resistncia, menor indutncia, podem ser mais facilmente produzidas (mais baratas) e mais fceis de inspeccionar. O mnimo genrico seria de 10 mils. A espessura do cobre normalmente definida em onas por p quadrado (ounces per square foot), sendo o cobre de 1oz o mais comum. Cobre mais espesso utilizado para correntes mais elevadas
Clculo da dimenso das pistas :
http://www.desmith.net/NMdS/Electronics/TraceWi dth.html Desenho Electrotcnico Lus Simes - DEE - ESTV
Considerando uma subida de temperatura de 10 C nas pistas:
Regras para pads

As dimenses e formato das pads dependem no s do componente como do processo de montagem da placa. O pad dever ser 1,8 vezes o dimetro do furo, ou pelo menos, 0,5mm mais largo.
Regras para pads

Os pads para componentes com pernos devem ser redondos sendo o seu dimetro comum de 70 mil. Os componentes DIL (dual in line) usam formas ovais com ~60x100mil.
Vias
As vias so semelhantes a pads mas servem propsitos diferentes: Pads: para fixar componentes Vias: para levar um sinal de uma face outra da placa Os furos nas vias so tipicamente de menor dimetro que nas pads.
Clearances
As clearances elctricas so muito importantes numa PCB. Uma clearance demasiado reduzida entre traces e pads podem conduzir a problemas durante a produo da placa e a curto-circuitos aps a sua montagem. Um valor razovel ser de 8 a 10 mils.
Alguns valores de referncia para as clearances em funo das tenses presentes no circuito
Localizao dos componentes

Colocar todos os componentes na rea de trabalho (feito automaticamente pelo software) Agrupar os componentes em blocos funcionais Alinhe os componentes (Circuitos integrados na mesma direco, resistncias e condensadores alinhados, etc.)
Routing
A ligao elctrica entre 2 ou mais pads designada por net. As nets devem ser to curtas quanto possvel As traces devem apenas ter ngulos de 45 graus. Deve evitar-se o uso de ngulos de 90 graus e em circunstncia alguma se deve usar ngulos superiores. As traces devem passar entre pads apenas quando absolutamente necessrio No deve existir na placa reas de cobre por ligar (dead copper). Ligue-os ao ground ou remova-os.
Silkscreen layer
Tambm designada por component layer, a camada que contm o contorno e a indicao dos componentes.
Solder Mask
A solder mask uma camada muito fina de revestimento que rodeia os pads para evitar que a solda estabelea pontes entre pinos dos componentes. A solder mask tipicamente cobre tudo excepto pads e vias. O programa de elaborao de PCB automaticamente eliminar a solder mask de pads e vias. No Eagle: tStop e bStop.
Rats nest
um diagrama em que as pads dos componentes ligados no schematic aparecem ligadas por uma linha direita (designada por air wire no Eagle). Este diagrama evita que se tenha de constantemente recorrer ao schematic para saber que componentes devem ficar ligados medida que avana o routing as linhas da rats nest vo desaparecendo. Quando no existir nenhum air wire, o routing estar completo.
Rats Nest
De rats nest para routing
A Design Rule Check permite verificar automaticamente se todas as regras impostas para clearance, conectividade, dimenso das pistas, etc. Com a complexidade das PCBs actuais seria pouco prtico realizar esta verificao manualmente verificado que cada trace na PCB corresponde s ligaes definidas no schematic. Verifica o afastamento (clearance) entre componentes, traces e pads. Verifica dimenses dos furos, largura das pistas e existncia de curto-circuitos.
Design Rule Check
Forward e Back Annotation

Alteraes feitas ao schematic so imediatamente transpostas para a PCB. Alguns programas eliminaro tambm traces relativas a ligaes que foram eliminadas do scheamtic. A back annotation ocorre quando alteraes efectuadas na PCB se reflectem no schematic. (S em situaes muito raras ser necessrio realizar back annotation)

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Desenho Electrotcnico -- Electrnica -Lus Simes lfcsimoes@estv.ipv.

CONSTITUINTES DOS EQUIPAMENTOS ELECTRNICOS

Desenho Electrotcnico Lus Simes - DEE - ESTV

Placa de circuito impresso (PCB printed circuit board)

Desenho Electrotcnico Lus Simes - DEE - ESTV

Tudo comea numa ideia

Desenho Electrotcnico Lus Simes - DEE - ESTV

Como passar de um esquema para uma placa PCB?

Da electrnica ao produto final

Desenho Electrotcnico Lus Simes - DEE - ESTV

Componentes mais comuns nos circuitos electrnicos

Desenho Electrotcnico Lus Simes - DEE - ESTV

Exemplo de esquema (schematic)

Desenho Electrotcnico Lus Simes - DEE - ESTV

Elementos tpicos no esquema de um circuito

Desenho Electrotcnico Lus Simes - DEE - ESTV

Elementos tpicos no esquema de um circuito

Desenho Electrotcnico Lus Simes - DEE - ESTV

Elementos tpicos no esquema de um circuito

Desenho Electrotcnico Lus Simes - DEE - ESTV

Elementos tpicos no esquema de um circuito

Desenho Electrotcnico Lus Simes - DEE - ESTV

Elementos tpicos no esquema de um circuito

Desenho Electrotcnico Lus Simes - DEE - ESTV

Elementos tpicos no esquema de um circuito

Uma tenso aplicada a um circuito provocar a movimentao de electres corrente elctrica.

Desenho Electrotcnico Lus Simes - DEE - ESTV

Elementos tpicos no esquema de um circuito

Bobinas (inductors): componentes que armazenam energia na forma de campo magntico

Desenho Electrotcnico Lus Simes - DEE - ESTV

Elementos tpicos no esquema de um circuito

Desenho Electrotcnico Lus Simes - DEE - ESTV

Elementos tpicos no esquema de um circuito

Desenho Electrotcnico Lus Simes - DEE - ESTV

Elementos tpicos no esquema de um circuito

Desenho Electrotcnico Lus Simes - DEE - ESTV

Elementos tpicos no esquema de um circuito

Desenho Electrotcnico Lus Simes - DEE - ESTV

Elementos tpicos no esquema de um circuito

Desenho Electrotcnico Lus Simes - DEE - ESTV

Elementos tpicos no esquema de um circuito

Desenho Electrotcnico Lus Simes - DEE - ESTV

ENCAPSULAMENTO DOS COMPONENTES

Mesmo componente, mesma funo, diferentes encapsulamentos!

SMD (surface mount device) Com terminais (Through Hole)

Desenho Electrotcnico Lus Simes - DEE - ESTV

Encapsulamento de componentes discretos

TO 220 TO 220 2pin

Desenho Electrotcnico Lus Simes - DEE - ESTV

Desenho Electrotcnico Lus Simes - DEE - ESTV

Desenho Electrotcnico Lus Simes - DEE - ESTV

Desenho Electrotcnico Lus Simes - DEE - ESTV

PTH (pin through hole)

SMT (surface mount technology)

BGA (ball grid array)

Desenho Electrotcnico Lus Simes - DEE - ESTV

Desenho Electrotcnico Lus Simes - DEE - ESTV

S Single D Dual Q Quad

Desenho Electrotcnico Lus Simes - DEE - ESTV

Semiconductor Packages Single Chip

P Package IC Integrated Circuit

In-Line Dual In-Line (DIL/DIP) Single In-Line (SIL/SIP)