DIAMOND CHIP

A Seminar Report

Submitted by

FELIX ANTONY

In partial fulfilment for the award of the degree Of

MASTER OF COMPUTER APPLICATIONS

From Cochin University Of Science And Technology

CHERTHALA NOVEMBER 2010

KOKOTHAMANGALAM P.O, CHERTHALA

BONAFIDE CERTIFICATE

This is to certify that the Seminar entitled DIAMOND CHIP has been submitted by FELIX ANTONY under my guidance Engineering & Technology. IT, Cherthala affiliated in partial fulfilment for the from KVM College of award of MASTER OF COMPUTER APPLICATIONS

to Cochin University of Science And

... Miss. Divya D. MCA, Lecturer, Dept. of Computer Applications KVM CE&IT, Cherthala.
Date: 23/10/2010 Place: CHERTHALA

Prof. SAJEEV B U Director Of MCA M.Sc,MCA,MTech,(PhD), Professor and Head, Dep. of Computer Applications KVM CE&IT Cherthala.

ACKNOWLEDGEMENT
At the very outset, I would like to give the first honors to God who gave the wisdom and knowledge to complete this seminar. I express my heart-felt gratitude to Dr. K.N James, Principal K.V.M. College of Engineering and IT, Cherthala for having given me the opportunity to complete this seminar successfully. I take this opportunity to express my sincere word of gratitude and thanks to Head Of the Department, Prof. Sajeev B U, Department of Computer Application, K.V.M. College of Engineering and IT, Cherthala for his able leadership and guidance in all the official matter regarding the seminar. I wish to extend my sincere thanks to my Guide Miss. Divya .D, Lecturer, Department of Computer Applications, K.V.M. College of Engineering and IT, Cherthala for her valuable guidance and support. I thank her for the timely suggestions and constant encouragement that led to the accomplishment of this seminar. Last but not least I thank my parents, friends and all my well-wishers who had supported me directly or indirectly, during the seminar.

Felix Antony

Abstract A crystalline diamond film that could produce more resilient semiconductor chips than those made from silicon, commonly synthetic diamonds have proved a poor semiconducting material. Their microscopic crystals are a disorderly hodgepodge, and their edges are not evenly aligned, impeding the flow of current. Now but by growing the diamond film on a surface of iridium, instead of on silicon, they can keep its grain boundaries aligned. Adding atoms of boron or nitrogen enables the diamond film to conduct electricity. Manufacturers plan to build a diamond chip that can withstand temperatures of 500 C, compared to only about 150 C for silicon chips. The chips would be most useful in devices located near hot-burning engines, such as those used in automobiles or airplanes. Diamond has an extremely high thermal conductivity, can withstand high electric fields, and can be made into a semiconductor ideal for power devices.

Felix Antony

TABLE OF CONTENTS PAGE NO

1 1.1 1.2 1.2.1 2 3 4 4.1 5 6 6.1 6.2 7 8 8.1 8.2 9 INTRODUCTION WHAT IS DIAMOND CHIP? CARBON NANOTUBE PROPERTIES CARBON CHIP TECHNOLOGY DIAMONDS ON FILM CARBON ENDGAME MORE MOORE'S LAW ADVANTAGES OF DIAMOND CHIP DIAMOND AND FLIP CHIPS INTRODUCTION HIGHER FREQUENCIES CONCLUSION APPENDIX APPENDIX I APPENDIX II REFERENCES 1 3 4 10 12 15 19 23 27 33 34 35 37 39 40 42 44

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