Professional Documents
Culture Documents
Silicon PIN Diode High voltage current controlled RF resistor for RF attenuator and switches Frequency range above 1 MHz up to 6 GHz Very low capacitance at zero volt reverse bias at frequencies above 1 GHz (typ. 0.17 pF) Low forward resistance (typ. 2.1 @ 10 mA) Very low signal distortion Pb-free (RoHS compliant) package Qualified according AEC Q1011)
BAR64-04 BAR64-04W
!
BAR64-05 BAR64-05W
!
BAR64-06 BAR64-06W
!
BAR64-07
"
, ,
,
,
,
Type BAR64-02LRH* BAR64-02V BAR64-03W BAR64-04 BAR64-04W BAR64-05 BAR64-05W BAR64-06 BAR64-06W BAR64-07
1*BAR64-02LRH
Package TSLP-2-7 SC79 SOD323 SOT23 SOT323 SOT23 SOT323 SOT23 SOT323 SOT143
Configuration single, leadless single single series series common cathode common cathode common anode common anode parallel pair
LS(nH) 0.4 0.6 1.8 1.8 1.4 1.8 1.4 1.8 1.4 2
2011-07-18
BAR64...
Maximum Ratings at T A = 25C, unless otherwise specified Symbol Parameter Diode reverse voltage Forward current Total power dissipation BAR64-02LRH, TS 135 C BAR64-02V, TS 125 C BAR64-03W, BAR64-07, T S 25 C BAR64-04, -05, -06, TS 65 C BAR64-04W, -05W, -06W, TS 115 C Junction temperature Operating temperature range Storage temperature Thermal Resistance Parameter Junction - soldering point1) BAR64-02LRH BAR64-02V, -04W, -05W, -06W BAR64-03W BAR64-04, -05, -06 BAR64-07 Symbol
RthJS
Unit V mA mW
VR IF Ptot
Tj Top Tstg
Unit
Electrical Characteristics at T A = 25C, unless otherwise specified Parameter DC Characteristics Breakdown voltage I(BR) = 5 A Forward voltage IF = 50 mA
1For
Unit
2011-07-18
BAR64...
Electrical Characteristics at T A = 25C, unless otherwise specified Parameter AC Characteristics Diode capacitance VR = 20 V, f = 1 MHz VR = 0 V, f = 100 MHz VR = 0 V, f = 1...1.8 GHz, BAR64-02LRH VR = 0 V, f = 1...1.8 GHz, all other Reverse parallel resistance VR = 0 V, f = 100 MHz VR = 0 V, f = 1 GHz VR = 0 V, f = 1.8 GHz Forward resistance IF = 1 mA, f = 100 MHz IF = 10 mA, f = 100 MHz IF = 100 mA, f = 100 MHz Charge carrier life time IF = 10 mA, IR = 6 mA, measured at IR = 3 mA, RL = 100 I-region width Insertion loss1) IF = 3 mA, f = 1.8 GHz IF = 5 mA, f = 1.8 GHz IF = 10 mA, f = 1.8 GHz Isolation1) VR = 0 V, f = 0.9 GHz VR = 0 V, f = 1.8 GHz VR = 0 V, f = 2.45 GHz VR = 0 V, f = 5.6 GHz
1BAR64-02LRH
Symbol min. CT RP rf rr
Unit
20 2.8 1.35 ns
WI IL
m dB
ISO -
in series configuration, Z = 50
2011-07-18
BAR64...
Diode capacitance CT = (VR) f = Parameter
0.7
pF
10 3
CT
Rp
1 MHz 100 MHz 1 GHz 1.8 GHz
V
0.5
10 2
0.4
10 1
0.3 10 0 0.2
0.1 0
10
12
14
16
20
10 -1 0
10
15
20
25
30
40
VR
VR
10 2
RF
10 -2
10 1
IF
10 -3
10 -4 10 0 10 -5
-40 C 25 C 85 C 125 C
10 -1 -2 10
10
-1
10
10
mA 10
10 -6 0
0.2
0.4
0.6
0.8
1.2
IF
VF
2011-07-18
BAR64...
Intermodulation intercept point IP3 = (IF ); f = Parameter
10 2
100 90 80 70 60 50 40 30 20 10
10
10
-1
10
mA
10
0 0
30
60
90
120
165
IF
TS
100 90 80
100 90 80
IF
IF
TS
TS
2011-07-18
BAR64...
Forward current IF = (TS ) BAR64-04W, BAR64-05W, BAR64-06W
120
mA
100 90 80
IF
TS
K/W
RthJS
10 1
IFmax/IFDC
10 1
10
10 -1 -6 10
10
-4
10
-3
10
-2
10
10 0 -6 10
10
-5
10
-4
10
-3
10
-2
10
tp
tp
2011-07-18
BAR64...
Permissible Puls Load RthJS = (t p) BAR64-02V
10
K/W
3
IFmax / IFDC
10 2
10 1
10 1
10 0
RthJS
10 -1 -6 10
10
-5
10
-4
10
-3
10
-2
10
10 0 -6 10
10
-5
10
-4
10
-3
10
-2
10
-1
10
tp
tp
10 2
IFmax/IFDC
10 1
10 0
10 1
RthJS
10 -1 -6 10
10
-5
10
-4
10
-3
10
-2
10
10 0 -6 10
10
-5
10
-4
10
-3
10
-2
10
tP
tP
2011-07-18
BAR64...
Permissible Puls Load RthJS = (t p) BAR64-04W, BAR64-05W, BAR64-06W
10
K/W
3
IFmax/IFDC
10 2
10 1
10 1
10 0
RthJS
10 -1 -6 10
10
-5
10
-4
10
-3
10
-2
10
10 0 -6 10
10
-5
10
-4
10
-3
10
-2
10
-1
10
tP
tP
dB
-0.1
|S21|2
|S21|2
-0.15
10 mA
-10
-0.2
5 mA
-15
-25 -0.35
0V 1V 10 V
1.5 2.5 3.5 4.5
GHz
-0.4 0
GHz
-30 0.5
6.5
2011-07-18
Package SC79
BAR64...
2011-07-18
BAR64...
Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 1) ) CES-Code
Month 2 0 03
01 02 03 04 05 06 07 08 09 10 11 12 a b c d e f g h j k l n
2 0 04
p q r s t u v x y z 2 3
2005
A B C D E F G H J K L N
2006
P Q R S T U V X Y Z 4 5
2 0 07
a b c d e f g h j k l n
2008
p q r s t u v x y z 2 3
2009
A B C D E F G H J K L N
2010
P Q R S T U V X Y Z 4 5
2011
a b c d e f g h j k l n
2012
p q r s t u v x y z 2 3
2 0 13
A B C D E F G H J K L N
2014
P Q R S T U V X Y Z 4 5
.
10
2011-07-18
Package SOD323
BAR64...
11
2011-07-18
Package SOT143
BAR64...
Package Outline
0.15 MIN.
2.4 0.15
10 MAX.
10 MAX.
0.08...0.1
0...8 0.2 M A
Foot Print
0.8 1.2 0.8
0.9
1.2 0.8
0.8
RF s
Pin 1
56
Standard Packing
Reel 180 mm = 3.000 Pieces/Reel Reel 330 mm = 10.000 Pieces/Reel
0.9
1.1
0.2
Pin 1
3.15
2.6 8
1.15
12
2011-07-18
Package SOT23
BAR64...
Package Outline
0.15 MIN.
2.9 0.1
3
B
2.4 0.15
10 MAX.
1)
10 MAX.
C 0.95 1.9
0.08...0.1
0...8
0.25 M B C
0.2
Foot Print
0.8
0.9
0.8
1.2
EH s
Pin 1
0.9
1.3
Standard Packing
Reel 180 mm = 3.000 Pieces/Reel Reel 330 mm = 10.000 Pieces/Reel
4 0.9
2.13 2.65
0.2
Pin 1
3.15
1.15
13
2011-07-18
Package SOT323
BAR64...
Package Outline
2 0.2 0.3 +0.1 -0.05 3
1.25 0.1 2.1 0.1
1 0.65 0.65
0.1 MIN.
Foot Print
0.6
0.8
0.65 0.65
1.6
Pin 1
Standard Packing
Reel 180 mm = 3.000 Pieces/Reel Reel 330 mm = 10.000 Pieces/Reel
4 0.2
Pin 1
2.15
2.3
1.1
14
2011-07-18
Package TSLP-2-7
BAR64...
Package Outline
Top view
0.39 +0.01 -0.03 0.05 MAX.
0.65 0.05
Bottom view
0.6 0.05
2
2 1
Cathode marking
0.5 0.035 1)
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.35
0.45
0.3 0.925
0.6
Copper
Solder mask
0.35
Stencil apertures
Standard Packing
Reel 180 mm = 15.000 Pieces/Reel Reel 330 mm = 50.000 Pieces/Reel (optional)
4
1.16
0.5
Cathode marking
0.76
0.25 0.035 1)
10.05
15
2011-07-18
BAR64...
Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany
2009 Infineon Technologies AG All Rights Reserved.
Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party.
Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>).
Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
16
2011-07-18