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The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications The IC06 74HC/HCT/HCU/HCMOS Logic Package Information The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines
Philips Semiconductors
Product specication
74HC/HCT123
where: tW = pulse width in ns; REXT = external resistor in k; CEXT = external capacitor in pF. Schmitt-trigger action in the nA and nB inputs, makes the circuit highly tolerant to slower input rise and fall times. The 123 is identical to the 423 but can be triggered via the reset input.
TYPICAL SYMBOL tPHL/ tPLH PARAMETER propagation delay nA, nB to nQ, nQ nRD to nQ, nQ CI CPD input capacitance power dissipation capacitance per monostable notes 1 and 2 CONDITIONS HC CL = 15 pF; VCC = 5 V; REXT = 5 k; CEXT = 0 pF 26 20 3.5 54 HCT 26 23 3.5 56 ns ns pF pF UNIT
Notes 1. CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD VCC2 fi + (CL VCC2 fo) + 0.75 CEXT VCC2 fo + D 16 VCC where: fi = input frequency in MHz fo = output frequency in MHz D = duty factor in % CL = output load capacitance in pF VCC = supply voltage in V CEXT = timing capacitance in pF (CL VCC2 fo) sum of outputs 2. For HC the condition is VI = GND to VCC For HCT the condition is VI = GND to VCC 1.5 V
Philips Semiconductors
Product specication
74HC/HCT123
plastic shrink small outline package; 16 leads; body width 5.3 mm plastic thin shrink small outline package; 16 leads; body width 4.4 mm
PIN DESCRIPTION PIN NO. 1, 9 2, 10 3, 11 4, 12 7 8 13, 5 14, 6 15 16 1A, 2A 1B, 2B 1RD, 2RD 1Q, 2Q 2REXT/CEXT GND 1Q, 2Q 1CEXT, 2CEXT 1REXT/CEXT VCC SYMBOL NAME AND FUNCTION trigger inputs (negative-edge triggered) trigger inputs (positive-edge triggered) direct reset LOW and trigger action at positive edge outputs (active LOW) external resistor/capacitor connection ground (0 V) outputs (active HIGH) external capacitor connection external resistor/capacitor connection positive supply voltage
1998 Jul 08
Philips Semiconductors
Product specication
74HC/HCT123
= HIGH voltage level = LOW voltage level = dont care = LOW-to-HIGH transition = HIGH-to-LOW transition = one HIGH level output pulse = one LOW level output pulse
(1) For minimum noise generation, it is recommended to ground pins 6 (2CEXT) and 14 (1CEXT) externally to pin 8 (GND).
1998 Jul 08
Philips Semiconductors
Product specication
74HC/HCT123
DC CHARACTERISTICS FOR 74HC For the DC characteristics see 74HC/HCT/HCU/HCMOS Logic Family Specifications. Output capability: standard (except for nREXT/CEXT) ICC category: MSI
1998 Jul 08
Philips Semiconductors
Product specication
74HC/HCT123
min. typ. max. min. max. tPLH propagation delay nRD, nA, nB to nQ propagation delay nRD, nA, nB to nQ propagation delay nRD to nQ (reset) propagation delay nRD to nQ (reset) output transition time trigger pulse width nA = LOW trigger pulse width nB = HIGH reset pulse width nRD = LOW output pulse width nQ = HIGH nQ = LOW output pulse width nQ = HIGH nQ = LOW retrigger time nA, nB external timing resistor external timing capacitor 10 2 100 20 17 100 20 17 100 20 17 83 30 24 83 30 24 66 24 19 66 24 19 19 7 6 8 3 2 17 6 5 14 5 4 450 255 51 43 255 51 43 215 43 37 215 43 37 75 15 13 125 25 21 125 25 21 125 25 21 320 64 54 320 64 54 270 54 46 270 54 46 95 19 16
CEXT = 0 pF; REXT = 5 k CEXT = 0 pF; REXT = 5 k CEXT = 0 pF; REXT = 5 k CEXT = 0 pF; REXT = 5 k
tPLH
ns
tPHL
ns
tPLH
ns
tTHL / tTLH
ns
tW
ns
Fig.7
tW
ns
Fig.7
tW
ns
Fig.8 CEXT = 100 nF; REXT = 10 k; Figs 7 and 8 CEXT = 0 pF; REXT = 5 k; note 1; Figs 7 and 8 CEXT = 0 pF; REXT = 5 k; note 2; Fig.7 Fig.9 Fig.9; note 3
tW
tW
75
ns
5.0
110
ns
k pF
1998 Jul 08
Philips Semiconductors
Product specication
74HC/HCT123
The value of additional quiescent supply current (ICC) for a unit load of 1 is given in the family specifications. To determine ICC per input, multiply this value by the unit load coefficient shown in the table below.
1998 Jul 08
Philips Semiconductors
Product specication
74HC/HCT123
TEST CONDITIONS UNIT V CC (V) WAVEFORMS/ NOTES CEXT = 0 pF; REXT = 5 k CEXT = 0 pF; REXT = 5 k CEXT = 0 pF; REXT = 5 k CEXT = 0 pF; REXT = 5 k
min. typ. max. min. max. min. tPHL tPLH tPHL tPLH tTHL / tTLH tW tW tW tW propagation delay nRD, nA, nB to nQ propagation delay nRD, nA, nB to nQ propagation delay nRD to nQ (reset) propagation delay nRD to nQ (reset) output transition time trigger pulse width nA = LOW trigger pulse width nB = HIGH reset pulse width nRD = LOW output pulse width nQ = HIGH nQ = LOW output pulse width nQ = HIGH nQ = LOW retrigger time nA, nB external timing resistor external timing capacitor 2 20 20 20 30 28 27 23 7 3 5 7 51 51 46 46 15 25 25 25 64 64 58 58 19
Fig.7 Fig.7 Fig.8 CEXT = 100 nF; REXT = 10 k; Figs 7 and 8 CEXT = 0 pF; REXT = 5 k; note 1; Figs 7 and 8 CEXT = 0 pF; REXT = 5 k; note 2; Fig.7 Fig.9
450
5.0
tW
75
ns
5.0
110
1000 no limits
ns k
5.0 5.0
pF
5.0
Fig.9; note 3
1998 Jul 08
Philips Semiconductors
Product specication
74HC/HCT123
The inherent test jig and pin capacitance at pins 15 and 7 (nREXT / CEXT) is approximately 7 pF. 2. The time to retrigger the monostable multivibrator depends on the values of REXT and CEXT. The output pulse width will only be extended when the time between the active-going edges of the trigger input pulses meets the minimum retrigger time. If CEXT > 10 pF, the next formula (at VCC = 5.0 V) for the set-up time of a retrigger pulse is valid: trt = 30 + 0.19 REXT CEXT0.9 + 13 REXT1.05 (typ.) where: trt = retrigger time in ns; CEXT = external capacitor in pF; REXT = external resistor in k.
The inherent test jig and pin capacitance at pins 15 and 7 (nREXT / CEXT) is 7 pF. 3. When the device is powered-up, initiate the device via a reset pulse, when CEXT < 50 pF.
1998 Jul 08
Philips Semiconductors
Product specication
74HC/HCT123
Fig.7
Fig.8
Fig.9
Typical output pulse width as a function of the external capacitor values at VCC = 5.0 V and Tamb = 25 C.
1998 Jul 08
10
Philips Semiconductors
Product specication
74HC/HCT123
Power-down considerations A large capacitor (CX) may cause problems when powering-down the monostable due to the energy stored in this capacitor. When a system containing this device is powered-down or a rapid decrease of VCC to zero occurs, the monostable may substain damage, due to the capacitor discharging through the input protection diodes. To avoid this possibility, use a damping diode (DX) preferably a germanium or Schottky type diode able to withstand large current surges and connect as shown in Fig.12
1998 Jul 08
11
Philips Semiconductors
Product specication
74HC/HCT123
SOT38-1
D seating plane
ME
A2
A1
c Z e b1 b 16 9 MH w M (e 1)
pin 1 index E
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION
1998 Jul 08
12
Philips Semiconductors
Product specication
74HC/HCT123
SOT109-1
A X
c y HE v M A
Z 16 9
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
8 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION
1998 Jul 08
13
Philips Semiconductors
Product specication
74HC/HCT123
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
A X
c y HE v M A
Z 16 9
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT338-1 REFERENCES IEC JEDEC MO-150AC EIAJ EUROPEAN PROJECTION A max. 2.0 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 6.4 6.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 1.00 0.55 8 0o
o
1998 Jul 08
14
Philips Semiconductors
Product specication
74HC/HCT123
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
c y HE v M A
16
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
8
w M detail X
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.10 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.40 0.06 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC MO-153 EIAJ EUROPEAN PROJECTION ISSUE DATE 94-07-12 95-04-04
1998 Jul 08
15
Philips Semiconductors
Product specication
74HC/HCT123
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering can be used for all SO packages. Wave soldering is not recommended for SSOP and TSSOP packages, because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering is used - and cannot be avoided for SSOP and TSSOP packages - the following conditions must be observed: A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Even with these conditions: Only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). Do not consider wave soldering TSSOP packages with 48 leads or more, that is TSSOP48 (SOT362-1) and TSSOP56 (SOT364-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
1998 Jul 08
16
Philips Semiconductors
Product specication
74HC/HCT123
Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. DEFINITIONS Data sheet status Objective specication Preliminary specication Product specication Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.
1998 Jul 08
17
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