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Lieferprogramm product range

B A LV E R Z I N N C O BA R

Der Erfolg ist Ansporn fr die Zukunft The success is motivation for the future

Gregor Jost

Josef Jost

Neue Wege gehen unter diesem Motto beschreiben wir, Josef und Gregor Jost, den Relaunch der Marken Balver Zinn und Cobar. Ob in der Oberflchenbeschichtung oder der Elektronik, der Lot- und Anodenspezialist Balver Zinn sorgt schon seit ber einem Jahrzehnt mit aufmerksamkeitsstarker Werbung und ffentlichkeitsarbeit dafr, dass Produkte und Services des Unternehmens zielgerichtet ins rechte Licht gerckt werden. Wir haben mit starken Themen, Anzeigen, Prospekten und Messestnden auf uns aufmerksam gemacht. Das nackte Produkt wurde nicht technisch, sondern mit Emotionen aufgeladen. Dies hat fr ein gutes Feedback im Markt gesorgt. Der Zukauf der Firma Cobar, die ein eigenes Erscheinungsbild und einen eigenen Auftritt im Markt hatte, wurde zum Anlass genommen, das Markenbild einem zeitgemen Relaunch zu unterziehen. Balver Zinn und Cobar werden als eigenstndige Unternehmen weitergefhrt, jedoch sollen fr den Nutzer der Produkte und beim Auftritt der beiden Marken klar zu erkennen sein, dass diese Unternehmen zusammengehren. Herzlichst Ihr Josef und Gregor Jost

The motto of forging new paths is for Josef and Gregor Jost a good description of the relaunch of the Balver Zinn and Cobar brands. Whether in surface refinement or electronics, for over a decade the solder and anode specialist Balver Zinn has been pursuing a strategy with high-visibility advertising and PR, to make sure their products and services are presented with the proper perspective. Drawing attention with fascinating themes, eyecatching ads, brochures and exhibition stands. The bare product was charged up not with technical aspects, but rather with emotions. Feedback in the market has been very positive. The acquisition of Cobar, a company with an image and a presence of its own in the market, was used as an opportunity to enhance the brand with an up-to-the-minute relaunch. Although Balver Zinn and Cobar remain independent companies, we want to make it clear to the users of our products through the joint presentation of our brands that our two companies now belong together. With kind regards Josef und Gregor Jost

Standorte locations

Geschichte history

Balve-Garbeck Jost Zinkgieerei Balver Zinn II BaTiLoy

Germany Jost zinc foundry Balver Zinn II BaTiLoy

Die Balver Zinn Josef Jost GmbH & Co. KG mit Sitz im sauerlndischen Balve ist einer der fhrenden Hersteller von Loten und hochwertigen Anoden der unterschiedlichsten Legierungen sowie von Spezialdrhten fr die Elektronikindustrie und Oberflchenveredelung. Insbesondere bleifreie Produkte fr die Elektronikindustrie gehren zu den Kernkompetenzen des Unternehmens. Schon seit Ende des 19. Jahrhunderts ist das Familienunternehmen in der Metallbranche ttig. 1976 erfolgte die Eintragung ins Handelsregister. Die Firma wird heute in dritter Generation von Josef und Gregor Jost geleitet. Die Geschftsttigkeit des ber 100 Mitarbeiter starken Unternehmens umfasst den weltweiten Vertrieb einer umfangreichen Produktpalette. The head office of Balver Zinn Josef Jost GmbH & Co. KG is situated in Balve in a region in Germany known as the Sauerland. The company is a leading manufacturer of solders, high-quality anodes, alloys and wires for the electronics industry and surface refinement applications. Lead free products for the electronics industry are one of the core competencies of the company. The family owned and operated company became active in the metal and metalworking industry in the late 19th century. In 1976, the company was entered into the Commercial Registry. Today, third-generation family members, Josef and Gregor Jost, manage the company, which employs more than 100 staff globally, including global sales and distribution.

1976 Bau einer Produktionshalle und eines Brogebudes in Balve Construction of a production hall and an office building in Balve 19861987 Bau der Produktionshalle Zinkgiesserei und der Verwaltung in Balve-Garbeck Construction of the production hall Zinkgiesserei and the administration in Balve-Garbeck 2000 Erstes Zertifiziertes Umweltmanagementsystem nach DIN 14001 First certified environmental management system to DIN 14001 2007 Fusion Balver Zinn / Cobar Merge Balver Zinn / Cobar

Balve Jost Zinn Recycling Lotpaste-/Flussmittelproduktion Labor F&E Abteilung

Germany Jost Zinn Recycling solder paste-/fluxproduction laboratory R&D department

Breda Cobar Europe B.V. Lotpaste-/Flussmittelproduktion Labor

Netherlands Cobar Europe B.V. solder paste-/fluxproduction laboratory

Absatz-Markt Sales Presence

Londonderry Cobar Solder Products Inc. Vertrieb

USA Sales office

Balver Zinn-Group Nihon 4 5

Unser Lieferprogramm Our product range

Lote Solder 8 25

Bleifreie Lote Bleihaltige Lote Barren Pellets Massivdrhte

Lead free solder Lead containing solder Bars Pellets Solid wires

Lsliche Anoden Zinkanoden

Soluble anodes Zinc anodes

Anoden Anodes 52 55

Lotpasten Solder paste 26 31

Bleifreie Lotpasten Bleihaltige Lotpasten Zum Drucken Zum Dispensen

Lead free solder pastes Lead containing solder pastes for Printing for Dispensing

Opferanoden Sacrifical anoders 56 57

Lotdrhte Solder wire 32 41

Bleifreie Lotdrhte Bleihalitge Lotdrhte Verschiedene Flussmittel

Lead free solder wire Lead containing solder wire Different flux types

Reinungsmittel Masken Entltlitzen

Cleaner Solder masks Desoldering braid

SSP

58 59

Flussmittel Flux 42 51
6

VOC VOC-free Low VOC

VOC VOC-free Low VOC

Schulungen/ Sonstiges Training/ miscellaneous 60 63


7

Lote Solder

Application

Lead free process

Leaded process

Sn96C High Reliability Automotive applications SN100C SN100CS SCAN-Ge (SnCu0.7NiGe) Moderate Reliability Industrial applications high rel. alloy low price less copper dessolution SCA (SnCu0.7Ag0.3) refill for wave soldering commodity for industrial apps. (SnCuAgNiGe) SN97C (SnAg3.0Cu0.5) commodity for industrial apps. high rel. alloy low price less copper dessolution The Standard leaded alloy (SnAg3.8Cu0.7) Commodity for industrial apps.

i-SAC Family
(SnAgCuCoGe) Sn63Pb37

Standard Reliability Consumer electronics

proposal

advantage favourable price low dross formation no silver content shiny solder joints reliability combination of SN100C and SAC - alloys with different silver contents low dross formation shiny solder joints reliability melting range 217- 219C very known solder

disadvantage

Wave and selective soldering

SN100C

melting temperature 227C

Wave and selective soldering if silver is needed

SCAN-Ge

price at high silver contents

Wave and selective soldering if silver is needed

SN97C

price dull solder joints ductility shrinkage hole

high temperature applications

i-SAC-series

melting range 217- 219C shiny solder joints fine grained microstructure

price

Lote solder 9

bleifreie Lote ohne Silber lead-free solder without silver

aniu m G erm l und ermanium icke mit N ickel and g ith n w

NEU

SN100C SN100CL SN100Ce SN100CLe


Legierung SnCu0,7NiGe0,0055 Schmelzpunkt 227C Dichte 7,4 g/cm3 weltweit bekannt und eingesetzt gnstiger Preis geringe Krtzebildung glnzende Ltstelle Zuverlssigkeit Duktilitt alloy SnCu0.7NiGe0.0055 melting temperature 227C density 7.4 g/cm3 very known alloy low price low dross formation shiny solder joints reliability ductility

SN100CS SN100CLS SN100CeS SN100CLeS


Legierung SnCu0,7NiGe0,010 Schmelzpunkt 227C Dichte 7,4 g/cm3 noch weniger Krtze bessere Benetzung besseres Flieverhalten geringere Oberflchenspannung Zuverlssigkeit Duktilitt alloy SnCu0.7NiGe0.010 melting temperature 227C density 7.4 g/cm3 very known alloy low price low dross formation shiny solder joints reliability ductility

> Bleifreie HAL Oberflche mit SN100CL lead free HASL finish SN100CL (Bildquelle/ Source: Hubert Brautmeier)

> glnzende Ltstelle, vergleichbar mit SnPb shiny solder joints; like SnPb

10

Lote solder 11

bleifreie Lote mit Silber lead-free solder with silver

bleifreie Lote mit und ohne Silber lead-free solder with and without silver

SN97C
Legierung SnAg3,0Cu0,5 Schmelzbereich 217- 219C Dichte 7,5 g/m3 bekante Legierung von IPC untersucht Schmelztemperatur alloy SnAg3.0Cu0.5 melting temperature 217- 219C density 7.5 g/m3 very known alloy investigated by IPC melting range

SCA (SnCu0.7Ag0.3)
Legierung SnAg0,3Cu0,7 Schmelzbereich 219- 227C Dichte 7,3 g/cm3 preisgnstig alloy SnAg0.3Cu0.7 melting temperature 219- 227C density 7.3 g/cm3 low price

SN96C
Legierung SnAg3,8Cu0,7 Schmelzpunkt 217C Dichte 7,5 g/m3 Eutektikum Schmelztemperatur alloy SnAg3.8Cu0.7 melting temperature 217C density 7.5 g/m3 eutectic melting temperature

Sonderlegierungen nach Kundenvorgaben


Sonderlegierungen auf Anfage Sprechen Sie uns an!

Special alloys according to customers specifications


Specials on clients request Contact us!

SN97C SnAg3.0Cu0.5 melting range C density g/cm3 217- 219 7.5

SN97Ce SnAg3.0 221 7.5

SN96C SnAg3.8Cu0.7 217 7.5

SN96Ce SnAg3.8 221 7.5

Sn63Pb37 183 8.4

SCA0307 SnCu0.7Ag0.3 melting range C density g/cm3 conductivity m 217 - 227 7.37 13

SnPb37 183 8.4 14.5

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Lote solder 13

bleifreie Lote silberhaltige, mikrolegiert lead-free solder silver-containing, micro-alloyed

bleifreie Lote silberhaltig, mikrolegiert lead-free solder silver-contaning, micro-alloyed

i-SAC105 i-SAC205 i-SAC305 i-SAC387


Mit Kobalt (Co) und Germanium (Ge) dotierte Zinn-Silber-KupferLote! glnzende Ltstellen feineres Gefge weniger Krtzebildung verbesserte Benetzungseigenschaften hhere mechanische Eigenschaften Micro-alloyed with Cobald (Co) and Germanium (Ge)! shiny solder joints fine grained microstructure low dross formation better wetting properties mechanical properties

SCAN-Ge 0703 SCAN-Ge 0708 SCAN-Ge 074 SCAN-Ge 002


Mit Nickel (Ni) und Germanium (Ge) dotierte Zinn-Kupfer-Silber-Lote! glnzende Ltstellen feineres Gefge (als SnAg-Lote) weniger Krtzebildung verbesserte Benetzungseigenschaften Micro-alloyed with Nickel (Ni) and Germanium (Ge)! shiny solder joints fine grained microstructure low dross formation better wetting properties

iu m r man nd Ge anium u er m o b al t mit K obalt and g c with

NEU

i-SAC387

um mani d G er el un germanium ick mit N ickel and ith n w

NEU

SnAg3.0Cu0.5 14 15

Lote solder

bleihaltige Lote die Klassiker leaded solder the classics

SnPb
Legierungen SnPb; PbSn; SnPbAg; SnPbCu etc. alloy SnPb; PbSn; SnPbAg; SnPbCu etc.

Alloy name SCAN-Ge 0703 SCAN-Ge 0705 SCAN-Ge 0708 SCAN-Ge 071 SCAN-Ge 072 SCAN-Ge 073 SCAN-Ge 074 SCAN-Ge 053 SCAN-Ge 0003 SCAN-Ge 0005 SCAN-Ge 0008 SCAN-Ge 001 SCAN-Ge 002 SCAN-Ge 003 SCAN-Ge 004

Typical alloy composition SnCu0.7Ag0.3NiGe SnCu0.7Ag0.5NiGe SnCu0.7Ag0.8NiGe SnCu0.7Ag1.0NiGe SnCu0.7Ag2.0NiGe SnCu0.7Ag3.0NiGe SnCu0.7Ag3.8NiGe SnCu0.5Ag3.0NiGe SnAg0.3NiGe SnAg0.5NiGe SnAg0.8NiGe SnAg1.0NiGe SnAg2.0NiGe SnAg3.0NiGe SnAg3.8NiGe

Sn

Cu

Ag 0.2 - 0.3 0.4 - 0.5 0.7 - 0.8

Ni

Ge

Al

As

Au

Bi

Cd

Fe

In

Pb

Sb

Zn

0.6 - 0.7

0.9 - 1.1 1.8 - 2.2 2.8 - 3.2 3.6 - 4.0 0.0400.060 0.0090.011 max. 0.002 max. 0.001

Remainder

0.2 - 0.3 0.4 - 0.5 0.7 - 0.8 max. 0.2 0.9 - 1.1 1.8 - 2.2 2.8 - 3.2 3.6 - 4.0

Lieferformen Delivery sizes

bersicht Summary
Welche Legierung ist fr welche Applikation? Which alloy for which application?

Format Ingots Ingots with hole Bar 1 kg Pellet Wire, solid on reel 1 kg 4 kg 3.7 kg 6 kg

L mm 325 300 540 570 285 300

B mm 28 50 50 48 42 30 12 x 25 1.0 - 6.0

H mm 15 40 20 35 12 15

Application High reliability Automotive applications Medium reliability Industrial applications Standard reliability Consumer Electronics SN100C Sn99.3Cu0.7NiGe high rel alloy low prices low copper dissolution

Lead-free process
Sn96.5Ag3.8Cu0.7

Leaded Process SN96C

SCA SCAN-Ge SnCuAgNiGe SnCu0.7Ag0.3 refill for wave soldering commodity for (stabilizes Cu content) industrial apps

commodity for industrial apps.


Sn96.5Ag3Cu0.5

i-SAC

Sn63Pb37 (standard)

SN97C

commodity for industrial apps.

weitere Lieferformen auf Anfrage

other forms of delivery on request

16

max. 0.001 17

max. 0.03

max. 0.03

max. 0.03

max. 0.03

max. 0.05

max. 0.05

0.4 - 0.6

2.8 - 3.2

max.0.02

Lote solder

Auswahlhilfe zu den Ltmittel Application guideline

Schmelztemperaturen von Standardloten Melting temperatures of standard alloys

Reflow SAC3-XM3S CuAg-XM3S S9M-XM3S SN100C-XF3+ SAC3-XF3+ SN96C PF32-FMQ

Selective

Dipping

Alloy name 385-D 390-RX-HT 323-ITM 396-DRX 396-DRX-M 396-QMX 2420 NC 94-QMB 95-RXZ-M 95-DRX-M SN100C SN100CS SCA SN97C SN96C SCAN-Ge i-SAC LF 2220 NC LF 3135 NC Brilliant 211 395-90 395-99 SN100C SN100CS SCA SN97C SN96C SCAN-Ge i-SAC Bi58Sn42 Sn63Pb37 SN96C SN100C; SN100CS SnCu1 SCAN-Ge 053 5 5 4 5 5 5 5 5 5 5 5 4 4 5 5 5 5 3 5 4 5 5 5 5 5 5 5 4 5 3 4 4 5 5 3 5 5 2 2 2 1 3 4 3 5 4 4 4 4 5 5 3 5 5 2 2 2 1 3 4 3 4 5 3 4 4 5 5 5 5 5 4 4 5 5 3 4 4 4 4 4 5 4 4 4 5 5 3 4 4 4 4

Composition Bi58Sn42 Sn63Pb37 SnAg3.8Cu0.7 SnCu0.7NiGe SnCu1 SnCu0.5Ag3.0NiGe SnAg3.0Cu0.5CoGe SnAg3.0Cu0.5 SnAg1.0Cu0.5CoGe SnAg0.3Cu0.7 SnCu0.7Ag0.3NiGe SnCu0.7Ag1.0NiGe SnCu2NiGe SnCu3NiGe SnCu4NiGe PbSnAg2 PbAg2.0

Density 8.7 8.4 7.5 7.4 7.3 7.4 7.4 7.5 7.4 7.3 7.4 7.4 7.2 7.3 7.4 11.1 11.2

Melting temperature 139 183 217 227 227 217- 219 217- 219 217- 219 217- 227 217- 227 217- 227 217- 227 227- 250 227- 260 227- 270 296- 301 304- 305

Reflow

Selective and wave fluxes VOC VOC-Free low-VOC

Selective and wave alloys

wire fluxes

wire alloys Wave

Typical apps.

Typical process temperature Wave ~ 250 265 265 265 265 265 265 265 265 265 265 ~ ~ ~ ~ ~ Selective ~ 250- 280 290- 320 290- 320 290- 320 292- 320 294- 320 290- 320 293- 320 291- 320 290- 320 291- 320 ~ ~ ~ ~ ~ > 300 > 400 > 500 > 400 > 400 > 300 > 300 Dipping ~ > 280

2 5 5 5 3 5 5 5 5 4 5 5 1 1 1 2 2

2 5 4 5 3 4 4 4 4 3 4 4 1 1 1 3 3

3 5 3 5 3 3 3 3 4 3 4 4 5 5 5 5 5

5 5 5 4 3 5 5 5 4 4 4 4 1 1 1 2 2

Reflow Nitrogen Reflow Air Vapor Phase Wave Reflow Wave Air Selective Nitrogen Selective Air Manual soldering Automatic soldering

5 5 4 5 5 5 3 3 3 4 4 4 3 3 5 3 3 3

i-SAC 305
SN97C

i-SAC 105
SCA SCAN-Ge 0703 SCAN-Ge 071 SN100C2 SN100C3 SN100C4 PbSn5Ag2 PbAg2

Beispiel 1 Bleifreies Lot Wellen- und Selektivlten an Luft ohne Silber? Beste Empfehlung: SN100CS Example 1 Lead free and silver free alloy for wave and selective soldering on air silver? Our recommendation: SN100CS Beispiel 2 Flussmittel fr Wellen- und Selektivlten an Luft? Beste Wahl fr beide Prozesse ist das 390-RX-HT. Example 2 Flux for wave and selective soldering? The best option for both processes will be the 390-RX-HT.

Beispiel 1 Prozesstemperaturen fr Wellen- und Selektivlten fr SN100CS? Welle: 265C; Selektiv: 290- 320C Example 1 What are process temperatures for wave and selective soldering with SN100CS? Wave soldering: 265C; selective soldering: 290- 320C

5 4 3 2 1 18

Especially made for this purpose Generally qualified for this purpose Generally useable for this purpose Generally not useable for this purpose Wrong choice 19

Lote solder

Ltfehler: Ursachen und Lsungsanstze Soldering problems: causes and possible solutions

Ltperlen Solder balling

Ltbrcken Bridging

Diese Hinweise sind angefertig worden, um den Anwender beim bleifreien Ltprozess zu untersttzen. Es soll helfen, Fehler und Probleme in den Ltprozessen zu finden und Lsungen vorzuschlagen. Diese Tipps und Ratschlge sollen helfen erste Lsungsanstze zu finden und mssen nicht immer die endgltige Problemlsung darstellen. Weitere Untersttzung bekommen Sie selbstverstndlich bei Balver Zinn, unter: cia@balverzinn.com oder besuchen Sie den virtual helpdesk unter www.cobar.com/pastemaster.asp

This user guide has been made to support the lead free soldering process. It is to help to find errors and problems during the soldering processes and suggest solutions. These are the first steps to find solutions for soldering problems. Further information and technical support can be found at Balver Zinn, please contact us: cia@balverzinn.com or visit the cobar virtual helpdesk at www.cobar.com/pastemaster.asp

Mgliche Ursachen Vorheiztemperatur; Prozesstemperatur; Flussmittelauftrag; Flussmittelaktivierung; Ltstopplack Abhilfe Vorheiztemperaturen berprfen; Flussmittelalternativen testen; Aushrtung Ltstopplack berprfen; Flussmittelmenge anpassen; Restsauerstoffgehalt bei Volltunnelanlagen berprfen Causes Solder balls stick to solder mask; too high temperatures; lack of flux activity Actions Review solder resist; use flux with better thermal stability and activity; reduce process temperatures

Mgliche Ursachen Design, Vorheiztemperatur; Lotbadtemperatur; Transportwinkel Flussmittelauftrag; Lnge Anschlussbeinchen usw. Abhilfe Vorheiztemperaturen berprfen; Lotbadtemperatur berprfen; Flussmittelauftrag berprfen; ggf. anderes Flussmittel testen: verschiedene Ltrichtungen testen; wenn mglich andere Dsenform testen; krzere Anschlussbeinchen verwenden. Causes Design, preheating temperature; solder bath temperature; transport angle; fluxing agent; pin lengthens etc. Actions check preheat and solderpot temperature; flux properties; check different wave former or settings; reduce lead length of components

Ltspinnen webbing

Mgliche Ursachen Einstellwerte Wellenhhe; Flussmittelauftrag; Ltstopplack; Oxide auf der Ltwelle Abhilfe Wellenhhe einstellen; Flussmittelauftrag berprfen; Ltstopplack berprfen Causes Solder oxides on wave; lack flux activity; solder resist Actions Check wave settings and process temperatures; verify flux amount; review solder resist

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Wicking Wicking

Ltzapfen Spikes

Popcorning Popcorning

Grabsteineffekt Tombstoning

Mgliche Ursachen Lot benetzt den Anschluss und nicht die Hlse / Durchkontaktierung Abhilfe Ltbarkeitstest durchfhren; Vorheizung und Lotbadtemperatur berprfen Causes Solder wicks against the leads of component due to oxidation or temperatures Actions Poor solderability of the barrel / pad; check preheat and solder pot temperature

Mgliche Ursachen Flussmittelaktivierung; Vorheizung; Transportgeschwindigkeit Abhilfe anderes Flussmittel testen; Flussmittelauftrag berprfen; Vorheizung berprfen; Transportgeschwindigkeit anpassen Causes Lack of flux activity; leads are too long; conveyor speed Actions Check flux activity; temperature setiings; reduce lead-length; review conveyor speed and wave settings

Mgliche Ursachen Feuchtigkeit im Bauteil Abhilfe Ltprofile anpassen; Temperaturgradienten reduzieren; Bauteile tempern Causes Components absorb moisture that evaporates during the reflow process Actions Slow down heating profile; decrease heating gradient; Review MSL for component

Mgliche Ursachen Bestckversatz; Ungenaue Temperaturfhrung im Ofen; Paddesign; Lotpastendepot ungleichmig; Falsche Lotpastenauswahl Abhilfe Bestckversatz optimieren; Ofen kontrollieren; Paddesign anpassen; Lotpastendepot berprfen; Lotpastenalternative whlen Causes Placement failure; improper heating oven; pad design; uneven paste deposit; incorrect solder paste Actions Optimize pick and placement conditions; check oven and improve the heating profile; review the pad design; select dedicated solder paste

Schlechter Durchstieg Poor hole filling

Brcken SMD bridging

Mgliche Ursachen Oxidation; Temperaturfhrung; Lackreste auf Pad Abhilfe Ltbarkeitstests; Strkeres Flussmittel; Vorheizung berprfen Causes Poor wetting; oxidation of surfaces; lack of board temperature Actions Check solderability of the PCB surface; stronger flux; measure preheat temperature topside board; check solder pot temperature

Mgliche Ursachen Hot slump; unsauberer Druck; Bestckversatz; Design; unsaubere Schablone; defekte Schablone Abhilfe Umgebungsbedingungen prfen; Druckeinstellungen prfen; Schablone prfen Causes hot slump; misprints; placement failure; design; dirty or damaged stencil Solution check ambient condition; check printer setup; check stencil

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23

Lotperlen Solder beading

Graping Graping

Ltperlen Solder balling

Voiding Voiding

Mgliche Ursachen Bestckversatz; Bestckdruck zu hoch; Bestcktiefe; Schablonendesign; Temperaturgradient zu hoch Abhilfe Bestckter optimieren; Ofen kontrollieren; Schablonendesign anpassen; Reflowprofil optimieren Causes placement failure; pick and place setup; stencil design; temperature gradient Actions check the pick and place; check the oven; change the stencil design; check reflow profile

Mgliche Ursachen Oxidation; geringe Pastendepots; lange Soakzeiten; hohe Soaktemperaturen Abhilfe Einsatz von Stickstoff; greres Lotpastenvolumen; Soakzeiten verkrzen; Soaktemperature senken Causes Oxidation of the solder sphere metal due to a lack of active flux; powder contamination Actions implementation of nitrogen; increase the solder paste volume (size / thickness); change reflow profile (less soaktemperature and soaktime)

Mgliche Ursachen Design; Schablone; Bestckdruck; Reflowprofil; Flussmittelchemie; Ltstopplack Abhilfe Schablone und Design berprfen; Reflowprofil optimieren; Restauerstoff in Ofen optimieren Causes Design; stencil aperture; pick and placement force; reflow profile; flux chemistry; solder resist Actions Review stencil and design; optimize the reflow profile, solder resist; PPM level in nitrogen atmosphere

Mgliche Ursachen Eingeschlossene Gase beim verdunsten der Lsemittel; Oxidation Abhilfe Andere Lotpaste whlen; Reflowprofil optimieren; andere LP-finishes testen Causes Evaporation of chemistry; powder and metallization oxides Actions Select board and components that are less oxidized; improve the heating profile; select dedicated solder paste

Entnetzung Dewetting

Mgliche Ursachen Oxidation; Kontamination der Pads Abhilfe Peaktemperatur anheben; Leiterplattenqualitt; aggressivere Lotpaste Causes oxidation; contamination on pads Actions increase peak temperature; better quality of PCBs; more aggressive solder paste

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25

Lotpasten Solder paste

Application

Lead free process

Leaded process

High Reliability Automotive applications

SAC-XF3+ REL0 S9M-XF3+ REL0 SN100C-XF3+ REL0

CuAg-XM3S REL1 proven technology S62-XF3+ REL0 S6M-XF3+ all purpose paste latest technology S62-XM3S REL1 S6M-XM3S REL1 all purpose paste latest technology

Moderate Reliability Industrial application

Standard Reliability Consumer electronics

all purpose paste latest technology

proposal

advantage

disadvantage

vaporphase

S9M-XF3+ S9M-XM3S SAC3-XF3+ SAC3-XM3S CuAg-XM3S PF32-FMQ SN96C PF31-FMQ SN97C PF26-FMQ SN100C SAC3-XF3+ S9M-XF3+ SN100C-XF3+ CuAg-XM3S PF32-FMQ SN96C PF31-FMQ SN97C PF26-FMQ SN100C

large melting range anti-tombstoning

dull solder joints

nitrogen process

standard alloy

dull solder joints

air process

different alloys available good wetting properties despite REL0

melting temperature of SN100C

leaded alloys

S62-XF3+ S6M-XM3S

low melting temperatures very known technology

leaded

low temperature

LRA5 Bi57 Bi58-XM5S

melting temperature 139C

refractory

26

Lotpasten solder paste 27

bleifreie Legierungen
SAC3 CuAg S9M SN100C SN96C SAC4 Bi57 SnAg3,0Cu0,5 SnAg4,0Cu0,5 SnAg3,75Cu0,25 SnCu0,7NiGe SnAg3,8Cu0,7 SnAg4,0Cu0,5 Bi57Sn43

Lead-free alloys
SAC3 CuAg S9M SN100C SN96C SAC4 Bi57 SnAg3.0Cu0.5 SnAg4.0Cu0.5 SnAg3.75Cu0.25 SnCu0.7NiGe SnAg3.8Cu0.7 SnAg4.0Cu0.5 Bi57Sn43

Flux

PowderTypee

Alloy

zum Drucken for print XF3+ (HF3+) XM3S / HM3S PF32-FMQ PF32-SFMQ PF26-FMQ PF26-SFMQ RMA6-FMQ WS157 LRA-5 Type 3 / Type 4 Type 3 / Type 4 Type 3 Type 4 Type 3 Type 4 Type 3 Type 3 Type 2 Diverse Diverse SN96C SN96C SN100C SN100C SnPb Diverse Bi57

bleihaltige Legierungen
S62 S6M Sn62Pb36Ag2 Sn62,5Pb36,5Ag1

Leaded alloys
S62 S6M Sn62Pb36Ag2 Sn62.5Pb36.5Ag1

Pulvertypen
Pulver Typ 2 2553 micron Pulver Typ 3 2545 micron Pulver Typ 4 2038 micron

Powder types
Powder Type 2 2553 micron Powder Type 3 2545 micron Powder Type 4 2038 micron

zum Dispensen for dispensing RMA-H1-FDQ 325-GM5 Typ 3 Type 3 Type 3 Dispenser Dispenser

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Lotpasten solder paste 29

Lieferformen Delivery packagings

Dosen 500 g Kartuschen 600 g Kartuschen 1200 g Proflow Dispenser

Jars 500 g Cartridges 600 g Cartridges 1200 g Proflow Syringes

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Lotpasten solder paste 31

Lotdrhte Solder wire

Application

Lead free process

Leaded process

High Reliability Automotive applications

Moderate Reliability Industrial applications

LF2220NC REL0 C395-90 REL0 BRILLIANT ROL0

i-SAC-series
Standard Reliability Consumer electronics SN100C SCAN-Ge

SAC-series

C395-99 REL1 LF3135NC REM1 SAC-series i-SAC-series SN100C SCAN-Ge

LF2220NC REL0 C395-90 REL0 BRILLIANT ROL0 SnPb SnPbCu

C395-99 REL1 LF3135NC REM1 SnPb SnPbCu

proposal

available alloy SnPb SnPbCu SN100C SN100CS SAC i-SAC SCAN-Ge SnPb SnPbCu SN100C SN100CS SAC i-SAC SCAN-Ge SnPb SnPbCu SN100C SN100CS SAC i-SAC SCAN-Ge

advantage

REL0 RoL0 oRL0

LF2220 NC BRILLIANT 211 C395-90

No Clean halide free clear residues (BRILLIANT)

REL1 RoL1 oRL1

C395-99

No Clean halide free

REM0/REM1 RoM0/REM1 oRM0/REM1

LF 3135 NC

No Clean

32

Lotdrhte solder wire 33

acid value:

J-STD-004; IPC-TM-650, Method 2.3.13; 06/04 A

212 mg KOH/g5%

LF 2220 NC
REL0 No Clean! Fr Rework / Nachlten Keine Halogenide! Standard Flussmittelgehalt 2,2% glnzende Ltstellen mit SN100C geringes Spritzverhalten schnelle Ltuntersttzung klare, trockene Rckstnde

LF 2220 NC
REL0 No clean! for rework / repair halide free standard flux content 2.2% shiny solder joints with SN100C low spattering fast wetting clear and dry residues

copper mirror test:

J-STD-004; IPC-TM-650, Method 2.3.32; 06/04 D

silver chromate test: solid content, flux:

J-STD-004; IPC-TM-650, Method 2.3.33; 06/04 D

passed

J-STD-004; IPC-TM-650, Method 2.3.34; 06/04 C

n.d.

bromide and chloride test: flouride after spot test: insulation resistance: corrosion test:

J-STD-004; IPC-TM-650, Method 2.3.35; 06/04 C

n.d.

J-STD-004; IPC-TM-650, Method 2.3.35.1; 06/04 A

passed

J-STD-004; IPC-TM-650, Method 2.6.3.3; 06/04 B

1x10 E8 Ohm

J-STD-004; IPC-TM-650, Method 2.6.15; 06/04 C

passed

34

Lotdrhte solder wire 35

C 395-90
REL0 No Clean! Fr Rework / Nachlten Keine Halogenide! Synthetische Harze Standard-Flussmittelgehalt 2,2% geringe Aktivierung geringes Spritzverhalten klare, trockene Rckstnde

C 395-90
REL0 No clean! for rework / repair halide free standard flux content 2.2% shiny solder joint with SN100C low spattering fast wetting clear and dry residues

Brilliant 211
REL0 verschiedene Flussmittelgehalte Handlten / Rework Halogenidhaltig! No Clean trotz Halogeniden! glnzende Ltstellen mit SN100C mittlere Aktivierung Halogenidgehalt < 0,5% exzellente ltuntersttzende Wirkung geringes Spritzverhalten klare, trockene Rckstnde

Brilliant 211
REL0 No clean! for rework / repair halides <0.5% standard flux content 2.2% shiny solder joint with SN100C low spattering fast wetting clear and dry residues

acid value:

J-STD-004; IPC-TM-650, Method 2.3.13; 06/04 A

230.9 mg KOH/g5%

acid value:

J-STD-004; IPC-TM-650, Method 2.3.13; 06/04 A

226.1 mg KOH/g5%

copper mirror test:

J-STD-004; IPC-TM-650, Method 2.3.32; 06/04 D

copper mirror test:

J-STD-004; IPC-TM-650, Method 2.3.32; 06/04 D

silver chromate test: solid content, flux:

J-STD-004; IPC-TM-650, Method 2.3.33; 06/04 D

passed

silver chromate test: solid content, flux:

J-STD-004; IPC-TM-650, Method 2.3.33; 06/04 D

passed

J-STD-004; IPC-TM-650, Method 2.3.34; 06/04 C

n.d.

J-STD-004; IPC-TM-650, Method 2.3.34; 06/04 C

n.d.

bromide and chloride test: flouride after spot test: insulations resistance: corrosion test:

J-STD-004; IPC-TM-650, Method 2.3.35; 06/04 C

n.d.

bromide and chloride test: flouride after spot test: insulations resistance: corrosion test:

J-STD-004; IPC-TM-650, Method 2.3.35; 06/04 C

n.d.

J-STD-004; IPC-TM-650, Method 2.3.35.1; 06/04 A

passed

J-STD-004; IPC-TM-650, Method 2.3.35.1; 06/04 A

passed

J-STD-004; IPC-TM-650, Method 2.6.3.3; 06/04 B

n.d.

J-STD-004; IPC-TM-650, Method 2.6.3.3; 06/04 B

n.a.

J-STD-004; IPC-TM-650, Method 2.6.15; 06/04 C

passed

J-STD-004; IPC-TM-650, Method 2.6.15; 06/04 C

passed

36

Lotdrhte solder wire 37

C 395-99
REL1 Fr Rework / Nachlten Halogenidhaltig! No Clean trotz Halogeniden! Standard-Flussmittelgehalt 2,2% glnzende Ltstellen mit SN100C geringe Aktivierung Halogenidgehalt < 0,5% geringes Spritzverhalten klare, trockene Rckstnde

C 395-99
REL1 No clean for rework / repair halides < 0.5% standard flux content 2.2% shiny solder joint with SN100C low spattering fast wetting clear and dry residues

LF 3135 NC
REM1 fr automatisiertes Kolbenlten Handlten / Rework Halogenidhaltig! No Clean trotz Halogeniden! glnzende Ltstellen mit SN100C mittlere Aktivierung Halogenidgehalt < 0,5% exzellente ltuntersttzene Wirkung geringes Spritzverhalten klare, trockene Rckstnde

LF 3135 NC
REM1 No clean for rework / repair halides < 0.5% standard flux content 2.2% shiny solder joint with SN100C low spattering fast wetting clear and dry residues according to J-STD-004

SN100C
alloy

REL0 LF2220NC
flux

FG 2.2%
flux content

acid value:

J-STD-004; IPC-TM-650, Method 2.3.13; 06/04 A

228 mg KOH/ g5% L

acid value:

J-STD-004; IPC-TM-650, Method 2.3.13; 06/04 A

195 mg KOH/ g5% M

copper mirror test:

J-STD-004; IPC-TM-650, Method 2.3.32; 06/04 D

copper mirror test:

J-STD-004; IPC-TM-650, Method 2.3.32; 06/04 D

silver chromate test: solid content, flux:

J-STD-004; IPC-TM-650, Method 2.3.33; 06/04 D

passed

silver chromate test: solid content, flux:

J-STD-004; IPC-TM-650, Method 2.3.33; 06/04 D

not passed weight n.d. marking height outside diameter inside diameter reels (piece/carton) 0.25 / 0.4 kg 63 / 37 63 mm 63 mm 11 mm 10 piece 0.5 / 1.0 kg BZ 80 mm 76 mm 30 mm 10 piece 0.4 / 0.8 kg K80 80 mm 80 mm 16 mm 10 piece

J-STD-004; IPC-TM-650, Method 2.3.34; 06/04 C

n.d.

J-STD-004; IPC-TM-650, Method 2.3.34; 06/04 C

bromide and chloride test: flouride after spot test: insulations resistance: corrosion test:
38

J-STD-004; IPC-TM-650, Method 2.3.35; 06/04 C

detected

bromide and chloride test: flouride after spot test: insulations resistance: corrosion test:

J-STD-004; IPC-TM-650, Method 2.3.35; 06/04 C

1,00% 0,2

J-STD-004; IPC-TM-650, Method 2.3.35.1; 06/04 A

passed

J-STD-004; IPC-TM-650, Method 2.3.35.1; 06/04 A

passed > 1x10 E8 Ohm passed

J-STD-004; IPC-TM-650, Method 2.6.3.3; 06/04 B

n.d.

J-STD-004; IPC-TM-650, Method 2.6.3.3; 06/04 B

Parameter diameter in mm flux content (weight %)

Standard 0.3 / 0.5 / 0.8 / 1.0 / 1.5 / 2.0 / 2.5 / 3.0 / 3.5 2.2 39

J-STD-004; IPC-TM-650, Method 2.6.15; 06/04 C

passed

J-STD-004; IPC-TM-650, Method 2.6.15; 06/04 C

Lotdrhte solder wire

Bleifreies Handlten Lead free hand soldering

Der Ltspitzenverbrauch steigt mit der Zunahme der Lttemperatur, speziell bei Temperaturen oberhalb 400C. Ein weiterer Faktor fr den Ltspitzenverbrauch ist der Zinn-Anteil im Lot. Bleifreie Lote haben mit 95- 99 % erheblich mehr Zinn als bleihaltige, was die Korrosion ebenfalls verstrkt. The consumption of soldering irons rises with increasing the temperature, particularly at temperatures above 400C. Another factor for the consumption of soldering irons is the tin-content in solders. Lead free solders have more tin than lead containing.

Stichworte Management der Ltspitzentemperatur Management der Ltspitzenoberflche Geeignete Auswahl des Flussmittels Management der Ltkomponeten (LP-Oberflche, Bauteil-Oberflche, Lotlegierung) Ltstationen mit bestmglichen thermischen Eigenschaften whlen Ltstationen mit guten Nachregelverhalten Ltspitzenpflege Keywords Management of soldering iron temperature Management of soldering iron surface Selection of fluxes Management of PCB finishes and component finishes Select soldering stations with optimum thermal characteristics Select soldering stations with good control modes Maintenance of soldering irons

Die 5 goldenen Regeln des Handltens Ltkolben nie lnger als erforderlich bei Lttemperatur eingeschaltet lassen Keine Temperaturen oberhlab von 400C whlen (360- 380C) Mglichst milden Flussmittel verwenden (Klasse L0 nach J-STD-004) Legierungen mit mglichst geringer Ablegierrate whlen Trockene Reinigungsgerte benutzen The 5 golden rules for hand soldering Never switch longer than necessary the soldering iron at working temperature Dont select temperatures above 400C (360- 380C) Use very low activated fluxes ( class L0 according to J-STD-004) Use alloys with a low copper dissolution Use dry cleaning equipment for cleaning of soldering tip

40

Lotdrhte solder wire 41

Flussmittel Flux

Application

VoC

Low-VoC

VoC-free

High Reliability Automotive applications

390-RX-HT REL0 High rel flux Proven reliable Product 323-ITM REL1

385-D REL0

94-QMB REL0 Anti-Solderball 95-RXZ-M REL0 95 DRX-M ORM0 Very low residues Approvals 396-DRX ORL0 396-QMX REL0 All purpose flux 396-DRX-M ORM0 Anti solderball

Moderate Reliability Industrial applications

Standard Reliability Consumer electronics

Optimum performance Optimum with SN100C performance with OSP

All purpose flux Approvals Latest technologoy

All purpose Latest flux technology Tough application Strong flux

proposal

advantage

disadvantage

VoC

385-D 390-RX-HT 323-ITM

moderate preheating reliable very know technology

flash point storage restrictions alcoholic odor

VoC free

396-DRX 396-QMX 396-DRX-M 2420 NC

environmentally friendly no restriction for storage

good preheating needed corrosion risk on humidity process upgrades needed

low-VoC

94-QMB 95-RXZ-M 95 DRX-M

easier to use as VOC free good wetting for lead free

preheating needed limited in use for selective

42

Flussmittel flux 43

Wellenlten mit / ohne N2 Wave soldering with / without N2

390-RX-HT

REL0 Alkoholbasis hochzuverlssig Applikationen

REL0 alcohol based high reliability application

95-RXZ-M

REL0 LOW-VOC hochzuverlssig Applikationen

REL0 LOW-VOC high reliability application

ISO 9454-1 IPC-ANSI-J-STD-004 JIS Z 3197 No-Clean process Post-solder cleaning Selective Soldering Pb-free process - Ambient Pb-free process - N
2 2

1.2.3.A REL0 1.2.3.N_I 5 2 4 4 5 5 5 3 5 5 2 5 5 4 4 4 4 5 5 5 5 5 5 5 5 5 3


2

SG @ 20C [kg/dm3] (+/-0.5%) Solids content [% w/w] Halides (silver-chromate-test) Halides (potentiometric) Acid number [mgKOH] (+/-2.5%) Water content [% w/w] VOC-content [% w/w]*** Filmformer(s) Flashpoint COC [C] Odor Color Telcordia/Bellcore TR-NWT-000078/3 IPC/ANSI-J-STD-004 Test report(s) ISO-TS-16949 (IATF number) Certificate of Compliance SPC - data* Environmental load unit** RoHS-Compliance Certificate Users Guidelines Thinner Packaging Can (HDPE) [liter] Drum (HDPE) [liter] recommended shelf-life (weeks) storage 20[C] storage 25[C] * certain conditions apply ** see www.cobar.com/QMS fot further details *** having a vapor pressure of > 0.01 mm Hg @ 25C Industrial chemical product. Read MSDS before use.v

0.813 2.20 pass pass 15.80 5 92.00 synthetic 12.4 alcoholic colorless qualified qualified available Website auditable 6.00 available english 425-00 10 200 78 52

ISO 9454-1 IPC-ANSI-J-STD-004 JIS Z 3197 No-Clean process Post-solder cleaning Selective Soldering Pb-free process - Ambient Pb-free process - N
2 2

1.2.3.A REL0 1.2.3.N_I 5 2 2 4 5 4 5 4 5 4 3 5 5 5 5 5 4 5 5 5 4 5 5 5 5 5 3


2

SG @ 20C [kg/dm3] (+/-0.5%) Solids content [% w/w] Halides (silver-chromate-test) Halides (potentiometric) Acid number [mgKOH] (+/-2.5%) Water content [% w/w] VOC-content [% w/w]*** Filmformer(s) Flashpoint COC [C] Odor Color Telcordia/Bellcore TR-NWT-000078/3 IPC/ANSI-J-STD-004 Test report(s) ISO-TS-16949 (IATF number) Certificate of Compliance SPC - data* Environmental load unit** RoHS-Compliance Certificate Users Guidelines Thinner Packaging Can (HDPE) [liter] Drum (HDPE) [liter] recommended shelf-life (weeks) storage 20[C] storage 25[C] * certain conditions apply ** see www.cobar.com/QMS fot further details *** having a vapor pressure of > 0.01 mm Hg @ 25C Industrial chemical product. Read MSDS before use.v

0.900 1.80 pass pass 15.90 40 58.00 synthetic 19.3 mild alcoholic colorless complicant complicant Website auditable 4.20 available english 308-00 10 200 52 40

N Process - full tunnel N2 Process - wave only Consumer electronics (TV, Video) Mid-Rel electronics (SPS, PC) Hi-Rel electronics (medicin, automotive) 1-layer, Video/TV 2-layer boards Multi-layer boards OSP compatible Ni/Au compatible Ni/Pd compatible Ag compatible Sn compatible Foam fluxing Nozzle-spray fluxing Moderate preheating Short contact time with solder Reduces skipped joints Reduces solder balling Reduces bridging Promotes wicking Cosmetic cleanliness Cosmetic cleanliness N Dull/frosty joints ICCT compatible Conformal compatible 44

N Process - full tunnel N2 Process - wave only Consumer electronics (TV, Video) Mid-Rel electronics (SPS, PC) Hi-Rel electronics (medicin, automotive) 1-layer, Video/TV 2-layer boards Multi-layer boards OSP compatible Ni/Au compatible Ni/Pd compatible Ag compatible Sn compatible Foam fluxing Nozzle-spray fluxing Moderate preheating Short contact time with solder Reduces skipped joints Reduces solder balling Reduces bridging Promotes wicking Cosmetic cleanliness Cosmetic cleanliness N Dull/frosty joints ICCT compatible Conformal compatible

4 3 5 5

4 2 5 2

Flussmittel flux 45

323-ITM

REL1 Alkoholbasis Welle Selektiv Tauchenverzinnen Kabelverzinnen

REL1 alcohol based for wave soldering for selective soldering

396-DRX

oRL0 Wasserbasis Kein Schaum Kein Selektiv

oRL0 water based not foamable not for selective

ISO 9454-1 IPC-ANSI-J-STD-004 JIS Z 3197 No-Clean process Post-solder cleaning Selective Soldering Pb-free process - Ambient Pb-free process - N
2 2

1.2.2.A REL1 1.2.3.N_II 5 3 4 4 5 4 5 5 5 4 5 5 4 5 4 5 4 4 5 5 5 5 5 4 4 4 3


2

SG @ 20C [kg/dm3] (+/-0.5%) Solids content [% w/w] Halides (silver-chromate-test) Halides (potentiometric) Acid number [mgKOH] (+/-2.5%) Water content [% w/w] VOC-content [% w/w]*** Filmformer(s) Flashpoint COC [C] Odor Color Telcordia/Bellcore TR-NWT-000078/3 IPC/ANSI-J-STD-004 Test report(s) ISO-TS-16949 (IATF number) Certificate of Compliance SPC - data* environmental load unit** RoHS-Compliance Certificate Users Guidelines Thinner Packaging Can (HDPE) [liter] Drum (HDPE) [liter] recommended shelf-life (weeks) storage 20[C] storage 25[C] * certain conditions apply ** see www.cobar.com/QMS fot further details *** having a vapor pressure of > 0.01 mm Hg @ 25C Industrial chemical product. Read MSDS before use.v

0.820 2.27 pass detected 22.00 7 90.00 resin 13.0 alcoholic yellowish qualified qualified available auditable 5.90 available english 304-00 10 200 40 35

ISO 9454-1 IPC-ANSI-J-STD-004 JIS Z 3197 No-Clean process Post-solder cleaning Selective Soldering Pb-free process - Ambient Pb-free process - N
2 2

2.1.3.A ORL0 2.1.3.N_I 5 3 3 5 5 4 5 4 5 5 3 5 5 5 5 4 5 5 1 5 3 4 5 4 4 5 5


2

SG @ 20C [kg/dm3] (+/-0.5%) Solids content [% w/w] Halides (silver-chromate-test) Halides (potentiometric) Acid number [mgKOH] (+/-2.5%) Water content [% w/w] VOC-content [% w/w]*** Filmformer(s) Flashpoint COC [C] Odor Color Telcordia/Bellcore TR-NWT-000078/3 IPC/ANSI-J-STD-004 Test report(s) ISO-TS-16949 (IATF number) Certificate of Compliance SPC - data* Environmental load unit** RoHS-Compliance Certificate Users Guidelines Thinner Packaging Can (HDPE) [liter] Drum (HDPE) [liter] recommended shelf-life (weeks) storage 20[C] storage 25[C] * certain conditions apply ** see www.cobar.com/QMS fot further details *** having a vapor pressure of > 0.01 mm Hg @ 25C Industrial chemical product. Read MSDS before use.v

1.007 2.02 pass pass 21.38 94 1.00 synthetic 0.0 none colorless complicant complicant not available available auditable 1.15 available english DI-water 10 200 104 90

N Process - full tunnel N2 Process - wave only Consumer electronics (TV, Video) Mid-Rel electronics (SPS, PC) Hi-Rel electronics (medicin, automotive) 1-layer, Video/TV 2-layer boards Multi-layer boards OSP compatible Ni/Au compatible Ni/Pd compatible Ag compatible Sn compatible Foam fluxing Nozzle-spray fluxing Moderate preheating Short contact time with solder Reduces skipped joints Reduces solder balling Reduces bridging Promotes wicking Cosmetic cleanliness Cosmetic cleanliness N Dull/frosty joints ICCT compatible Conformal compatible 46

N Process - full tunnel N2 Process - wave only Consumer electronics (TV, Video) Mid-Rel electronics (SPS, PC) Hi-Rel electronics (medicin, automotive) 1-layer, Video/TV 2-layer boards Multi-layer boards OSP compatible Ni/Au compatible Ni/Pd compatible Ag compatible Sn compatible Foam fluxing Nozzle-spray fluxing Moderate preheating Short contact time with solder Reduces skipped joints Reduces solder balling Reduces bridging Promotes wicking Cosmetic cleanliness Cosmetic cleanliness N Dull/frosty joints ICCT compatible Conformal compatible

4 2 4 2

5 3 5 4

Flussmittel flux 47

Selektivlten Selective soldering

323-ITM 94-QMP 95-RX2-M

REL1 Alkoholbasis Welle Selektiv Tauchenverzinnen Kabelverzinnen

REL1 alcohol based for wave soldering for selective soldering

ISO 9454-1 IPC-ANSI-J-STD-004 JIS Z 3197 No-Clean process Post-solder cleaning Selective Soldering Pb-free process - Ambient Pb-free process - N
2 2 2

1.2.2.A REL0 1.2.3.N_II 5 3 4 4 5 4 5 5 5 4 5 5 4 5 4 5 4 5 5 5 5 5 5 4 4 4 3 4 2 4 2

SG @ 20C [kg/dm3] (+/-0.5%) Solids content [% w/w] Halides (silver-chromate-test) Halides (potentiometric) Acid number [mgKOH] (+/-2.5%) Water content [% w/w] VOC-content [% w/w]*** Filmformer(s) Flashpoint COC [C] Odor Color Telcordia/Bellcore TR-NWT-000078/3 IPC/ANSI-J-STD-004 Test report(s) ISO-TS-16949 (IATF number) Certificate of Compliance SPC - data* Environmental load unit** RoHS-Compliance Certificate Users Guidelines Thinner Packaging Can (HDPE) [liter] Drum (HDPE) [liter] recommended shelf-life (weeks) storage 20[C] storage 25[C] * certain conditions apply ** see www.cobar.com/QMS fot further details *** having a vapor pressure of > 0.01 mm Hg @ 25C Industrial chemical product. Read MSDS before use.v

0.820 2.27 pass pass 22.00 7 90.00 resin 13.0 alcoholic yellowish qualified qualified website auditable 5.90 available english 304-00 10 200 40 35

N Process - full tunnel N Process - wave only Consumer electronics (TV, Video) Mid-Rel electronics (SPS, PC) Hi-Rel electronics (medicin, automotive) 1-layer, Video/TV 2-layer boards Multi-layer boards OSP compatible Ni/Au compatible Ni/Pd compatible Ag compatible Sn compatible Foam fluxing Nozzle-spray fluxing Moderate preheating Short contact time with solder Reduces skipped joints Reduces solder balling Reduces bridging Promotes wicking Cosmetic cleanliness Cosmetic cleanliness N2 Dull/frosty joints ICCT compatible Conformal compatible 48

Flussmittel flux 49

2420 NC

oRL0 Wasserbasis Kein Schaum Kein Selektiv

oRL0 water based not for foaming not for selective soldering

specific gravity:
BZ

1.00 g/ml 0.005

ph:

10% Lsung; 25C

3-4

solid content: acid value:

J-STD-004; IPC-TM-650, Method 2.3.34

3%

J-STD-004; IPC-TM-650, Method 2.3.13; 06/04 A

26.5 mg KOH/g5%

copper mirror test:

J-STD-004; IPC-TM-650, Method 2.3.32; 06/04 D

silver chromate test:

J-STD-004; IPC-TM-650, Method 2.3.33; 06/04 D

passed

bromide and chloride:

J-STD-004; IPC-TM-650, Method 2.3.35; 06/04 C

n.d.

fluoride after spot test: insulation resistance: corrosion test:

J-STD-004; IPC-TM-650, Method 2.3.35.1; 06/04 A

n.d

J-STD-004; IPC-TM-650, Method 2.6.3.3; 06/04 B

> 1 Exp 8 Ohm

J-STD-004; IPC-TM-650, Method 2.6.15; 06/04 C

passed

50

Flussmittel flux 51

Anoden Anodes

Standard Anoden Kundenspezifische Formen

standard anodes customer specific anodes

tin / wire galvanic alloy Sn Pb delivery sizes board: 200 x 10 x 100 6000 mm billet 85 x 60 x 100 1250 mm bowl: 50 mm pellets: 25 x 12 mm alloy Pb Sn Pb Sb Pb Sb Ag Pb Sn Ag Pb Sn Sb

chrome plating delivery sizes round massive: 5 50 mm tube: di / Da13/10 55/40 mm reel: 100 6000 mm lang Profile Smooth on both sides Double-sided corrugated / ribbed One-sided corrugated / ribbed Dimensions on request

Zusammensetzung: Ausschnitt aus EN 1179:2003 Composition: extract from EN 1179:2003


Composition in % (mass share) 1 varietiesclassification color coding nominal content Pb max. Z1 white 99.995 0.003 2 Cd max. 0.003 3 Fe max. 0.002 4 Sn max. 0.001 5 Cu max. 0.001 6 Al max. 0.001 sum of the elements in the column 1-6 0.005

Lieferformen Delivery forms


standard alloy Zn 99.995 nach DIN EN 1179:2003 dimension solid sphere hemisphere pellets various boards various billets packaging

customized on request

52

Anoden anodes 53

Massivdrhte Solid wires

Lieferprogramm Spritzdrhte Product range spay wires


Zink (Zn) Babbit Diverse Durchmesser zinc (Zn) Babbit different diameter

Lieferformen Delivery sizes

Format Ingots Ingots with hole Bar 1 kg Pellet Wire, solid on reel 1 kg 4 kg 3.7 kg 6 kg

L mm 325 300 540 570 285 300

B mm 28 50 50 48 42 30 12 x 25 1.0 - 6.0

H mm 15 40 20 35 12 15

weitere Lieferformen auf Anfrage

other forms of delivery on request

54

Massivdrhte solid wires 55

Opferanoden Sacrifical anodes

NEU

In unserem Lieferprogramm finden Sie auch Opferanoden fr die vielfltigsten Anwendungen: Schiffsbau Pipelines Onshore / Offshore Verschiedene Materialien: Zink (zn) Aluminium (Al) Zink Alu (ZnAl)

In our product range can be found all different types of sacrifical anodes. Applications: naval architecture Pipelines Onshore / Offshore Different materials: zinc (Zn) aluminium (Al) zinc Alu (ZnAl)

56

opferanoden sacrifical anodes 57

SSP
SSP Balver Wipe Balver Braid Balver Flux Remover Balver Pen Solder Mask 58 59

IPC Schulungen IPC Training

Qualitativ erstklassige Produkte, hergestellt mit hochwertigen Ltmitteln durch qualifizierte Prozesse und Mitarbeiter, erleichtern Ihnen den Weg zum Erfolg. Vor allem in schlechten Zeiten! BALVER ZINN, Ihr Systempartner liefert Ihnen neben den Ltmitteln nun auch das BALVER ZINN Trainingsprogramm um Ihre Mitarbeiter durch fundiertes Fachwissen kosteneffizient einsetzten zu knnen.

High quality products, manufactured with high quality solders by qualified staff and processes, facilitate you the way to success. Especially in bad times! BALVER ZINN, your System partner provides also in addition to the solders the BALVER ZINN training programm.

Programm
Whrend des Seminars lernen die Teilnehmer den Umgang mit der IPCA-610 sowie Kriterien fr die optische Inspektion elektronischer Baugruppen kennen. Darber hinaus wird vermittelt, wie die Vorgaben der IPCA-610 in Fertigung, Qualittsstellen, Wareneingang und allen angrenzenden Bereichen angewendet werden knnen. Das ist hilfreich um kosten- und zeitsparend arbeiten und Baugruppen beurteilen zu knnen. Vermittelt werden unter anderem: Training IPC-A-610 und JSTD 001 Handhabung elektronischer Baugruppen, ESD mechanische Montage und Befestigungsteile Ltstellen Anschlsse, Ltsttzpunkte, Spannungsentlastung: Durchsteckmontage-Technologie Oberflchenmontierte Baugruppen Bauteilbeschdigungen Leiterplatten und Baugruppen Einzelverdrahtung

Program
During the seminar, participants learn how to deal with the IPC-A-610 as well as criteria for the optical inspection of electronic assemblies. In addition, you will learn how the provisions of the IPC-A-610 in production, quality jobs, goods receipt and all adjacent areas can be applied. This is useful for cost-and time-saving work and assemblies can be assessed. Mediated among others: Dealing with IPC-A-610 Handling of electronic components, ESD Mechanical assembly and mounting hardware Solder joints Connections, soldering terminals, Voltage discharge: Through hole technology Surface mount assemblies Component damage Circuit boards and assemblies Single wiring

60

Schulungen Training 61

Sonstiges Miscellaneous

KIC Vision Schauen Sie Ihrem Ltprofil auf die Finger! Online-System zur rund um die Uhr berwachung Ihrer Prozesse Automatische berwachung; Aufzeichung und Analyse der Prozesse Kombinierbar mit SlimKIC 2000 oder KIC Explorer kompakt einfache Bedienung Lieferbar mit 9 und 12 Kanlen

KIC Vision See your soldering to fingers! Online system to work round the clock - the monitoring of your processes Automatic monitoring, record and analyze the processes Combined with SlimKIC 2000 or KIC Explorer compact simple operation available with 9 or 12 channels

62

Sonstiges Miscellaneous 63

Ansprechpartner Contact person

Quality, Enviroment & Safety Manager


Johannes Thsing (Dipl.-Ing.) Tel.: +49 (0) 23 75 915 -230 Mobil: +49 (0) 160 96 93 06 01 Fax: +49 (0) 23 75 915 114 Mail: johannes.thuesing@balverzinn.com

Authorized Signatory European Sales & Support Manager


Thomas Kolossa Certifeid IPC-A-610 Trainer (CIT) Tel.: +49 (0) 23 75 915 -140 Mobil: +49 (0) 160 90 50 83 96 Fax: +49 (0) 23 75 915 114 Mail: thomas.kolossa@balverzinn.com

Research & Development Manager


Peter Fischer Tel.: +49 (0) 23 75 915 -232 Mobil: +49 (0) 170 8 68 23 47 Fax: +49 (0) 23 75 915 236 Mail: peter.fischer@balverzinn.com

Assistant European Sales & Support Manager


Bernd Schulte Tel.: +49 (0) 23 75 915 -115 Fax: +49 (0) 23 75 915 114 Mail: bernd.schulte@balverzinn.com

Marketing Manager
Melanie Schulte Tel.: +49 (0) 23 75 915 -182 Mobil: +49 (0) 170 5 65 83 82 Fax: +49 (0) 23 75 915 114 Mail: melanie.schulte@balverzinn.com

Senior Sales Manager Export


Tanja Sprenger Tel.: +49 (0) 23 75 915 -113 Fax: +49 (0) 23 75 915 114 Mail: tanja.sprenger@balverzinn.com

Sales Manager Export


Sandra Fritzsche Tel.: +49 (0) 23 75 915 -106 Fax: +49 (0) 23 75 915 114 Mail: sandra.fritzsche@balverzinn.com

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Vertrieb Inland Sales national

Technik Technic

Senior Sales Manager Connect


Melanie Brinkschulte Tel.: +49 (0) 23 75 915 -111 Fax: +49 (0) 23 75 915 114 Mail: melanie.brinkschulte@balverzinn.com

Area Sales Manager


Paolo Corviseri (Maschinenbautechniker) Certified IPC-A-610 Trainer (CIT) Certified IPC-J-STD 001 Trainer (CIT) Tel.: +49 (0) 23 75 915 -150 Mobil: +49 (0) 170 6 37 95 49 Fax: +49 (0) 23 75 915 114 Mail: paolo.corviseri@balverzinn.com

Sales Manager Connect


Margarita Grote Tel.: +49 (0) 23 75 915 -116 Fax: +49 (0) 23 75 915 114 Mail: margarita.grote@balverzinn.com

Area Sales Manager


Gerjan Diepstraten Certified IPC-A-610 Trainer (CIT) Certified IPC-J-STD 001 Trainer (CIT) Tel.: +31 (0) 76 5 44 55 66 Mobil: +31 (0) 6 51 13 12 00 Fax: +31 (0) 76 5 44 55 77 Mail: g.diepstraten@cobar.com

Senior Sales Manager Protect


Jrgen Lisowski Tel.: +49 (0) 23 75 915 -112 Fax: +49 (0) 23 75 915 114 Mail: juergen.lisowski@balverzinn.com

Area Sales Manager


Han Raetsen Certified IPC-A-610 Trainer (CIT) Tel.: +31 (0) 76 5 44 55 66 Mobil: +31 (0) 6 22 98 40 50 Fax: +31 (0) 76 5 44 55 77 Mail: h.raetsen@cobar.com

Sales Manager Protect


Sandra Grger Tel.: +49 (0) 23 75 915 -110 Fax: +49 (0) 23 75 915 114 Mail: sandra.groeger@balverzinn.com

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Technik Technic

Cobar

Area Sales Manager Benelux


Ronny Danils Tel.: +31 (0) 76 5 44 55 66 Mobil: +31 (0) 6 14 86 77 37 Fax: +31 (0) 76 5 44 55 77 Mail: ronny.daniels@balverzinn.com

Authorized Signatory Managing Director CEO Cobar Division


Stan Renals Mobil: +49 (0) 23 75 915 -0 Holland +31 (0) 76 5 44 55 66 Fax: +31 (0) 76 5 44 55 77 Mail: stan.renals@balverzinn.com

Technical Support Manager


Harry Trip Certified IPC-A-610 Specialist (CIS) Tel.: +31 (0) 76 5 44 55 66 Mobil: +31 (0) 6 55 35 62 13 Fax: +31 (0) 76 5 44 55 77 Mail: h.trip@cobar.com

Managing Director COO


Manfred Bult Tel.: +31 (0) 76 5 44 55 66 Mobil: +31 (0) 6 53 44 84 57 Fax: +31 (0) 76 5 44 55 77 Mail: m.bult@cobar.com

Sales / Export Assistant


Gitte Brent Tel.: +31 (0) 76 5 44 55 88 Fax: +31 (0) 76 5 44 55 77 Mail: g.brent@cobar.com

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Vertriebshndler Europa Distributors Europe

Finnland - Candor Finland Sweden - Candor Sweden Denmark - Candor Denmark

United Kingdom - DKL Benelux - Cobar Benelux Germany - Balver Zinn - Sub distributors

France - Dilectro - Azelis Switzerland - Metallex Spain

Italy - Cabel + Russia - Dial Electrolux - Dipaul Baltics

Poland - Ch Erbslh Polska Czech Republic & Slovakia - PBT Rosnov Slovenia & Austria - Slovenia, Croatia, Serbia: AMTest - Austria: IVS

Hungary & Romania - ATT Hungary Turkey -Selas South Africa - PEM Technologies

- Soldering Technologies - CH Erbslh Baltic - Indusolder

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NEW
Balver Zinn is also activ in the solar and photovoltaic segment

SOLAR

Balver Zinn ist jetzt auch im Segment Solar und Photovoltaik zu finden

NEU

Balver Zinn Blintroper Weg 11, D-58802 Balve Telefon: +49 (0) 23 75 - 915 0 Fax: +49 (0) 23 75 - 915 114

info@balverzinn.com www.balverzinn.com

INT RU SOL

toelle-fotostudio.de / kundn.de