A PROJECT REPORT ON

AIRCRAFT COLISSION AVOIDANCE SYSTEM

Submitted for the award of the degree of Bachelor of Engineering (Applied Electronics & Instrumentation)

SESSION: 2008-2012 Guided By: Er.Gaurav Kumar Assistant Professor Deptt. of A.E.I. JMIT, Radaur Submitted By: Shravani(1208850) Sitakshi(1208852) Urvi(1208854) JMIT, Radaur

Department of Applied Electronics & Instrumentation Engineering Seth Jai Parkash Mukand Lal Institute of Engineering & Technology, Radaur Kurukshetra University, Kurukshetra
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PREFACE This report presents the research, findings and recommendations resulting from the project AIRCRAFT COLLISION AVOIDANCE SYSTEM, developed by our team under the guidance of experienced teachers and seniors. The objective of this project is to develop an economical and practically efficient collision avoidance system which can be easily implemented in the planes and is reliable as well. This system works on the data transmission between the plane and the ground station. Along with all other communication parameters the ATC sends the warning signal in terms of data of other planes. The data send from the ATC comprises of all the parameters corresponding to the flight of other planes in the same area. This system is an under development project with greater prospects in future. The scientific parameters associated with system can be further enhanced and modified for future research.

Acknowledgement The successful completion of any task would be incomplete without accomplishing the people who made it possible and whose constant guidance and encouragement secured us the success. It provided me opportunity to me to upgrade my skills as well as sharpen my professional knowledge and understanding in an environment that was intellectually stimulating. I express my sincere gratitude to Mr. Gaurav kumar for his valuable suggestions, guidance and encouragement to allow me to go out to the practical world and explore my knowledge to the maximum. I would also like to express my sincere gratitude Mr. Rajat Kapila, HOD Applied electronics and instrumentation, JMIT Radaur (K.U) for helping me at every stage and for allowing me to avail all available amenities in the college. I am indeed indebted to him for providing me with invaluable guidance for the successful completion of the project.

ABSTRACT A collision between aircraft is one of the most sudden and catastrophic transportation accidents imaginable. These tragic events are rarely survivablehundreds of people may die as the two aircraft are destroyed. In response to this threat this project is basically a collision avoidance system implemented in the aircrafts and which works on the data obtain from ATC (Air Traffic Control). ATC is the ground station which calculates the parameters and gives details to the planes regarding their flight and the path they should be following. The transmission of data between ATC and plane follows below explained transmission basis.

Figure 1

TABLE OF CONTENTS

CHAPTER NO.

TITLE ABSTRACT LIST OF TABLE LIST OF FIGURES LIST OF SYMBOL

PAGE NO. iv xvi xviii xxvii

INTRODUCTION 1.1 History of such systems 1.2 Introduction 1.2.1 Objective of project 1.2.2 Project description 09 10 11 11

2 2.1 PCB Layout 2.1.1 Layout information 2.1.2 DC Power Supply 2.1.3 PCB Layout 2.2 PCB Modeling Process 2.2.1 PCB Etching 2.2.2 Component Mounting 2.2.3 Soldering 2.2.4 Flux 2.2.5 Process 2.3 Block Diagrams 2.3.1 Transmission Circuit 2.3.2 Reception circuit 2.4 Components used 2.4.1 Step down Transformer 2.4.2 Regulator 2.4.3 Capacitor 2.4.4 Rectifier 2.4.5 Transistor 2.4.6 Potentiometer
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12 12 12 13 14 14 15 15 16 17 18 18 19 20 20 21 21 22 23 23

2.4.7 Resistor 2.4.8 Diode 2.4.9 PIC Controller 2.4.10 Encoder 2.4.11 Transmitter 2.4.12 Receiver 2.4.13 Decoders 2.4.14 AT89S52 Controller 2.5 Compilers 2.5.1 MPLAB Compiler 2.5.2 KEIL Compiler 2.6 Working and Theory of Project 2.7 Logic involved CHAPTER 3 3.1 Conclusion 3.2 References

24 24 25 26 27 28 29 30 32 32 32 33 34

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List of Tables Table 3.1 30

List of Figures CHAPTER 1 Fig. 1 Theme Idea Fig. 2 TCAS Fig. 3 Collision avoiding system Fig. 4 Circuit diagram Fig. 5 Layout of DC Power Supply Fig. 6 PCB Layout Fig. 7 PCB Fig. 8 Transmission side circuit Fig. 9 Reception side circuit Fig. 10 Regulator Fig. 11 Capacitor Fig. 12 Bridge Rectifier Fig. 13 Potentiometer Fig. 14 Resistor Fig. 15 PIC Controller Fig. 16 Encoder Fig. 17 Transmitter Fig. 18 Receiver Fig. 19 Decoder Fig. 20 40 Lead PDIP 05 09 11 12 13 14 18 19 20 21 21 22 23 24 25 26 27 28 29 31

CHAPTER 1

1.1 HISTORY OF SUCH SYSTEM The Traffic Alert and Collision Avoidance System (TCAS) have had extraordinary success in reducing the risk of mid-air collisions. Now mandated on all large transport aircraft, TCAS has been in operation for more than a decade and has prevented several catastrophic accidents. TCAS is a unique decision support system in the sense that it has been widely deployed (on more than 25,000 aircraft worldwide) and is continuously exposed to a high-tempo, complex air traffic system. TCAS is the product of carefully balancing and integrating sensor characteristics, tracker and aircraft dynamics, maneuver coordination, operational constraints, and human factors in time-critical situations. Missed or late threat detections can lead to collisions, and false alarms may cause pilots to lose trust in the system and ignore alerts, underscoring the need for a robust system design. Building on prior experience, Lincoln Laboratory recently examined potential improvements to the TCAS algorithms and monitored TCAS activity in the Boston area. Now the Laboratory is pursuing new collision avoidance technologies for unmanned aircraft. This above system is the basis of all the collision systems being implemented.

Figure 2

1.2 INTRODUCTION Safety is a key part of mission readiness; that is, systems must be safe to operate in their intended environment and not cause preventable accidents or illnesses that erode or degrade mission capability and readiness. Because of the strong correlation between readiness and safety, the Secretary of Defense has established goals for accident reduction and continues to challenge the Department of Defense (DOD) to eliminate the loss of resources incurred as a result of preventable accidents. In todays crowded airspace, mid-air collisions pose a growing threat to safety. Developed for military fast jets, the Collision Warning System (CWS) technology demonstrator is a highly advanced airborne system, which provides timely warning of potential collisions. The system is now ready to proceed to full-scale development. The CWS will be instrumental in reducing the number of mid-air incidents and accidents by improving the aircrews situational awareness. It is complemented by a model which can be used to assess detection effectiveness in a wide range of scenarios. The system also has potential benefits for the civil aircrafts. The CWS uses Secondary Surveillance Radar (SSR) techniques. The host aircraft carries an interrogator which sends out an interrogation signal (Modes A & C) and, when nearby aircraft respond, the delay time is used to deduce their range. The bearing is derived - using monopoles techniques by Measuring either the phase or amplitude differential at spatially separate receiving antenna elements. From knowledge of bearing and range or - more particularly - range rate, effective warnings can be produced. This report recommends specific technologies that could eliminate military Aircraft losses. In the past five years (FY 2004 - FY 2008), the Department of Defenses aircraft operations sustained 276 military deaths and destroyed 247 military aircraft (not including unmanned aircraft systems). Although many of the deaths are attributed to "human error," inserting hardware and software safety technologies could greatly reduce these actual losses during the next five through twenty years. Preventing these crashes will increase readiness, reduce the need for replacement aircraft, and save the lives of our Soldiers, Sailors, Marines, and Airmen. These technologies assist the pilots when they are task-saturated. Several Of these technologies already exist in commercial aircraft, in foreign military aircraft, or have been previously tested in Department of Defense military aircraft -- but not previously funded.

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1.2.1 OBJECTIVE OF PROJECT The objective of this project is to design a simple, easy to install and cheap microcontroller based circuit to transmit data regarding height and bearing of planes from ATC to planes in the region, and to provide a collision avoidance system in the aircrafts. So that on air collisions can be avoided and a safe flight can be assured up to a good extend. 1.2.2 PROJECT DESCRIPTION

Figure 3 Where -: a= height of aircraft & b= bearing of aircraft This system is a combination of RT (radio telephoning) system used for transmission of data from aircraft to ground station based on which ATC obtain the altitude and bearing of the aircraft. A reception system for getting data on ground as well as on the aircraft. Then a micro controller based evaluation system for comparing the parameters and then at the end an alarm system comprising of audio n visual alarm for dangerous conditions
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CHAPTER 2

2.1 PCB LAYOUT 2.1.1 Layout formation For layout formation first we studied well the circuit diagram. Here we have shown an example of layout.

Figure 4 Circuit diagram of collision avoidance system

2.1.2 DC Power Supply An AC powered unregulated power supply usually uses a transformer to convert the voltage from the wall outlet (mains) to a different, nowadays usually lower, voltage. If it is used to produce DC, a rectifier is used to convert alternating voltage to a pulsating direct voltage, followed by a filter, comprising one or more capacitors, resistors, and sometimes inductors, to filter out (smooth) most of the pulsation. A small remaining unwanted alternating voltage component at mains or twice mains power frequency (depending upon whether half- or full-wave rectification is used)rippleis unavoidably superimposed on the direct output voltage. A regulated power supply is one that controls the output voltage or current to a specific value; the controlled value is held nearly constant despite variations in either load current
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or the voltage supplied by the power supply's energy source. For this project 220/12V DC regulated power supply is used. The layout for 12V DC power supply is as:-

Figure 5 Layout of dc power supply 2.1.3 PCB Layout

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Figure 6 2.2 PCB MODELING PROCESS

2.2.1 PCB Etching A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate. It is also referred to as printed wiring board (PWB) or etched wiring board. A PCB populated with electronic components is a printed circuit assembly (PCA), also known as a printed circuit board assembly (PCBA). Printed circuit boards are used in virtually all but the simplest commercially produced electronic devices. Chemical etching Chemical etching is done with ferric chloride, ammonium per sulfate, or sometimes hydrochloric acid. For PTH (plated-through holes), additional steps of electroless deposition are done after the holes are drilled, then copper is electroplated to build up the thickness, the boards are screened, and plated with tin/lead. The tin/lead becomes the resist leaving the bare copper to be etched away.

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The simplest method, used for small scale production and often by hobbyists, is immersion etching, in which the board is submerged in etching solution such as ferric chloride. Compared with methods used for mass production, the etching time is long. Heat and agitation can be applied to the bath to speed the etching rate. In bubble etching, air is passed through the etchant bath to agitate the solution and speed up etching. Splash etching uses a motor-driven paddle to splash boards with etchant; the process has become commercially obsolete since it is not as fast as spray etching. In spray etching, the etchant solution is distributed over the boards by nozzles, and recirculated by pumps. As more copper is consumed from the boards, the etchant becomes saturated and less effective; different etchants have different capacities for copper, with some as high as 150 grams of copper per liter of solution. In commercial use, etchants can be regenerated to restore their activity, and the dissolved copper recovered and sold. Small-scale etching requires attention to disposal of used etchant, which is corrosive and toxic due to its metal content. The etchant removes copper on all surfaces exposed by the resist. "Undercut" occurs when etchant attacks the thin edge of copper under the resist; this can reduce conductor widths and cause open-circuits. Careful control of etch time is required to prevent undercut. Where metallic plating is used as a resist, it can "overhang" which can cause short-circuits between adjacent traces when closely spaced. Overhang can be removed by wire-brushing the board after etching. 2.2.2 Component Mounting After etching, components are mounted on the PCB by using soldering process. 2.2.3 Soldering Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal (solder) into the joint, the filler metal having a lower melting point than the work piece. Soldering differs from welding in that soldering does not involve melting the work pieces. There are three forms of soldering, each requiring higher temperatures and each producing an increasingly stronger joint strength: 1. soft soldering, which originally used a tin-lead alloy as the filler metal, 2. silver soldering, which uses an alloy containing silver, 3. Brazing which uses a brass alloy for the filler.

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In the soldering process, heat is applied to the parts to be joined, causing the solder to melt and to bond to the work pieces in an alloying process called wetting. 2.2.4 Flux The purpose of flux is to facilitate the soldering process. The obstacle to a successful solder joint is an impurity at the site of the union, e.g. dirt, oils or oxidation. The impurities can be removed by mechanical cleaning or by chemical means, but the elevated temperatures required to melt the filler metal (the solder) encourages the work piece (and the solder) to re-oxidize. This effect is accelerated as the soldering temperatures increase and can completely prevent the solder from joining to the work piece. One of the earliest forms of flux was charcoal, which acts as a reducing agent and helps prevent oxidation during the soldering process. Some fluxes go beyond the simple prevention of oxidation and also provide some form of chemical cleaning (corrosion). For many years, the most common type of flux used in electronics (soft soldering) was rosin-based, using the rosin from selected pine trees. It was ideal in that it was noncorrosive and non-conductive at normal temperatures but became mildly reactive (corrosive) at the elevated soldering temperatures. Plumbing and automotive applications, among others, typically use an acid-based (muriatic acid) flux which provides cleaning of the joint. These fluxes cannot be used in electronics because they are conductive and because they will eventually dissolve the small diameter wires. Many fluxes also act as a wetting agent in the soldering process,[5] reducing the surface tension of the molten solder and causing it to flow and wet the workpieces more easily. Fluxes for soft solder are currently available in three basic formulations: 1. Water-soluble fluxes (no VOC's required for removal) are higher activity fluxes designed to be removed with water after soldering. 2. No-clean fluxes which are mild enough to not "require" removal due to the nonconductive and non-corrosive residue.[1] Performance of the flux needs to be carefully evaluated; a very mild 'no-clean' flux might be perfectly acceptable for production equipment, but not give adequate performance for a poorly controlled hand-soldering operation. They are so-called "no-clean" because the residue left after the solder operation is non-conductive and won't cause electrical shorts; nevertheless these fluxes leave a white-color residue like dilute bird-droppings. which is plainly visible. Since the presence of foreign matter, detritus, even lint, on circuit boards is adefect for all three classes of electronic circuit boards
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(ranging from cheap consumer electronics to high-reliability, mission critical applications), these sorts of fluxes must still be cleaned as with all hand solder work, typically brushing with 99% isopropyl alcohol as the solvent and lint-free non-synthetic (eg cotton) wipes. 2.2.5 Process Soldering operations can be performed with hand tools, one joint at a time, or en masse on a production line. Hand soldering is typically performed with a soldering iron, soldering gun, or a torch, or occasionally a hot-air pencil. Sheet metal work was traditionally done with "soldering coppers" directly heated by a flame, with sufficient stored heat in the mass of the soldering copper to complete a joint; torches or electricallyheated soldering irons are more convenient. All soldered joints require the same elements of cleaning of the metal parts to be joined, fitting up the joint, heating the parts, applying flux, applying the filler, removing heat and holding the assembly still until the filler metal has completely solidified. Depending on the nature of flux material used, cleaning of the joints may be required after they have cooled. The distinction between soldering and brazing is arbitrary and often misunderstood, with some choosing to make each type a separate category, though the only distinction is the alloy of the filler metal (the solder) and the temperature at which it melts. Soft soldering can be done with a heated iron whereas the other methods require a higher temperature to melt the solder than can be achieved with a heated iron. Soldering, by definition, is the use of a filler metal to join work pieces and, as such, encompasses soft soldering, "hard" soldering (silver soldering) and brazing. The word brazing comes from the type of solder that is used for that soldering processa brass alloy. The term silver solder likewise denotes the type of solder that is used. Soft solder comes from the fact that lead was a primary ingredient and is a soft metal.

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Figure 7 2.3. BLOCK DIAGRAMS 2.3.1. TRANSMISSION CIRCUIT It consists of four potentiometers at the input corresponding to 2 different parameters from two different planes one of which is our mother plane. Then comes the PIC 16F877A controller. PIC is followed by the eight bit encoder HT640/S. Encoder is at the end connected to the Rf transmitter TLP434A.

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Figure 8 2.3.2 RECEPTION CIRCUIT The Rf receiver receives the transmitted information and the pass the serial data to the next stage. The next stage of this part consists of an eight bit decoder HT-648L. This decoder decodes the serial data into parallel form and then passes it on. Moving ahead comes the microcontroller AT89S52; here the main programming is done. The comparative o/p of controller is displayed through a 16*2 LCD display. And a buzzer is connected to give the final warning.

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Figure 9

2.4. COMPONENT USED

2.4.1. STEP DOWN TRANSFORMER

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Devices that are used to step down electrical current at input power sources, which allow voltage to be compatible with equipment. Transformers are electrical devices that transform voltage through magnetic couplings, and they have no moving parts. There is a magnetic core with one winding of wire placed close to one or more windings, which can couple two or more alternating-current circuits together by employing the induction between the windings. The primary winding is connected to the power source and the other windings are known as secondary windings. If the secondary voltage wire is less than the primary wire, the transformer is called a step down transformer. If the secondary wiring is of higher voltage, the transformer is a step-up transformer, which increases voltage input. 2.4.2. REGULATOR

Figure 10 A voltage regulator is an electrical regulator designed to automatically maintain a constant voltage level. A voltage regulator may be a simple "feed-forward" design or may include negative feedback control loops. It may use an electromechanical mechanism, or electronic components. Depending on the design, it may be used to regulate one or more AC or DC voltages. 2.4.3. CAPACITOR

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Figure 11 A capacitor (formerly known as condenser) is a passive two-terminal electrical component used to store energy in an electric field. The forms of practical capacitors vary widely, but all contain at least two electrical conductors separated by a dielectric (insulator); for example, one common construction consists of metal foils separated by a thin layer of insulating film. Capacitors are widely used as parts of electrical circuits in many common electrical devices. 2.4.4. RECTIFIRE A rectifier is an electrical device that converts alternating current (AC), which periodically reverses direction, to direct current (DC), which flows in only one direction. The process is known as rectification. Physically, rectifiers take a number of forms, including vacuum tube diodes, mercury arc valves, solid-state diodes, silicon-controlled rectifiers and other silicon-based semiconductor switches

Full wave rectifier A full-wave rectifier converts the whole of the input waveform to one of constant polarity (positive or negative) at its output. Full-wave rectification converts both polarities of the input waveform to DC (direct current), and is more efficient. However, in a circuit with a non-center tapped transformer, four diodes are required instead of the one needed for half-wave rectification. Four diodes arranged this way are called a diode bridge or bridge rectifier.

Figure 12: Bridge rectifier: a full-wave rectifier using 4 diodes.

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2.4.5. TRANSISTOR

A transistor is a semiconductor device used to amplify and switch electronic signals and power. It is composed of a semiconductor material with at least three terminals for connection to an external circuit. A voltage or current applied to one pair of the transistor's terminals changes the current flowing through another pair of terminals. Because the controlled (output) power can be much more than the controlling (input) power, a transistor can amplify a signal. Today, some transistors are packaged individually, but many more are found embedded in integrated circuits.

2.4.6 POTENTIOMETER

Figure 13 A potentiometer, informally, a pot, is a three-terminal resistor with a sliding contact that forms an adjustable voltage divider. If only two terminals are used (one side and the wiper), it acts as a variable resistor or rheostat. Potentiometers are commonly used to control electrical devices such as volume controls on audio equipment. Potentiometers operated by a mechanism can be used as position transducers, for example, in a joystick.

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2.4.7. RESISTOR

Figure 14

A linear resistor is a linear, passive two-terminal electrical component that implements electrical resistance as a circuit element. The current through a resistor is in direct proportion to the voltage across the resistor's terminals. Thus, the ratio of the voltage applied across a resistor's terminals to the intensity of current through the circuit is called resistance. This relation is represented by Ohm's law:

2.4.8. DIODE In electronics, a diode is a type of two-terminal electronic component with a nonlinear currentvoltage characteristic. A semiconductor diode, the most common type today, is a crystalline piece of semiconductor material connected to two electrical terminals.[1] A vacuum tube diode (now rarely used except in some high-power technologies) is a vacuum tube with two electrodes: a plate and a cathode.

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2.4.9 PIC CONTROLLER 28-Pin PDIP, SOIC, SSOP

Figure 15 PIC16F873A/876A devices are available only in 28-pin packages, while PIC16F874A/877A devices are available in 40-pin and 44-pin packages. All devices in the PIC16F87XA family share common architecture with the following differences: The PIC16F873A and PIC16F874A have one-half of the total on-chip memory of the PIC16F876A and PIC16F877A The 28-pin devices have three I/O ports, while the 40/44-pin devices have five The 28-pin devices have fourteen interrupts, while the 40/44-pin devices have fifteen The 28-pin devices have five A/D input channels, while the 40/44-pin devices have eight
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 The Parallel Slave Port is implemented only on the 40/44-pin devices. Block diagrams of the PIC16F873A/876A and the pin outs for these a device family is shown above. Some pins for these I/O ports are multiplexed with an alternate function for the peripheral features on the device. In general, when a peripheral is enabled, that Pin may not be used as a general purpose I/O pin. Programming of PIC family is done using MP LAB compiler kit available on net. 2.4.10 ENCODER PIN DIAGRAM

Figure 16

FEATURES Operating voltage: 2.4V~12V Low power and high noise immunity CMOS technology Low standby current Capable of decoding 18 bits of information Pairs with HOLTEKs HT640 encoder 10 address pins 8 data pins Trinary address setting Two times of receiving check Built-in oscillator needs only a 5% resistor Valid transmission indictor
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 Easily interface with an RF or an infrared transmission medium Minimal external components

2.4.11. TRANSMITTER

Figure 17 TLP 434-A ULTRA SMALL TRANSMITTER FREQUENCY- 433.92 MHz Specification: Frequency Range: 433.92MHz Modulate Mode: ASK Circuit Shape: S/F Data Rate: 8Kbps Supply Voltage: 3~12 V Voltage: 3v; Current: 4.9mA Voltage:5v ;Current: 8.4Ma Power Supply & All Input/output pins: -0.3 to 12.0 V Non-Operating Case Temperature: -10 to +85 centigrade Soldering Temperature: 230 centigrade (10 seconds) Simple to Apply with Low External Count High Sensitivity Passive Design.

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2.4.12. RECEIVER

Figure 18

Table 3.1

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2.4.13 DECODERS Pin description

Figure 19 General description The 318 decoders are a series of CMOS LSIs for remote control system applications. They are paired with the 318 series of encoders. For proper operation a pair of encoder/decoder pair with the same number of address and data format should be selected (refer to the encoder/ decoder cross reference tables). The 318 series of decoders receives serial address and data from that series of encoders that are transmitted by a carrier using an RF or an IR transmission medium. It then compares the serial input data twice continuously with its local address. If no errors or unmatched codes are encountered, the input data codes are decoded and then transferred to the output pins. The VT pin also goes high to indicate a valid transmission. The 318 decoders are capable of decoding 18 bits of information that consists of N bits of address and 18N bits of data. To meet various applications they are arranged to provide a number of data pins whose range is from 0 to 8 and an address pin whose range is from 8 to 18. In addition, the 318 decoders provide various combinations of address/data number in different packages.

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Features Operating voltage: 2.4V~12V Low power and high noise immunity CMOS technology Low standby current Capable of decoding 18 bits of information Pairs with HOLTEKs 318 series of encoders 8~18 address pins 0~8 data pins Trinary address setting Two times of receiving check Built-in oscillator needs only a 5% resistor Valid transmission indictor Easily interface with an RF or an infrared transmission medium Minimal external components. 2.4.14 AT89S52 CONTROLLER Description- The AT89S52 is a low-power, high-performance CMOS 8-bit microcontroller with 8K bytes of in-system programmable Flash memory. The device is manufactured using Atmels high-density nonvolatile memory technology and is compatible with the industry standard 80C51 instruction set and pin out. The on-chip Flash allows the program memory to be reprogrammed in-system or by a conventional nonvolatile memory programmer. By combining a versatile 8-bit CPU with in-system programmable Flash on a monolithic chip, the Atmel AT89S52 is a powerful microcontroller which provides a highly-flexible and cost-effective solution to many embedded control applications. The AT89S52 provides the following standard features: 8K bytes of Flash, 256 bytes of RAM, 32 I/O lines, Watchdog timer, two data pointers, three 16-bit timer/counters, a six-vector two-level interrupt architecture, a full duplex serial port, on-chip oscillator, and clock circuitry. In addition, the AT89S52 is designed with static logic for operation down to zero frequency and supports two software selectable power saving modes. The Idle Mode stops the CPU while allowing the RAM, timer/counters, serial port, and interrupt system to continue functioning. The Power-down mode saves the RAM con-tents but freezes the oscillator, disabling all other chip functions until the next interrupt or hardware reset.

Features Compatible with MCS-51 Products 8K Bytes of In-System Programmable (ISP) Flash Memory Endurance: 10,000 Write/Erase Cycles
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 4.0V to 5.5V Operating Range Fully Static Operation: 0 Hz to 33 MHz Three-level Program Memory Lock 256 x 8-bit Internal RAM 32 Programmable I/O Lines Three 16-bit Timer/Counters Eight Interrupt Sources Full Duplex UART Serial Channel Low-power Idle and Power-down Modes Interrupt Recovery from Power-down Mode Watchdog Timer Dual Data Pointer Power-off Flag Fast Programming Time Flexible ISP Programming (Byte and Page Mode) Pin configurations 40-Lead PDIP

Figure 20

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2.5 COMPILERS 2.5.1 MPLAB COMPILERIn order to develop your software and organize your files you will have to use an integrated development environment. The number one IDE used with PIC microcontrollers is MPLab IDE by Microchip Technology. PIC microcontrollers can be programmed in Assembly, C or a combination of the two. Other high level programming languages can be used but embedded systems software is primarily written in C. Once you have downloaded and installed MPLab IDE and chosen a programming language you will have to select a compiler. The compiler, assembler, and linker are usually combined in a single package. For basic C operations and delays the files stdlib.h and delay.h are needed. The file pic.h is required for access to the PIC microcontrollers I/O pins, memory locations, and other components.

2.5.2 KEIL COMPILERThe Intel 8x931 USB microcontroller uses the MCS8051 core. The Keil C51 compiler comes with an additional header to accommodate the 8x931 USB peripherals. This file is Reg931.h and is located in the c:\c51\inc directory. The Keil tool chain consists of the following executables located in the c:\c51eval\bin directory: mVision uvw51e.exe C Compiler c51.exe Assembler a51.exe Linker bL51.exe dScope dsw51.exe mVision IDE mVision is a Windows based front end for the C Compiler and Assembler. It was developed in the USA as was the printed manual set. Compiler, Assembler and Linker options are set with simple mouse clicks. mVision runs on Windows 3.1, 95 and NT. C51 C Compiler for the 8051, 8x931Hx and 8x931Ax [USB] The C51 ANSI compiler along with the A51 assembler is designed specifically for the Intel MCS8051 microcontroller family, including the 8x931 USB. The C51 is 100% compatible with existing 8051 programs.

A51 Macro Assembler This Macro Assembler is included with each Compiler package or is available separately. All utilities needed to complete your project are included for all members of the 8051
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family. This Assembler is DOS based or can be run from mVision which is included with every Assembler and Compiler package. BL51 Linker - Banked Linker The BL51 Linker/Locator is used to join reloadable object modules and library files together. The object files are created with the C51 compiler or the A51 Assembler using the Keil library files. The linking process results in absolute object modules.

dScope Simulator dScope is a software simulator. Your code can be debugged either in software on your PC or in your target hardware. When operated in conjunction with the Keil monitor installed in your target hardware, dScope becomes tScope.

2.6 WORKING AND THEORY OF THE PROJECT:The aircraft collision avoiding system so developed is based on the ATC (air traffic control) communication with the plane. The ATC is the master control unit the ground station which controls all the on air routes and process based on RADAR navigation system. The ATC calculate the speed, height and other parameters of the plane through the RADAR technology. This collision avoidance system which can be easily implemented in the planes and is reliable as well. This system works on the data transmission between the plane and the ground station. Along with all other communication parameters the ATC sends the warning signal in terms of data of other planes. The data send from the ATC comprises of all the parameters corresponding to the flight of other planes in the same area. These parameters are then received bi the plane and the matched wrt to its own parameters and resulting upon the calculation the o/p is generated.

Transmission side description This circuit consists of all the input parameters being transmitted from ATC to the planes which includes all the data from different planes and received and stored at ATC. It consists of four I/Ps given to a PIC microcontroller. This performs the task of conversion of analog data in digital form and then its transmission through an encoder, which convert the parallel o/p of microcontroller into serial to be given to Rf transmitter to be transmitted to the plane.

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Reception side description On this side the transmitted signal is being received by the Rf receiver. This received data is in serial form so is again feed to a decoder which decodes the serial data into parallel form. This parallel data is then feed to the microcontroller AT89S52 which belongs to 8051 family. Here the required programming is done for checking of parameters and developing of a system which can effectively avoid mid air collisions and accordingly a display and alarm is generated. 2.7 LOGIC INVOLVED Programming is done in embedded C on the following basis. For PIC the MPLAB compiler is used while for AT89S52 the Keil compiler is used. For reception side the programming is only for transmission of data but on reception side its for comparison and display of result. Transmission side:Programming is done in PIC controller for transmission of 4 i/p data through rf transmitter. Simple A/D conversion is involved from 1st port of PIC then these data are transmitted.

Reception side:If (A =! B & C =! D) Display SAFE FLYING; If (A=B & C=! D) Display ALERT HEIGHT SAME; If (A=! B & C=D) Display ALERT BEARING SAME; If (A=B & C=D) Display DANGER, And blow the buzzer;

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CHAPTER 3 3.1 CONCLUSION The system implemented for transmission of parameters from ground station to the aircraft can be effectively used for transmission of parameters which can be used by the aircrafts alarm system for comparison of parameters to avoid a dangerous condition which could arise due to neglectance or any failure. This system is a quite inexpensive system and can be implemented in railways as well which can be helpful for avoiding increasing such kind of accidents in our country. This system is a relatively low power system as involved the implementation of micro controllers and various micro chips most of which run near or at 5 volts. So such systems can be effectively implemented and do have a very large scope in R&D as well. 3.2 REFRENCES www.google.com www.wikipedia.org www.datasheetcatalog.com www.matrixtelesol.com Electronics For You Projects Vol. 25 MAX 232 data sheet from Texas Instruments Modern Digital Electronics- R.P. Jain

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APPENDICES

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