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6.1 Introduction
Tensile Strength Tensile Test Flexural Strength Bend Test for brittle materials Hardness Hardness Test Toughness Impact Test Fatigue Life Fatigue Test Creep rate Creep Test
F A0 l l0 l0
l l0 Engineerin g strain l0
Note: in Metals, Yield stress is usually the stress required for dislocations to slip.
Poisson' s ratio :
longitudin al
lateral
Poisson' s ratio :
longitudin al
lateral
Effect of Temperature
Flexural strength
where is deflection
Note: BCC metals have transition temperature, but most FCC metals do not.
(a) Stress-rupture curves for an iron-chromium-nickel alloy (b) The Larson-Miller parameter for ductile cast iron
Creep Testing
Time dependent deformation under an applied load. Metals/alloys do not exhibit time dependent deformation under normal service condition. Metals subjected to a constant load at elevated temperatures will undergo a time dependent increase in length.
The high and low temperature are relative to the absolute melting temperature of the material. Homologous temperatures of more than 0.5 of melting T is of engineering significance. Metal Melting temp. 0.5xMelting Temp Lead 327oC 600oK 327oK 27oC W 3407 3680 1840 1567
The rate of deformation of a sample is known as the creep rate. It is the slope created by the creep v. time.
the primary creep starts at a rapid rate and slows with time; the secondary creep has a relatively uniform rate; the tertiary creep has an accelerated creep rate and terminates when the material breaks or ruptures.
High temperature Tensile Test Creep Test: Stress rupture Test High temperature Tensile Test: Similar to short term room temperature testcompleted in few minutes and provide stress versus strain curve.
Measure dimensional changes accurately at constant high temperature and constant load or stress. Useful for long term applications which are strain limited. such as turbine blade.
Measure strain verses time at constant T and Load. Relatively low loads and creep rate Long duration 2000 to 10,000 hours. Not always fracture. Strain typically less than .5%.
Measure time to failure at specified stress and temperature. Useful for applications where some strain can be tolerated but failure must be avoided. such as large furnace housings.
Measure stress verses time to rupture at constant temperature. Higher load and creep rate. Shorter duration, less than 1000 hours. Always to fracture Time and strain to fracture measured. Strain typically up to 50%.
Creep generally occurs at elevated temperatures, so it is common for this type of testing to be performed with an environmental chamber for precise heating/cooling control. Temperature control is critical to minimize the effects of thermal expansion on the sample.
The unloaded specimen is first heated to the required T and the gage length is measured. The predetermined load is applied quickly without shock. Measurement of the extension are observed at frequent interval. Average of about 50 readings should be taken.
To predict the stress and time for long lives on the basis of much shorter data. Plant life 30 to 40 years(260000,35000 hrs) While creep data is not available beyond lives of more than 30000 hrs. Larson Miller Parameter Manson Hafford parameter
To determine stress-relaxation of a material, the specimen is deformed a given amount and decrease in stress is recorded over prolonged period of exposure at constant elevated temperature. The stress-relaxation rate is the slope of the curve at any point.
Creep Testing
Creep is a time-dependent deformation of a material while under an applied load that is below its yield strength. It is most often occurs at elevated temperature, but some materials creep at room temperature. Creep terminates in rupture if steps are not taken to bring to a halt
Creep in service is usually affected by changing conditions of loading and temperature The number of possible stresstemperature-time combinations is infinite. The creep mechanisms is often different between metals, plastics, rubber, concrete.
Time dependent deformation under an applied load. Metals/alloys do not exhibit time dependent deformation under normal service condition. Metals subjected to a constant load at elevated temperatures will undergo a time dependent increase in length.
The high and low temperature are relative to the absolute melting temperature of the material. Homologous temperatures of more than 0.5 of melting T is of engineering significance. Metal Melting temp. 0.5xMelting Temp Lead 327oC 600oK 327oK 27oC W 3407 3680 1840 1567
The rate of deformation of a sample is known as the creep rate. It is the slope created by the creep v. time.
the primary creep starts at a rapid rate and slows with time; the secondary creep has a relatively uniform rate; the tertiary creep has an accelerated creep rate and terminates when the material breaks or ruptures.
High temperature Tensile Test Creep Test: Stress rupture Test High temperature Tensile Test: Similar to short term room temperature testcompleted in few minutes and provide stress versus strain curve.
Measure dimensional changes accurately at constant high temperature and constant load or stress. Useful for long term applications which are strain limited. such as turbine blade.
Measure strain verses time at constant T and Load. Relatively low loads and creep rate Long duration 2000 to 10,000 hours. Not always fracture. Strain typically less than .5%.
Stress rupture of Materials Science and Engineering Elements Data On log-log scale
Measure time to failure at specified stress and temperature. Useful for applications where some strain can be tolerated but failure must be avoided. such as large furnace housings.
Measure stress verses time to rupture at constant temperature. Higher load and creep rate. Shorter duration, less than 1000 hours. Always to fracture Time and strain to fracture measured. Strain typically up to 50%.
Creep generally occurs at elevated temperatures, so it is common for this type of testing to be performed with an environmental chamber for precise heating/cooling control. Temperature control is critical to minimize the effects of thermal expansion on the sample.
The unloaded specimen is first heated to the required T and the gage length is measured. The predetermined load is applied quickly without shock. Measurement of the extension are observed at frequent interval. Average of about 50 readings should be taken.
To predict the stress and time for long lives on the basis of much shorter data. Plant life 30 to 40 years(260000,35000 hrs) While creep data is not available beyond lives of more than 30000 hrs. Larson Miller Parameter Manson Hafford parameter
To determine stress-relaxation of a material, the specimen is deformed a given amount and decrease in stress is recorded over prolonged period of exposure at constant elevated temperature. The stress-relaxation rate is the slope of the curve at any point.
All real crystals contain imperfections which may be point, line , surface or volume defects. Which disturb locally the regular arrangement of the atoms. Their presence can significantly modify the properties of crystalline solids.
Electrical conductivity Semiconductor Properties Yield stress Fracture Strength Creep strength Practically all the mechanical properties are structure-sensitive properties.
Defect, or imperfection Science and Engineering Elements of Materials The term defect, or imperfection, is generally used to describe any deviation from an orderly array of lattice points. When the deviation from the periodic arrangement of the lattice is localized to the vicinity of only a few atoms it is called a point defect, or point imperfection. However if the defects extends through microscopic region of the crystal, it is called a lattice imperfection. Lattice imperfections may be divided into Line defects and surface or Plane, defects.
Lattice imperfections may be divided into Line defects and surface or Plane, defects. However if the defects extends through microscopic region of the crystal, it is called a lattice imperfection. Lattice imperfections may be divided into Line defects and surface or Plane, defects.
Line defects obtain their name because they propagate as lines or as a two dimensional net in the crystal. The edge and Screw dislocations are the common line defects encountered in materials. Surface defects arise from the clustering of line defects into plane
Grain boundaries, a low angle boundaries and Twin boundaries are surface defects. The stacking fault between two closed packed regions of the crystal that have alternate stacking sequences and twinned region of a crystal are other example of surface defects.
All the atoms in a perfect lattice are at specific atomic sites (ignoring thermal vibrations). In pure metal two types of point defect are possible, I) Intrinsic defects ii) Exterinsic defects. Intrinsic defects: i) A vacant atomic site or vacancy, ii) an interstitial atom. Vacancy formed by the removal of an atom from the an atomic site . Interstitial by the introduction of an atom into a nonlattice site at 1/2, 1/2, 0 position.
It is known that vacancies and interstitials can be produced in materials by plastic deformation and highenergy partical irradiation. The latter process is particularly important in materials in nuclear reactor installations. The interstitial defect occurs in pure metals as a result of bombardment with high-energy nuclear particles ( radiation damage), but it does not occur frequently as a result of thermal activation. Further more, intrinsic point defects are introduced into crystals simply by virtue of temperature, for all temperature above 0K there is a thermodynamically stable concentration.
The formation energy of interistial is typically two to four times more than the formation energy of vacancy. Therefore in metals in thermal equilibrium the concentration of intestinal may be neglected in comparison with that of vacancies
Exterinsic defects . Impurity atoms in a crystal can be considered as a extrinsic point defect. Impurity atoms can take up two different types of sites. Substitutional. An atom of the parent lattice lying in a lattice site is replaced by the impurity atom Interstitial The impurity atom is at a non- lattice site
The most important two dimensional, or line, defect is the dislocation. Dislocations are important for explaining the slip of crystals, They are also intimately connected with nearly all other mechanical phenomena such as , the yield point, strain hardening /work hardening, creep, fatigue, and brittle fracture.
One way of thinking of a dislocation is to consider that it is the region of localized lattice disturbance separating the slipped and un slipped region of a crystal.
Elements of Materials Science and Engineering The two basic types of dislocations : Edge dislocation , Burger vector is normal to the line of the dislocation Two types Positive edge dislocation and negative edge dislocation. Screw dislocation, burger vector is parallel to the line of dislocation.Two types , Right hand screw and left hand screw dislocation.
Two important rules. I) The burger vector of edge dislocation is normal to the line of the dislocation . II) The burger vector of screw dislocation is parallel to the line of the dislocation . All crystals, apart from some whiskers, contain dislocations and in well annealed crystals the dislocation are arranged in a rather ill- defined net work, the frank net.
Dislocationof Materials Science and Engineering Elements Density The dislocation density is defined as the total length of dislocation line per unit volume of crystal, normally quoted in units of mm-2. Thus for a volume V containing line length l, Density = l/V. An alternative definition, the number of dislocations intersecting a unit area, again measured in units of mm-2 . If all the dislocations are parallel, the two density values are the same, but for completely random arrangement the volume density is twice the surface density.
A stacking fault is a planer defects , it is a local region in the crystal where the regular sequence has been interrupted. The atomic arrangement on the plane of an fcc structure and the plane of an hcp structure could be obtained by the stacking of closed- packed planes of spheres. For the fcc strycture, the stacking sequence of the planes of atom is given by ABCABCABC. For the hcp structure, the sequence is given by ABABAB and there is no alternate site for an A layer resting on B layer.
Elements of Materials Science and Engineering For the hcp structure, the sequence is given by ABABAB and there is no alternate site for an A layer resting on B layer.In case of ABCABCABC stacking, A layer can rest equally well on either B or C position and geometrically there is no reason for the selection of a particular position. Therefore in fcc lattice two types of stacking fault are possible. Either by removal or introduction of stacking sequence.