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Interconnect and Packaging

Lecture 3: Skin Effect
Chung-Kuan Cheng
UC San Diego
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Outlines

I. Transmission Line Model
II. Spectrum of Configurations
III. Skin Effect
IV. Coaxial Cable

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I. Transmission Line Model
Rl Ll
Cl
Rl Ll
Cl

i(z,t)
Rl Ll
Rl Ll
Voltage drops through serial resistance and inductance
Current reduces through shunt capacitance
Resistance increases due to skin effect
Shunt conductance is caused by loss tangent
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I. Interconnect Model
Telegraphers equation:
) , (
) , ( ) , (
) , (
) , (
) , (
t z GV
dt
t z dV
C
dz
t z dI
dt
t z dI
L t z RI
dz
t z dV
=
=
Propagation Constant:
| o e e j C j G L j R + = + + = ) )( (
Wave Propagation:
| e
e | o
/ / , ) , (
0
= = =
+
t z v e V t z V
t j z j z
Characteristic Impedance
) /( ) ( C j G L j R Z e e + + =
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I. Interconnect Model
LC RG RG RC LG LC j
LC RG RG RC LG LC j
2 2 2 2 2 2 4
2 2 2 2 2 2 4
) ( ] ) ( ) [( ) (
2
1
) ( ] ) ( ) [( ) (
2
1
e e e
e e e | o
+ + + + +
+ + + + = +
Propagation Constant:
Wave Propagation:
| e
e | o
/ / , ) , (
0
= = =
+
t z v e V t z V
t j z j z
Characteristic Impedance
) /( ) ( C j G L j R Z e e + + =
| o e e j C j G L j R + = + + = ) )( (
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I. Interconnect Model (Constants)
AWG (American Wire Gauge
Wire Diameter = 2.54x10
-(AWG+10)/20

Copper p= 2.2uohm-cm
Copper thickness 1oz(/sqft)= 36um
Electric Permittivity of Air 8.85x10
-12
F/m
Magnetic Permeability of Air
Characteristic Impedance of Air

O = 8 . 376 / c
m H / 10 4
7
t
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II. Spectrum of Configurations
| o e e j C j G L j R + = + + = ) )( (
RLGC R L G C
0001 ( jwC ) Capacitance
0010 ( G ) Shunt
0011 ( G + jwC ) Leaky Capacitance
0100 ( jwL ) Inductance
0101 ( jwL )( jwC ) Lossless LC Line
0110 ( jwL )( G ) Skin Effect Derivation
0111 ( jwL )( G + jwC ) Skin Effect + Permitivity
1000 ( R ) Resistance
1001 ( R )( jwC ) RC Line
1010 ( R )( G ) Leaky Resistance
1011 ( R )( G + jwC ) Leaky RC Line
1100 ( R + jwL ) Lossy Inductance
1101 ( R + jwL )( jwC ) Lossy LC Line
1110 ( R + jwL )( G ) Lossy and Leaky Inductance
1111 ( R + jwL )( G + jwC ) Transmission Line
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III. Skin Effect
eo
o
2
=
2 2
) )( (
LG
j
LG
LG j
C j G L j R
e e
e
e e
+ ~
~
+ + =
Skin Depth
(Equivalent Depth of Uniform Current)
Assuming that resistance and capacitance
are negligible.
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IV. Coaxial Cable
0
2
,
2
),
1 1
(
2
1
Z
R
b a
R = = + = o
eo
o
too
O = => =
+ = => =
77 6 . 3 /
/ 1 / ln 0
0
Z a b
b a a b
da
do
) / ln(
60
2
) / ln(
0
a b
a b
Z
r
c
t c

~ =
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IV. Coaxial Cable: Inductance
a b L
rdr
a
I
b r LI
a
/ ln
2 8
2 ) , (
0
2
2
t

t
t
+ =
u =
}
a b
I
r a
a
I
dr
r
I
dr
a
Ir
r
b r
b
a
a
r
/ ln
2
) (
4
2 2
) , (
2 2
2
2
2
t

+ =
+ = u
} }
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IV. Coaxial Cable: Inductance
i
L R e =
o
e
oo eo
o
o

o
2
1 1
,
2
1
2
2
0
p p
R
p p
L
p
I
rdr
p
I
I L
i
i
= = = =
= =
}
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IV. Coaxial Cable: Inductance
) /( ) (
/
) (
) (
2
) (
1
0
ec o e e q
eo
eo
t
e q
j j
m
j a I
j a I
a
Z
i
+ =
O =
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IV. Coaxial Cable: Impedance
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IV. Coaxial Cable: Impedance
2 2
AC DC
R R R + =
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HW1: Remarks on z900
Chip (Processor)
10x17 sqmm, 38W, 918MHz, 250MIPS
128bits to each L2 cache chip
280um pitch chip to MCM
MCM
127x127sqmm, 5xTerabits/s, 459MHz
20 Processors, 8x4MB Memory
11Knets, 95mm max length on critical path
1ns on MCM, 1.4ns off MCM
33um think film pitch, 396um ceramic substrate
101Kpins, 35.3pin/sqcm
4224pins/1735pg to PCB
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HW1: Remarks
Board
553x447sqmm, 1 MCM, 64GB memory, 24 STI
7 mils pitch (3.3width/4sep)
24GB/s IO, 1GB/s bus, 240lines/MBA (6GB/s),
10pairs/STI, 9 signals/1 clock
3516nets, 19,788pins (signals + pg), 8pins/sqcm