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Power Dissipation

CMOS
Outline
Motivation to estimate power dissipation
Sources of power dissipation
Dynamic power dissipation
Static power dissipation
Metrics
Conclusion
Need to estimate power dissipation
Power dissipation affects
Performance
Reliability
Packaging
Cost
Portability

Where Does Power Go in CMOS?
Dynamic Power Consumption
Short Circuit Currents
Leakage
Charging and Discharging Capacitors
Short Circuit Path between Supply Rails during Switching
Leaking diodes and transistors
Node Transition Activity and Power
Consider switching a CMOS gate for N clock cycles
E
N
C
L
V
dd
-
2
n N ( ) - =
n(N): the number of 0->1 transition in N clock cycles
E
N
: the energy consumed for N clock cycles
P
avg
N
lim
E
N
N
-------- f
clk
- =
n N ( )
N
------------
N
lim
\ .
| |
C -
L
V
dd
-
2
f
clk
- =
o
0 1
n N ( )
N
------------
N
lim =
P
avg
= o
0 1
C -
L
V
dd
-
2
f
clk
-
Due to charging and discharging of capacitance
Activity factors of basic gates
AND

OR

XOR
B A B A
p p p p ) 1 ( = o
)] 1 )( 1 ( 1 )[ 1 )( 1 (
B A B A
p p p p = o
) 2 )]( 2 ( 1 [
B A B A B A B A
p p p p p p p p + + = o
Dynamic Power dissipation

Power reduced by reducing V
dd,
f, C and also activity
A signal transition can be classified into two categories
a functional transition and
a glitch
Glitch Power Dissipation
Glitches are temporary changes in the value of the output
unnecessary transitions
They are caused due to the skew in the input signals to a gate
Glitch power dissipation accounts for 15% 20 % of the
global power
Basic contributes of hazards to power dissipation are
Hazard generation
Hazard propagation
Glitch Power Dissipation
P = 1/2 .CL.Vdd . (Vdd Vmin) ;
Vmin : min voltage swing at the output
Glitch power dissipation is dependent on
Output load
Input pattern
Input slope


Glitch Power Dissipation
Hazard generation can be reduced by gate sizing and path
balancing techniques
Hazard propagation can be reduced by using less number of
inverters which tend to amplify and propagate glitches
Short Circuit Power Dissipation
Short circuit current occurs during signal transitions when
both the NMOS and PMOS are ON and there is a direct path
between V
dd
and GND
Also called crowbar current
Accounts for more than 20% of total power dissipation
As clock frequency increases transitions increase
consequently short circuit power dissipation increases
Can be reduced :
faster input and slower output
V
dd
<= V
tn
+ |V
tp
|
So both NMOS and PMOS are not on at the same time
Static Power Consumption
V
in
=5V
V
out
C
L
Vdd
I
stat
P
stat
= P
(In=1)
.V
dd
. I
stat
Dominates over dynamic consumption
Not a function of switching frequency
Wasted energy
Should be avoided in almost all cases
Static Power Dissipation
Power dissipation occurring when device is in standby mode
As technology scales this becomes significant
Leakage power dissipation
Components:
Reverse biased p-n junction
Sub threshold leakage
DIBL leakage
Channel punch through
GIDL Leakage
Narrow width effect
Oxide leakage
Hot carrier tunneling effect






Leakage Current


New Problem: Gate Leakage

Now about 20-30% of all leakage, and growing
Gate oxide is so thin, electrons tunnel thru it
NMOS is much worse than PMOS
Principles for Power Reduction
Prime choice: Reduce voltage!
Recent years have seen an acceleration in
supply voltage reduction
Design at very low voltages still open question
(0.6 0.9 V by 2010!)
Reduce switching activity
Logic synthesis
Clock gating
Reduce physical capacitance
Proper Device Sizing
Good layout
Factors affecting leakage power
Temperature
Sub-threshold current increases exponentially
Reduction in Vt
Increase in thermal voltage
BTBT increases due to band gap narrowing
Gate leakage is insensitive to temperature change


Factors affecting leakage power
Gate oxide thickness
Sub-threshold current decreases in long channel transistors and
increases in short channel
BTBT is insensitive
Gate leakage increases as thickness reduces

Solutions
MTCMOS
Dual Vt
Dual Vt domino logic
Adaptive Body Bias
Transistor stacking
Metrics
Power Delay product
Energy Delay Product
Average energy per instruction x average inter instruction
delay
C
unit_area
Capacitance per unit area


Summary

Power Dissipation is already a prime design constraint
Low-power design requires operation at lowest
possible voltage and clock speed
Low-power design requires optimization at
Conclusion
Power dissipation is unavoidable especially as technology
scales down
Techniques must be devised to reduce power dissipation
Techniques must be devised to accurately estimate the power
dissipation
Estimation and modeling of the sources of power dissipation
for simulation purposes

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