EMI/EMC

B.T.P.MADHAV

B.T.P.MADHAV

EMI / EMC

EMI is defined as the undesirable signal which causes

unsatisfactory operation of a circuit or device.

EMC is defined as the ability of electronic and communication

equipment to be able to operate satisfactorily in the presence of interference and not be a source of interference to nearby equipment.

EMS Electromagnetic susceptibility (EMS) is the capability of a

device to respond to EMI.

B.T.P.MADHAV

B.T.P.MADHAV

Basic Types of EMI: These are of two types. They are a) Intra-EMI: EMI is said to be intra-EMI if the functional characteristics of one module within an electronic equipment or system is disturbed due to EMI from another module. b) Inter-EMI: EMI is said to be inter-EMI if the functional characteristics of one equipment is disturbed due to EMI generated by another equipment.

B.T.P.MADHAV

EMI SOURCES These are divided mainly into two types. I. Natural and II. Man-made I. Natural EMI sources are again of the following types: Terrestrial and Extra-Terrestrial. Terrestrial Sources These are atmospheric thunderstorms, lightning discharges and precipitation static.

Extra-Terrestrial Sources These are sun-disturbed & quiet, cosmic noise and radio stars.
B.T.P.MADHAV

B.T.P.MADHAV

The common effects of EMI (i) Annoying Effects Very often, momentary and random disturbances in radio and television reception occur. (ii) Disturbing Effects Unwanted reset and change of status in settings in computers and digital equipment is noticed due to EMI. The malfunctioning of computer key boards are noticed. (iii) Catastrophic Situations The burning of electronic components, loss of data, change of threshold settings, improper or unwanted operations and sometimes biological hazards occur very often.
B.T.P.MADHAV

B.T.P.MADHAV

B.T.P.MADHAV

BIOLOGICAL EFFECTS OF EMI / EMR EM waves, light, heat, x-ray and gamma rays are all different forms of electromagnetic radiation.

However, they differ in their wavelength. These radiations have

hazardous effects on men and material. The effects can be divided into two categories. 1. Thermal Effects 2. Non-thermal Effects.

B.T.P.MADHAV

EMC STANDARDS These are of two types a) Military Standards These include emission and susceptibility standards. Emission standards specify emission limits in voltage or current, power or field strengths in specified frequency ranges. Susceptibility standards specify conducted spike or radiated field parameters. b) Civilian Standards The civilian EMC standards are applicable for equipments used for commercial, industrial and domestic applications. The emission standards are specified to protect the broadcast services from interference. These also take into account the physiological interference effects experienced by human beings.
B.T.P.MADHAV

MILITARY STANDARDS
MIL - STD - 461A TEST CE01 Power Leads DESCRIPTION 30 Hz-20 kHz FREQ

CE02

Control / Signal Leads

30 Hz-20 kHz

CE03

Power Leads

20 kHz-50 MHz

CE04

Control / Signal Leads

20 kHz-50 MHz

CE05

Inverse Filter Method

30 Hz-50 MHz

CE06

Antenna Terminal

10 kHz-10 GHz

CE07

N/A

B.T.P.MADHAV

MIL - STD - 461B/C

TEST DESCRIPTION FREQ

CE01

Power / Signal Leads

30 Hz-15 kHz

CE02

N/A

CE03

Power/Signal Leads

15 kHz-50MHz

CE04

N/A

CE05

N/A

CE06

Antenna Terminal

10 kHz-26 GHz

CE07

Power Leads

Spikes / Time Domain

B.T.P.MADHAV

MIL - STD - 461D

TEST DESCRIPTION FREQ

CE101

Power Leads

30 Hz-10 kHz

CE102

Power Leads

10 kHz-10 MHz

CE106

Antenna Terminal

10 kHz-40GHz

MIL - STD - 461E

TEST DESCRIPTION FREQ

CE101

Power Leads

30 Hz-10 kHz

CE102

Power Leads

10 kHz-10 MHz

CE106

Antenna Terminal

10 kHz-40GHz

B.T.P.MADHAV

MIL - STD - 461A

TEST DESCRIPTION FREQ

CS01

Power Leads

20 Hz-50 kHz

CS02

Power Leads

50 kHz-400MHz

CS03

Intermodulation

15 kHz-10 GHz

CS04

Undesired Sig. Rejection

15 kHz-10 GHz

CS05

Cross Modulation

15 kHz - 10 GHz

CS06

Spikes, Power Leads

CS07 CS08

Squelch Ckts Undesired Sig. Rejection 30 Hz-10 GHz

CS09

N/A

CS10

N/A

B.T.P.MADHAV

MIL - STD - 461B/C

TEST DESCRIPTION FREQ

CS01

Power Leads

30 Hz-50 kHz

CS02

Power Leads

50 kHz-400 MHz

CS03

Intermodulation

15 kHz-10 GHz

CS04

Undesired Sig. Rejection

30 kHz-20 GHz

CS05

Cross Modulation

30 kHz - 20 GHz

CS06

Spikes, Power Leads

CS07 CS08

Squelch Ckts N/A

CS09

Structure Common Mode Current

60 Hz-100 kHz

CS10

Damped Sinusoidal Transients (terminals)

10 kHz-100 MHz

B.T.P.MADHAV

MIL - STD - 461D

TEST DESCRIPTION FREQ

CS101

Power Leads

30 Hz-50 kHz

CS103 CS104

Antenna Port-Intermod Antenna Port-Rej. of Undesired Sig.

15 kHz-10 GHz 30 Hz -20 GHz

CS105

Antenna Port-Cross Mod.

30 Hz-20 GHz

MIL - STD - 461E

TEST DESCRIPTION FREQ

CS101

Power Leads

30 Hz-150 kHz

CS103 CS104

Antenna Port-Intermod Antenna Port-Rej. of Undesired Sig.

15 kHz-10 GHz 30 Hz -20 GHz

CS105

Antenna Port-Cross Mod. B.T.P.MADHAV

30 Hz-20 GHz

MIL - STD - 461A

TEST DESCRIPTION FREQ

RE01

Magnetic Field

30 Hz-50 kHz

RE02

Electric Field

14 kHz-10 GHz

RE03

Spurious & Harmonic

10 kHz-40 GHz

RE04

Magnetic Field

20 Hz-15 kHz

RE05

Vehicle & Eng. Equipment

150 kHz-1 GHz

RE06

Overhead Powerlines

14 kHz-1 GHz

RS01

Magnetic Field

30 Hz-30 kHz

RS02

Magnetic Induction

Powerline & Spike

RS03

Electric Field

14 kHz-10 GHz

RS04

Parallel Line Fields

14 kHz-30 MHz

RS05

N/A

B.T.P.MADHAV

MIL - STD - 461B/C

TEST DESCRIPTION FREQ

RE01

Magnetic Field

30 Hz-50 kHz

RE02

Electric Field

14 kHz-10 GHz

RE03

Spurious & Harmonic

10 kHz-40 GHz

RE04

N/A

RE05

N/A

RE06

N/A

RS01

Magnetic Field, Equipment and Cables

30 Hz-50 kHz

RS02

Magnetic Induction, Equipment and Cables

Powerline & Spike

RS03

Electric Field, Equipment and Cables

14 kHz-40 GHz

RS04

N/A

RS05

Electromag Pulse Field

Transients

B.T.P.MADHAV

MIL - STD - 461D

TEST DESCRIPTION FREQ

RE101 RE102 RE103

Magnetic Field Electric Field Antenna Spurious & Harmonics

30 Hz-100 kHz 10 kHz-18 GHz 10 kHz-40 GHz

RS101

Magnetic Field, Equipment and Cables

30 Hz-100 kHz

RS103

Electric Field, Equipment and Cables

10 kHz-40 GHz

RS105

Transient Electromag Field

Transients

CS109 CS114

Structure Current Bulk Cable Injection

60 Hz-100 kHz 10 kHz-400 MHz

CS115

Bulk Cable Injection

Impulse

CS116

Sine Transients - Cables, and Power Leads

10 kHz-100 MHz

B.T.P.MADHAV

MIL - STD - 461E

TEST DESCRIPTION FREQ

RE101 RE102 RE103

Magnetic Field Electric Field Antenna Spurious & Harmonics

30 Hz-100 kHz 10 kHz-18 GHz 10 kHz-40 GHz

RS101

Magnetic Field, Equipment and Cables

30 Hz-100 kHz

RS103

Electric Field, Equipment and Cables

2 MHz-40 GHz

RS105

Transient Electromag Field

Transients

CS109 CS114

Structure Current Bulk Cable Injection

60 Hz-100 kHz 10 kHz-200 MHz

CS115

Bulk Cable Injection

Impulse

CS116

Sine Transients - Cables, and Power Leads

10 kHz-100 MHz

B.T.P.MADHAV

ADVANTAGES OF EMC STANDARDS

The advantages are:

1. Compatibility, reliability and maintainability are increased. 2. Design safety margin is provided. 3. The equipment operates in EMI scenario satisfactorily. 4. Product life is increased.

5. Higher profits are possible.

B.T.P.MADHAV

B.T.P.MADHAV

B.T.P.MADHAV

METHODS TO ELIMINATE EMI OR DESIGN METHODS FOR EMC

The effective methods to eliminate EMI are

1. Shielding 2. Grounding 3. Bonding 4. Filtering 5. Isolation 6. Separation and orientation 7. Circuit impedance level control 8. Cable design 9. Cancellation techniques in frequency or time

domain
10. Proper selection of cables, passive components 11. Antenna polarization control

12. Balancing

B.T.P.MADHAV

Filtering : These are used to filter out conducted EMI. The filtering effectiveness is expressed by Insertion loss (IL). It is defined as

B.T.P.MADHAV

CLASSIFICATION OF EMI FILTERS 1) Low pass power line filters. 2) Low pass telephone line filters. 3) High pass data line filters. 4) Band pass communication filters. 5) Band reject filters. lumped element low-pass filters(capacitive and inductive filters). L-section filters -section filters T-section filters High pass filters Band pass filters Band reject filters
B.T.P.MADHAV

Shielding :

The main objective of shielding is to restrict radiations to a specified region to prevent it from entering into susceptible devices.
The quality of shielding is expressed in the form of shielding effectiveness of the material. The shielding of materials can be solids, screens and braids. They can be in the form of boxes, partitions, cables and connector shields.

B.T.P.MADHAV

B.T.P.MADHAV

Grounding :

Grounding provides a conducting path between electronic devices and

ground. The ground is nothing but some reference point. It is a circuit concept.

The ideal ground is characterized by zero potential and impedance.

GROUNDING is a technique that provides a low resistance path between

electrical or electronic equipment and the earth or common reference

low impedance plane to bypass fault current or EMI signal.

B.T.P.MADHAV

EFFECT OF IMPROPER GROUNDING

Lightning stroke current from radio tower i Radio equipment cabinet

Side flash because of long load grounding lead equipment cabinet VL L di/dt

B.T.P.MADHAV

The types of grounding techniques are

a) Floating Ground : It isolates circuits from a common ground plane. It may

be hazardous some times. The ground plane is in the form of wire or a conductive rod.

b) Single point Grounding : It reduces the effects of facility ground currents.

This is used to control EMP energy. c) The multiple point grounding : It reduces ground lead lengths.

B.T.P.MADHAV

Bonding :

It provides a low-impedance path between two conducting surfaces. It is a

part of grounding and represents its physical implementation. It creates homogeneous structure for current flow and suppresses the

creation of potentials between two metallic parts.

Bonding is useful to protect against the effects of shocks, protect circuits from current return paths.

They reduce potential difference between the devices and carry large faulty
currents. The bonding is of two types. Direct bonding is made by metal-to-metal between the connected elements. Indirect bonding is made by contact using conductive jumpers.

B.T.P.MADHAV

B.T.P.MADHAV

ISOLATION TRANSFORMERS The isolation transformers are used to suppress the common-mode and differential mode interferences. CM is the unwanted electrical p.d b/w any current carrying conductor and the reference ground. DM is the unwanted p.d b/w any two current carrying conductors. Transformers are used to isolate ground current loops.

B.T.P.MADHAV

Vc = ( Vpg + Vng )/2 Vd = (Vpg - Vng )/2

The shield facing the primary side is connected to the primary

neutral to suppress DM interference.

The shield facing the secondary side is connected to the reference ground to suppress CM interference.
B.T.P.MADHAV

Ground loop
Signal wire Circuit-I Ground wire Circuit-II

Ground loop
VG1 VG2

To obtain noise immunity, the ground loop must be broken. This can be done using transformers, optical couplers etc. Flux Circuit-I Ground loop Circuit-II

B.T.P.MADHAV

Electrical surges are short duration transient waves of current, voltage, or power on low voltage power supply lines i.e (<1000v rms ) Such transients produce EMI in the practical operation of equipment.

The energy delivered by a surge to a receptor is W = V(t).i(t) dt

The transient that travels along well protected power supply lines and due to this input stages of the receptors may damage.

There are two categories of transient suppression devices are there 1) Gas discharge tubes. 2) Semiconductor devices. The nature and shape of the transient interference signal waves change during propagation through transmission lines.

B.T.P.MADHAV

Gas Tube surge suppressors

L
Fuse Gas tube supply Surge current Load

1. The gas discharge tube can handle very large transient currents ( >10KA),
when the tube is connected between the line and the ground.

2. When the transient EMI voltage in line exceeds the striking voltage of the tube, an arc discharge occurs and the ionized gas produces a low impedance from line to ground to shunt surge current.

B.T.P.MADHAV

Applications
Because of high current handling capability gas tube surges suppressors are used in AC power distribution lines and in telecom lines as lightning and other high energy surge or transient arrestors.

Drawbacks
Its response time is slow and it cant be used for fast rise time surges. The tube remains in the conducting state even after the surge is removed.

Semiconductor Transient suppressors

Semiconductor transient suppression device maintain a constant voltage at a

desired level across a device by offering variable resistance when transient

voltages are present.

B.T.P.MADHAV

1. METAL OXIDE VARISTORS

Metal oxide varistors in which metal oxide semiconductors are used to exhibit voltage dependent resistance.

Fuse
L supply Load G When connected between line and common point , these devices present very high resistance at normal operating voltage levels. when high voltage spikes appear in the AC or DC line the terminal voltage exceeds the switch on voltage and the resistance decreases rapidly.

ADVANTAGES.
1) Low cost 2) High transient energy absorption

DISADVANTAGES
1) Low average power dissipation.

2) Progressive degradation with repetitive surges

APPLICATIONS
1) Due to high peak current, they used at equipment power input stage.

Component selection
The selection of components can be classified into three categories:

A) Components that affect the RELIABILITY and FUNCTIONALITY .These

Components are marked as RELIABILITY CRITICAL components or

components that MODERATELY affect RELIABILITY.

B) Components that affect the EMI PERFORMANCE are marked as EMI

CRITICAL and EMI MODERATE.

C) Components that affect the AUDIO PERFORMANCE, e.g. Signal to Noise Ratio are marked as AUDIO CRITICAL and AUDIO MODERATE.
B.T.P.MADHAV

Signal control
Shielding uses conductive material to wrap up the EMI completely to ground. In this way, electromagnetic energy is kept inside the system. It also gets harder for an external signal to cause EMI into the system. It is useful to both conducting EMI and radiated EMI. Generally this is an expensive way to protect the sensitive part of the system, and it takes space. It works well for higher frequencies. For clock frequencies or edge rates lower than 100 MHz, EMI is coupled from the clock signal onto the shield and the shield itself does the radiating. In this case, shielding has very little effect. Good decoupling and careful layout can reduce conducting EMI better than shielding, in most cases. Bypassing or "decoupling" capacitors on each active device (connected across the power supply or ground, as close to the device as possible) help to guide the clock or any other high-frequency signal component directly to ground instead of interfering other signals.

B.T.P.MADHAV

B.T.P.MADHAV

TYPICAL SYSTEMS IN ELECTRONIC EQUIPMENT 1) Transmitters. 2) Receivers 3) Antennas 4) Power supplies 5) Motors 6) Control devices 7) Digital circuits 8) Computers 9) Integrated circuits

B.T.P.MADHAV

Transmitters:The physical design of the transmitter should be so as to achieve input-output isolation. Thus high power stages are physically removed from low level signal stages. Interstage shielding will help to achieve isolation where physical isolation is not feasible due to space constraint. Grounding measures should be applied considering multipoint grounding. Lumped or distributed constant filters should be used at required source of interference.

The undesired RF paths should be decoupled by the use of bypass capacitors and
series inductors.
B.T.P.MADHAV

Receivers : -

RF Amplifier

Mixer

IF Amplifier

Demodulat or

AF Amplifier

Local Oscillator RF Must be low noise amplifier. Use AGC circuits to maintain Constant output By maintaining the perfect Isolation Between blocks. By maintaining the high of RF amplifier, sensitivity is also high. Selectivity is to be High. Fidelity ---- Ability of the receiver to reproduce all frequencies.
B.T.P.MADHAV

Objective :To study the behavior of passive components such as resistors, capacitors, inductors and transformers at various frequencies.

To know the factor affecting the choice of components for high frequency applications

Passive components, such as resistors, capacitors, and inductors, are powerful tools for reducing externally induced interference when used properly.
B.T.P.MADHAV

INDUCTORS An inductor or a reactor is a passive electrical component that can store energy in a magnetic field created by the electric current passing

through it.
An inductor is usually constructed as a coil of conducting material, typically copper wire, wrapped around a core either of air or of ferromagnetic material. Guide lines for inductors :Core losses ---- -----Causes Energy losses 1)Eddy currents ------- Amount of energy loss increases with the area inside the loop of current.

2)Hysteresis ---------- Materials with low coercivity have narrow hysteresis loops
and so low hysteresis losses. 3)Non-linearity -------- E.g.... Intermodulation.
B.T.P.MADHAV

When an inductor is inserted in series in a noise producing Circuit , its impedance increases with frequency. The lower frequency signals are permitted to pass due to the low impedance. However, the higher frequency noise elements are attenuated and prevented from proceeding through the circuit.

when general-purpose inductors are used, signal wave forms may become distorted, and satisfactory impedance may not be obtained at noise frequencies

B.T.P.MADHAV

Capacitors : Capacitors are used for charge storage, timing, filtering, blocking, control of rise and fall times and to provide low impedance paths for high frequency signals.

Different Types of Capacitors are -----1.Electrolytic Capacitors 2.Paper Capacitors 3.Mica and Ceramic Capacitors 4.Polystyrene Capacitors

5.Feed through Capacitors

Impedance of the Capacitor is

Z C RS jwl

Rp (1 jwR p C )

B.T.P.MADHAV

When a bypass capacitor is connected from the signal to ground, the capacitor impedance decreases as the frequency increases. Since noise is a high frequency phenomenon, and the impedance is minute at high

frequencies, the capacitor will channel the noise directly to ground, eliminating it
from the circuit. At lower desired frequencies the capacitor appears as an open circuit and the desired frequencies are allowed to pass the filter.

B.T.P.MADHAV

Resistors :Incoming noise is converted to heat and dissipated in the resistor. But note that a fixed resistor does produce thermal noise of its own.

Resistors are grouped into 1) wire-wound 2) Film type 3) Composition-carbon

& mixed Wire-wound Low noise Composition Noise is more.

Film type Noise is in Between wire-wound and composition.

Series Resistors Also among the most important and cheapest of protective elements. Properly selected according to resistance and power dissipation, they can replace more costly elements, with comparable results.

B.T.P.MADHAV

TRANSFORMERS
Used for voltage and current transformation or level shifting, impedance matching, power transfer and Isolation process

This allows noise coupling through the transformer. This coupling can be eliminated by providing an electrostatic or Faraday shield

Conductors : conductors exhibits intrinsic or internal inductance due to thermal magnetic flux an ac resistance due to skin effect. Conductors exhibit external inductance giving rise to external magnetic flux. The external inductance of conductor with diameter d located at distance h above ground plane is L = 0.2 ln (4h/d) H/m Wiring Guidelines :For the purpose of wiring & signal connection the signals can be divided into 1. Digital & Low current, filtered & regulated power signals. 2. Analog and video signals.

3. High current switching signals

4. AC and unfiltered dc main signals.

B.T.P.MADHAV

1. Wires of different types are not be bundled together.

2. Wire bundles of different types of signals should be physically separated from

each other. 3. Minimum separation is to be 6-8cm. 4. The area of current loops on PCBs and board interconnections should be minimum. 5. Maximum loop area should be 4cm2. 6. Divide larger loops with smaller loops. 7. Loops and wires should cross at right angles to each other

8. Distance between twisted pairs should be atleast 1.5 times the twist length.
9. Multiple ckts with common return should be twisted as group. 10. Wires between units should follow the most direct route.
B.T.P.MADHAV

CHAPTER-4

OPEN AREA TEST SITES

B.T.P.MADHAV DEPT.OF ECE KL UNIVERSITY

OPEN AREA TEST SITES

The measurements of radiated emissions and radiated susceptibility of apparatus , equipment constitute two basic electromagnetic interference and electromagnetic compatibility measurements. The purpose of radiation susceptibility testing is to determine the degradation in

equipment performance caused by externally coupled electro magnetic energy.

OPEN AREA TEST SITE MEASUREMENTS

Open site measurement is most direct and universally accepted standard approach for
measuring radiated emissions from an equipment or the radiation susceptibility of a component or equipment

MEASUREMENT OF RE EUT is switched on The receiver is scanned over the specific frequency range It measures electromagnetic emissions from the EUT

It determine the compliance of these data with the stipulated specifications.

EUT

Power line filter Power source

calibrated receiver/ field strength meter

Power source

MEASUREMENT OF RS

EUT is placed in an electromagnetic field created with the help of suitable radiating
antenna. The intensity of the electromagnetic field is varied by varying the power delivered to the antenna by the transmitter amplifier performance of EUT are then observed under different levels of electromagnetic field intensity. EUT

Power line filter Power source

Transmitter Power line filter

Power source

Test Antennas

A convenient approach to illuminate an equipment under test with known field strengths is to used exact half wave length a long dipoles at fixed frequencies. This arrangement is superior when compared to connecting a test antenna to a signal source using co-axial cable that might distort the field pattern.
Antenna Type Rod antenna Loop antenna Biconical antenna Dipole antenna Log periodic antenna Frequency, MHz 1 - 30 1 30 30 220 30 - 1000 200 -1000

Conical log spiral

Wave guide horn

200 10000
Above 1000

Measurement Precautions
1)

Electro magnetic environment According to American national standards describes that is conducted and radiated ambient radio noise and signal levels measured at the test site with the EUT deenergized, be at least 6 db below the allowable limit of the applicable specification or standard.

2)

Electro magnetic scatters

One method fro avoiding interference from underground scatters is to

use a metallic ground plain to eliminate stror reflections from under ground sources such as buried metallic objects.

3)

Power and cable connections The power needs used to energize the EUT, receiver and transmitter should also pass through filters to eliminate the conducted interferences carried by power lines.

B.T.P.MADHAV

B.T.P.MADHAV

B.T.P.MADHAV

B.T.P.MADHAV

B.T.P.MADHAV