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Introduction
ISEHS
PRESENTATION
FLOW
Integrated
Passive Components
Analysis
Conclusion
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ISEHS INTRODUCTION
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ISEHS BACKGROUND
Wireless sensor application in various fields like :
Medicine
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ISEHS BACKGROUND
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Fig. 3. Top view of photodiodes. (a) D1. (b) D2. (c) D3.
(d) Layer key.
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ISEHS CAPACITANCE
CThe
HARACTERIZATION
total capacitance is given by
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where Ev is the energy stored in the capacitor, Vsolar is the voltage difference between the
capacitor plates, and Ct is the total capacitance, which is made up of the metal capacitance Cm
and the diode capacitance Cd.
where Cr is the input capacitance of the regulator and Ct is the storage capacitance
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where 0 is the built in potential of the junction, Ai is the area, and Pi is the perimeter of the ith
diode.
ISEHS EFFICIENCY
where R is the percent of reflected energy, is the power absorption coefficient, and d is the
average depth of the pn junction.
where Ip is the generated electrical current, q is the charge of an electron, Popt is the incident
optical power, h is Plancks constant, and v is the frequency of the incident light.
Fig. 6. (a) Output power versus incident light intensity and load
resistance. Active area = 3000 m2 , photodiode D1 output power = 400
nW when RL = 500 k and input intensity = 25 kLUX. (b) Photodiode
D2 output power = 600 nW when RL = 400 k and input intensity = 25
kLUX. (c) Photodiode D3 output power = 800 nW when RL = 230 k and
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input intensity = 25 kLUX.
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Fig. 14. (a) Ultracapacitor capacitance per unit volume versus total capacitance. Dashed
line represents the linear best fit model. (b) Comparison of capacitance density versus
supply voltage for a 10 F capacitor for ultracapacitor technology, theoretical limit (TL1)
of interconnect capacitance, and vertical parallel plate (VPP) interconnect capacitance.
Supply voltage years correspond to the ITRS roadmap.
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ISEHS CONCLUSION
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