Silicon and Wafer Preparation

Lyndon Mark P. Olaguera

PS147: Physical Electronics

OBJECTIVES
At the end of this lesson, the student should be able to:
1. describe how the raw silicon is refined into semiconductorgrade silicon.
2. explain the crystal structure and growth method for
producing mono-crystalline silicon.
3. outline and describe the basic process steps for wafer
preparation, starting from a silicon ingot and finishing with
a wafer.
4. explain what epitaxy is and why it is important for wafers.

Semiconductor Grade Si
Pure siliconused to minimize micro-defects at the
atomic level of the silicon that are detrimental to
semiconductor performance.
Semiconductor grade Si(SGS)highly refined
silicon
>>also known as electronic grade silicon

Semiconductor Grade Si

Source: Semiconductor Manufacturing Technology by Michael Quirk, Julian Seda, 2001

Siemens Process
Silicon produced
by this process
does not have
atoms arranged
in a desirable
crystal order.

Source: Semiconductor Manufacturing Technology by Michael Quirk, Julian Seda, 2001

CRYSTAL STRUCTURE
CRYSTAL>>a solid
material that has an
ordered, repeatable
three dimensional
pattern over a long
range of many
atoms.

Source: Semiconductor Manufacturing Technology by Michael Quirk, Julian Seda, 2001

CRYSTAL STRUCTURE
Amorphous Materials
>>non crystalline solids
that lack a repetitive
structure and demonstrate
structural disorder at the
atomic level.
E.g. Plastic
Source: Semiconductor Manufacturing Technology by Michael Quirk, Julian Seda, 2001

CRYSTAL STRUCTURE
Unit Cell
>>the simplest
arrangement of atoms
that, when repeated in
a three dimensional
framework gives the
crystal structure.

Source: Semiconductor Manufacturing Technology by Michael Quirk, Julian Seda, 2001

CRYSTAL STRUCTURE

http://2.bp.blogspot.com/-B-6gSM0wsXw/UC_bwvm7ooI/AAAAAAAABAw/1y1TIhYkcpc/s1600/seven.pnghttp://2.bp.blogspot.com/-B6gSM0wsXw/UC_bwvm7ooI/AAAAAAAABAw/1y1TIhYkcpc/s1600/seven.pnghttp://2.bp.blogspot.com/-B6gSM0wsXw/UC_bwvm7ooI/AAAAAAAABAw/1y1TIhYkcpc/s1600/seven.pngv

CRYSTAL STRUCTURE

Source: Semiconductor Manufacturing Technology by Michael Quirk, Julian Seda, 2001

CRYSTAL STRUCTURE
Within a crystal structure, unit
cells are tightly packed,
therefore, share atoms.
Sharing of atoms this is how
unit cells build up into a
cohesive crystal lattice
structure.
FCC unit cellfour shared
atoms.
Silicon crystalFour shared
and Four unshared (four
atoms inside the cubic
structure)
Source: Semiconductor Manufacturing Technology by Michael Quirk, Julian Seda, 2001

POLY-CRYSTAL and MONOCRYSTAL

Poly crystalthe unit cells are not in a regular arrangement.
Silicon produced from the semiconductor grade purification process
poly-silicon.
Mono-crystalsif unit cells are neatly arranged in a three dimensional,
repeatable manner.

Source: Semiconductor Manufacturing Technology by Michael Quirk, Julian Seda, 2001.

REQUIREMENTS for Si Wafer Processing

Pure
Mono-crystalline
WHY??
1. Repeatable units provide the desirable
electrical and mechanical properties

CRYSTAL ORIENTATION

(100) common for MOS devices, GaAs devices.

(111)bipolar devices (tighter packing density)

Source: Semiconductor Manufacturing Technology by Michael Quirk, Julian Seda, 2001.

MONOCRYSTAL SILICON GROWTH

Crystal Growthprocess of converting the polysilicon chunks of SGS into
a large monocrystal of Si.
INGOTgrown silicon monocrystal.
Czochralsky Method (CZ)--Most commonly used technique for growing
monocrystal ingots.

Source: Semiconductor Manufacturing Technology by Michael Quirk, Julian Seda, 2001.

MONOCRYSTAL SILICON GROWTH

Objectives of the pull process:
Replicate the seed structure while obtaining dopant
uniformity
Achieving the correct ingot diameter
Limiting the introduction of impurities

Parameters affecting the growth process:

1. Pull rate
2. Crystal rotation
3. //Temperature

DOPING

Adding impurities to obtain the desired resistivity

Resistivity of pure silicon =2.5x10^5 ohm-cm

FLOAT ZONE METHOD

Produces a silicon monoscrystal ingot which significantly lower oxygen
content.
Produces ingots with smaller diameters.

WAFER DIAMETERS

WAFER PREPARATION

SHAPING OPERATIONS
End Removal
Diameter Grinding
Wafer Flat or Notch

Source: Semiconductor Manufacturing Technology by Michael Quirk, Julian Seda, 2001.

WAFER IDENTIFYING FLATS

Source: Semiconductor Manufacturing Technology by Michael Quirk, Julian Seda, 2001.

WAFER SLICING

http://www.pveducation.org/node/496

WAFER LAPPING

http://www.microchemicals.com/uploads/pics/wafer_lapping_polishing.jpg