Professional Documents
Culture Documents
Benefits
Disadvantages
History
Basic operation
Engineering Design
Cold plate
Refrigerants
Capillary tube
Condensation
Product Reliability
Current applications:
Supercomputer and Mainframe Cooling
Current research:
Microscale VCRS
Benefits
(peeples, 2001)
Benefits
Sub
Benefits
Carrier mobility- velocity of charge carriers in a solid material with an electric field
Benefits
Disadvantages
History
Basic Operation
(Peeples,2001)
Basic Operation
Ideal cycle
1-2 The working refrigerant, a saturated vapor, is carried
through the suction tube to the compressor. The
compressor compresses the saturated vapor into a
superheated vapor which is then passed to the condenser.
2-3 The heat of the hot and high pressure vapor is released
into the environment from the condenser. The working gas
is transformed into a saturated liquid.
3-4 The liquid is pumped through a capillary tube or a
thermal expansion valve into the evaporator, dropping
significantly in temperature. The working fluid is a saturated
mixture.
4-1 Heat flows into the evaporator from the heat source.
The heat vaporizes all the working liquid (refrigerant), at the
end of this stage the vapor is saturated, and the process
repeats.
(Peeples,2001)
Basic Operation
Qout,
12 isentropic (s=const)
23 isobaric (P=const)
34 isenthalpic (h=const)
41 isobaric ( P=const)
(Peeples,2001)
Win
Qin = QL
Basic Operation
ws h2 s h1
wa h2 h1
Basic Operation
Actual cycle
The
Basic Operation
Note that the pressure drops between stages 8-1, 2-3,4-5 etc. cause alterations
to the TS diagram. The process 1-2 represents a compression path that may
be more desirable than the 1- 2 pathway because the specific volume
of the refrigerant is lower and thus the work input is lower.
Basic Operation
Basic Operation
The Coefficient of performance of the VCR is the ratio of heat into the
evaporator to work put into the compressor. Generally, the COP is
around 2 to 3.
Q e
COP
W c
h1 h4
COP
h2 h1
(Cengel and Boles, 2002)
Basic Operation
QL
revers
TH
TL
Basic Operation
1
1
QH /Q L 1 TH /T L1
Basic Operation
Engineering Goals
Cold Plate/Evaporator
Refrigerant Fluids
(Peeples,2001)
Refrigerant Fluids
The next slide shows the P-T curves of R-404a and R-134a
describing the refrigerants lowest practical operating limit.
(Peeples,2001)
(Peeples,2001)
Capillary Tube
(Heydari, 2002)
Condensation
Condensation, much like in TEC, is a
problem because the surfaces of the VCR
may be lower than the dew point.
Since water is hazardous to electronic
assemblies, condensation must be
minimized by insulating surfaces from air
in spot-cooling applications. (Peeples,2001)
More on sealants later on in the slides.
Product Reliability
Electro-mechanical
systems generally have
product life cycles called
bathtub curves.
The curve has three
distinct regions
Infant mortality- rate of
failure decreases with time
Normal use-rate of failure
relatively constant
Wear out- rate of failure
increases with time.
(Peeples,2001)
Improving Performance
Improving Performance
Cascade Refrigeration
(Schmidt et al.,2002)
Below the MCM are blowers that provide air cooling for
all of the components in the processors except for the
processor module, which is cooled by refrigeration.
Below the blowers are two modular refrigeration units
(MRUs-the VCR) which provide cooling via the
evaporator mounted on the processor module.
In the bottom of the mainframe are the input/ output
(I/O)connections and two blowers. The blowers cool
the I/O connections, as well as, provide the cooling for
the condenser of the MRUs.
(Schmidt et al.,2002)
(Schmidt et al.,2002)
expansion
valve
DC rotary compressor
(Schmidt et al.,2002)
Condensation Protection
Condensation Protection
Microscale VCRs
Microscale Evaporators
Microscale Condenser
Refrigerant Fluids
Refrigerant COP
Ammonia
Refrigerant
R718
R134a
R-22
R-407c
R507a
2
COP
Refrigerant Fluids
Refrigerant Fluids
Refrigerant Fluids
Microscale VCRs
(Moran,2001)
Microscale VCRs
(Moran,2001)
Microscale VCRs
Microscale VCRs
(Moran,2001)
Microscale VCRs
The expansion and compression
diaphragms are the only moving parts.
Expansion of the working gas directly
beneath the expansion diaphragm in each
cycle creates a cold top end for extracting
heat, while compression at the other
bottom end creates a hot region for
dissipating heat.
(Moran, 2001)
References
Cengel and Boles, 2002, Yunus A., Boles, Michael A. (2002). Thermodynamics: an Engineering Approach.
New York: NY: McGraw-Hill.
Chiriac, Florea; &Chiriac, Victor (2005). An alternative Method for the Cooling of Power Microelectronics
Using Classical Refrigeration. ASME/Pacific Rim Technical Conference and Exhibition on Integration and
Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging. pp 425-430.
Heydari, Ali. (2002). Miniature Vapor Compression Refrigeration System for Active Cooling of High
Performance Computers. 8th Intersociety Conference on Thermal and Thermommechanical phenomena
in Electronic Systems. pp. 371-378.
IEEE Standard Dictionary of Electrical and Electronics Terms. (1973). New york: Wiley-Interscience.
Moran, Mathew E. (2001). Micro-Scale Avionics Thermal Management. 34th International Symposium on
Microelectronics sponsored by the International Microelectronics and Packaging Society.
Peeples, John. W.(2001). Mechanically Assisted Cooling for High Performance Applications. Advances in
Electronics Packaging; Procedings of the Joint ASME/JSME Conference on Electronics Packaging. Pp.
899-904.
Phelan, Patrick; Chiriac, Florea; &Chiriac, Victor (2004). Designing a Mesoscale Vapor-Compression
Refrigerator for Cooling High-Power Microelectronics. Intersociety Conference on Thermal Phenomena,
1, pp. 218-223.
Schmidt, Roger R., and Notohardjono, Budy D. (2002). High-End Server Low-Temperature Cooling. IBM
Journal of Research and Development, 46 ( 6), pp. 739-750.
Wikipedia the Free Encyclopedia (August 2006). CMOS. Retrieved August 2006.
http://en.wikipedia.org/wiki/CMOS .
Wikipedia the Free Encyclopedia (August 2006). Electron mobility. Retrieved August 2006.
http://en.wikipedia.org/wiki/Electron_mobility