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ISSUES TO ADDRESS...
How are electrical conductance and resistance
characterized?
What are the physical phenomena that distinguish
conductors, semiconductors, and insulators?
For metals, how is conductivity affected by
imperfections, temperature, and deformation?
For semiconductors, how is conductivity affected
by impurities (doping) and temperature?
Chapter 18 -
(d)
(d)
(a)
45 m
0.5 mm
Electrical Conduction
Ohm's Law:
V=IR
geometry
Conductivity,
surface area
of current flow
current flow
path length
Chapter 18 -
Ohm's Law
Thisrelationshipstatesthat:Thepotential
difference(voltage)acrossanidealconductoris
proportionaltothecurrentthroughit.The
constantofproportionalityiscalledthe
"resistance",R.Ohm's Lawisgivenby:V=IR
whereVisthepotentialdifferencebetweentwo
pointswhichincludearesistanceR.
Chapter 18 -
resistivity
Electrical resistivity (also known
as resistivity, specific electrical resistance, or
volume resistivity) is an intrinsic property that
quantifies how strongly a given material
opposes the flow of electric current. A
low resistivityindicates a material that readily
allows the flow of electric current.
Chapter 18 -
Conductivity
Definitions
Further definitions
J=
J current density
electric field potential = V/
J = (V/ )
Electron flux
conductivity
voltage gradient
Chapter 18 -
Conductivity: Comparison
Room temperature values (Ohm-m)-1 = ( - m)CERAMICS
conductors
1 METALS
-10 -10 -11
Soda-lime glass 10
Silver
6.8 x 10 7
-9
Concrete
10
Copper
6.0 x 10 7
-13
Aluminum oxide <10
Iron
1.0 x 10 7
SEMICONDUCTORS
Silicon
Germanium
GaAs
POLYMERS
4 x 10 -4
Polystyrene
2 x 10 0
Polyethylene
<10
10
-14
10 -6
semiconductors
insulators
Selected values from Tables 18.1, 18.3, and 18.4, Callister & Rethwisch 8e.
Chapter 18 -
Chapter 18 -
partly
filled
band
filled
band
filled
band
filled states
band
filled
filled states
Chapter 18 -
Insulators:
GAP
filled
valence
band
filled
band
filled states
GAP
filled
valence
band
filled
filled states
band
Chapter 18 -
5
4
increases with:
Cu + 3.32 at%Ni
3
d Cu + 1.12 at%Ni
Ohm-m)
deformed
-8
Cu + 1.12 at%Ni
2
i
Resistivity,
(10 1
-200
=thermal
Pure Cu
-100
-- temperature
-- wt% impurity
-- %CW
T (C)
Adapted from Fig. 18.8, Callister & Rethwisch 8e. (Fig. 18.8
adapted from J.O. Linde, Ann. Physik 5, p. 219 (1932); and C.A.
Wert and R.M. Thomson, Physics of Solids, 2nd ed., McGraw-Hill
Book Company, New York, 1970.)
impuri
ty
Chapter 18 -
+ deformation
Estimating Conductivity
Question:
180
50
160
40
140
125
30
120
Ohm-m)
100
-8 20
21 wt% Ni
10
80
Resistivity,
(10
0
60
0 10 20 30 40 50
0 10 20 30 40 50
Yield strength (MPa)
wt% Ni, (Concentration C)
From step 1:
CNi = 21 wt% Ni
Chapter 18 -
Intrinsic Semiconductors
Pure material semiconductors: e.g., silicon &
germanium
Group IVA materials
Compound semiconductors
III-V compounds
II-VI compounds
Chapter 18 -
electron
hole
pair migration
no applied
electric field
+ -
applied
electric field
applied
electric field
Adapted from Fig. 18.11,
Callister & Rethwisch 8e.
# holes/m3
hole mobility
# electrons/m3
electron mobility
Chapter 18 -
Intrinsic Semiconductors:
Conductivity vs T
Data for Pure Silicon:
-- increases with T
-- opposite to metals
material
Si
Ge
GaP
CdS
Chapter 18 -
Extrinsic:
-- electrical behavior is determined by presence of impurities
that introduce excess electrons or holes
-- n p
n-type Extrinsic: (n >> p)
Phosphorus atom
4+ 4+ 4+ 4+
4+ 5+ 4+ 4+
4+ 4+ 4+ 4+
Adapted from Figs.
18.12(a) & 18.14(a),
Callister & Rethwisch 8e.
no applied
electric field
Boron atom
hole
conduction
electron
4+ 4+ 4+ 4+
valence
electron
4+ 4+ 4+ 4+
Si atom
4+ 3+ 4+ 4+
no applied
electric field
Chapter 18 -
-- increases doping
-- reason: imperfection sites
lower the activation energy to
produce mobile electrons.
Comparison: intrinsic vs
extrinsic conduction...
-- extrinsic doping level:
1021/m3 of a n-type donor
impurity (such as P).
-- for T < 100 K: "freeze-out,
thermal energy insufficient to
excite electrons.
-- for 150 K < T < 450 K:
"extrinsic"
-- for T >> 450 K: "intrinsic"
doped
undoped
3
2
1
freeze-outextrinsic
intrinsic
0 electron
Conduction
concentration
(1021/m3)
0
200
400
600
T (K)
Chapter 18 -
Chapter 18 -
-- No applied potential:
no net current flow.
-- Forward bias: carriers
flow through p-type and
n-type regions; holes and
electrons recombine at
p-n junction; current flows.
-- Reverse bias: carriers
flow away from p-n junction;
junction region depleted of
carriers; little current flow.
p-type
+
-n-type
-
+ + +
+ -
+ p-type
+
+
+
+
Adapted from
Fig. 18.21
Callister &
Rethwisch
8e.
n-type
-
n-type
-
Chapter 18 -
Chapter 18 -
Junction Transistor
Chapter 18 -
MOSFET Transistor
Integrated Circuit Device
Chapter 18 -
Chapter 18 -
Ferroelectric Ceramics
Experience spontaneous polarization
BaTiO3 -- ferroelectric below
its Curie temperature (120C)
Piezoelectric Materials
Piezoelectricity
application of stress induces voltage
application of voltage induces dimensional change
stress-free
with applied
stress
Adapted from Fig. 18.36, Callister & Rethwisch 8e. (Fig. 18.36 from Van Vlack, Lawrence H., Elements of
Materials Science and Engineering, 1989, p.482, Adapted by permission of Pearson Education, Inc.,
Upper Saddle River, New Jersey.)
Chapter 18 -