Tutorial 3

Disediakan oleh :
 Penyaduran Plastik
menggunakan Logam (Kuprum)

Penyaduran kuprum dan penyaduran

elektrik bergantung pada electrodeposition
untuk menyalut substrat tersebut.
Plastik tidak conduct elektrik.
Melaksanakan beberapa langkah-langkah
awal mesti diambil sebelum proses
penyaduran
 Molding:necessary to ensure the plastic is the highest
quality, which is essential for effective copper electroplating.
Molding involves converting the plastic into suitable shapes.
Cleaning:remove soil, dirt and debris from the plastic part.
Mild alkaline cleaning solution can be used, or a highly-
wetted chromic acid solution can be used to ensure
thorough wetting prior to etching.
Pre-dipping:Pre-dipping the cleaned part in a solvent prior
to etching will improve the surface of highly-stressed parts,
particularly those made of ABS and other organic polymers,
which allows for a more uniform coating. It can also be used
to swell the surface of normally hard-to-etch plastic parts,
enabling the etchant to more readily attack the substrate
surface.
 Etching:An etchant is a potent oxidizing solution that will eat
away the surface of the plastic part to a certain extent, which
provides two important benefits: it makes the part more
amenable to accepting water, and it creates microscopic holes
in the surface that promote better adhesion between the plastic
and the metal ions in the plating solution.
Neutralizing:Neutralizing entails the use of sodium bisulfite or
a similar material to eliminate any excess etchant from the part.
Activating:An activator typically contains a precious metal
such as gold, palladium or platinum, and it serves as a catalyst
during plating.
Accelerating:After activation, an accelerator is applied to
remove excess stannous hydroxide, which is necessary to
enable the precious metal in the activator to fulfill its role as a
catalyst.
 Electroless Plating

Once all of the above pretreatment steps have been

completed, the next phase of the copper
electroplating involves electroless plating. The
electroless plating process deposits an adherent
metallic film onto the surface of the substrate,
which renders it electrically conductive. Electroless
plating differs from electroplating in that no
electrical current is introduced into the plating bath.
Instead, deposition occurs via chemical reduction.
 Electroless Plating

Setelah semua langkah di atas telah selesai,

penyaduran kuprum melibatkan penyaduran
electroless (Electroless Plating). Electroless proses
penyaduran deposit filem logam yang pengikut ke
permukaan substrat, yang menjadikan ia pengalir
elektrik. Penyaduran Electroless berbeza daripada
penyaduran elektrik yang tiada arus elektrik
diperkenalkan ke dalam mandian penyaduran.
Sebaliknya, pemendapan berlaku melalui proses
pengurangan kimia
Elektrolisis Air Garam (brine)

http://www.gcsescience.com/pt11.htm
Anod : 2 Cl (aq) Cl2(g) + 2e
: 4 OH(aq) O2(g) + 2 H2O (aq) + 4e
: Pengoksidaan ion klorin berlaku (hilang elektron) kepada
atom klorin. Atom klorin kemudian bergabung dan
menjadi klorin
molekul
Katod : Na +(aq) +e Na(s)
: H+ (aq) + 2e H2(g)
: Penurunan ion hidrogen berlaku (menerima elektron) kepada
atom hidrogen. Atom hidrogen kemudian bergabung dan
menjadi hidrogen molekul