KL 3224 System Design

Hilmi Sanusi
 Spesification
Dimension
Components placement
Application
Frequency usage of the design :
DC
Low Frequency
Audio range
High Frequency
microwave
Environment
Noise from EMC RFI and EMI
Temperature range
Will limits the design in term of:
Shape of the PCB
Dimension, shape, thickness of the board, etc
Components placement
Input location,
Output location,
Heat dissipation,
bypass capacitor
Required layers
etc
 Required/desired need for PCB design
Grounding
Track width
Dielectric of the board
Thickness of the track
Required need of the track
Amount of current
Types of signal that pass through the track
Analog
Digital
Interference from produced modulation from the
current that pass through the track
 Type of grounding/earthing
Arrangement of modular segmentation
EMC interference
Placement of input/output/power/heat
Type of track
Bus
track corner
junction
Type of pad
Pad size
Placement of pad
Type of pad
Type of Connections
Jumper
via
 PCB

Low Frequency High frequency

DC High frequency

Low frequency
Microwave
< 400Hz

Audio range

Emc rfi & emi

Noise Interference Capacitive and inductive effect of the
Power line modulation track and patch
Back propagation from switching Track corner
single layer Shielding effect
Double layer Skin effect
(Isolation) Multiple layer
grounding Two layer (microstrip)
 Application

Dimension limitation
Operating frequency Specification
and component

Component selection
Track width to satisfy the
Segmentation
Type of ground Specification
Modular
Interconnect Footprint of the
selected component
 Layer / type of the board
EMC
Track width
Overall design
Modular / segment / component placement
PCB shape and dimension limitation
Components selection
Footprint and dimension
Dimension
Footprint
Usage
- Tolerance
- specification
- rating
 Based on
Rating
Specification
dimension