A

SEMINAR
ON

Integrated power electronics

module
Presented by

Swapnil Subhash Patil .

TE E&TC

Guided by
Prof. V. M. Deshmukh
 CONTENTS
INTRODUCTION

FEATURE OF IPEMS

EMBEDDED POWER TECHNOLOGY

ADVANTAGES AND DISADVANTAGES

APPLICATION

CONCLUSION

REFERENCES
 INTRODUCTION
Power electronics modules are key units in a
power electronics system.
These modules contain integration of power
switches and associated electronic circuitry for
drive control and protection.
The objective of power electronics circuits is
electronics energy processing and hence require
high power handling capability and proper
thermal management.
 FEATURE OF IPEMS
Power devices and their drive and protection circuit is
called the active IPEM and the remaining part is called
passive IPEM.
Passive components include inductors, capacitors,
transformers etc.
The commonly used power switching devices are
MOSETs and IGBTs.
IGBT Gate Drivers

Low Propagation delay < 100ns

Enables application in high frequency
switching circuits of the order of 50kHz
Peak Gate Driver Current of 30A and
provision for paralleling of IGBTs
 EMBEDDED POWER TECHNOLOGY
Embedded power technology is a three-dimensional,
multilayer integrated packaging technology.
Figure shows the conceptual structure of an embedded
power packaged module.
It consists of three parts: embedded power stage,
electronics circuitry and base substrate, which are
soldered together to build a module.
Steps Description
Ceramic Frame Opening in flat Al2O3 plate by laser cutting
Die mount Dispense dielectric
Dielectric pattern Void free precision dielectric pattern, good
adhesion by screen printing
Metallization Adhesion, barrier, low stress, low resistance by
sputtering of Ti/Cr-Cu thin film

Table: processing step for embedded power stage.

 Comparison of wire bond and IPEM

Comparison of wire bond and IPEM

 ADVANTAGES
Modular approach .

Improved usage of space.

Reduction of components and inter connects.

Reduction in structural packaging inductance.

 DISADVANTAGES

It is very complex compared to other 2-D modules.

It requires efficient combination of a large number of

different technologies.
 APPLICATION

Motor drives

UPS systems

Power supplies

Inverters

Converters
 CONCLUSION
In power electronics modules further improvements in performance,
reliability and cost can be achieved by using IPEMs. Various experiments
have proved its manufacturability and other features of this technology.
The impacts of system integration via IPEM will enable a rapid growth of
power electronics that can be compared to the impacts in computer
applications brought about by VLSI technology.
 REFERENCES
[1] B.K.Bose, Modern power electronics , Jaico Books.

[2] B. G. Streetman, S. Banerjee, Solid state electronic devices, PHI.

[3] www.seminarsonly.com

[4]F.C.Lee, J.D.Van Wyk, D. Boroyevich, G.Q. Lu, Z. Liang and P. Barbosa

Technology trends towards system in a module in power electronics ,
IEEEcircuits &systems.