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Chang Liu
Micro Actuators, Sensors, Systems Group
University of Illinois at Urbana-Champaign
MASS
Chang Liu
UIUC
Definition of Piezoresistive Sensing
MASS
Chang Liu
UIUC
Stress-Strain Relation
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Chang Liu
UIUC
Physical Causes of Piezoresistivity
• Change of relative dimensions, as the resistance is related to
length and cross-sectional area (local).
l
R dR
dL
L
d
L
dA
A A A A2
dR dL d dA
R L A
MASS
Chang Liu
UIUC
Why Electrical Conductivity Change With
Stress/Strain?
• Change of electrical conductivity and resistivity as a result of
crystal lattice deformation.
• Strain causes the shape of energy band curves to change,
therefore changing the effective mass, m*. Therefore electrical
conductivity s changes. 2
h
m*
d 2 E / dk 2
qt
s
m*
R L
G
R L
R stresss E
R
G R
l R
l
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Chang Liu Why the big difference between materials? UIUC
Applications at Macroscale
• Spot-weldable strain gauges are used with
strain gauge sensors and a vibrating wire
indicator or data logger to monitor strain in
steel members. Typical applications include:
• Monitoring structural members of buildings
and bridges during and after construction.
• Determining load changes on ground anchors
and other post-tensioned support systems.
• Monitoring load in strutting systems for deep
excavations.
• Measuring strain in tunnel linings and supports.
• Monitoring areas of concentrated stress in
pipelines.
• Monitoring distribution of load in pile tests.
MASS
Chang Liu
UIUC
Metal Strain Gauge
• For metals, the resistivity is not
changed significantly by the stress. The
gauge factor is believed to be
contributed by the change of
dimensions. These may be made from
thin wires or metal films that may be
directly fabricated on top of micro
structures. Typical strain gauge pattern
is shown in the following figure. Thin
film strain gauges are typically
fabricated on top of flexible plastic
substrates and glued to surfaces.
• etched foil gauges
– These strain gauges consist of a
conduction path etched onto metal clad
plastic film. The strain gauges are
designed to be glued, using very special
procedures onto the component to be
tested. When the component stretches,
the strain gauge will also stretch as will
the etched conduction path.
• Nickel-Chrominum alloy
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Chang Liu
UIUC
Two Primary Classes of Piezo-resistor
Configuration
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Chang Liu
UIUC
Semiconductor Strain Gauge
• The very first semiconductor strain gauge used a doped silicon
strip attached to a membrane of another material.
• In semiconductor strain gauges, the piezoresistive effect is very
large, leading to much higher G.
• P-type silicon has a G up to 200 and n-type has a negative G of
down to -140.
• Strain gauges can be locally fabricated in bulk silicon through
ion implantation or diffusion
MASS
Chang Liu
UIUC
Gauge factor of polysilicon with doping
N type P type
Phosphorous doped Si Boron doped Si
-22 30
-20 28
-18 26
-16 24
-14 22
-12 20
-10 18
-8 16
-8 14
-6 12
-4 10
-2 8
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Chang Liu
UIUC
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Chang Liu
UIUC
Why Use Semiconductor Strain Gauge
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Chang Liu
UIUC
Merit of Piezoresistive Sensors Vs Capacitive
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Chang Liu
UIUC
Single Crystal Silicon Vs. Polycrystal
• Single Crystal Silicon: Uniform crystal orientation throughout
the entire material.
– Method of growth: heat melt (bulk); epitaxy (thin film)
• Polycrystal silicon: crystal orientation exist with in individual
grains which are separated by grain boundaries.
– Methods of growth: low pressure chemical vapor deposition;
sputtering (like a metal).
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Chang Liu
UIUC
Piezoresistivity Components
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Chang Liu
UIUC
Example
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Chang Liu
UIUC
Methods for Compensating Temperature Effect
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Chang Liu
UIUC
Wheatstone Bridge Circuit -
Transforming resistance change to voltage change
Common configuration.
Rs R R
R2 R4
Vout Vin
1
R R2 R3 R4
R R
Vout Vin
R ( R R ) 2 R
R / 2
R Vout Vin
(R ) 2 R R
R 1 R
Vin 2 Vin
2 R R 2 2 R R 2( R
)
R Temperature in-sensitive!!
2
MASS
Chang Liu
UIUC
Strain Gauge Made of Single Crystal Silicon
- A Pressure Sensor
• Process
• Etch backside to form
diaphragm with controlled
thickness.
• Silicon is selectively doped
in the region where stress is
greatest.
• Difference of pressure
across the diaphragm will
cause stress concentration.
MASS
Chang Liu
UIUC
Stress Analysis and Sensor Placement
displacement Stress
4w 4w 4w p
2 2 2 4
x 4 x y y D
Differential eq.
For displacement.
2mx 2ny
w amn 1 cos 1 cos
m 1 n 1 a b
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Chang Liu
UIUC
Pressure Sensor Based On Polysilicon
• Sensors placed on edges (highest tensile stress) and center
(highest compressive stress).
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Chang Liu
UIUC
Fabrication Process
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Chang Liu
UIUC
Fabrication Process (Continued)
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Chang Liu
UIUC
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Chang Liu
UIUC
Piezoresistive Accelerometer
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Chang Liu
UIUC
Condition for Mechanical Equilibrium
Tensile
Compressive
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Chang Liu
UIUC
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Chang Liu
UIUC
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Chang Liu
UIUC
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Chang Liu
UIUC
Relationship between maximum stress and applied
force
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Chang Liu
UIUC
Example 6.2
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Chang Liu
UIUC
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Chang Liu
UIUC
Good vs. Bad Designs
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Chang Liu
UIUC
• When one tried to bend a cantilever beam, the failure always
occurs at the anchored end and the surface of the beam. Why?
MASS
Chang Liu
UIUC
Comments on Mechanical Failure
– Fatigue
• If repeated cycle of force is applied to a mechanical member, with the
induced strain much lower than that of the fracture strain, the member
may failure after repeated cycles.
• Mechanism: microscopic defects (bubbles, dislocations) amplifies
over time and causes stress concentration (re-distribution of stress).
The defects are often hidden underneath the surface of the material.
MASS
Chang Liu
UIUC
Stress-Strain Curve
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Chang Liu
UIUC
Case 6.1: Analysis of Accelerometer
• Acceleration induced force F, F=ma.
• The force induces stress at the fixed end of the cantilever beam.
• The stress is detected by chance in resistance.
Assumptions
• assume entire resistance is
concentrated at the
anchor;
• for moment of inertia at
the end, ignore the
thickness of the resistor.
• Assume the stress on the
resistor is the maximum
value.
• The proof mass is rigid. It
does not bend because of
the significant thickness
and width.
MASS
Chang Liu
UIUC
Analysis of Sensitivity
• Under a given a, the force has a magnitude F m a
L
• The moment applied at the fixed end of the beam is M F (l )
2
L L
6GF (l ) 6Gm(l )
R 2 2 a
G max
Ewt 2 Ewt
2
R
MASS
Chang Liu
UIUC
Stress state analysis example
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Chang Liu
UIUC
Stress state analysis example
MASS
Chang Liu
UIUC