Submitted by, Robin Thomas(s7 A)[33] Pranoy T.

Jose(s7 A)[29] Rejo George Varghese(S7 A)[30] Nithin Alex John(S7 A)[26]

IC PACKAGING
o Semiconductor industry manufactures large variety of Integrated

circuits with different packaging requirements. o Package attributes taken into consideration when choosing a package type for a particular semiconductor device include: size, lead count, power dissipation, field operating conditions & cost.

ROLES OF IC PACKAGING
o Two Primary and Fundamental functions : 1) the IC package protects the die from physical damage 2) redistributes the I/O to a more manageable pitch in assembly o Number of potential secondary roles : 1) providing a structure more amenable to standardization 2) providing a thermal path away from the die 3) providing protection from the potential of soft errors due to alpha particles 4)providing a structure more easily disposed to electrical test and burn-in o The IC package has several roles to play as keeper of the chip

o package can also serve to interconnect multiple IC : 1)directly to each other using standard interconnection technologies, such as wire bonding 2) indirectly using interconnection pathways provided on the package, such as those used in hybrid packages and MCMs

CLASSIFICATION
o broadly separated and defined by their basic construction :

1) lead frame-type packages 2) substrate-type packages a) organic-laminate b) ceramic-base materials

o There is now package product family concerned with the assembly of ICs

on the wafer called wafer-level packaging (WLP)

- packaging elements

typically are constructed on the face of the wafer, resulting in a true chipsize package.

o depending on next level of interconnection : 1) lead frame and the dual in-line package (DIP), are designed for either pin-in-hole solder assembly 2) pin-grid array (PGA), are designed for socketing 3) compliant-lead-type lead frame packages are designed for surface mounting Eg: quad flat pack (QFP), the leadless-type lead frame package, quad flat no-lead (QFN) package o QFP and QFN are representatives of peripherally leaded packages

Area Array Packages

o ADV : handle high I/O without sacrificing performance & natural area conservancy

E.g.: Ball grid array (BGA) made using organic laminate substrates

TYPES OF IC PACKAGING

1) Ceramic Ball Grid Array :square-shaped or rectangular ceramic

package that uses solder balls for external electrical connection instead of leads. These solder balls are arranged in a grid or array at the bottom of the ceramic package body, hence the name 'ceramic ball grid array

2) Ceramic Column Grid Array :CCGA, is a square-shaped or

rectangular ceramic package that uses solder columns for external electrical connection instead of leads or solder balls. These solder columns are arranged in a grid or array at the bottom of the ceramic package body, hence the name 'ceramic column grid array' . 3) Ceramic Dual-in-Line Package :It is a rectangular ceramic package that has leads extending from both of its longer sides, thus forming two sets of in-line pins. 4) Ceramic Package : is a hermetically sealed rectangular ceramic package that has leads extending from both of its longer sides, thus forming two sets of in-line pins

5) Ceramic Leadless Chip Carrier :is a square or rectangular

surface-mount ceramic package that has no leads

6) Ceramic Pin Grid Array :CPGA, is a square or rectangular

through-hole ceramic package whose pins or leads are arranged in a square array at the bottom of the package body.

7) Ceramic Quad Flat Pack :CQFP, is a ceramic IC package

with leads extending from all four sides of the package body.

8) Dual Flat No Leads Package: a very small square-shaped or

rectangular surface-mount plastic package with no leads. Metal pads or lands along two sides of the bottom of the DFN package serve as electrical connection points to the outside world . The DFN is similar to the QFN, except that the latter has lands all around the periphery of the package instead of just two sides like the DFN.

9)Decawatt Package :C package developed by Motorola to

encase discrete high-power devices. The DPAK is also known as the 'TO-252'

10) Power Quad Flat No Leads Package :PQFN, is a small square-shaped or

rectangular surface-mount plastic package with no leads that is capable of high power dissipation. Instead of leads, it uses metal pads around the periphery of the bottom of the package body for electrical connection to the outside world. It is basically a 'high-power' version of the quad flat no leads (QFN) package.

11) Plastic Pin Grid Array :PPGA, is a square-shaped plastic package whose
pins or leads are arranged in a square array at the bottom of the package body.

12) Plastic Leaded Chip Carrier : PLCC is a four-sided plastic package that
has "J" leads around its periphery. These "J" leads occupy less board space than the gull-wing leads that other packages have.

13) Plastic Dual-in-Line Package : it is rectangular in shape and has leads

extending from both sides along its length, thus forming two sets of in-line pins.

14) Plastic Quad Flat Pack :is an IC package with leads extending
from all four sides of the package body. PQFP's are predominantly square in shape, although rectangular variants do exist.

15) Power Small Outline Package : is a rectangular small outline

IC package developed by Amkor that integrates a copper heat slug in its plastic body. The die is attached to this heat slug, increasing the chip's ability to dissipate heat and thus handle more power.

16) Quad Flat No Leads Package :QFN, is a very small squareshaped or rectangular surface-mount plastic package with no leads. It is basically a quad flat package, except for the absence of leads protruding from its sides. Metal pads or lands around the periphery of the bottom of the QFN package serve as electrical connection points to the outside world. Because the QFN has no leads and has shorter bond wire lengths, it exhibits less inductance than leaded packages and therefore provides a higher electrical performance.

PCB DESIGN

PCB BOARD
Printed Circuit Boards are primarily an insulating material used as base, into which conductive strips are printed The base material is generally fiberglass, and the conductive connections are generally copper and are made through an etching process The main PCB board is called the motherboard, the smaller attachment PCB boards are called daughter boards or daughter cards

PCB BOARD DESIGN

PCB board design defines the electrical pathways between components It is derived from a schematic representation of the circuit When it is derived, or imported from a schematic design, it translates the schematic symbols and libraries into physical components and connections

MANUFACTURING PROCESS
Step 1: Film Generation The film is generated from the design files (gerber files) which are sent to the manufacturing house. Step 2: Raw Material Industry standard 0.059 thick, copper clad panel is generated per layer

Step 3: Drill Holes Using NC machines and carbide drills to drill holes according to the drill specifications sent to the manufacturing house Step 4: Electroless Copper Apply thin copper deposit in hole barrels

Step 5: Apply Image Apply photosensitive dry film to panel and use a light source and the film to expose the panel

Step 6: Pattern Plate Electrochemical process to build copper in the holes and on the trace areas. Apply tin to surface

Step 7: Strip and Etch Remove the dryfilm, and then etch the exposed copper. The tin protects the copper circuitry from being etched away

Step 8: Solder Mask Apply a solder mask area to the entire board with the exception of solder pads

Step 9: Solder Coat Apply solder to pads by immersing into tank of solder. Hot air knives level the solder when removed from the tank Step 10: Nomenclature Apply white letter markings using screen printing process

PCB DESIGN LAYERS A PCB design package allows the designer to define and design on multiple layers Many of these are physical layers such as: Signal Layer Power plane Layer Mechanical Layer And some are special layers such as: Solder & Paste Mask Layers Silkscreen or Top Overlay Layers Drill guides Keep-out Layer And some CAD specific displayonly layers: Ratsnest layer DRC Errors

GROUNDING AND BYPASSING

Providing good grounding is critical to the functionality of a PCB board On a multi layer board, one of the layers should be dedicated ground and all ground signals should have ways into this ground plane. Avoid chaining grounds in order to prevent ground loops from occurring Use bypass capacitors to smooth out power spikes by components that suddenly draw significant current Bypass caps should be placed as close to the components power pins as possible

MANUFACTURING DETAILS
Internal layers should be designed at least 15 away from the edge of the PCB board. This is to ensure that the manufacturer of the board does not cut into the copper or short the planes. You can employ the keepout layer for this purpose. Each manufacturing house has their own manufacturing guidelines for minimum space width, copper-to-edge distance, via and hole sizes, annular ring, etc. Many assembly houses require that you provide your PCB boards in a panelized format.

COMPONENT PLACEMENT Component placement is an extremely important function of the designer Components should be placed according to their connections to other components, thermal considerations, mechanical requirements, as well as signal integrity and routability Components which have connections to each other should be placed in the same vicinity Components should also be placed on a grid, usually a 100 mil grid, in order to provide for a symmetric flow of routing where tracks and components are lined up

CABLES

AND CONNECTORS

CABLES
They are the link between the device and the power that makes the mechanism run . Most transmit signals between electrical equipments. The type of signals transmitted is based on what type of cable is being used. Different types of cables are: Twisted wire cables Coaxial cables Optical fibre

Twisted pair cable

STP - Twisted pair copper, protected from external electromagnetic interference by a metal sheath UTP - Twisted pair copper with no shield

Available in two varieties of wire: Stranded Solid

Coaxial cable
High-capacity used for video and communication networks Provides higher bandwidth than twisted pair cable Contains a single wire at the center, (stranded or solid) surrounded by a metallic shield that serves as a ground Thin and thick coaxial cables use baseband transmission. Thin coaxial cable has a maximum segment length of 185 meters Thick coaxial cable has a maximum segment length of 500 meters.

Fibre optic cable

Commonly used as the backbone media when implementing a large LAN Can accommodate data transmissions much faster than coaxial or twisted pair cable Transmission rates in the Gigabits-per-second range Laser transmitters send the modulated light pulses and optical receivers receive them Two types of optic fibre cables are single : Single mode-intercity telephone trunks and video applications. Multimode-uses a large no: of modes used in LANs and WANs

CONNECTORS
Cable connectors are audio and visual connectors used to carry audio and/or video signals. These signals are either digital or analog. Cables and connectors are necessary to unite outputs and inputs, and the quality of the signal varies with each connector.

BNC connector
British Naval Connector (or Bayonet Neil-Concelman) Commonly used to connect coaxial cable to NICs, hubs and other network devices Connector is crimped on the cable using a bayonet mount

Universal serial bus(USB)

Designed to replace serial and parallel ports Allows up to 127 devices to be daisy-chained using one USB port Offers a bandwidth of 1.5MB/sec Devices are hot swappable Uses a type A socket (4-pins) Network adapters using USB connections are becoming common

SERIAL PORTS
Two types of connectors: DB-9 (9-pin) - Usually COM1 DB-25 (25-pin) - Usually COM2 Usually two serial ports are found on PCs: one DB-9 and one DB-25 (some only have 2 DB-9) Traditionally based on Recommended Standard-232 (RS-232) Standard cable limit is 50 feet

PS/2 connectors
A computer mini-socket and plug used to connect a keyboard and a mouse to a computer Consists of a 6-pin circular connector

PARALLEL PORTS
Computer sockets that connect printers or any other parallel device, such as removable disks and tapes backup devices, to a computers Built into the computer motherboard Some manufacturers sell network adapters that can be connected to a parallel port Now enhanced using IEEE 1284 standard, providing bi-directional transfers and increased speeds, and it defines a cable type that allows data transfers up to 32 feet on a parallel cable Uses a DB-25 connector on the computer end, and a Centronics 36-pin connector at the printer

SMALL COMPUTER SYSTEM INTERFACE Allows up to 15 devices to be daisychained using one SCSI controller The last device in a SCSI daisy-chain must have a SCSI terminator Three types of external SCSI connectors: 25-pin (SCSI-1) 4 Mbps, DB-25 (8-bit bus) 50-pin (SCSI-2) 4 Mbps, supports multiple chained devices, Centronics 50 (8-bit bus) 68-pin (SCSI-3) 40 Mbps, Ultra Wide SCSI, Centronics 68 (16-bit bus)

THANK YOU